Provided herein are an examination device and an examination method that can efficiently perform examination even when both whole blood and serum/blood plasma specimens are to be examined. A solid-phase extraction cartridge or a filter is placed on a continuous track of a cartridge table. A cup table is disposed below the cartridge table. A cup is placed on a continuous track of the cup table to receive a sample purified by the filter. When viewed from above, the continuous track of the cartridge table and the continuous track of the cup table cross each other at a position “m”, and each of the tracks crosses a position at which a sample probe operates. A pretreatment for serum/blood plasma is completed in one rotation of the cartridge table. A pretreatment for whole blood is completed in two rotations of the cartridge table.

Immunoassay is an examination method widely used in clinical testing. On the other hand, analysis method by mass spectrometry (MS) is a measurement technique which measures target components based on the mass of the components. The sample can therefore be distinguished from molecules having a similar structure such as metabolites. Especially, MS/MS analysis and MSn analysis are technologies which allow distinction of components having similar structures with high accuracy by converting target components to fragment signals. Mass spectrometry analysis method excels in selectivity and accuracy compared to the immunoassay method, and a movement of applying it to clinical examination is spreading.
Mass spectrometry analysis method can be applied to clinical examinations such as therapeutic drug monitoring (TDM) and metabolic disorder screening. One example of TDM is observing pharmacokinetics of drugs in human body. For administration of drugs to patients in medical sites, it is important to plan a dosing plan based on the symptom of each patient in order to ensure effectiveness and safety. Even if patients take the same amount of drugs, their therapeutic effects may differ. One reason for this is that the blood concentration of the drug in patients differs due to individual differences in drug pharmacokinetics. Therefore, one performs TDM, a technique of optimizing the dosage amount and dosage method by measuring the patient's blood concentration, so that it falls within a therapeutic range. For example, TDM is necessarily performed for immunosuppressants used to suppress rejection response to a transplanted organ. The therapeutic range of those immunosuppressants is in a low concentration range, from several ng/mL to several hundred ng/mL. When the patient's blood concentration of a drug exceeds the therapeutic range, a severe side effect such as hypertension, hyperglycemia, a peptic ulcer, or dysfunction of the liver or kidney may occur. In order to reduce such side effects, cocktail administration is generally performed, in which multiple types of immunosuppressants and a drug such as a steroid are administered while performing TDM.
Another known example is metabolic disorder screening in which whole blood is used as a specimen, and target components are extracted by liquid-liquid extraction to be measured by a mass spectrometer (Patent Document 1). Amino acids such as alanine and valine, and acyl carnitine are thus quantitated so as to examine the degree of the metabolic reaction of the target component in vivo.
The MS mode employed in the aforementioned two examples is the multiple reaction monitoring (MRM) mode of a triple quadrupole mass spectrometer which has high selectivity. MRM is a technique such that the first stage quadrupole functions as a filter to pass only the precursor signal through it, and the passed signal is cleaved in a collision cell so that only a product signal that is specific to the generated compound is monitored in the second stage quadrupole. In this method, a compound is examined by identifying it using mass information specific to the compound.
On the other hand, regarding the series of operations performed in a clinical application of mass spectrometry, although the device automatically analyzes samples, pretreatment of the samples are performed manually. A laboratory technologist needs to conduct a plurality of pretreatment processes using a plurality of devices, resulting in low efficiency. Therefore, there is a demand for a device that can efficiently perform a series of examinations so as to save labor, shorten the time for examination reporting, and downsize the device by integrating the components.
The substance to be examined may exist in a blood cell component or a serum/blood plasma component, and the specimen may be whole blood or serum/blood plasma, because the position of localization varies depending on the property of the substance to be examined. A pretreatment for whole blood is different from that for serum/blood plasma. Therefore, a device that can handle various examination items, that is, various pretreatments is demanded.
As an example of a technique capable of performing pretreatments on both whole blood and serum/blood plasma, there is a known device that can consistently perform immunoserological examination or biochemical examination which uses serum as a specimen, and blood coagulation examination which uses whole blood as a specimen (refer to, for example, Patent Document 2). The device performs the first half process of the biochemical examination or immunoserological examination in parallel with the process of the blood coagulation examination on the same examination area so that two types of examinations are performed consistently and efficiently.

Examination device and examination method


An interposer in a BGA or similar package includes a polymide core and a filler of thermally conductive, electrically nonconductive filler. The interposer has a higher thermal conductivity as compared to conventional interposers, thereby increasing the thermal dissipation through the interposer and enabling the device to cool more efficiently. The filler also reduces the coefficient of thermal expansion of the interposer to more closely match the die and reduce stresses. Furthermore, the filler increases the rigidity of the interposer, thereby enabling the interposer to be handled and carried more easily, for example, without a metal frame carrier.

1. Field of the Invention
The present invention relates to integrated circuit packages, and more particularly, to an interposer for a ball grid array (BGA) package having high thermal dissipation, a low coefficient of thermal expansion (CTE) and a high Young""s modulus.
2. Description of the Related Art
In the last few decades, the electronics industry has literally transformed the world. Electronic products are used by, or affect the daily lives of, a large segment of the world""s population. For example, telephones, televisions, radios, personal computers (PCs), laptop PCs, palmtop PCs, PCs with built-in portable phones, cellular phones, wireless phones, pagers, modems and video camcorders, are just a few of the electronic products that have been developed in recent years and which have been made smaller and more compact, while providing more functions than ever before and/or enhanced functions. The integrated circuit (IC) chip and the more efficient packaging of the IC chip have played key roles in the success of these products.
The IC chip is not an isolated island. It must communicate with other chips in a circuit through an Input/Output (I/O) system of interconnects. Moreover, the IC chip and its embedded circuitry are delicate, and must therefore be protected in a package that can both carry and protect it. As a result, the major functions of the IC package are: (1) to provide a path for the electrical current that powers the circuits on the chip; (2) to distribute the signals on to and off of the chip; (3) to remove the heat generated by the circuit; and (4) to support and protect the chip from hostile environments.
As ICs become more complex and printed circuit boards become more crowded, IC packages continually need more leads or pins while their footprints consume smaller and smaller areas. In an effort to meet these demands, developers created the ball grid array (BGA) package.
A typical BGA package includes an IC affixed to a flexible polyimide tape or interposer. A very thin conductor or wire bond connects a pad on the IC to a conductive trace on the polyimide tape. The conductive trace is routed to a solder ball. The solder ball is one of an array of solder balls mounted to the opposite side of the polyimide tape and protruding from the bottom of the BGA package. These solder balls interconnect with an array of pads located on a substrate, such as a printed circuit board. Accordingly, the typical BGA package electrically connects each pad on an IC to a pad on a printed circuit board.
A variation of the BGA package that has been introduced recently is the Area Tape Automated Bonding (ATAB) Ball Grid Array (BGA) package, or more commonly referred to as simply the Tape Ball Grid Array (TBGA) package. The TBGA package advantageously provides high lead counts, is thin, is lightweight, has high electrical and thermal performance, and has a BGA surface mount. The conventional TBGA package includes a tape containing a polyimide dielectric. At least one layer of the tape is formed into traces or conductors that interconnect a chip to a printed circuit board (PCB). See John H. Lau (Ed.), Ball Grid Array Technology, Chapter 14, xe2x80x9cArea Tape Automated Bonding Ball Grid Array Technologyxe2x80x9d (McGraw-Hill, 1995), incorporated herein by reference.
One particular type of BGA package developed by Tessera is the micro-ball grid array (xcexcBGA) package. The basic package typically includes a package interposer that is a 25 xcexcm thick polyimide film with double-sided copper (Cu). One side of the Cu serves as a ground plane, which the other side has signal traces for I/O redistribution. A layer of silicone elastomer is positioned between the chip and the substrate. This compliant layer typically has a thickness of 150 xcexcm. The first-level interconnects of the xcexcBGA are flexible ribbons which are typically bonded on aluminum (Al) bond pads on the chip by a single-shot thermosonic process. The ribbons are typically 25 xcexcm-wide soft gold (Au) leads with a thickness of 20 to 25 xcexcm, bonded in a lazy-S shape so that they may accommodate any deformation due to thermal expansion. In order to protect the bonded leads, an encapsulant such as a silicone material is dispensed from the back side (between the chip and the interposer) after the lead bonding is completed. The package terminals of the xcexcBGA may be plated bumps, solder balls or solid-core metal spheres. Further details describing the typical xcexcBGA package may be found in John H. Lau, Chip Scale Package, Chapter 16, xe2x80x9cTessera""s Micro-Ball Grid Array (xcexcBGA)xe2x80x9d (McGraw-Hill, 1999), incorporated herein by reference.
In a typical xcexcBGA manufacturing process, the flexible tape interposer is first provided and tailored from a reel to mount as strips onto a metal frame. The elastomer layer is applied to the tape, and an adhesive material is deposited for die attachment. Die attachment is performed with an automated pick-and-place machine. Subsequently, ribbon leads are bonded to the Al die pads by a thermosonic process. Once the lead bonding is finished, a dry film resist is laminated to the interposer using a vacuum system. The encapsulant is dispensed from the back side, and the curing is performed to complete the encapsulation. The subsequent procedures include dry film exposure and developing, solder-ball attachment and reflow, cleaning, marking, and package singulation. Further details are described in Chapter 16 of John Lau""s Chip Scale Package referenced above.
One problem with integrated circuits, including BGA packages, is that they require precise temperature control for efficient operation. Thus, if a package runs too hot, the heat can affect the performance and timing of the device. Accordingly, there is a need for an effective way to maintain control over the temperature of a device and keep it cool.
Another problem in BGA and similar packages is the mismatch in coefficient of thermal expansion (CTE) between the die and the tape or interposer containing the polyimide dielectric. The polyimide tape typically has a much higher coefficient than that of the die to which the tape is bonded. For instance, a die having a CTE of about 3 ppm/xc2x0 C. may be coupled to a polyimide tape interposer having a CTE of about 20 ppm/xc2x0 C. or more. This mismatch causes the tape to expand and shrink more rapidly than the die, thereby creating stress on the conductive leads connecting the solder ball array to the die. This stress can lead to breakage of the wire and a corresponding loss of electrical connection between the IC pads. The mismatch in CTE between the interposer and the die can also lead to delamination of the die attach or elastomer layer found therebetween. These problems result in lower yield rates and increase the overall cost of package manufacture.
Briefly stated, the preferred embodiments of the present invention address these and other problems by providing an interposer in a BGA or similar package comprising a polymide core and a filler of thermally conductive, electrically nonconductive filler. This improved interposer has a higher thermal conductivity as compared to conventional interposers, thereby increasing the thermal dissipation through the interposer and enabling the device to cool more efficiently. The filler also reduces the CTE of the interposer to more closely match the die and reduce stresses. Furthermore, the filler increases the rigidity of the interposer, thereby enabling the interposer to be handled and carried more easily, for example, without a metal frame carrier.
In one aspect of the present invention, an interposer for an integrated circuit package is provided. The interposer comprises a polyimide core and a thermally conductive, electrically nonconductive filler. Preferably, the interposer includes between about 10% and 95% filler by weight. More preferably, this filler may be either boron nitride or alumina. The filler advantageously increases the thermal conductivity of the interposer by at least about 5% as compared to that of the polyimide core alone. The filler also advantageously reduces the coefficient of thermal expansion of the interposer by at least about 10% as compared to the polyimide core alone. Furthermore, the filler advantageously increases the modulus of the interposer by at least about 10% as compared to the modulus of the polyimide core alone.
In another aspect of the present invention, a flexible tape for connecting a die to a plurality of package terminals is provided. The tape comprises a polyimide core and a filler material. The filler material increases the thermal conductivity of the tape as compared to the thermal conductivity of the polyimide core alone.
In another aspect of the present invention, an integrated circuit package is provided. This package comprises a die, a die attach layer over the die, an array of package terminals over the die attach layer, and a composite tape between the die attach layer and the array of package terminals. The composite tape comprises a polyimide core and a thermally conductive filler embedded therein. The composite tape further comprises a layer of metal wire electrically connected to the die.
In another aspect of the present invention, a method of increasing the thermal conductivity of a flexible tape for use in an integrated circuit is provided. This method comprises adding a filler of thermally conductive material to a polyimide film. In one preferred embodiment, the filler is added by blending the filler into a polyimide resin.


