A shock absorber according to the present invention for use in a vehicle for cushioning a vibration generating between a vehicle body and an axle, in which a suspension spring is disposed between one member which may serve as a mass below the spring and the other member which may serve as a mass above the spring, has an apparatus for adjusting the height of vehicle permits its mounting length to be adjusted without changing an initially set load of the suspension spring while being relatively displaced with respect to the one member so that a stroke of the shock absorber may be changed.

In the latest automatic two-wheeled vehicle, an apparatus for adjusting a height of the vehicle has often been provided so that rider's feet cannot only reach the ground to stop the vehicle when running on the urban area but also a performance of the vehicle as covering a wasteland may be improved. There have conventionally been two kinds of a rear cushion type apparatus: one is a type in which an initially set load can be changed and the other to a type in which its entire length can be changed.
A rear cushion having an apparatus for adjusting the height of vehicle, in which the initially set load can be changed, is known from, for example, U.S. Pat. No. 4,159,105. Its schematic views are shown in FIGS. 10 to 12, in which reference numeral is a damper cylinder, 2 a piston, 3 a piston rod, 4 a suspension spring, 5 a rebound spring, 6 a stopper rubber, 7 a member for mounting the piston rod 3, around which a cylinder 11 for adjusting the height of vehicle is formed as one member for adjusting the height of vehicle. 8 is a mounting member used for either one of the vehicle body and axle, 9 the other remaining mounting member used for the vehicle body or axle, 10 a piston for adjusting the height of vehicle, which is arranged as the other member for adjusting the same, the piston vertically sliding within the above-mentioned adjusting cylinder, with one end of the suspension spring supported thereagainst. FIG. 10 relates to a state in which the suspension spring 4 is set to be slightly compressed in an initially loaded state, i. e., when the piston rod 3 is withdrawn to maximum extent out of the cylinder until the rebound spring 5 is completely compressed, the state being one in which the shock absorber is extended to maximum extent. FIG. 11 illustates a state in which since a rider rides on the vehicle the suspension spring 4 is compressed from a position of FIG. 10 and a mounting length is shortened and yet the height of vehicle is not adjusted yet, the state being suitable for running on the urban area because his feet can reach the ground. FIG. 12 illustrates a state in which when the rider rides on the vehicle and runs into a wasteland a hydraulic oil is supplied into the cylinder for adjusting the height of vehicle formed about the member 7 for mounting the piston rod to outwardly displace the member 7 with the result that the height of vehicle is increased from L.sub.1 to L.sub.2. l.sub.t is a total stroke, l.sub.1 a compession stroke, and 1.sub.2 a rebound stroke. (Actually, although the stroke l.sub.t equals a value obtained by deducting a compressed length of the rebound spring and the basic lengthes assumed by, for example, an oil seal and rod guide and the like at the end of a bore of the cylinder, in this case, it is represented as such including them for convenience of description. Unless otherwise specified, the same applies to the following part of this specification.)
If a displacement vs. load curve of the suspension spring is graphically plotted in which an initial load is set, then K.sub.1 is obtained as in FIG. 13. I.sub.1 is the value of the initial load If the initiallly set load is varied from I.sub.1 to I.sub.2, then the displacement vs. load curve is plotted as K.sub.2. If the piston 10 for adjusting the height of vehicle is now upwardly displaced from a position of the lower end within the cylinder of FIG. 11 to increase the initially set load of the suspension spring, then, since the load applied to the suspension spring is the same as before adjusting the height of vehicle, the piston rod is withdrawn by that displacement of the piston 10 from a damper cylinder 1 to increase the height. Consequently, the rider will feel rather stiff to ride on the vehicle because the initiallly set load of the suspension spring is increased. Besides, since the total stroke l.sub.t of the hydraulic shock absorber remains the same before (FIG. 11) and after (FIG. 12) the height is increased, even if he increases the height of vehicle after he runs into the wasteland, a great shock cannot be absorbed. Further, although the total stroke l.sub.t remains the same before and after the height is increased the position of the piston in an unloaded state is changed and the distributions of stroke at the compression and extension sides become different with each other. As a result, they respectively assume a relationship of the strokes: compression side stroke l.sub.1 ' and the rebound stroke 1.sub.2 ', and when the height of vehicle is increased, then the rebound stroke is shortened, which causes a frequency at which the piston strikes against the rebound spring to be increased with the result that a proper cushioning performance cannot be achieved.
Further, another hydraulic shock absorber having a height adjusting apparatus of a type in which a full length may be changed is known from. for example, Japanese Patent Laid-open 79776/1980. Its schematic views are shown in FIGS. 14 and 15. 21 is a damper cylinder, 22 a piston, 23 a piston rod, 24 a suspension spring, 25 a rebound spring, 26 a rubber stop, 27 a spring bearing rigidly fixed along the outer periphery of the piston rod, 28 a mounting member for either side of the body and axle of a two-wheeled vehicle, 29 a mounting member for the other side of the body or axle, 30 a piston for adjusting the height of vehicle serving as one member for adjusting the same, which is fixed to the upper end of the piston rod, 31 a cylinder for adjusting the height of vehicle, which is arranged as the other member for adjusting the same and 32 a spring bearing fixed to the outer periphery of the cylinder. When, in a state prior to increase of the height of vehicle, in which a rider rides, as shown in FIG. 14, a hydraulic oil is supplied to the upper port of the cylinder 31, assuming for ease of understanding that the piston rod 23, hence, the piston 30 stands still and only the cylinder 31 is elevated, the height of vehicle is increased as shown in FIG. 15, so that the mounting length is increased from L.sub.1 to L.sub.2. As a result, since the initially set load of the suspension spring remains the same, when the height of the vehicle is increased, the rider can experience the same feeling as when he runs on the flat urban area, but since the total stroke l.sub.t remains the same, a possible major thrust from below, which can often be experienced during running on the wasteland, cannot be absorbed, as in the case of the above-described shock absorber in which the initially set load can be changed. Besides, since the mounting length is made longer by a stroke of the piston 30 as the shock absorber is compressed to maximum extent after the height of vehicle is increased, a large space becomes necessary between the body of vehicle and the axle.
Also, in the conventional apparatus for adjusting the height of vehicle for use in a front fork of the two-wheeled vehicle, there are two types: a type in which the initially set load can be changed and a type in which the entire length can be changed.
The front fork of a type in which the initially set load may be changed is known from, for example, Japanese Utility Model Laid open 160890/1983, which is illustrated in FIGS. 16 to 18. In the same figures, 41 denotes an inner barrel, 42 an outer barrel, 43 a sheet pipe, 44 a suspension spring, 45 a rebound spring, 46 a piston for adjusting the height of vehicle and 47 a cylinder for adjusting the height of vehicle. FIG. 16 shows a state in which an initially set load is set, i. e., a state in which the suspension spring 45 is slightly compressed with the height of vehicle not adjusted as the inner barrel is withdrawn to maximum extent and the rebound spring 45 is completely compressed. FIG. 17 shows a state in which when a rider rides on a two-wheeled vehicle having a front fork of FIG. 16 and the suspension spring is compressed the height of vehicle is not adjusted, which is suitable for running on a flat urban area. FIG. 18 shows a state in which as a rider rides on a two-wheeled vehicle and runs on a wasteland a hydraulic oil is supplied to a cylinder 47 for adjusting the height of vehicle formed at a fork bolt 48 of an inner barrel 41 to displace the inner barrel 41 with respect to an outer barrel 42 with the result that the height of vehicle is increased from L.sub.1 to L.sub.2. l.sub.t is a total stroke. Actually, its value becomes equal to a value obtained by deducting a basic lengh assumed by, for example, an oil lock collar at the tip end of the inner barrel and the compressed lengthes of the rebound spring and the like. However, in this embodiment, it is generally represented as l.sub.t for convenience of discription. Unless otherwise specified, the same also applies to the following part of specification.
If a displacement vs. load curve of the suspension spring is graphically potted as the initial load of FIG. 16 is set, then K.sub.1 is obtained as seen in FIG. 19. I.sub.1 is the value of the initially set load. If the initially set load is changed from I.sub.1 to I.sub.2, then the displacement vs. load curve of the suspension spring is shifted to K.sub.2. Now let us assume that in order to increase the height of the vehicle the piston 46 of FIG. 17 is downwardly displaced from the upper end position within the cylinder 47 to increase the initial load imposed on the suspension spring 44, then, since the load imposed thereon is the same as before adjusting the height of vehicle, the inner barrel is withdrawn by a displacement of the piston 46 from the outer barre with the result that the height of the vehicle is increased. In consequence, the rider can feel rather stiff to ride on the vehicle by such an increased initial load of the suspension spring.
Besides, since the total strokes l.sub.t of the hydraulic shock absorber are the same before(FIG. 17) and after (FIG. 18) the height of vehicle is increased, even if he runs into the wasteland and accordingly increases the height of vehicle, it cannot absorb large shocks. In addition, although the total strokes l.sub.t remain the same before and after the height of vehicle is increased, the position of the stroke of the piston in the condition of an unloaded state is altered, so that the distributions of the stroke become different at the compression and extension sides, and when the height of vehicle is increased as in FIG. 18, then the rebound stroke l.sub.2 ' is shortened, which causes a frequency at which the piston strikes against the rebound spring to be increased with the result that a proper cushioning performance cannot be achieved.
Further, a front fork provided with an apparatus for adjusting the height of vehicle of a type in which the entire length can be changed is known from, for example, Japanese Patent Publication 23036/1988. Its schematic views are shown in FIGS. 20 and 21. In this embodiment, a screw rod 57 is screwed into a cap 56 at the upper end of an inner barrel 51, this screw rod being rotatably mounted to a sliding pipe 58 which may slidably fit with the outer circumference of the inner barrel 51 by means of a handle 59. In a state of FIG. 20, prior to increase of the height of vehicle, in which a rider rides and runs into the wasteland, for ease of understanding, let us assume that the inner barrel 51 stands still, a handle 59 is turned so that the sliding pipe 58 may upwardly be moved. At this time, the mounting length of the front fork is increased from L.sub.1 to L.sub.2 as the suspension spring is compressed to maximum extent. At this time, since the initially set load of the suspension spring 54 remains the same, the rider can experience the same feeling as when the height of vehicle is increased as when he runs on the flat urban area, but since the total stroke l.sub.t remains the same, a large thrust from below cannot be absorbed when he runs on the wasteland as in the above-described type in which the initially set load can be changed. In addition, since the mounting length of the front fork, which is compressed to maximum extension after the height of the vehicle is increased, becomes larger by a stroke of the sliding pipe 58 than before the height of vehicle is increased, a large space can become necessary between the vehicle body and the tire.
Accordingly, it is a principal object of the present invention to provide a novel shock absorber for use in a vehicle in which drawbacks inherent to the above-described two types are eliminated, i.e., the initially set load is also not changed a the height of vehicle is increased and the total stroke is made longer while at the same time the rebound stroke remains the same and yet the mounting length of the absorber assumed as compressed to maximum extent also remains the same.
Another object of the present invention is to provide a novel shock absorber having an apparatus for manually adjusting the height of vehicle for use in a vehicle, in which the initially set load of the suspension spring is not changed as the height of vehicle is increased while at the same time the stroke of piston is made longer and yet the mounting length of the shock absorber assumed as compressed to maximum extent is not also changed.
A further object of the present invention is to provide an inexpensive shock absorber having a hydraulic drive source for driving an apparatus for adjusting the height of vehicle for use in a vehicle, in which the initially set load of the suspension spring is not changed a the height of vehicle is increased while at the same time the stroke of piston is made longer and yet the mounting length of the shock absorber assumed as compressed to maximum extent is not also changed, said apparatus using a combination of a pressure tank and a check valve in place of an electromotive hydraulic pump.