A vehicle having one or more cameras, configured to record one or more images of a person approaching the vehicle. The camera(s) can be configured to send biometric data derived from the image(s). The vehicle can include a computing system configured to receive the biometric data and to determine a risk score of the person based on the received biometric data and an AI technique, such as an ANN or a decision tree. The received biometric data or a derivative thereof can be input for the AI technique. The computing system can also be configured to determine whether to notify a driver of the vehicle of the risk score based on the risk score exceeding a risk threshold. The vehicle can also include a user interface, configured to output the risk score to notify the driver when the computing system determines the risk score exceeds the risk threshold.

Ridesharing has become a pervasive mode of transportation in the United States and is growing throughout the world. A ridesharing service connects passengers with drivers or vehicles via a website or another type of application. Currently, several ridesharing services match customers and vehicles via mobile apps. Ridesharing services for automobiles can be referred to as ride-hailing services, and such services also are available for ridesharing with other types of vehicles including aircraft and watercraft.
Ridesharing services have become prevalent in less populated or poorer areas that are not regularly served by taxicabs. Also, ridesharing has become widespread because there is at least a perception that such services are less expensive than taxicab services. Also, ridesharing is beneficial because it has been shown to reduce drunk driving rates in some cities where such services operate.
One example problem with ridesharing is that it is at least perceived to be less safe than hailing a taxi or a professional ride service. However, steps are being made to overcome safety concerns as well as concerns of fraudulent ridesharing services. On the other hand, intoxicated, fraudulent, or belligerent customers can create problems for drivers. Also, tired, drunk, deceitful, or aggressive drivers can create problems for customers.
To protect drivers as well as customers, ridesharing services have been regulated in cities, states, and countries. And, in some jurisdictions, ridesharing has been banned due to safety concerns and possibly lobbying by taxi companies. Regulations for ridesharing services can include requirements for driver background checks, fares, the number of drivers, licensing, and driver wage.


An opto-mechanical apparatus including a hollow housing member having a first end and a second end, the housing member having a longitudinal axis, a parabolic mirror positioned on a side of to the first end of the housing member, and a mirror adjustment mechanism attached to the second end of the housing member, the mirror adjustment mechanism connected to the parabolic mirror through the housing member, the mirror adjustment mechanism configured to adjust an axial position of the parabolic mirror along the longitudinal axis and to adjust a radial position of the parabolic mirror about the longitudinal axis.

In many optical setups parabolic mirrors are used to direct a light beam towards a target and to redirect the beam reflected by the target to a detector assembly. To optimize performance, the parabolic mirrors need to be in near-perfect alignment with both the target and the detector assembly. To achieve this positioning, many parabolic mirrors use an adjustable mounting assembly. The mounting assembly has adjusting mechanisms adapted to adjust the parabolic mirrors in both azimuth and elevation. Once the parabolic mirrors are in the proper azimuthal and elevational directions, a locking mechanism in each direction is used to lock the parabolic mirrors in position. The locking mechanisms, however, can act on the adjusting mechanisms, moving the parabolic mirrors out of alignment. Once the parabolic mirrors are out of alignment, the light beam is not aimed directly at the target, which also affects the reflected beam.

This patent is subject to a terminal disclaimer.

Optomechanical part for parabolic mirror fine rotation and on-axis linear positioning


One embodiment is directed to a method comprising estimating a velocity vector that is experienced by an apparatus; reporting to a network element, NE, the velocity vector; receiving from the NE at least one primary reference signal, RS, which will be experienced during a predicted trajectory, and at least one secondary RS that will potentially be experienced during the predicted trajectory; sending to the NE feedback based on the at least one primary RS and the at least one secondary RS; and sending an update of the velocity vector to the NE.

This section is intended to provide a background or context to the invention that is recited in the claims. The description herein may include concepts that could be pursued, but are not necessarily ones that have been previously conceived, implemented or described. Therefore, unless otherwise indicated herein, what is described in this section is not prior art to the description and claims in this application.
Certain abbreviations that may be found in the description and/or in the Figures are herewith defined as follows:
3GPP3rd Generation Partnership Project5G5th GenerationAIArtificial IntelligenceAP-CSI-RSAperiodic Channel State Information Reference SignalAP-SRSAperiodic Sounding Reference SignalBWPBandwidth PartC-DRXConnected Mode Discontinuous ReceptionCCComponent CarrierCEControl ElementCORESETControl Resource SetCSIChannel State InformationCSI-RSChannel State Information Reference SignalDCIDownlink Control InformationDLDownlinkDMRSDemodulation Reference SignaleMBBenhanced Mobile BroadbandeNBenhanced Node BFR2Frequency Range 2gNB5G Node BIDIdentifierIoTInternet of ThingsL1-RSRPLayer 1 Reference Signal Received PowerLTELong Term EvolutionM2MMachine to MachineMACMedium Access ControlMIMOMultiple Input and Multiple OutputMLMachine LearningmMTCmassive Machine Type CommunicationNENetwork ElementNGNext GenerationNRNew RadioP-CSI-RSPeriodic Channel State Information Reference SignalP-SRSPeriodic Sounding Reference SignalPDCCHPhysical Downlink Control ChannelPDSCHPhysical Downlink Shared ChannelPUCCHPhysical Uplink Control ChannelPUSCHPhysical Uplink Shared ChannelQCLQuasi-Co-LocationRACHRandom Access ChannelRRCRadio Resource ControlRSReference SignalRxReceptionSP-CSI-RSSemi-persistent Channel State Information Reference SignalSP-SRSSemi-persistent Sounding Reference SignalSRScheduling RequestSRSSounding Reference SignalSSBSynchronization Signal BlockTCITransmission Coordination IndicationTRPTransmission and Reception PointTRSTracking Reference SignalTxTransmissionUEUser EquipmentULUplinkURLLCUltra Reliable Low Latency Communication
LTE is a standard for wireless communication that seeks to provide improved speed and capacity for wireless communications by using new modulation/signal processing techniques. The standard was proposed by the 3GPP. Since its inception, LTE has seen extensive deployment in a wide variety of contexts involving the communication of data. In recent years, the exponential growth of smartphones and the traffic they generate have become a major challenge of the industry. 3GPP has been continuing to alleviate this challenge by enhancing LTE standards to further improve capacity and performance and introducing improvements for system robustness.
3GPP 5G or NG system, may support a number of use cases and features. These use cases are, but not limited to: eMBB and URLLC, as well as mMTC. 5G is mostly built on a NR, but a 5G (or NG) network can also build on LTE radio. NR is expected to deliver extreme broadband and ultra-robust, low latency connectivity and massive networking to support the IoT. With IoT and M2M communication becoming more widespread, there will be a growing need for designs that meet the needs of lower power, high data rate, and long battery life. It is noted that, in 5G, the nodes that can provide radio access functionality to a user equipment (i.e., similar to eNB in LTE) may be named gNB when built on NR radio and may be named NG-eNB when built on LTE radio.
The gNB in 5G systems may include one or more TRPs. Some gNB functionalities can be distributed across different TRPs, while others are centralized, leaving the flexibility for specific deployments to fulfil the requirements for specific use cases.

Apparatus and method for beam management


A copying machine (image forming apparatus) including an operation displaying portion, a fan and a middle discharging portion. The operation displaying portion includes a color liquid crystal which can be rotated with respect to a main body of the copying machine displaying panel and is adapted to display information concerning the copying machine. The fan is provided in the operation displaying portion and is adapted to cool the operation displaying portion. The middle discharging portion is provided in a back of the operation displaying portion, and a recording sheet is discharged therein. Further, the operation displaying portion includes a back surface casing having an air hole, and the fan is capable of sending air through the air hole of the operation displaying portion toward a recording sheet which is discharged in the middle discharging portion.

1. Field of the Invention
The invention relates to an image forming apparatus comprising a displaying portion for displaying information concerning the apparatus.
2. Description of the Related Art
Conventionally, as described in Japanese Unexamined Patent Publication No. HEI11-119498, an image forming apparatus comprising a displaying portion for displaying information concerning the apparatus is known. The Japanese Unexamined Patent Publication No. HEI11-119498 discloses an electronic imaging apparatus (image forming apparatus) which is so constructed that an inclination angle of an operating portion including a liquid crystal displaying panel (displaying portion) with respect to a horizontal plane can be changed so as to enable a user (operator) who is in a state of sitting on a chair to easily operate the apparatus.
Meanwhile, in recent years, there is a tendency to incorporate a large-sized liquid crystal color display panel in an image forming apparatus so as to enhance the visibility of the displaying portion. For this reason, the processing speed of a CPU (Central Processing Unit) mounted in the displaying portion as a displaying circuit becomes higher.
In such image forming apparatus described above, with the high processing speed of the CPU mounted in the displaying portion, the amount of heat generated by the CPU also increases. It is required to suppress excessive rise in temperature of the displaying portion due to such increase in the amount of heat generated by the CPU.

Image forming apparatus with fan for cooling a displaying portion


The invention generally relates to systems and methods for construction field management and operations with building information modeling. In certain embodiments, the invention provides systems for construction field management and operations, that include a central processing unit (CPU), and storage coupled to the CPU for storing instructions that when executed by the CPU cause the CPU to: encode and map data structures and data sets received from Building Information Modeling software; select particular data structures and data sets relevant to at least one person associated with a construction project; transmit the selected data structures and data sets to a user terminal operated by the person; receive inputs made by the person to the selected data structures and data sets; and synchronize and update the data structures and data sets received from Building Information Modeling software based on the inputs received from the person.

Building Information Modeling and Building Information Management refers to object-oriented building development processes with a related set of software applications that utilize multi-dimensional, digital modeling concepts, information technology and software interoperability to design, construct and operate a building project. Building Information Modeling can communicate its details including building geometry, spatial relationships, performance information, geographic information, and quantities and properties of building assemblies, systems, equipment and components to numerous persons associated with a construction project. Building Information Modeling and Building Information Management increase productivity in building design, construction and operations.
In the building design phase, Building Information Modeling is typically used for the conceptual design, schematic design, design development and construction documentation of building assemblies, systems, equipment and components such as: Heating, Ventilating, and Air-Conditioning (HVAC), Electrical, Plumbing, Structural Steel Framing, and Cast-in-Place Concrete, for example. In the building construction phase, Building Information Modeling is typically used for the detailed design coordination and fabrication of building assemblies, systems, equipment and components.
However, in the building construction phase, Building Information Modeling cannot be used for construction field operations out in the field, on the job site and at the point of construction, by construction field personnel. Building Information Modeling tools cannot be used for construction field operations because the tools are designed to communicate details of the design and coordination of the building project including building geometry, spatial relationships, performance information, geographic information, and quantities and properties of building components. Building Information Modeling tools are not designed to communicate details of construction field operations, and accordingly lack the data structures and data sets for construction field operations.
Further, Building Information Modeling tools cannot be used for construction field operations because the tools are generally designed around three-dimensional (3D) visualization or graphic-based representation of a building project, and communicate its details including building geometry and spatial relationships, and are not designed around text-based data structures and data sets that are required for performing construction field operations. Thus, Building Information Modeling tools cannot be used on mobile computer hardware, mobile smart phones, or tablet computers, because Building Information Modeling tools are designed to be used on fixed platforms with large displays.

Systems and methods for construction field management and operations with building information modeling


An end panel for a patient support apparatus such as a hospital bed has a frame, a housing covering the frame, a roller mounted on the frame which rotates relative to the frame.

The present disclosure relates to systems which assist with the movement of patients who are partially or completely incapacitated. More specifically, the disclosure is related to a system coupled to a patient support apparatus and configured to reposition a patient relative to the longitudinal length of the patient support apparatus.
From time to time, patients on a patient support apparatus such as a hospital bed who are partially or completely incapacitated need to be moved or repositioned. For example, in some cases, a patient may have slid down, slumped, or otherwise moved toward a foot end of the patient support apparatus, for example. This may result from inclination of a head section of the patient support apparatus and the patient may need to be repositioned toward the head end of the patient support apparatus when the head section is lowered back down. In other cases, a patient may need to be moved to a different bed.
In repositioning or moving a patient, a caregiver such as a nurse, for example, will grip the patient and pull, slide, or roll the patient to the new position. For larger patients, the caregiver may summon assistance from other nurses, assistants, orderlies, or the like. In some cases, a piece of fabric referred to as a draw-sheet may be positioned under the patient and used by the caregivers as an aid to repositioning the patient. The draw-sheet may be gripped by the caregiver(s) and used to lift and reposition the patient or the sheet may be pulled over the surface of the patient support apparatus to reposition the patient.


A resistive heating conductor having at least one strand, a first electrical insulation surrounding the resistive heating element, a sensor conductor helically disposed around the first electrical insulation and a second electrical insulation surrounding both the sensor conductor and the first electrical insulation.

1. Field of the Invention
The present invention relates to a heater system, and a method of operation thereof, which utilizes a two conductor element, and, more particularly, to an electric heating blanket which incorporates a single conductor heating element and a single conductor sensing element.
2. Description of the Related Art
Blankets are woven from a variety of materials including wool, cotton, synthetics, and various animal and vegetable fibers. Blankets are used as a shawls, bed coverings and horse coverings. The blanket making of primitive people is one of the finest remaining examples of early domestic artwork. For example, the blankets of Mysore, India, are famous for their fine, soft texture. The loom of the Native American, though simple in construction, can produce blankets so closely woven as to be waterproof. The Navaho, Zuxc3x1i, Hopi, and other Southwestern Native Americans are noted for their distinctive, firmly woven blankets. The Navahos produced beautifully designed blankets characterized by geometrical designs woven with yarns colored with vegetable dyes. The ceremonial Chilcat blanket of the Tlingit of the Northwest, is generally woven with a warp of cedar bark and wool and a weft of goats"" hair. Blankets, like society, have changed significantly over the years and it was in the 20th century that the electric blanket, with electric wiring between layers of fabric, gained wide popularity.
The direct conversion of electric energy into heat was first described by the English physicist James P. Joule. According to Joule""s law, a conductor carrying a current generates heat at a rate proportional to the product of the resistance of the conductor and the square of the current. It is the use of this principle, of applying electrical energy to a distributed resistance incorporated in a blanket, which provides warmth to the user. Joule""s law also points to a potential problem, if resistance is locally increased, in a distributed resistive element, more heat is produced in that localized area causing a local hot spot.
In spite of the advantages to the users of electric blankets, consumers have voiced concerns. Manufactures of electric blankets have addressed consumer concerns with scientific studies, incorporation of safety features and marketing techniques. Regardless of the manufacturer""s care in manufacturing electric blankets, localized hot spots can occur in an electric blanket as a result of either a manufacturing defect, handling damage or consumer misuse. A localized hot spot in an electric blanket may cause damage to the electric blanket, property loss and/or injury to the user.
U.S. Pat. No. 5,861,610 (Weiss) discloses a heater wire with a first conductor for heat generation and a second conductor for sensing the temperature. The second conductor is made of 99.5% nickel. The first conductor and second conductor are each wound as coaxial spirals with an insulating material isolating the two conductors. A problem with the Weiss invention is that winding two coaxial spirals separated by an insulating material is rather expensive.
What is needed in the art is an electric blanket with a two conductor heating element which is economical to manufacture, is safe and provides disconnection if a localized heating problem occurs therein.
The present invention provides a two wire heating element. One wire is electrically resistive for the production of heat and the second wire is utilized for the sensing of the temperature of the assembly.
The invention comprises, in one form thereof, a resistive heating conductor having at least one strand, a first electrical insulation surrounding the resistive heating element, a sensor conductor helically disposed around the first electrical insulation and a second electrical insulation surrounding both the sensor conductor and the first electrical insulation.
An advantage of the present invention is that if the heating conductor overheats, electrical power thereto is removed.
Another advantage is that localized overheating of a resistive conductor is detected.
Yet another advantage is that the temperature at which a localized heating problem is detected is predetermined by the selection of the melting temperature of an electrical insulation.
A further advantage is that the electrical heating element is easily manufactured as a stranded resistive conductor with a sensor conductor helically wound around an insulation covering the stranded heating resistive conductor.