A method of using a computer processor for grouping prosthetic valve leaflets of an aggregate of prosthetic valve leaflets is provided. For each leaflet of the aggregate, in response to an image parameter of the leaflet, a leaflet-flexibility value is derived. At least some of the leaflets of the aggregate are designated into leaflet groups, based on similarity between the respective leaflet-flexibility value of each leaflet of the aggregate. For each of the designated leaflet groups, the flexibility value of each leaflet in the designated leaflet group is within the intra-group tolerance with respect to the leaflet-flexibility value of each other leaflet in the designated leaflet group. An indication of the designated leaflet groups is outputted. Other embodiments are also described.

Prosthetic heart valves may be constructed of a frame to which prosthetic leaflets are attached, the leaflets providing check-valve functionality by opening in response to blood flow in a first direction, and closing in response to blood flow in a second direction. In order to inhibit leakage ("regurgitation") of blood between the closed leaflets in the second direction, it is important that the leaflets coapt well against each other. One factor facilitating coaptation of leaflets in a prosthetic heart valve is flexibility of leaflets.

This patent is subject to a terminal disclaimer.


A female connector and a plug-in connector comprising the female connector and a male connector that can be coupled to the female connector. The female connector includes a first end configured for being attached to a pipe or a hose and a second end configured for being connected to the male connector. The second end including elastic retention means configured for retaining the male connector inside the female connector. The female connector also includes a non-removable cover arranged at the second end of the female connector covering the retention means, preventing the retention means from being able to be manipulated from the outside of the plug-in connector.

Plug-in connectors comprising a female connector and a male connector are known, wherein each connector is fixed at one end to a pipe or a hose, the adapters interacting with one another for fluidically joining both pipes/hoses in a fast and efficient manner.
In connectors of this type, the free end of the female connector tends to comprise retention means cooperating with the male connector for retaining it inside the female connector. During insertion of the male connector, the retention means is elastically deformed and returns to its original position when the retention means contact a recess or groove arranged in the male connector, such that the male connector is retained by the elastic means.
In this sense, EP1671058 A1 discloses a plug-in connector for pipes and hoses formed by a male connector and a female connector. The male connector comprises a retention step surrounding the outer perimeter and comprising a slope that increases from the outer perimeter and a retention surface arranged thereafter behind the slope. The female connector comprises a U-shaped retention spring cooperating with the retention step. When the male connector moves forward in the direction of insertion, the slope pushes the retention spring which slides in the radial direction. When the retention spring contacts the retention surface, the retention spring returns to its original state retaining the male connector.

Female connector of a plug-in connector and plug-in connector


In the pattern formation method of this invention, a resist film is formed by applying, on a substrate, a pattern formation material containing a polymer including a first unit represented by Chemical Formula 1 and a second unit represented by Chemical Formula 2, and an acid generator,