Structures and a method are disclosed for grounding gate-stack and/or silicon active region front-end-of-line structures on a silicon-on-insulator (SOI) substrate, which may be used as test structures for VC inspection. In one embodiment, a structure includes a grounded bulk silicon substrate having the SOI substrate thereover, the SOI substrate including a silicon-on-insulator (SOI) layer and a buried oxide (BOX) layer; the silicon active region having at least one finger element within the SOI layer, the at least one finger element isolated by a shallow trench isolation (STI) layer; and a polysilicon ground intersecting the at least one finger element and extending through the STI layer and the BOX layer to the grounded bulk silicon substrate, the polysilicon ground contacting the silicon active region and the grounded bulk silicon substrate.

1. Technical Field
The invention relates generally to semiconductor fabrication, and more particularly, to structures and a method for grounding front-end-of-line (FEOL) structures, such as a gate stack or active region, through a silicon-on-insulator (SOI) substrate.
2. Background Art
In-line voltage contrast (VC) inspection is a powerful technique for detecting and isolating yield limiting defects in the semiconductor fabricating industry. In-line VC inspection includes scanning the wafer surface in which test structures exist with a scanning electron microscope (SEM). As the inspection proceeds, the SEM induces a charge on all electrically floating elements whereas any grounded elements remain at a zero potential. This potential difference is visible to the SEM. In particular, for electron landing energies less than the second crossover of the secondary electron yield curve (approximately 1.5 keV for tungsten (W) and copper (Cu)), grounded elements appear bright whereas floating elements appear dark.
Test structures exploiting this phenomenon can be created for many yield limiting defects including metal, gate and active region shorts and opens, and via and contact opens. For example, FIGS. 1A-B, show a short (FIG. 1B) indicated by a normally floating (dark) element becoming bright, and an open (FIG. 1A) indicated when a normally bright element becomes dark. As shown, even if the defect causing the electrical failure is buried or extremely small, its existence is indicated by a change in the VC signal of the entire element. In addition, the exact location of an open is indicated by a change in the VC signal of the structure after the break.
A number of challenges exist relative to building VC test structures. One challenge is grounding front-end-of-line (FEOL) structures targeting the active region or gate stack levels, especially for silicon-on-insulator (SOI) technology. For bulk silicon technology, an active region may be grounded to the substrate by doping the active region P+, while masking out the N well so that the P+ directly contacts the P− material of the substrate. However, with SOI technology, the buried oxide (BOX) layer presents an additional barrier so the above-described grounding technique does not work. Some SOI technologies provide a mask level for forming holes through the BOX layer. Design rules typically do not allow this level and the active region or gate stack levels to be coincident. However, this level enables the first metal level to make contact to the substrate. Since the active region and gate stack levels also can be connected to the first metal level, they may be grounded through as shown in FIG. 2. Unfortunately this ground path is not helpful for VC inspection for active region and gate stack structures because the ground path to the VC test structure is required when the test structure is still exposed at the wafer surface and visible to the SEM. Therefore, VC test structures that require grounding of an active region are currently impossible for SOI technology.
Several approaches exist to ground polysilicon structures in SOI substrates. For example, Patterson et al., "Rapid Reduction of Poly-Silicon Electrical D0 using uLoop Test Structures," Proceedings of ASMC, pp. 266-272, March 2003, describes the use of a modified process flow for generating grounded gate stack VC test structures. This short loop sequence starts with the formation of a 2000 angstrom (Å) silicon dioxide (SiO2) layer. Contact holes are patterned in the silicon dioxide (SiO2). The contacts are opened with an isotropic etch. The gate stack excluding the gate dielectric (e.g., SiO2) is then deposited. Gate stack VC test structures are then formed using the contact holes to ground select elements. This method has a number of disadvantages. First, special short loop wafers are necessary, which creates an additional cost. Second, because the transistors will not work, very little other data can be collected for comparison. Third, the process sequence is not entirely representative of the real process.
A second technique to ground gate stack structures in SOI technology is to use large capacitors to generate a virtual ground path. This technique also suffers from a number of drawbacks. First, these capacitors are formed with a plate of gate stack over the active region, and take up a large amount of the area (e.g., approximately 25-40% of a test area). Secondly, a large plate of gate stack is often a design rule violation. A third technique for grounding the gate stack level is through the first metal layer, as described earlier. Again, this method is not useful for VC inspection because the ground path to the VC test structures is required when the test structures are still exposed at the wafer surface. By the first metal level, the test structures have been covered by the contact dielectric.
In view of the foregoing, there is a need in the art for a solution to the problems of the related art.

Grounding front-end-of-line structures on a SOI substrate

International Business Machines Corporation


Techniques are described related to for generating/distributing state machines that are implemented within a security zone to obtain private information from one or more resources within the security zone. In various implementations, an automated assistant client implemented by processor(s) within the security zone may receive a free form natural language query (“FFNLQ”) that is answerable using private information available from resource(s) within the security zone. Data indicative of the FFNLQ may be provided to a semantic processor outside of the security zone, and the online semantic processor may return a state machine that is implemented by processor(s) within the security zone to obtain the private information from resource(s) within the security zone. Based on the state machine and the obtained private information, natural language output may be generated and presented to convey information responsive to the FFNLQ.

Humans may engage in human-to-computer dialogs with interactive software applications referred to herein as "automated assistants" (also referred to as "chatbots," "interactive personal assistants," "intelligent personal assistants," "personal voice assistants," "conversational agents," etc.). For example, humans (which when they interact with automated assistants may be referred to as "users") may provide commands, queries, and/or requests (collectively referred to herein as "queries") using free form natural language input which may be vocal utterances converted into text and then processed, and/or by typed free form natural language input.
In many cases, logical instances of automated assistants may be implemented across multiple computing devices. For example, a logical instance of an automated assistant may include an automated assistant client installed on a user's mobile phone and one or more cloud-based automated assistant components. The automated assistant client may be configured to provide the user with an automated assistant interface that the user can operate to engage in a human-to-computer dialog with the automated assistant. However, much of the heavy lifting associated with the human-to-computer dialogs is often performed by the cloud-based automated assistant components, which are able to leverage the virtually limitless resources of the cloud to perform semantic processing of natural language queries.
Users may engage in human-to-computer dialogs with automated assistants for a variety of reasons, such as searching for information, performing tasks, etc. Sometimes when users interact with automated assistants, the users may seek information that is sensitive or private, or that depends on information that is sensitive or private. This potentially sensitive or private information may be stored on one or more computing devices operated by the user and/or on the cloud in association with a user profile of the user. While it is possible to grant cloud-based automated assistant components access to such user-controlled resources, doing so may potentially expose the private or sensitive information to third parties that the user would not wish to have access to the information. And in some scenarios, the user may not want even the cloud-based automated assistant components to have access to sensitive or private information. Moreover, cloud-based automated assistant components may not have access to some information that is stored, for instance, at resources (e.g., computing devices) that are within protected "security zones," such as corporate networks that are behind one or more firewalls.

Using distributed state machines for human-to-computer dialogs with automated assistants to protect private data


A head comprises multiple nozzles on an ejection surface. The number n of nozzle rows each comprising a plurality m of nozzles arranged in a direction intersecting a first direction are disposed parallel to each other, where n and m are integers 2 or greater. Between the nozzles of each nozzle row, the nozzles of other of the nozzle rows are located as viewed in the first direction and the plurality of nozzles are located at the number m×n of dot positions. An interval defined by the number of dot positions from a dot position where one nozzle is arranged to a dot position just before a dot position where a next one of the nozzles is arranged in each row is referred to as nozzle pitch. At least one of the rows comprises two or more types of the nozzle pitches varying in the number of the dot positions.

A known liquid ejection head performs printing by ejecting liquid (for example, ink) from multiple nozzles to a recording medium (for example, paper) (for example, PTL 1). Generally, the multiple nozzles are arranged in a direction intersecting a direction (hereinafter, referred to as first scanning direction) of relative movement between the liquid ejection head and the recording medium and form a nozzle row. A two-dimensional image is formed by repeating the ejection of liquid from the nozzle row while moving at least one of the recording medium and the liquid ejection head relative to each other. The liquid ejection head sometimes includes multiple nozzle rows. In this configuration, multiple nozzles forming nozzle rows are arranged such that the positions thereof in a direction (hereinafter, referred to as second scanning direction) orthogonal to the first scanning direction do not overlap one another. This can increase the density of dots on the recording medium in the second scanning direction.