The present invention relates to pattern formation material and method. More particularly, it relates to a pattern formation method employed for forming a resist pattern, used for forming a semiconductor device or a semiconductor integrated circuit on a semiconductor substrate, by using exposing light of a wavelength of a 1 nm through 30 nm band or a 110 nm through 180 nm band, and a pattern formation material used in the same.
Currently, in fabrication of a mass storage semiconductor integrated circuit, such as a 64 Mbit dynamic random access memory (RAM) and a logic device or a system LSI with a 0.25 xcexcm through 0.15 xcexcm rule, a resist pattern is formed by using a chemically amplified resist material including a polyhydroxystyrene derivative and an acid generator as principal constituents with KrF excimer laser (of a wavelength of a 248 nm band) used as exposing light.
Moreover, for fabrication of a 256 Mbit DRAM, a 1 Gbit DRAM or a system LSI with a 0.15 xcexcm through 0.13 xcexcm rule, a pattern formation method using, as exposing light, ArF excimer laser operated at a shorter wavelength (of a 193 nm band) than the KrF excimer laser is now under development.
The resist material including a polyhydroxystyrene derivative as a principal constituent has high absorbance against light of a wavelength of a 193 nm band because of an aromatic ring included therein. Therefore, exposing light of a 193 nm band cannot uniformly reach the bottom of a resist film, and hence, a pattern cannot be formed in a good shape. Accordingly, the resist material including a polyhydroxystyrene derivative as a principal constituent cannot be used when the ArF excimer laser is used as the exposing light.
Therefore, a chemically amplified resist material including, as a principal constituent, a polyacrylic acid derivative or a polycycloolefin derivative having no aromatic ring is used when the ArF excimer laser is used as the exposing light.
On the other hand, as exposing light for a pattern formation method capable of coping with high resolution, X rays, an electron beam (EB) and the like are being examined.
When the X rays are used as the exposing light, however, there are a large number of problems in the exposure system and preparation of a mask. Also, when the EB is used as the exposing light, the throughput is disadvantageously low, and hence, the EB is not suitable to mass production. Thus, neither the X rays nor the EB is preferred as the exposing light.
Accordingly, in order to form a resist pattern finer than 0.10 xcexcm, it is necessary to use exposing light of a wavelength shorter than that of the ArF excimer laser, such as Xe2 laser (of a wavelength of a 172 nm band), F2 laser (of a wavelength of a 157 nm band), Kr2 laser (of a wavelength of a 146 nm band), ArKr laser (of a wavelength of 134 nm band), Ar2 laser (of a wavelength of a 126 nm band) and soft-X rays (of a wavelength of a 13, 11 or 5 nm band). In other words, a resist pattern is required to be formed by using exposing light of a wavelength of a 1 nm through 30 nm band or a 110 nm through 180 nm band.
Therefore, the present inventors have formed resist patterns by conducting pattern exposure using F2 laser (of a wavelength of a 157 nm band) on resist films formed from conventionally known chemically amplified resist materials respectively including a polyhydroxystyrene derivative represented by Chemical Formula A, a polyacrylic acid derivative represented by Chemical Formula B and a polycycloolefin derivative represented by Chemical Formula C.
Now, a pattern formation method using any of the aforementioned conventional chemically amplified resist materials and problems of the method will be described with reference to FIGS. 2A through 2D.
First, as is shown in FIG. 2A, the chemically amplified resist material is applied on a semiconductor substrate 1 by spin coating and the resultant substrate is heated, thereby forming a resist film 2 with a thickness of 0.3 xcexcm. Then, as is shown in FIG. 2B, the resist film 2 is subjected to pattern exposure by irradiating with a F2 laser beam 4 through a mask 3. In this manner, an acid is generated from the acid generator in an exposed portion 2a of the resist film 2 but no acid is generated in an unexposed portion 2b of the resist film 2.
Then, as is shown in FIG. 2C, the semiconductor substrate 1 is heated with a hot plate at, for example, 100xc2x0 C. for 60 seconds.
Next, the resist film 2 is developed with an alkaline developer, thereby forming a resist pattern 5.
However, as is shown in FIG. 2D, the resist pattern 5 has a defective pattern shape, and much scum remains on the semiconductor substrate 1. Such problems occur not only in using the F2 laser as the exposing light but also in using another light of a wavelength of a 1 nm through 30 nm band or a 110 nm through 180 nm band.
Accordingly, a resist pattern cannot be practically formed by irradiating a resist film formed from any of the aforementioned chemically amplified resist materials with light of a wavelength of a 1 nm through 30 nm band or a 110 nm through 180 nm band.
In consideration of the aforementioned conventional problems, an object of the invention is forming a resist pattern in a good pattern shape with minimally producing scum by using exposing light of a wavelength of a 1 nm through 30 nm band or a 110 nm through 180 nm band.
The present inventors have studied the causes of the conventional problems occurring in using the aforementioned conventional chemically amplified resist materials, and have found the following:
First, the conventional chemically amplified resist materials have high absorbance against light of a wavelength of a 1 nm through 180 nm band. For example, a resist film formed from the chemically amplified resist material including a polyhydroxystyrene derivative as a principal constituent and having a thickness of 100 nm has transmittance of 20% at most against the F2 laser (of a wavelength of a 157 nm band). Therefore, various examination has been made on means for improving the transmittance of a chemically amplified resist material against light of a wavelength of a 1 nm through 180 nm band. As a result, the transmittance of a chemically amplified resist material against light of a wavelength of a 1 nm through 180 nm band can be improved by introducing a unit of a polymer having a cyano group (xe2x80x94Cxe2x89xa1N) on its side chain into a base polymer of the chemically amplified resist material.
Furthermore, when the aforementioned chemically amplified resist materials, particularly the resist material including a polyhydroxystyrene derivative, are irradiated with light of a wavelength of a 1 nm through 180 nm band, a reaction is caused regardless of the function of an acid, so that a hydrogen atom bonded to carbon located at the xcex1-position of the principal chain of the polymer can be released and that polymer radicals from which the hydrogen atoms are released can bond to each other to be crosslinked. As a result, the solubility of an exposed portion of the resist film in a developer is degraded. Therefore, means for preventing the crosslinking reaction of the principal chains of the polymer of the chemically amplified resist material has been variously studied. As a result, it has been found that the crosslinking reaction of the principal chains can be avoided by substituting an alkyl group or a chlorine atom for a hydrogen atom located at the xcex1-position of the principal chain of the polymer.
Moreover, when a cyano group is introduced to a side chain of the polymer, the cyano group interacts with a hydroxyl group based on a hydrogen bond. Therefore, the dry etching resistance and the heat resistance of the resist film can be improved, and an unexposed portion of the resist film can be more effectively prevented from dissolving in a developer, so as to improve the contrast between the exposed portion and the unexposed portion.
The present invention was devised on the basis of the aforementioned findings, and specifically provides pattern formation materials and methods described below.
The first pattern formation material of this invention comprises a polymer including a first unit represented by Chemical Formula 1 and a second unit represented by Chemical Formula 2; and an acid generator,
wherein R1 and R2 are the same or different and selected from the group consisting of an alkyl group such as a methyl group and an ethyl group, a chlorine atom and an alkyl group including a chlorine atom such as CCl3; and R3 is a protecting group released by an acid.
In the first pattern formation material, since the first unit has a cyano group, the transmittance against light of a wavelength of a 1 nm through 180 nm band can be improved, and since an alkyl group, a chlorine atom or an alkyl group including a chlorine atom is substituted for a hydrogen atom located at the xcex1-position of the principal chain of each of the first and second units, a crosslinking reaction is never caused in the principal chains, resulting in improving the solubility of an exposed portion of a resist film in a developer. Furthermore, since the first and second units have a benzene ring, the dry etching resistance can be largely improved.
The second pattern formation material of this invention comprises a polymer including a first unit represented by Chemical Formula 3, a second unit represented by Chemical Formula 4 and a third unit represented by Chemical Formula 5; and an acid generator,
wherein R1, R2 and R4 are the same or different and selected from the group consisting of an alkyl group such as a methyl group and an ethyl group, a chlorine atom and an alkyl group including a chlorine atom such as CCl3; and R3 is a protecting group released by an acid.
In the second pattern formation material, since the first unit has a cyano group, the transmittance against light of a wavelength of a 1 nm through 180 nm band can be improved, and since an alkyl group, a chlorine atom or an alkyl group including a chlorine atom is substituted for a hydrogen atom located at the xcex1-position of the principal chain of each of the first, second and third units, a crosslinking reaction is never caused in the principal chains, resulting in improving the solubility of an exposed portion of a resist film in a developer. Furthermore, since the first, second and third units have a benzene ring, the dry etching resistance can be extremely improved. In addition, since the third unit has a phenyl group, the wettability is improved so as to improve adhesion onto a substrate, and the dissolving rate in an alkaline developer can be controlled by adjusting the ratio of the third unit in the polymer.
The third pattern formation material of this invention comprises a polymer including a first unit represented by Chemical Formula 6, a second unit represented by Chemical Formula 7 and a third unit represented by Chemical Formula 8; and an acid generator,
wherein R1, R2 and R5 are the same or different and selected from the group consisting of an alkyl group such as a methyl group and an ethyl group, a chlorine atom and an alkyl group including a chlorine atom such as CCl3; and R3 is a protecting group released by an acid.
In the third pattern formation material, since the first unit has a cyano group, the transmittance against light of a wavelength of a 1 nm through 180 nm band can be improved, and since an alkyl group, a chlorine atom or an alkyl group including a chlorine atom is substituted for a hydrogen atom located at the xcex1-position of the principal chain of each of the first, second and third units, a crosslinking reaction is never caused in the principal chains, resulting in improving the solubility of an exposed portion of a resist film in a developer. Furthermore, since the first and second units have a benzene ring, the dry etching resistance can be largely improved. In addition, since the third unit has a carboxyl group, carboxylic acid is generated in the exposed portion of the resist film through irradiation with light. Therefore, the contrast between the exposed portion and an unexposed portion can be improved.
The fourth pattern formation material of this invention comprises a polymer including a first unit represented by Chemical Formula 9 and a second unit represented by Chemical Formula 10; and an acid generator,
wherein R1 and R6 are the same or different and selected from the group consisting of an alkyl group such as a methyl group and an ethyl group, a chlorine atom and an alkyl group including a chlorine atom such as CCl3; and R7 is a protecting group released by an acid.
In the fourth pattern formation material, since the first unit has a cyano group, the transmittance against light of a wavelength of a 1 nm through 180 nm band can be improved, and since an alkyl group, a chlorine atom or an alkyl group including a chlorine atom is substituted for a hydrogen atom located at the xcex1-position of the principal chain of each of the first and second units, a crosslinking reaction is never caused in the principal chains, resulting in improving the solubility of an exposed portion of a resist film in a developer. Also, since the first unit has a benzene ring, the dry etching resistance can be improved. Furthermore, when an acid is generated through irradiation with light and the protecting group is released from the second unit, carboxylic acid is generated in the exposed portion of the resist film. Therefore, the contrast between the exposed portion and an unexposed portion can be improved.
The fifth pattern formation material of this invention comprises a polymer including a first unit represented by Chemical Formula 11, a second unit represented by Chemical Formula 12 and a third unit represented by Chemical Formula 13; and an acid generator,
wherein R1, R4 and R6 are the same or different and selected from the group consisting of an alkyl group such as a methyl group and an ethyl group, a chlorine atom and an alkyl group including a chlorine atom such as CCl3; and R7 is a protecting group released by an acid.
In the fifth pattern formation material, since the first unit has a cyano group, the transmittance against light of a wavelength of a 1 nm through 180 nm band can be improved, and since an alkyl group, a chlorine atom or an alkyl group including a chlorine atom is substituted for a hydrogen atom located at the xcex1-position of the principal chain of each of the first, second and third units, a crosslinking reaction is never caused in the principal chains, resulting in improving the solubility of an exposed portion of a resist film in a developer. Furthermore, since the first and second units have a benzene ring, the dry etching resistance can be largely improved, and since the second unit has a phenyl group, the wettability is improved so as to improve adhesion onto a substrate. Moreover, the dissolving rate in an alkaline developer can be controlled by adjusting the ratio of the second unit in the polymer. Furthermore, when an acid is generated through irradiation with light and the protecting group is released from the third unit, carboxylic acid is generated in the exposed portion of the resist film. Therefore, the contrast between the exposed portion and an unexposed portion can be improved.
The sixth pattern formation material of this invention comprises a polymer including a first unit represented by Chemical Formula 14, a second unit represented by Chemical Formula 15 and a third unit represented by Chemical Formula 16; and an acid generator,
wherein R1, R5 and R6 are the same or different and selected from the group consisting of an alkyl group such as a methyl group and an ethyl group, a chlorine atom and an alkyl group including a chlorine atom such as CCl3; and R7 is a protecting group released by an acid.
In the sixth pattern formation material, since the first unit has a cyano group, the transmittance against light of a wavelength of a 1 nm through 180 nm band can be improved, and since an alkyl group, a chlorine atom or an alkyl group including a chlorine atom is substituted for a hydrogen atom located at the xcex1-position of the principal chain of each of the first, second and third units, a crosslinking reaction is never caused in the principal chains, resulting in improving the solubility of an exposed portion of a resist film in a developer. Also, since the first unit has a benzene ring, the dry etching resistance can be improved. Furthermore, since the second unit has a carboxyl group, carboxylic acid is generated in the exposed portion of the resist film from the second unit through irradiation with light, and when an acid is generated through irradiation with light and the protecting group is released from the third unit, carboxylic acid is generated. Therefore, the contrast between the exposed portion and an unexposed portion can be largely improved.
Specific examples of the protecting group released by an acid represented by R3 in the aforementioned formulas are represented by Chemical Formula D:
Specific examples of the protecting group released by an acid represented by R7 in the aforementioned formulas are represented by Chemical Formula E:
The first pattern formation method of this invention comprises the steps of forming a resist film by applying, on a substrate, the first pattern formation material; irradiating the resist film with exposing light of a wavelength of a 1 nm through 30 nm band or a 110 nm through 180 nm band for pattern exposure; and forming a resist pattern by developing the resist film after the pattern exposure.
In the first pattern formation method, the first pattern formation material is used, and hence, the transmittance against light of a wavelength of a 1 nm through 180 nm band can be improved and the solubility of an exposed portion of the resist film in a developer can be improved. Furthermore, the dry etching resistance can be largely improved.
The second pattern formation method of this invention comprises the steps of forming a resist film by applying, on a substrate, the second pattern formation material; irradiating the resist film with exposing light of a wavelength of a 1 nm through 30 nm band or a 110 nm through 180 nm band for pattern exposure; and forming a resist pattern by developing the resist film after the pattern exposure.
In the second pattern formation method, the second pattern formation material is used, and hence, the transmittance against light of a wavelength of a 1 nm through 180 nm band can be improved and the solubility of an exposed portion of the resist film in a developer can be improved. Furthermore, the dry etching resistance can be largely improved. In addition, the wettability of the pattern formation material is improved so as to improve the adhesion onto the substrate, and the dissolving rate in an alkaline developer can be controlled by adjusting the ratio of the third unit in the polymer.
The third pattern formation method of this invention comprises the steps of forming a resist film by applying, on a substrate, the third pattern formation material; irradiating the resist film with exposing light of a wavelength of a 1 nm through 30 nm band or a 110 nm through 180 nm band for pattern exposure; and forming a resist pattern by developing the resist film after the pattern exposure.
In the third pattern formation method, the third pattern formation material is used, and hence, the transmittance against light of a wavelength of a 1 nm through 180 nm band can be improved and the solubility of an exposed portion of the resist film in a developer can be improved. Furthermore, the dry etching resistance can be largely improved. In addition, since carboxylic acid is generated in the exposed portion of the resist film through irradiation with light, the contrast between the exposed portion and an unexposed portion can be improved.
The fourth pattern formation method of this invention comprises the steps of forming a resist film by applying, on a substrate, the fourth pattern formation material; irradiating the resist film with exposing light of a wavelength of a 1 nm through 30 nm band or a 110 nm through 180 nm band for pattern exposure; and forming a resist pattern by developing the resist film after the pattern exposure.
In the fourth pattern formation method, the fourth pattern formation material is used, and hence, the transmittance against light of a wavelength of a 1 nm through 180 nm band can be improved and the solubility of an exposed portion of the resist film in a developer can be improved. Also, the dry etching resistance can be largely improved. Furthermore, since carboxylic acid is generated in the exposed portion of the resist film through irradiation with light, the contrast between the exposed portion and an unexposed portion can be improved.
The fifth pattern formation method of this invention comprises the steps of forming a resist film by applying, on a substrate, the fifth pattern formation material; irradiating the resist film with exposing light of a wavelength of a 1 nm through 30 nm band or a 110 nm through 180 nm band for pattern exposure; and forming a resist pattern by developing the resist film after the pattern exposure.
In the fifth pattern formation method, the fifth pattern formation material is used, and hence, the transmittance against light of a wavelength of a 1 nm through 180 nm band can be improved and the solubility of an exposed portion of the resist film in a developer can be improved. Furthermore, the dry etching resistance can be largely improved. In addition, the wettability of the pattern formation material is improved so as to improve the adhesion onto the substrate, and the dissolving rate in an alkaline developer can be controlled by adjusting the ratio of the third unit in the polymer. Moreover, since carboxylic acid is generated in the exposed portion of the resist film through irradiation with light, the contrast between the exposed portion and an unexposed portion can be improved.
The sixth pattern formation method of this invention comprises the steps of forming a resist film by applying, on a substrate, the sixth pattern formation material; irradiating the resist film with exposing light of a wavelength of a 1 nm through 30 nm band or a 110 nm through 180 nm band for pattern exposure; and forming a resist pattern by developing the resist film after the pattern exposure.
In the sixth pattern formation method, the sixth pattern formation material is used, and hence, the transmittance against light of a wavelength of a 1 nm through 180 nm band can be improved and the solubility of an exposed portion of a resist film in a developer can be improved. Also, the dry etching resistance can be largely improved. Furthermore, since a large amount of carboxylic acid is generated in the exposed portion of the resist film through irradiation with light, the contrast between the exposed portion and an unexposed portion can be largely improved.
In any of the first through sixth pattern formation methods, the exposing light is preferably F2 excimer laser, Ar2 excimer laser or soft-X rays.