Liquid ejection head and recording apparatus


A data viewing terminal for displaying graphical indices pointing to elements of a database of information in a way that takes into account properties of the human visual perception system so as to maximize the amount of information that the user can absorb. The system has an interface with a processor that displays the graphical indices as images moving across a viewing screen. The screen is divided into viewing segments, each of which displays graphical indices in motion in a direction predetermined for that segment where the information in at least one pair of adjacent viewing segments moves in anti-parallel directions.

Today's principal commercial computer user interface is the GUI (Graphical User Interface). It is based upon two simple user interface elements: the mouse controlled cursor and the pull-down menu. These elements have also been used in tandem to enable hypertext linking.
The current implementations of a GUI has serious limitations when used to navigate through large databases. It presents tree-like structures of file names, file contents and links on the Web. In doing so, 95% of the time it presents lists as vertical or horizontal screen displays. Just as the graphical format display of telephone books, GUI's tree-structures relegates the user to a tedious search through lists, and lists of lists, reached through only two features: scroll up and down buttons and links. In either case, the complete content of the database is not effectively presented and the format soon exhausts the user's attention span, making GUI inefficient at best for speedy navigation and location of desired content.
Numerous hierarchical tree-like structures, branching and sub-branching methodologies have been developed to ease this limitation. Their common flaw lies in the method of data presentation. The method of presentation has but one purpose: the communication of information to the user's mind. Thus, the presentation problem should be approached from the point of view of the mind's "information acquirement" abilities. A step towards higher cognitive processing should not ignore such information acquirement factors as differentiation, elimination, in-depth analysis and context identification with formal commitment to memory.


A method for controlling a frequency converter unit, the frequency converter unit containing an input connection for supplying electric power at an input frequency to the frequency converter unit, and an output connection for supplying electric power at an output frequency from the frequency converter unit, the method comprising a control step, in which the frequency converter unit is controlled by means of control signals. In the control step the control signals are supplied through an inductive connection to at least one wire connected to the input connection or the output connection of the frequency converter unit for transmitting electric power, the control signals being supplied to the frequency converter unit over the at least one wire.

The invention relates to the control of frequency converters.
In a conventional frequency converter assembly the user interface means of the frequency converter unit is arranged in association with the frequency converter unit. A problem with this kind of arrangement is that if the frequency converter unit is inconveniently placed, for example high up, it is difficult for the user to control the frequency converter unit.

Method for controlling frequency converter unit, and frequency converter assembly


A system and method to provide extensibility to an existing vehicular control network. To provide such extensibility, an information layer network incorporating a protocol such as an Ethernet protocol in which additional peripheral devices may be easily coupled thereto or additional software applications providing enhanced functionality. Interfacing of the information layer to the vehicular control network is accomplished via an Information layer interface mechanism that translates signals from those compliant to the vehicular control network to those compliant with the information layer. Additionally, means are disclosed to provide for momentary control over one or more peripheral devices that are coupled to the vehicular control network via peripheral devices that are coupled to the information layer.

The modernization of vehicular systems such as aircraft, automobiles, or marine vessels have included the implementation of guidance and control systems having a computerized control system. For vehicular systems such as aircraft having a military purpose, deployment and actuation of armament disposed thereon has migrated to computer control as well. In fact, newer technologies have been developed for the specific purpose of providing guidance, tactical, and/or strategic control over these aircraft. These newer technologies have resulted in a plurality of differing types of peripheral devices that may be configured on the aircraft for use by the pilot.
Given the data intensive nature of these systems, various networking protocols have been developed in order to move data efficiently from among the multiplicity of peripheral devices. One particular networking protocol that has gained wide acceptance for military applications is the MIL-STD-1553 "Aircraft Internal Time-Division Command/Response Multiplex Data Bus". The MIL-STD-1553 databus was originally deployed on military vehicles such as aircraft during the early 1970's, an era in which the computing capabilities of most peripheral devices was relatively crude by today's standard. Due to these inherent computing limitations, the MIL-STD-1553 was designed to encompass a highly command and control type architecture with very deterministic type inter-process signaling.

Information layer for a vehicular control network and method


A system for medical emergency care and monitoring of a patient includes as its first component a patient holding apparatus with a fixed base and a table mounted on it, and the table protrudes past the base on the head end with a radio transparent first region and on the foot end with a radio transparent second region. There is also a CT scanner which is movable on the floor along a guide element in such a way that the second region of the table can be brought, by moving the CT scanner, into the patient opening of the CT scanner. For taking x-ray images in the first region of the table, there is an x-ray unit. Another component pertains to a guided patient board that is ridable on the table in the longitudinal direction.

The invention relates to a system for medical emergency care and monitoring of a patient.
In the diagnosis and treatment of critically injured patients, severely injured patients, or patients with multiple traumas, there is a need to be able to perform clinical processes within a very short time in order to minimize lasting damage to the patient and thus to minimize clinical follow-up and health care costs.
Typically, the patient is taken by emergency technicians to a so-called trauma room, where he is first physiologically stabilized by life-support measures. In some places, the first information on possible internal injuries is also collected using an ultrasound apparatus. After that, the patient is taken to radiology, for instance to take top views of the skull, cervical spine, chest, abdomen, and anterior-posterior and/or lateral views of the pelvis. Depending on how the hospital is equipped, these views are taken either with a conventional x-ray unit, partially supplemented by images from a computed tomography (CT) scanner, or the views are taken only with a CT scanner. If both a conventional x-ray unit and a CT scanner are used, the patient must as a rule be transferred from one table to another and moved to a different examination room. After his stay in radiology, the patient often returns to the trauma room for remaining stabilization, before finally being taken to an operating room or to a room in an intensive care unit. The numerous routes between different rooms and/or units of the hospital, and moving the patient from one table to another in every room are both time-consuming and not always wise for the health of the patient in view of his extremely severe injuries. Also, during the examinations and along the way there, it is not always possible to monitor the patient's vital functions continuously and to care for him adequately.
Various systems have become known in which various imaging equipment has been fused or combined into one joint system. From German Patent Disclosure DE 197 11 499 A1, for instance, a radiological diagnostic unit with a CT scanner and an x-ray unit have a common holding device. The holding apparatus is adjustable along a guide rail from a first position, associated with the CT scanner, to a second position, associated with the x-ray unit.
In German Published, Nonexamined Patent Application DE 198 53 463 A1, a plurality of multiple examination systems with many imaging systems have been disclosed; the imaging systems are disposed on a common support and can be associated with the patient's bed by moving the carrier relative to the bed of one of the imaging systems in succession.
U.S. Pat. No. 5,822,814 discloses a diagnosis and/or treatment system that has a C-arm device. The associated table can be pivoted outward 90° to allow a mobile "ring arm CT scanner" to be taken to the table. With this diagnostic and/or treatment system, a full-body scan of the patient is not possible.
German Patent DE 199 21 280 C1 shows a radiological diagnostic unit in which a CT scanner can also be operated as a conventional radiological diagnostic unit, in that the beam emitter that is present for the sake of the computed tomography can be associated with both a row detector for the computed tomography and a further beam receiver.
In a Siemens AG brochure entitled "SOMATOM Emotion, Balance, Esprit-Sliding Gantry", No. A91001-M2120-G151-01-7600, a system comprising a CT scanner and an x-ray unit is also described for angiography. Here, the patient holding apparatus has a table that protrudes past a base on one side. By moving the CT scanner, which is movable along a guide rail on the floor, the protruding part can be introduced into the patient opening of the CT scanner, so that CT images are possible. The angiography device can also be positioned in the region of the protrusion, to take corresponding images.

System for medical emergency care and monitoring of a patient


High-performance ultra-wideband Phased Array Sensors (PAS) are disclosed, which have unique capabilities, enabled through photonic integrated circuits and novel optical architectures. Unique capabilities for a Receive PAS are provided by wafer scale photonic integration including heterogeneous integration of III-V materials and ultra-low-loss silicon nitride waveguides, combining key component technologies into complex PIC devices. Novel aspects include optical multiplexing combining wavelength division multiplexing and/or a novel extension to array photodetectors providing the capability to combine many RF photonic signals with very low loss. The architecture also includes optical down-conversion, as well as digital signal processing to improve the linearity of the system. Simultaneous multi-channel beamforming is achieved through optical power splitting of optical signals to create multiple exact replicas of the signals that are then processed independently.

CMOS foundry based silicon photonics devices provide the opportunity for high volume, low cost devices; ideal candidates for use in Phased Array Sensor (PAS) systems, which require processing for 1000's of elements per antenna, supporting the use of large array Photonic Integrated Circuit (PIC) devices. Advances in photonic integration, including heterogeneous integration of III-V materials to fabricate lasers, linear modulators, and photodetectors; ultra-low-loss silicon nitride waveguides for high performance filters and time delay devices; and heterogeneous integration of magneto optic materials to create optical isolators; enable the design and fabrication of complex PIC devices that can provide unique capabilities for PAS systems that cannot be obtained with electronic technologies. This invention utilizes these advanced photonic devices integrated onto large size (wafer scale) PIC devices to enable a future generation of advanced PAS systems.