Abstract: wherein R1 and R2 are the same or different and selected from the group consisting of an alkyl group, a chlorine atom and an alkyl group including a chlorine atom; and R3 is a protecting group released by an acid. Then, the resist film is irradiated with exposing light of a wavelength of a 1 nm through 30 nm band or a 110 nm through 180 nm band for pattern exposure, and a resist pattern is formed by developing the resist film after the pattern exposure.

Matsushita Electric Industrial Co., Ltd.


A non-contacting magnetic position sensor that produces a magnetic field having improved linear characteristics over an extended sensing range. The magnetic position sensor includes a pair of magnets, a pair of pole pieces extending between the magnets and spaced apart to define an air gap, and a magnetic flux sensor operable to sense varying magnitudes of magnetic flux density along the length of the air gap. The pole piece segments form a stepped interface with each of the magnets and cooperate with the magnets to provide a magnetic field having a magnetic flux density that varies in a substantially linear manner along substantially the entire length of the air gap. The magnetic flux sensor is positioned within the magnetic field and is operable to sense a magnitude of the varying magnetic flux density along the air gap and to provide an output signal representative of a position of the magnetic flux sensor relative to the magnetic field.

The present invention generally relates to the field of magnetic sensors for sensing the position of a structure over a predetermined sensing range, and more specifically relates to a non-contacting magnetic position sensor having a stepped magnet interface that provides a magnetic field having improved linear characteristics over an extended sensing range.
Magnetic position sensors are devices that generate an electronic signal output that is indicative of the relative position of a mechanical component, such as, for example, a control shaft or rotor in the case of a rotational position sensor or a carrier mechanism or linkage in the case of a linear position sensor. Certain types of magnetic position sensors generate an electronic signal output representative of the relative position of the mechanical component without actual physical contact with the mechanical component. These types of non-contacting magnetic position sensors include a magnetic circuit that is operably coupled to the mechanical component and which is configured to produce a magnetic field having a magnetic field strength that varies along an air gap. A magnetic sensing element is positioned within the air gap and is operable to sense variations in the magnitude of the magnetic field strength in response to relative displacement between the magnetic field and the sensing element. The magnitude of the magnetic field strength is translated through the sensing element and is converted to a voltage or current output signal that is uniquely representative of the relative position of the mechanical component.
Referring to FIG. 1, shown therein is one example of a prior art magnetic position sensor 10. The magnetic position sensor 10 includes a pair of permanent magnets 12a, 12b and a pair of magnetically permeable plates 14a, 14b extending between the magnets 12a, 12b and spaced apart to define an air gap 16 therebetween. The magnets 12a, 12b and the plates 14a, 14b cooperate to form a closed magnetic circuit that produces a magnetic field having a magnetic field strength that varies along the length of the air gap 16. A magnetic sensing element 18 is positioned within the air gap 16 and is operable to sense variations in magnetic field strength as the sensing element 18 is relatively displaced along the air gap 16. Notably, the magnetically permeable plates 14a, 14b are rectangular-shaped, each defining a flat, uninterrupted inner surface 20 that is operably attached to a corresponding flat magnetic pole surface 22 defined by each of the magnets 12a, 12b. As a result, the width w of the air gap 16 is equal to the distance d between the pole surfaces 22 of the magnets 12a, 12b.
The sensing element 18 is physically capable of being displaced along virtually the entire length of the air gap 16. When positioned at the approximate midpoint 24 of the air gap 16, the magnitude of the magnetic flux density passing through the sensing element 18 is at or near zero. As the sensing element 18 is relatively displaced on either side of the midpoint 24, the absolute value of the magnetic flux density increases in a manner proportional to the distance from the midpoint 24. However, since the magnetic field flows in opposite directions on either side of the midpoint 24, the actual value of the magnetic flux density on one side of the midpoint 24 is interpreted as being positive while the actual value of the magnetic flux density on the other side of the midpoint 24 is interpreted as being negative.
As shown in FIG. 2, the magnitude of the magnetic flux density varies in a substantially linear manner along the mid-portion 28 of the air gap 16 on either side of the midpoint 24 . However, as the relative position of the sensing element 18 approaches the end portion 30a of the air gap 16 adjacent the magnet 12a and the end portion 30b of the air gap 16 adjacent the magnet 12b, the change in magnitude of the magnetic flux density significantly deviates from that experienced along the mid-portion 28 of the air gap 16. This phenomenon at least partially results from the tendency of the magnetic flux to leak from the interfaces between the inner plate surface 20 and the magnetic pole surface 22, thereby resulting in an increased concentration of the magnetic flux density field strength in the areas adjacent the magnets 12a, 12b. This non-linearity in the magnitude of the magnetic flux density field strength adjacent the magnets 12a, 12b reduces the overall sensing range of the magnetic position sensor 10. Although an auxiliary electronic circuit may be used to compensate for these non-linear characteristics, post processing of the sensor output signal typically results in increased sensor costs and a possible decrease in sensor accuracy and reliability.
Thus, there is a general need in the industry to provide a magnetic position sensor having improved linear characteristics over an extended sensing range. The present invention satisfies this need and provides other benefits and advantages in a novel and unobvious manner.
The present invention is directed to a magnetic position sensor having a stepped magnet interface that provides a magnetic field having improved linear characteristics over an extended sensing range. While the actual nature of the invention covered herein can only be determined with reference to the claims appended hereto, certain forms of the invention that are characteristic of the preferred embodiments disclosed herein are described briefly as follows. However, it should be understood that other embodiments are also contemplated as falling within the scope of the present invention.
In one form of the present invention, a magnetic position sensor is provided which includes a magnet, a pair of pole piece segments spaced apart to define an air gap, and a magnetic flux sensor. The pole piece segments form a stepped interface with the magnet to provide a magnetic field within the air gap having a varying magnetic flux density. The magnetic flux sensor is positioned within the magnetic field and is operable to sense a magnitude of the varying magnetic flux density along the air gap and to provide an output signal representative of a position of the magnetic flux sensor relative to the magnetic field.
In another form of the present invention, a magnetic position sensor is provided which includes first and second magnets, first and second pole pieces extending between the magnets and spaced apart to define an air gap, and a magnetic flux sensor. The first and second pole pieces form a stepped interface with the magnets to form a closed magnetic circuit that provides a magnetic field within the air gap having a varying magnetic flux density. The magnetic flux sensor is positioned within the magnetic field and is operable to sense a magnitude of the varying magnetic flux density along the air gap and to provide an output signal representative of a position of the magnetic flux sensor relative to the magnetic field.
In yet another form of the present invention, a magnetic position sensor is provided which includes a magnet, a pair of pole piece segments spaced apart to define an air gap, and a magnetic flux sensor. The magnet has a first pole surface, a second pole surface, and side surfaces extending between the first and second pole surfaces. The pole piece segments each include a first portion positioned adjacent a respective one of the first and second pole surfaces of the magnet, and a second portion positioned adjacent one of the side surfaces of the magnet. The magnet and the pole piece segments cooperate to provide a magnetic field within the air gap having a varying magnetic flux density. The magnetic flux sensor is positioned within the magnetic field and is operable to sense a magnitude of the varying magnetic flux density along the air gap and to provide an output signal representative of a position of the magnetic flux sensor relative to the magnetic field.
In still another form of the present invention, a magnetic position sensor is provided which includes means for generating a magnetic field, means for providing the magnetic field with a varying magnetic flux density along an axis with the means for providing forming a stepped interface with the means for generating, and means for sensing a magnitude of the varying magnetic flux density along the axis and for generating an output signal representative of a position of the means for sensing relative to the magnetic field.
It is one object of the present invention to provide an improved magnetic position sensor having a stepped magnet interface that provides a magnetic field having improved linear characteristics over an extended sensing range.

Magnetic position sensor having a stepped magnet interface


A valve device includes a valve body; a cylindrical member provided in an accommodation recess and communicating with the first flow path; a valve seat supported by the cylindrical member; a seal member interposed between the periphery of the opening of first flow path on the bottom surface of the accommodation recess and the lower end portion of the cylindrical member; an annular plate which is flexible, air-tightly or liquid-tightly fixed to an annular support portion formed on the inner peripheral surface of the accommodation recess, air-tightly or liquid-tightly fixed to an annular support portion formed on the outer peripheral surface of the cylindrical member and has a plurality of openings communicating with the second flow path; and a diaphragm that moves between an open position at which the diaphragm does not contact the valve seat and a closed position at which the diaphragm contacts the valve seat.

For example, in a semiconductor manufacturing process, valve devices are used to control supply of various process gases to chambers of semiconductor manufacturing apparatuses. In the atomic layer deposition method (ALD method) or the like, there is a demand for a valve device which is miniaturized and can stably supply a process gas used in a process of depositing a film on the substrate at a larger flow rate.
Patent Literature 1 discloses a diaphragm valve which is miniaturized and can stably supply a process gas at a higher flow rate. A recess of a main body of the diaphragm valve is composed of a large diameter portion close to the opening and a small diameter portion continuous below the large diameter portion through a step portion. A flow path forming disk is fitted in the recess. The flow path forming disk consists of a large diameter cylindrical portion fitted to the recess large diameter portion, a connecting portion which is received by the recess step portion, and a small diameter cylindrical portion which has an outer diameter smaller than the inner diameter of the recess small diameter portion and has a lower end received by bottom surface of the recess. A plurality of through holes are formed in the connecting portion of the flow path forming disk to make the outer annular space of the small-diameter cylindrical portion communicate with the inner annular space of the large-diameter cylindrical portion. A fluid inflow passage communicates with the lower end of the small diameter cylindrical portion of the flow path forming disk and a fluid outflow passage communicate with the outer annular space of the small diameter cylindrical portion, respectively.

Valve device, fluid control device, fluid control method, semiconductor manufacturing apparatus, and semiconductor manufacturing method


A ground fault immune power and data delivery system for downhole sensors is connected to a downhole motor via a three-phase power cable. An AC power supply and sensor data module are electrically connected to one of two conductors (phases) at a time selected from the three conductors (phases) to provide power and data signals to the downhole sensors. If a ground fault is detected on one of the two connected phases, an isolation module isolates the grounded phase and switches to the ungrounded connected phase to continue transmitting power and data signals. A frequency of AC power supply, data communication frequencies and a switching frequency of a drive controlling the downhole motor are orthogonal to each other in order to mitigate interference. Surface-to-downhole communication can occur by adjusting voltage, frequency and/or phase of AC power supply controlled by a processor.

Artificial lift systems, such as Electrical Submersible Pump (ESP) systems, are often used in hydrocarbon producing wells to pump fluids from the well up to the surface. A conventional ESP system typically includes a centrifugal pump that is driven by a three-phase voltage supply and a variable speed drive, both located at the surface, that deliver the three-phase power to the downhole motor via a three-phase power cable. In addition, data signals between the surface and downhole sensors are also transmitted over the power cable. Such signals include various data related to performance of downhole components and downhole measurements.
An issue arises, however, when one or more of the phases are grounded along the power cable. When this occurs, data transmission is not reliable or not possible over the power cable depending on the location at which the cable is grounded.
Accordingly, there is a need in the art for a ground fault immune power and data delivery system for use in a downhole environment.

Ground fault immune sensor power supply for downhole sensors


Relatively small capacity solid-state storage devices (SSD) are combined with larger capacity magnetic disk storage devices for storing storage block write data to ensure data consistency. Write operations are stored in a sequential write buffer in an SSD to guarantee the storage of write data and then copied from the sequential write buffer to the destination address in a magnetic disk storage device. The sequential write buffer store write data in locations corresponding to the order of receipt of write operations. Write data from the sequential write buffer is transferred to the magnetic disk storage device in the same order and a checkpoint index is frequently updated to indicate the completion of some transfers. During system initialization, the most recent value of the checkpoint index is retrieved and used as a starting location for transferring write data from the sequential write buffer to the magnetic disk storage device.

This disclosure relates generally to data storage systems, and systems and methods to improve storage efficiency, compactness, performance, reliability, and compatibility. Magnetic disk storage devices, such as hard disk drives, provide large amounts of affordable storage. However, magnetic disk storage devices often include an internal write buffer for storing write data before it is written to disk. Write data stored in the internal write buffer is at risk of loss if there is a power failure. Magnetic disk storage devices may be configured so that write operations are only acknowledged after the write data has been stored on disk, as opposed to the internal write buffer; however, this reduces write performance greatly. More specialized hardware, such as hardware RAID controllers, may include battery or supercapacitor power backups to preserve data in the write buffer in the event of a power failure; however, these hardware components increase the cost and complexity of systems.
In contrast, many relatively low-cost solid-state disk drives (SSDs) include a backup power source, such as a battery or supercapacitor, to preserve write data in the write buffer in the event of a power failure. However, SSDs are much more expensive than magnetic disk drives of similar storage capacity. Thus, most low-cost SSDs have much smaller storage capacities than typical magnetic disk drives.

Ensuring write operation consistency using multiple storage devices


A Baseline DVB-CPCM is presented in this proposal to provide a secure and interoperable content delivery and transferring apparatus. The proposed Baseline DVB-CPCM is a unit to be implemented in a compliant CPCM device, and it consists of five major modules to be used for end-to end solution and content transferring between devices. These modules are CPCM Manager, Tools Box, Rights Management Module, Message Router, and CAS-CPCM Converter.

Contents will be available easily to consumers as digital technology and media processing power become more and more advanced. Not like analogue media, digital media almost has unlimited number of copies with good quality. Thus as content owner, or content operator they will have much concern about the dangerous if content is not protected well.
Digital TV (DTV) broadcasting has been widely deployed in the world. So far there is not much concern about the content protection and security. However as new generation DTV-STB (Set-Top-Box) that has local hard disk and digital interface like IEEE 1394, etc. is launched, content association, movie industries, and media owners are starting to worry about the content protection and copy management. Before having a complete and very secured DTV-STB, a secured content delivery and transferring mechanism, as well as a secured transmission channel, they would not allow to release contents to such applications. Therefore many parties in the world including standard bodies like MPEG, DVB, TVAnytime, content companies, CE (Consumer Electronics) manufacturers, as well as security technology providers, etc., are gathering together to work on a both interoperable and secure end-to-end solution to the content protection and copy management in such application scenario.
Content distribution and video-on-demand is also becoming more and more demanding as multimedia data and contents can reach to anywhere and anytime. User is happy with the convenience and flexibility, and they can enjoy entertainment easily and efficiently.
On the other hand, content owners are trying to meet the customer's needs but at the same time they also worry about the illegal usage of their property. There is a balance between two sides.
In MPEG standardisation group, people are working towards to standardise an IPMP (Intellectual Property Management and Protection) system that involves compliant terminal. All the terminals can play back a protected content that is encrypted and protected by following the same IPMP standard, no matter what kinds of IPMP tools they use.
DVB consortium has also issued Call for Proposal for CPCM (Content Protection and Copy Management), to mainly focus on content delivery from operator to receiver and content transferring from one DVB-CPCM device to another in a both secure and interoperable manner.
The current DVB receiver as a DVB device cannot fulfil the both secure and interoperable requirement, especially for content transferring between DVB receiver and other storage devices like PVR, etc., which has not addressed before.
Basically the prior art for an existing DVB receiver is shown in FIG. 1, to indicate how a content is delivered to DVB receiver in a secure but private way.
Related invention is disclosed in Japanese Patent Application Nos. 2001-265908 and 2001-058236 which are filed by the present applicant.
To design an interoperable and secure device to be used in content delivery or transmission in a secure manner;
To design an interoperable and secure device to be used in content transferring between such devices in a secure manner;
In the above-mentioned cases, content is protected against illegal use of the property and granted usage is properly managed and carried from one device to another within authorised domain.

Matsushita Electric Industrial Co., Ltd.


A camshaft including a carrier element and a cam, in which the carrier element is composed of carrier segments arranged axially one behind the other along a longitudinal axis such that the carrier segments are axially displaceable relative to each other.

The invention relates to a camshaft having at least one carrier element and at least one cam.
A camshaft has at least one carrier element, also termed a tube or shaft, and at least one cam. When used in engines, camshafts serve as a part of the valve operating assembly, and the camshaft in this case rotates about its longitudinal axis. The cams convert the rotary movement into longitudinal motion, thereby controlling the intake and exhaust valves of the engine. In order to make it possible to provide better control according to the load on the engine, the prior art includes so-called camshaft adjusters which bring different cams into functional engagement with the valves, or which modify the settings of the cams with respect to each other, for example via the angles thereof.


A boiler or other fired vessel includes a housing with a burner at one end, a furnace downstream of the burner, a convection section downstream of the furnace and a flue gas outlet downstream of the convection section. A first means for loading a reducing agent comprising at least two injectors is located downstream of the furnace. A second means for loading a reducing agent is located downstream of the first means for loading a reducing agent. A selective catalytic reduction catalyst is located either downstream of the second means for loading a reducing agent or adjacent the second means for loading a reducing agent such that the catalyst is provided to the boiler or other fired vessel approximately simultaneously with the reducing agent from the second means for loading the reducing agent.

The ever-increasing emissions from combustion sources have led to increasing efforts to reduce fugitive emissions from these sources. Existing measures for NOx (nitrogen oxides) reduction in boilers include two-stage combustion, exhaust gas recirculation, rapid mix burners, high excess air with air/fuel pre-mixed and the like. In two-stage combustion, combustion air is supplied in two stages to the burner, where the fuel is burned with a smaller amount of air than necessary for complete combustion in the first stage, and the remaining amount of air necessary for complete combustion is supplied in the second stage, thereby lowering peak combustion temperatures and reducing NOx formation. In exhaust gas recirculation, exhaust gas generated by combustion is re-circulated so as to be mixed with the combustion air and fed to the burner, thereby also lowering peak combustion temperatures and reducing NOx formation. Rapid mix burners employ both exhaust gas recirculation (e.g., flue gas recirculation) and a rapid mix of fuel and air in the burner. The rapid mix promotes air/fuel distribution in the flame which reduces localized high temperatures in the flame which reduces NOx formation. Pre-mix burners mix fuel and air just prior to combustion to provide uniform air/fuel mixtures combined with high excess air to reduce NOx formation.
While these known methods have been effective at reducing NOx formation, the reduction has come at the cost of at least some reduction in boiler performance. For example, in at least some respects, boilers employing the above methods show a diminished response to load changes, an increase in the horsepower necessary for the combustion air fan motor to move the additional volumes of air, and an increase in operating costs due to an increased electrical energy demand.
Selective catalytic reduction (SCR), using post-combustion oxidation catalysts to reduce NOx, has been an effective means for reducing NOx emissions without sacrificing boiler performance. In SCR, an ammonia source is required for the oxidation catalyst to remove NOx from the boiler flue gases. Anhydrous ammonia is the most readily usable source of ammonia in SCR applications. However, anhydrous ammonia poses significant safety hazards if the boiler system leaks or fails. Anhydrous ammonia has a health hazard rating of 3 on a scale of 0 to 4, with even short exposure capable of causing serious temporary or residual injury, even if prompt medical care is given. Eye wash stations, ambient ammonia sensors, and alarms are required to manage the health hazards of anhydrous ammonia. Moreover, many boiler installations are in hospitals, schools, prisons and universities where a large, and sometimes already susceptible or weak, population could be exposed to anhydrous ammonia during a leak or failure. This could be catastrophic.
Some boilers now employ aqueous methods of ammonia or reducing urea to ammonia to avoid some of the health risks associated with storing large amounts of anhydrous ammonia. Urea is particularly attractive to use in Nox reduction systems as urea has a health hazard rating of 1 on a scale of 0 to 4, with short exposure potentially causing irritation but only minor residual injury even if no treatment is given. Boilers which incorporate methods of reducing urea to ammonia typically employ additional external heat sources and methods to convert urea to ammonia external to the boiler or through various ducts and side streams of flue gas before adding dilution air to the ammonia for delivery through an ammonia injection grid located upstream from the catalyst bed.
Delivering the oxidizing agent in these systems to the flue gas requires external ducting with heat tracing, insulation, hot gas fans, and other components. Failure of the heat tracing or insulation systems results in fouling of the delivery system causing unscheduled shut-down and maintenance. Moreover, these systems and added components increase the complexity and cost of boiler systems, increase the average maintenance costs of the boiler, and consume a larger amount of energy to deliver the oxidizing agent to the flue gas stream.
For at least these reasons, therefore, it would be advantageous if a new or improved method for SCR NOx reduction could be developed that addressed one or more of the above-described concerns, and/or other concerns. Particularly, it would be advantageous if a new or improved method for SCR NOx reduction could be provided for the low emission demands of the regulatory environment and the efficiency and performance demands for reduced energy costs, and without sacrificing safety.

Process for direct urea injection with selective catalytic reduction (SCR) for NOx reduction in hot gas streams and related systems and assemblies


A computer arrangement for inducing a retraction of a computer component in response to a sensed emergency or security condition. The computer arrangement can include an enclosure with an open inner volume and a support member extendably and retractably retained relative to the enclosure. A computer component, such as a monitor, a keyboard, or a laptop computer, can be retained relative to the support member. One or more sensors can sense an emergency or security condition thereby to induce a retraction of the support member and, possibly, a closing of a lid. The keyboard or laptop computer can be retained relative to a support unit or cradle, which can be manually or automatically pivotable between a storage configuration and a second configuration.