A packaging system comprising a trough and a packaging element separate therefrom for closing the trough, the packaging trough having an outer cardboard structure folded or formed from corrugated board with an insert of a single or multiple layer plastic film, the inner side of each side wall of the cardboard structure being connected by material means to the insert only in its upper part of the side wall, the insert forming a substantially identically shaped, but loose contact surface with the lower part of the inner side of each side wall down to the base of the packaging trough and the trough having at least one gas venting opening.

The provision of packaging systems which are suitable especially for the packaging of foodstuffs, in particular fresh or cooked meat, poultry or fish, meat products such as ham or sausages, or non-food products represents a particular challenge. The packaging systems must not only provide hygienic protection for the product during transport and storage but also allow the products to be presented in a manner that is appealing to the customer so that, for example, the customer is able to have a close look at the product.
In order to maintain the product quality—such as freshness and color—as optimally as possible and to extend the shelf life, the products are packed in the packaging systems, which preferably consist of a tray and a lid, preferably under an inert gas atmosphere in order to keep the oxygen content in the packaging as low as possible.
The known packaging systems, in particular in the field of the foodstuffs industry, comprise inter alia a tray of plastics material, which is usually not produced from renewable raw materials. Further disadvantages may be high carbon dioxide emissions and high water consumption during production, as well as high costs for disposal. This is also true of packaging systems in which the packaging tray consists of cardboard that is laminated with a plastics film over its entire surface and the laminated surface of which faces the packaged product.
The object of the present invention was, therefore, to provide a packaging system which does not exhibit the disadvantages of the packaging systems of the prior art, that is to say in particular a packaging system which provides an improved insulating action for protecting the packaged product, or the consumer during handling.
The packaging system is accordingly to be based as far as possible only on renewable raw materials, which preferably are at least recyclable.

Packaging system comprising a cardboard structure


Embodiments of the present invention include a camera having two modes: a visible light imaging mode (day-mode) and an IR imaging mode (night-mode). In the visible light imaging mode, an IR filter is in line with the lens assembly. In the IR imaging mode, the IR filter is mechanically removed, and IR light is allowed to pass to the sensor. In one embodiment, in the IR imaging mode, IR lighting is provided by an IR LEDs on the camera to illuminate the scene. In one embodiment, the various components are chosen, balanced and optimized so that images captured using visible light and images captured using non-visible light are both in focus. In one embodiment, an algorithm determines when there sufficient visible light is present and when it is not, and thus determines when to switch the camera from one mode to another.

1. Field of the Invention
The present invention relates generally to cameras, and more particularly to cameras for producing acceptable quality video data in varying lighting conditions.
2. Description of the Related Arts
One of the challenges for imaging capturing devices is to capture acceptable quality images in a variety of lighting conditions. Most image capturing devices are challenged by very low visible light or no visible light conditions.
Some conventional cameras have a "night mode" which can be used for capturing images in low light conditions. However, some of these conventional cameras simply increase the exposure time in the "night mode", so as to gather sufficient light in low light conditions. There are several problems with such cameras. For one thing, increase in the exposure time implies that it takes longer to capture each image. This can be unacceptable or undesirable in certain situations, such as in a security/surveillance camera where a delay in capturing an image can result in missed information. This can also be undesirable if a video stream is being captured, since this results in a lower frame-rate. Further, this solution alone still requires a certain amount of visible light to be present, and thus will not function in really low visible light or no visible light environments. Other conventional cameras may use other solutions which also suffer from several problems, and which again require at least a certain amount of visible light, and will not work in extremely low or no visible light environments.
There are some applications where it is critical to produce image (video and/or still) data all around the clock. One such application is a video surveillance camera system. In a 24 hour period, the lighting conditions change from night to day and then day to night again. Video surveillance cameras are often located in environments where the visible lighting is very low or non-existent at night time. It is therefore particularly difficult to produce good video in night conditions. Further, it is not desirable to use a visible light source on a surveillance camera—this may alert intruders, disturb neighbors, etc.
Some existing surveillance cameras have non-visible light sources, such as infra-red (IR) lighting using IR LEDs. IR lighting is invisible to the human eye, so the camera may remain stealthy, and will pose much less of a nuisance to the neighbors. However, such existing cameras have very big pixels so as to not have severe degradation of image quality when using IR. Thus such cameras have very poor resolution and thus produce poor quality images in many lighting environments, including when visible light is present.
IR light poses problems in normal (visible) lighting conditions. In normal lighting conditions, the lens and sensor (imager) in a camera are very sensitive to Infra-Red (IR) light. An imager is very sensitive to IR lighting because of the longer wavelength which penetrates deeper into the imager device substrate than visible light and washes the color out of the scene, creating a black and white picture. This is particularly problematic because in natural light, plenty of IR light is included with all the visible light.
In a cameras of high quality, images captured in adequate light (e.g., in the daytime) should look natural to the users with good color and sharpness, while at the same time images captured in low or no visible light conditions (e.g., night time without sufficient visible light) should also have acceptable quality. In cameras used in very low light scenarios or in no light scenarios (e.g., in a dimly illuminated environment or unlit environment at night), such as surveillance cameras, it is especially important that these cameras work well not only in brightly lit environments, but in such low light environments as well.
Thus there is a need for a camera that functions well not only in well-lit environments, but also in very low visible light or no visible light environments, and where the captured images remain in focus regardless of whether visible light is present or not. Further, it is desirable to have a camera that can function in a gamut of visible light environments, and can be switched from a sufficient visible light mode to an insufficient visible light mode in a simple and intuitive manner. Moreover, an algorithm is needed to determine whether the sufficient illumination with visible light is present and when it is not. Moreover, such a camera needs to have a compact form factor. Further still, such a camera needs to compensate for the different wavelengths and penetrating properties of visible and non-visible light.


According to one embodiment, a condition judging unit judges whether a target pixel corresponds to a defect condition based on a signal of the target pixel and a signal of a horizontal peripheral pixel. A signal substituting unit performs signal substitution on the target pixel corresponding to the defect condition. When the condition judging unit judges that at least one of a vertical peripheral pixel and an oblique peripheral pixel corresponds to the defect condition, the signal substituting unit stops the signal substitution on the target pixel.

In recent years, in solid-state imaging devices, pixels have been miniaturized with a high resolution of the pixels. Under such a circumstance, the solid-state imaging device may have a problem that a defective portion (hereinafter, appropriately referred to as a "defect") of a digital image signal caused due to a pixel which does not normally function occurs. In defect inspection at the time of manufacturing a solid-state imaging device, a product for which many pixel defects greater than regulations are recognized is treated as a defective product. However, as the regulations become stricter, a yield ratio of solid-state imaging device may deteriorate, and thus a manufacturing cost may increase. Accordingly, in a solid-state imaging device according to the related art, a method of causing a defect to be unnoticeable through signal processing in a defect correcting circuit is actively utilized.
The defect correcting circuit judges whether a target pixel to be subjected to defect correction is a defect by comparing a signal of the target pixel to a signal of a peripheral pixel located in the periphery of the target pixel. In regard to the process of judging whether the target pixel is a defect, for example, there is a known defect correcting circuit that uses a signal of a peripheral pixel located in a line including the target pixel and signals of peripheral pixels located in lines before and after the line. For example, a pixel with the same color as that of the target pixel is used as the peripheral pixel.
In order for the defect correcting circuit to perform such a process, the solid-state imaging device necessarily includes a line memory that stores a plurality of lines. By applying the line memory, the solid-state imaging device is able to perform the defect correction using the signals of the peripheral pixels included in the lines located before and after the line including the target pixel. However, there is a problem that a circuit size may increase. When it is judged whether the target pixel is a defect using only a target pixel and a peripheral pixel located in the line including the target pixel, the solid-state imaging device has a problem that erroneous correction may occur, although the circuit size is reduced.

Image processing device with defect correcting circuit and image processing method


Methods and systems for determining origin-specific network metrics in respect of a data network having at least one ingress node, the method comprising: receiving data items from outside the network; forwarding the data items with headers comprising fields for carrying origin information relating to the origin of the data item, and path metric information indicative of a characteristic being monitored; causing the data items to traverse the network; updating the fields carrying path metric information as the data items traverse the network; determining the origin information and path metric information after the data items have traversed the network and deriving in dependence thereon an origin-specific path metric relating to the characteristic in respect of the relevant portion of a path across the network; and combining origin-specific path metrics derived in respect of different data items if they relate to characteristics in respect of data items having a common origin. Also, methods and systems for determining target-specific network metrics in respect of a data network having at least one egress node.