In numerous circumstances, it would be advantageous to be able to induce an automatic retraction of a computer arrangement in response to a sensed emergency or security condition. By way of example, computers, computer components, and the data contained therein can be damaged or rendered unusable by fire and other extreme conditions. Furthermore, the mere threat of fire in a building can induce emergency precautions, such as sprinkler and fire retardant activation, that can impart irremediable damage to computer components. Additionally, theft, tampering, and unauthorized access to computer components present real and recognized dangers to businesses and individuals. Indeed, the risk of theft increases in proportion to the consistent decrease in physical size of computer components. Slim screen monitors, laptops, and other computers and computer components have become victim to their portability in that unauthorized persons can steal the devices quickly and surreptitiously.
A number of talented inventors have sought to provide mechanisms for enabling an adjustment of a relative position of an electronic component, such as a computer monitor. For example, in U.S. Pat. No. 5,526,756, Watson discloses a multi-platform desk with cantilevered and threaded rod combinations for adjustably supporting keyboard and monitor platforms at desired heights. Additionally, in U.S. Pat. No. 6,494,150, Phoenix et al. describes a display elevating and lowering mechanism that employs a complex threaded rod arrangement. Still further, U.S. Pat. No. 6,733,094 to Chang is directed to a parallelepiped lifting device for a computer monitor that operates based on a combination of chain wheels, bars, and adjusting screws. To date, however, the prior art has failed to provide satisfactory systems and methods for enabling a retraction of computer components to a protected configuration to prevent damage and loss due to emergency and security threats.

Emergency and security condition retractable computer arrangements


A variable resistance non-volatile storage device includes: a first line which includes a barrier metal layer and a main layer, and fills an inside of a line trench formed in a first interlayer insulating layer; a first electrode covering a top surface of the first line and comprising a precious metal; memory cell holes formed in a second interlayer insulating layer; a variable resistance layer formed in the memory cell holes and connected to the first electrode; and second lines covering the variable resistance layer and the memory cell holes, wherein in an area near the memory cell holes, the main layer is covered with the barrier metal layer and the first electrode in an arbitrary widthwise cross section of the first line.

In recent years, the development of digital technology enables electronic devices such as portable information devices and information home appliances to have high functionality. Along with the expansion of functionality of such electronic devices, rapid progress is being made in miniaturizing semiconductor devices to be used and increasing the speed thereof. In particular, the usage of large-capacity non-volatile memory represented by a flash memory is being expanded rapidly. Furthermore, as a new, next-generation non-volatile memory which substitutes for the above flash memory, research and development are conducted on a non-volatile storage device in which a variable resistance element is used (which is referred to as a variable resistance non-volatile storage device or simply a non-volatile storage device). Here, a variable resistance element is an element which has a feature of reversibly changing its resistance value according to an electrical signal, and can furthermore store therein information corresponding to this resistance value in a non-volatile manner.
A crosspoint non-volatile memory element has been proposed, as an example of a large-capacity non-volatile memory which includes such a variable resistance element. An element having a configuration in which a variable resistance film is used as a storage unit and a diode element is used as a switching element is disclosed (see Patent Literature (PTL) 1, e.g.).
Parts (a) and (b) of FIG. 23 illustrate a non-volatile storage device 80 which includes conventional variable resistance elements. Part (a) of FIG. 23 is a perspective view of a crosspoint memory cell array 200 which includes bit lines 210, word lines 220, and memory cells 280 formed at crosspoints thereof. Part (b) of FIG. 23 is a cross-sectional view of the memory cell 280, the bit line 210, and the word line 220 in the bit line direction.
A variable resistance layer 230 which stores information according to a change in the electric resistance due to electrical stress is interposed between an upper electrode 240 and a lower electrode 250, thereby forming a variable resistance element 260. A nonlinear element 270 for bidirectional current flow is formed on the variable resistance element 260, and the memory cell 280 is formed by a series circuit having the variable resistance element 260 and the nonlinear element 270, the nonlinear element 270 having two terminals and nonlinear current-voltage characteristics. The nonlinear element 270 is a two-terminal element, such as a diode, having nonlinear current-voltage characteristics which show that a current change with respect to a voltage change is not constant.
In addition, the bit line 210 serving as an upper line is electrically connected to the nonlinear element 270, and the word line 220 serving as a lower line is electrically connected to the lower electrode 250 of the variable resistance element 260. A current flows through the nonlinear element 270 bidirectionally when the memory cell 280 is rewritten, and thus for example, a varistor having nonlinear current-voltage characteristics which are bidirectionally symmetrical (such as ZnO or SrTiO3) is used therefor. The above configuration allows a current flow of 30 kA/cm2 or more, which is current density necessary for rewriting the variable resistance element 260, and achieves large current density, thereby obtaining a large-capacity non-volatile memory.

Non-volatile storage device and method for manufacturing the same


A switched reluctance machine is energized by phase circuits with four active switches, for example MOSFETs, arranged in a bridge configuration. The switches are capable of conducting current in both a first direction and a second direction and are capable of operating as a diode. The direction of current flow through the phase winding is reversed when changing from motoring to generating and from generating to motoring. The ratings of the switches are set in accordance with the energy supply and energy return currents.