Network owners and operators would like to be able to make customers accountable for any problems they cause to their network. One of the biggest problems for most networks is path congestion. When a network is congested then it is not able to provide good service to any of the customers of that network and thus its reputation may suffer. Accountability is generally done on the basis of the volume of traffic passed into the network by a given customer. Mechanisms allowing for collection of network path characteristics such as level of congestion are useful as such information may be used for more accurate accountability purposes. Such characteristics may also give advance notice of potential problems in the network and may enable the network to react to problems before they become too severe.
We start by presenting some basic concepts to facilitate the understanding of the mechanisms that are presented further on.
Packets
Data networks usually split the data they carry into small units known as packets. The actual communication between endpoints is controlled by various communication protocols. Each communication protocol required to carry the data across the Internet adds a header that contains the required information to enable the data exchange between the end hosts (usually a source host and a destination host). In the Internet, one of the most common types of packet consists of a payload that contains the data generated by an application running at the source, encapsulated by a Transmission Control Protocol (TCP) header which ensures the reliable delivery of the data, encapsulated again by an Internet Protocol (IP) header, which ensures that the data reaches the destination host for which it is aimed. The TCP header includes a unique sequence number (to allow the data to be reconstructed at the destination) and the IP header includes the IP addresses of the source and destination host.
Distributed Bandwidth Sharing and Congestion
Data traversing the Internet will follow a path between a series of routers, controlled by various routing protocols. If many paths need to use the same router in the network, this router can get congested (packets experience delays whilst using that network path). If sources persisted sending traffic through that router it may become overloaded or even fail. If sources still persist in sending traffic around this bottleneck it could force more routers to fail, and if the phenomenon keeps spreading, that can lead to a congestion collapse for the whole Internet—which occurred regularly in the mid-eighties.
The solution to that problem has been to ensure that sources take responsibility for the data-rate they send over the Internet by implementing congestion control mechanisms. Sources monitor path characterisation metrics to detect when the path their data is following is getting congested, in which case they react by reducing their throughput—while they usually slowly increase it when there is no sign of the path getting congested.
The typical path characterisation metrics sources monitor are the average roundtrip time (RTT) for the data path, the variance of the roundtrip time (referred to as jitter), and the level of congestion on the path, which is the primary parameter influencing the data-rate adaptation of a source sending data over a congested path.
The congestion level can be signalled either implicitly (through congested routers dropping packets) or explicitly (through mechanisms such as explicit congestion notification—see next subsection). Recently the most common option has been implicit signalling. Historically, routers would drop packets when they got completely saturated (which happens when a traffic burst cannot be accommodated in the buffer of the router). This policy is called "Droptail". The problem with this is that it can lead to a phenomenon known as global synchronisation which reduces the overall efficiency of the network. An improvement has been proposed whereby routers monitor the average queue length in their buffer. When this is higher than a given threshold, the router starts to drop packets with a probability which increases with the excess length of the queue over the threshold. This policy is called Random Early Detection (RED). It is widely used in today's internet because it allows sources to react more promptly to incipient congestion. Sources using TCP are able to detect losses because a packet loss causes a gap in the sequence; whenever a source detects a loss, it halves its data-rate, which alleviates the congestion on the router at the bottleneck.
Explicit Congestion Notification
Explicit Congestion Notification (ECN) [ECN] further improves on RED by using a two-bit ECN field in the IP header to signal congestion. It runs the same algorithm as RED, but instead of dropping a packet, it sets its ECN field to the Congestion Experienced (CE) codepoint. The ECN standard requires the sender to echo any congestion mark signalled in the data; for instance, a TCP receiver sets the Echo Congestion Experienced (ECE) flag in the TCP header, which the TCP source interprets as if the packet has been dropped for the purpose of its rate control. In turn the source will reduce its data-rate and will set Congestion Window Reduced (CWR) in the TCP header of the next packet.
The four values of the two-bit ECN field are:                Not-ECT (Not ECN Capable Transport), which signifies that the packet belongs to a flow that doesn't support ECN        ECT(0) and ECT(1), which signify that the packet belongs to a flow that supports ECN but and that upstream routers haven't had to mark the packet.        (CE) Congestion Experienced which signals to the receiver that a packet has experienced congestion along its path.IP Tunnels
In the context of a data network, tunnelling consists of encapsulating one protocol header inside another protocol header. The aim is to improve the network service, for instance in terms of connectivity (it may allow data to get across a network it couldn't get across otherwise) or of security (the data may be encrypted so it cannot be used if it is intercepted).
A special case of tunnels are IP-in-IP tunnels where the original header is retained intact, and simply encapsulated in another standard IP header, at the entrance of the tunnel. The outer IP header source and destination addresses identify the "endpoints" of the tunnel while the inner header preserves the original source and destination addresses for the packet. As the packet traverses the tunnel, the outer header may be modified as the header of any other packet on the same path. When the packet reaches the other end of the tunnel, decapsulation occurs: the outer header is stripped off, the original header fields are updated if necessary and the packet is forwarded to its originally-intended destination.
Re-Feedback
The re-Feedback proposal [Briscoe05c] provides a mechanism whereby the congestion information that a receiver sends back to a source can be re-inserted into the forward data path, thus allowing nodes along the path to see downstream congestion information as well as upstream information. This allows network providers to trace the source of any congestion and hold appropriate customers to account for this congestion. The proposal also outlines how a similar mechanism could work for other characterisation metrics such as RTT.
Pre-Congestion Notification
Pre-Congestion Notification (PCN) [PCN] is a mechanism for protecting the quality of service of certain flows within a given region of the network. Flows are only admitted to the network if they won't cause too much congestion. In order to work out if a flow can be admitted, the incipient congestion inside the network is monitored. This allows the ingress node to predict what the edge-to-edge congestion will be for any given flow asking for admission.

British Telecommunications public limited company


A subsea boosting module for use with an alternating current (AC) power system includes a housing defining at least one interior chamber. A fluid pump is disposed within the interior chamber. An electric motor is disposed within the interior chamber and drivingly coupled to the fluid pump. A plurality of power components is disposed within the interior chamber to deliver power to the electric motor.

This description relates to subsea boosting, more particularly, to systems and methods for subsea boosting in high-voltage direct current (HVDC) and/or high-voltage alternating current (HVAC) transmission and distribution systems.
As oil and gas fields in shallow waters diminish, producers are tapping offshore fields in deeper waters with oil installations that operate far below the surface of the sea. The typical equipment for such subsea oil recovery and production include gas compressors and various pumps for multiple functions. Electric variable speed drive (VSD) and motor systems are one way to power such equipment directly under the deep water. Therefore, the delivery of electric power from a remote onshore utility grid or power generation is important to secure a reliable production and processing of oil and gas in subsea locations. Typically, the transmission power requirement is up to several hundred megawatts for medium to large oil/gas fields.
Alternating current (AC) transmission and distribution systems are one technology suited for delivery of power to subsea locations. Such systems typically deliver AC power from a platform or onshore location to a large subsea transformer through a large power cable. Power is transferred from the subsea transformer to subsea AC switchgear through another power cable. The subsea AC switchgear feeds AC power to one or more subsea VSDs via yet another cable. The VSDs each provide variable AC power to electric motors via a power cable. The connections between components in subsea AC distribution systems typically require wet mateable connectors, which are significantly more complex and expensive than dry mateable connectors. In addition, the power requirement and thus the size of components in subsea boosting systems has generally increased over time. Some known systems utilize three to five megavolt-ampere (MVA) pumps, each of which may weigh more than ten tons. Other components in known subsea boosting systems and/or AC transmission and distribution systems are also very large and/or heavy. Moreover, some AC transmission and distribution topologies face technical challenges, which become more significant when transmission distance is in excess of fifty kilometers.

Methods and systems for subsea boosting with direct current and alternating current power systems


A digital-to-analog converter (DAC) for generating an analog output voltage according to a digital input value includes a plurality of pulse width modulation (PWM) units and a voltage generating unit. The digital input value includes a plurality of bit segments. The plurality of PWM units generates a plurality of PWM signals according to the plurality of bit segments of the digital input value. The voltage generating unit is coupled to the plurality of PWM units and generates the analog output voltage according to the plurality of PWM signals.

1. Field of the Invention
The present invention relates to a digital-to-analog converter (DAC), and more particularly, to a DAC that is realized by a plurality of pulse width modulation (PWM) units, and a method thereof.
2. Description of the Prior Art
A digital-to-analog converter (DAC) is a device that converts a digital input value into a corresponding analog output voltage, which is then supplied to a backend circuit. For example, in a television (TV) system, after the user has chosen a TV channel, the TV system determines a digital input value according to the chosen TV channel. A DAC is utilized to convert the digital input value into an analog output voltage, which is then supplied to a TV tuner and allows the TV tuner to process received TV signals accordingly.
With technological advances, electrical products demand higher and higher resolutions on DACs. More specifically, a DAC is required to generate an accurate analog output voltage according to a digital input value with increased bit counts. However, the cost of a high resolution DAC is usually much higher than that of a low resolution DAC. Since cost is always a critical concern when manufacturing electrical products, reducing the costs of high resolution DACs has becomes a desire of manufacturers of electrical products.

Digital-to-analog converter (DAC) using multiple PWMs and method thereof


The invention relates to a luminaire (20) for work events, film events or sports events. According to the invention, in order to produce a robust and simple construction of a luminaire (20), while also providing high flexibility in the use thereof and reduced power consumption, the at least one LED module (1) of such a luminaire (20) has an approximately triangular, flat basic form, a lateral surface being fitted with LEDs, preferably power LEDs, and the rear side of the LED module (1) being designed to emit thermal radiation. Connecting elements are formed on one of the side edges, which connecting elements are used by means of suitable retaining elements (21) to construct the luminaire (20). The particular advantage of the luminaire (20) is that high light intensity can be achieved in the field of use of the luminaires (20), namely for work events, film events or sports events. Because of the pivotability of individual LED modules (1), the area to be illuminated can additionally be influenced.

The invention relates to a luminaire for work events, film events or sports events, comprising at least one retaining element to which at least one LED module is pivotably fastened and can be supplied with a voltage via leads.
Luminaires are offered in a variety of types, for example as interior luminaires in the form of ceiling- or wall-mounted luminaires. The luminaires may accommodate one or more lamps which can be supplied with voltages. The luminaires consist either of glass, ceramics, or plastics, wherein a lampshade can be additionally provided which optionally has a frame with a fabric cover. Apart from this, recessed luminaires are known which are embedded either into a wall or into a ceiling. All of these luminaires are mainly usable indoors. Furthermore, there are various housing shapes for luminaires which are employed outdoors, for example as gardening illumination or house illumination in the form of recessed luminaires, wherein an assembly of the recessed luminaires can be accomplished in a roof superstructure or in an entrance area. Moreover, watertight designs of various gardening luminaires are embedded into the ground or existing terrace surfaces. In the external area, it is necessary for this to observe the regulations in view of humidity protection. Many of the luminaires are provided for stationary assembly and are not transportable.
Apart from this, there is a market for high-performance luminaires which are used, for example, for illuminating working areas, or as film equipment or in sports events. In such cases, high light intensity is important, as such luminaires are typically arranged at rather great heights of more than 3 m, in individual cases even above 10 m. Moreover, such luminaires might be fastened to a stand and can thus be positioned for the different intended applications at the required height.
Due to amendments to the regulations and, in some cases, the elimination of lamps, for example halogen lamps, it is necessary to develop a new luminaire concept which is mainly directed to LEDs. On the one hand, light intensity is to be increased thereby, and on the other hand, power consumption is to be reduced as much as possible.

Luminaire for work events, film events or sports events


Systems and methods are provided for enabling interaction between a user and a software probe inserted into application code for monitoring and testing application performance. Communications are initialized with the software probe and a user interface is provided to the user. Command data is received from the user through the interface and forwarded to the software probe. In response, data communications are received from the software probe.

Software debugging and testing are difficult and time-consuming tasks. While these tasks are vital to the success of an application programming project, they can add significant time and cost to the project. In order to mitigate these time and money costs, a variety of testing tools are available to the application testing engineer to enable him to function more efficiently. One such testing tool is a software probe. A software probe, such as OC System's AProbe™, allows a user to temporarily add code to a software product without modifying the product's code base allowing the capture of performance metrics as an aid in identifying off-nominal application function. Enclosed herein are systems and methods for improving the usability of instrumented software probes including a user interface facilitating real time interaction with an executing software probe, a code injection mechanism allowing a user to inject and execute code segments into an executing software probe, and a visualization aid improving the readability of commonly captured metrics. These improvements advance the goal of more efficient software debugging and testing by improving testing engineer cost and time efficiency.

Systems and methods for interactions with software probes


A unit of the cardboard pallet is formed by a single piece of cardboard. First, the two side portions are folded up towards the centerline. Then, the cardboard piece is folded up along the centerline. Next, the two end portions are folded outwards to a right angle. Now, a unit with a “T” shaped cross section and an enhanced strength is formed.

1. Field of the Invention
The invention generally relates to several folding methods for cardboard pallets. More particularly, the invention relates to several folding methods by which structurally simple, easy-to-assemble cardboard pallets with an enhanced strength may be formed with a low production cost.
2. Description of the Prior Art
The bottom supporting structure of a conventional goods-carrying box is typically made of foam because foam is light, sturdy and inexpensive. Because foam is not bio-degradable and sends out poisonous fume when burned, it is quite environmentally unfriendly. Hence, if the use of foam is not banned, it may cause serious impacts on the environment.
Hence, many countries have banned the use of foam. Other materials have been used to replace foam as the bottom supporting structure of a box. As of now, wood and metal have been used for this purpose. Though the bottom supporting structure made of wood or metal has a great strength and hence may be used to carry heavy goods, such structure is relatively heavy and hence requires a higher transport cost; in addition, it is more difficult to recycle such structure.
Hence, cardboard pallet has been used for this purpose. The only disadvantage of the cardboard pallet of the prior art is its lack of strength because it is made of a single layer of cardboard; hence, such pallet can not be used to carry heavy goods. An improved cardboard pallet is made of several layers of cardboard; however, such pallet is more difficult to produce because several layers of cardboard need to be glued together and one or more slots need to be provided. Whence, the production cost of such improved cardboard pallet is quite high.
To eliminate these disadvantages, the inventor put a lot of effort in the subject and has successfully come up with the folding methods of the present invention by which structurally simple cardboard pallets with great strength may be formed.


A surgical instrument comprises a handle having a blade proximate a distal end of the handle. A blade edge inset from a mouth of the recess is exposed within the recess and faces at least partially toward a proximal end of the handle with the blade edge inset from a mouth of the recess. The distal end further comprises a point bounding a portion of the recess and facing at least partially toward the proximal end of the handle. Methods of use are also disclosed.

Obstetric surgeries involve the initiation and completion of one or more incisions, typically as in the case of a caesarean section, through a mother's abdomen (termed a laparotomy) and uterus (termed a hysterotomy) for delivery of one or more babies. Historically, a caesarean section was used as a last resort, in situations when a vaginal delivery was deemed to pose a health risk to the mother or baby. For example, during prolonged labor or a failure to progress to a normal delivery, fetal distress, umbilical cord prolapsed, uterine rupture, hypertension (mother or baby) after amniotic rupture, tachycardia (mother or baby) after amniotic rupture, placental problems, breach or transverse presentation of the baby, failed labor induction, an overly large baby, umbilical cord abnormally, among others. Other complications of pregnancy, preexisting conditions of the mother, and concomitant disease may also indicate the desirability or necessity of a caesarean section.
In recent years, however, caesarean sections have become far more popular, and now comprise a substantial minority of deliveries in the U.S. and abroad. As a consequence, the risks associated with caesarean sections have drawn more attention from the medical community.
In a conventional caesarean section procedure, an abdominal incisions is made, followed by either a midline longitudinal incision in the uterus or, more typically at the present, a lower uterine segment incision. The latter comprises a transverse cut just above the edge of the bladder, and results in less blood loss and facilitates repair, in comparison to the former. In either case, the incisions are typically made with a conventional scalpel, with which the depth of incisions may be difficult to control in some situations, even for a skilled surgeon. In addition, effecting an initial incision requires two acts: first, the scalpel tip is used to perforate the wall of the uterus, followed by reversal of the scalpel in the surgeon's hand to complete the incision. As a consequence, not only is continuity of grip on the scalpel compromised, but also the potential arises for injury to the surgeon, mother and fetus from the scalpel due to a momentary lack of complete control of the instrument.
Attempts to alleviate the aforementioned disadvantages of a conventional scalpel is described in U.S. Pat. No. 7,818,885 to Lafauci et al. Unfortunately, the surgical devices disclosed in the '885 patent require a motion to implement that is foreign to the manner in which surgeons are trained to employ a scalpel. Specifically, not only is a tip, characterized as a "beak," of a surgical device pointed away from the surgeon when an initial tissue perforation is made, but the incision is completed by pushing the surgical device away from the surgeon rather than being drawn toward him or her in a controlled manner and wherein the blade and tissue being incised are more visible.


The invention relates to composite components and methods of producing composite components. In yet another embodiment, the present invention relates to a method of producing a composite component using anaerobically digested biomass. In still yet another embodiment, the method further comprises using liquid effluent from the digester. In still yet another embodiment, the method further comprises wet-mat forming and cold pressing the anaerobically digested biomass and wet-mat drying under heat and pressure.

Livestock confinement facilities generate large amounts of animal waste that can create serious environmental and human health concerns. For example, animal waste constituents such as organic matter, nitrogen, phosphorus, pathogens and metals can degrade water quality, air quality, and adversely impact human health. Organic matter, for example, contains a high amount of biodegradable organics and when discharged to surface waters will compete for, and deplete the limited amount of dissolved oxygen available, causing fish kills and other undesirable impacts. Similarly nutrient loading from nitrogen and phosphorus can lead to eutrophication of surface waters.
The annual accumulation of organic waste in the world is immense. There are approximately 450,000 Animal Feeding Operations ("AFOs") in the United States. Common types of AFOs include dairies, cattle feedlots, and poultry farms. A single dairy cow produces approximately 120 pounds of wet manure per day. The waste produced per day by one dairy cow is equal to that of 20-40 people. If properly stored and used, manure from animal feeding operations can be a valuable resource.
Anaerobic digesters can be used to process waste fibrous material, such as wood and manure, and convert the material into biogas composed of methane, ammonia, and CO2, and remaining fibrous residuals. The biogas, primarily methane, can be used to produce electricity. The remaining residual fibrous material has been used for cow bedding, land nutrient amendment, or as compost. Large dairies have an abundance of this remaining fibrous material and managers of these dairies would like to have a value-added outlet other than bedding or land application.
Others have experimented with digester solids to determine what type of products could be made from the material; however, to date, methods used to convert fibrous material into other products have been limited. Most experiments have focused on drying the residual material, then combining it with adhesive, and possibly wood, to make an air-laid dry-formed composite board. Others have combined the residual material with plastic to extrude it into various outdoor products. However, these products have been limited in size, shape, strength, utility and industrial applicability.
Therefore, methods that can convert the fibrous residual material into a product of value, such as a composite component, would be extremely useful.

Composite components from anaerobic digested fibrous materials

The United States of America as Represented by the Secretary of Agriculture