1. Field of the Invention
The present invention relates to a circuit for the efficient operation of switched reluctance machines, particularly those machines which are required to be operated in both motoring and generating modes.
2. Description of Related Art
In general, a reluctance machine is an electrical machine in which torque is produced by the tendency of its movable part to move into a position where the reluctance of a magnetic circuit is minimized, i.e. where the inductance of the exciting winding is maximized. In some forms, circuitry is provided for detecting the angular position of the rotor and energizing the phase windings as a function of the rotor position. This type of reluctance machine is generally known as a switched reluctance machine and it may be operated as a motor or a generator. The characteristics of such switched reluctance machines are well known and are described in, for example, "The Characteristics, Design and Application of Switched Reluctance Motors and Drives" by Stephenson and Blake, PCIM'93, Nürnberg, Jun. 21-24, 1993, incorporated herein by reference. That paper describes in some detail the features of the switched reluctance machine which together produce the characteristic cyclically varying inductance of the phase windings. It is well-known in the art that such machines can be operated in either the motoring or generating mode simply by altering the timing of the winding excitation, without altering the direction of current flowing in the phase winding(s).
FIG. 1 shows the principal components of a typical switched reluctance drive system, connected to a load 19. The input DC power supply 11 can be either a battery or rectified and filtered AC mains and can be fixed or variable in magnitude. In some known drives, the power supply 11 includes a resonant circuit which produces a DC voltage which rapidly varies between zero and a predetermined value to allow zero voltage switching of power switches. The DC voltage provided by the power supply 11 is switched across the phase windings 16 of the motor 12 by a power converter 13 under the control of the electronic control unit 14. The switching must be correctly synchronized to the angle of rotation of the rotor for proper operation of the drive. A rotor position detector 15 or a position detection algorithm supplies signals indicating the angular position of the rotor. Some form of current transducer 17 is normally provided to give phase current feedback. The input demand 18 can be a torque or speed demand for motoring or a current or voltage demand for generating.
The energization of the phase windings in a switched reluctance machine depends on detection of the angular position of the rotor. This may be explained by reference to FIGS. 2 and 3, which illustrate the switching of a reluctance machine operating as a motor. FIG. 2 generally shows a rotor pole 20 approaching a stator pole 21 according to arrow 22. As illustrated in FIG. 2, a portion 23 of a complete phase winding 16 is wound around the stator pole 21. When the portion 23 of the phase winding 16 around stator pole 21 is energized, a force will be exerted on the rotor, tending to pull rotor pole 20 into alignment with stator pole 21. FIG. 3 generally shows typical switching circuitry in the power converter 13 that controls the energization of the phase winding 16, including the portion 23 around stator pole 21 of stator 24. The voltage busses 36, 37 are generally known as the DC link and the capacitor 35 across them is known as the DC link capacitor, whose function is to handle the alternating currents on the DC link. When switches 31 and 32 are closed, the phase winding is coupled to the source of DC power and is energized. When the phase winding of a switched reluctance machine is energized in the manner described above, the magnetic field set up by the flux in the magnetic circuit gives rise to the circumferential forces which, as described, act to pull the rotor poles into line with the stator poles.
In general, the phase winding is energized to effect the rotation of the rotor as follows. At a first angular position of the rotor (called the "turn-on angle", θon), the controller 14 provides switching signals to turn on both switching devices 31 and 32. When the switching devices 31 and 32 are on, the phase winding is coupled to the DC link, causing an increasing magnetic flux to be established in the machine. The magnetic flux produces a magnetic field in the air gap which acts on the rotor poles to produce the motoring torque. The magnetic flux in the machine is supported by the magneto-motive force (mmf) which is provided by a current flowing from the DC supply 11 through the switches 31 and 32 and the phase winding 23. Current feedback is generally employed and the magnitude of the phase current is controlled by chopping the current by rapidly switching one or both of switching devices 31 and/or 32 on and off. FIG. 4(a) shows a typical current waveform in the chopping mode of operation, where the current is chopped between two fixed levels. In motoring operation, the turn-on angle θon is often chosen to be the rotor position where the center-line of an inter-polar space on the rotor is aligned with the center-line of a stator pole, but may be some other angle. FIG. 4(a) also shows the form of the idealized inductance profile of the phase winding.
In many systems, the phase winding remains connected to the DC link (or connected intermittently if chopping is employed) until the rotor rotates such that it reaches what is referred to as the "freewheeling angle", θfw. When the rotor reaches an angular position corresponding to the freewheeling angle (e.g., the position shown in FIG. 2) one of the switches, for example 31, is turned off. Consequently, the current flowing through the phase winding will continue to flow, but will now flow through only one of the switches (in this example 32) and through only one of the diodes 33/34 (in this example 34). During the freewheeling period, the voltage drop across the phase winding is small, and the flux remains substantially constant. The circuit remains in this freewheeling condition until the rotor rotates to an angular position known as the "turn-off angle", θoff, (e.g. when the center-line of the rotor pole is aligned with that of the stator pole). When the rotor reaches the turn-off angle, both switches 31 and 32 are turned off and the current in phase winding 23 begins to flow through diodes 33 and 34. The diodes 33 and 34 then apply the DC voltage from the DC link in the opposite sense, causing the magnetic flux in the machine (and therefore the phase current) to decrease.
It is known in the art to use other switching angles and other current control regimes. Similarly, many other configurations of lamination geometry, winding topology and switching circuitry are known in the art, some of which are discussed in the Stephenson & Blake paper cited above.
As the speed of the machine rises, there is less time for the current to rise to the chopping level, and the drive is normally run in a "single-pulse" mode of operation. In this mode, the turn-on, freewheel and turn-off angles are chosen as a function of, for example, speed and load torque. Some systems do not use an angular period of freewheeling, i.e. switches 31 and 32 are switched on and off simultaneously. FIG. 4(b) shows a typical such single-pulse current waveform where the freewheel angle is zero. It is well known that the values of turn-on, freewheel and turn-off angles can be predetermined and stored in some suitable format for retrieval by the control system as required, or can be calculated or deduced in real time.
FIG. 5(a) shows the current and flux waveforms for a typical single-pulse operating point in motoring. It will be noted that the current and flux begin to rise as soon as the voltage is applied to the phase winding at θon. The voltage is applied for a conduction angle θc. At the switch-off angle θoff, the gradient of the flux reverses as the voltage across the coil is reversed and, in the absence of eddy currents in the magnetic circuit, the current and flux reach zero together. This Figure is drawn for the ideal case of zero resistance, so the rise and fall times are equal. FIG. 5(b) shows the waveforms for the corresponding generating point, in which the waveforms are a mirror image in time of those of FIG. 5(a).
It will be noted that the currents in the switches and in the diodes are generally different. For example, in the motoring mode of FIG. 5(a) the switch current is significantly greater than the diode current—indeed the root mean square (rms) value is probably three times that of the diode current. By contrast, in the generating mode of FIG. 5(b) the diode current has the larger value. It follows that if the drive is required to provide broadly the same output in motoring and generating the ratings of the switches and diodes must be broadly the same.
The losses associated with the currents in the switches and diodes may be significant, either with respect to the cooling of the devices themselves, to keep them within their thermal operating limits, or with respect to the overall efficiency of the drive. In an industrial drive operating from, say, a 400V 3-phase supply and developing tens or hundreds of kilowatts, the device losses will probably be below 3% of the total input power. In a low-voltage drive however, the devices losses can be 10% or more of the input.
One solution to this problem is to use devices with larger silicon area, and this will improve the situation to a limited extent, albeit at the expense of the size and cost of the devices. However, this is beneficial mainly to the switches, since the voltage drop characteristic of the diodes is either a constant value (e.g. 1.0V) or a constant plus a current dependent term (e.g. 0.5V+0.05i). This is not too much of a problem in the motoring mode, when the diode current is relatively small. However, in the generating mode the larger current often produces losses which are a serious drawback to efficient operation.
It would be possible to replace the diodes with thyristors, as shown in FIG. 6, but there is no advantage in this, for two reasons. Firstly, the timing of the switching of the thyristor would be absolutely critical, since the thyristor would need to be fired at the instant the corresponding main switch was opened. Because of finite switching times associated with the devices (generally of the order of 10-20 μsec, depending on its size), it would be extremely difficult to ensure correct firing at all times. Secondly, even if the first objection were overcome, the voltage drop across the thyristor would be greater than across the diode it replaced, leading to larger, not smaller, device losses.
Other types of switch would be precluded, for the same or additional reasons. For example, an Integrated Gate Bipolar Transistor (IGBT) could be considered on the grounds that it would have a smaller device loss than a thyristor, but replacing the diode by an IGBT would not work, since the reverse voltage across the IGBT would destroy it.
It has been known to use standard configurations of IGBTs and diodes, which are available in industry-standard modules, for a switched reluctance drive. For example, the paper "Starter-alternator for hybrid electric vehicle: Comparison of induction and variable reluctance machines and drives" by Miller et al, Proceedings of the 1998 IEEE Industry Applications Society Annual Meeting, Oct. 12-15, 1998, St Louis, Mo., Vol. 1, pp 513-523, incorporated herein by reference, describes the arrangement of IGBTs and diodes reproduced in FIG. 7. The use of this circuit is described in the paper at p 517, column 2. In one cycle of phase conduction, the IGBTs SA & SD are used as switches and the return diodes are DB and DC. IGBTs SB and SC are biased to the off condition. In the following cycle of phase conduction, the IGBTs SC & SB are used as switches and the return diodes are DA and DD. IGBTs SA and SD are biased to the off condition. This is done so that current will flow in opposite directions in the phase winding on successive cycles, thus reducing mutual coupling between adjacent phases, as described at page 518, column 1, lower half. While this achieves the high torque output sought by the authors, it is a very costly solution, requiring eight devices per phase.
European Patent Application No. 0886370, incorporated herein by reference, also discloses a switching circuit in which a half bridge module is connected between the voltage rails. A diode is connected across each switch to conduct towards the positive rail. The phase current reverses direction on alternate cycles or on groups of cycles.

Circuit for use with switched reluctance machines


A conductive connector includes a bendable, shape retainable extension having a first end and a second end. The first end is integral with the probing head. The test point connector is integral with said second end. The test point connector is for making electrical contact with testing points. The present invention may be part of a probing system. The present invention may also include a method for using the conductive connector.

The present invention relates to an electrical test probe tip ("probing tip"), and more particularly to a bendable conductive connector.
FIGS. 1 and 2 show a probing system that includes an electrical test probe 20 for providing an electrical connection between electrical components 22 and testing instruments 24. An electrical test probe 20 generally consists of a cable 32 having a probing head 30 at one end and a testing instrument connector 34 at the other end for attaching the cable to testing instruments 24 (e.g. oscilloscopes and other measuring, monitoring, diagnostic, and signal processing instruments). The probing head 30 generally is interconnectable with at least one probing tip, which may be a removable and/or replaceable probing tip 40. A socket 38 or other connection means may be used for connecting the probing tip 40 to the probing head 30. One or more of the probing tips 40 may be used, for example, for making electrical contact with testing points 22 (e.g. pins, leads, paths, or other electrical components) such as those found on a circuit board. One or more of the probing tips 40 may be used as a means for connecting the probing head 30 to ground. Ground provides the electrical reference point for other signal measurements, so the ground connection typically remains unchanged while the probing head is positioned at testing points so that the electrical signal thereon may be measured, monitored, or otherwise processed.
It is difficult to form a contact with modern miniaturized testing points. For example, both the pins and the spacing between the pins on a modern integrated circuit chip ("IC") have been miniaturized. If two adjacent pins are contacted simultaneously by the probing tip, a short circuit may result between the two adjacent pins. A short circuit may prevent measurement of the desired signal and may result in damage to the internal circuitry of the IC.
Most probing tips are stiff. For example, a traditional probing tip is a stiff conductive member that terminates in a conical, blunt, or rounded point. IC grabber probes have a jaw-like tip that connects to and holds a pin, but are also relatively stiff and prevent optimum positioning of probing heads.
Tektronix, Inc. produces a signal-ground adapter that has been specifically designed to connect with a square pin. But like the IC grabber probes, the signal-ground adapter connects rigidly to signal and ground pins, and the inflexibility prevents desirable movement of the probing head to optimum positions. Tektronix also produces a right-angle adapter that includes a stiff coil used to rigidly attach a probe at a right angle to a pin. The purpose of the stiff coil is to mate with a pin, and the stiffness prevents movement of the probe. Because it is inflexible after mating with the pin, the coil is not adaptable and may be used in only one position for probing a specific type of pin (a 0.025 inch diameter square pin). Tektronix also produces a "Y-lead" adapter that has wire leads that may be combined with the right-angle adapter. The combination of the right-angle adapter and the Y-lead adapter may allow the probing head to be moved relative to the device being probed, but the addition of leads may add inductance. Probing an electrical device using the Y-lead adapter may be inconvenient or impossible using just one hand. Typically, the probe body must be laid on the table while pin connections are changed. Draping the wire leads on electrical components and moving parts, such as a CPU fan, is another disadvantage of the Y-lead adapter.
Several prior art references are directed to electrical test probe tips and electrical connectors. U.S. Pat. No. 4,978,312 to Fodali (the "Fodali reference") is directed to a tip attachment for a circuit test probe and, specifically, to a spring attachment for placement on a handheld tester with an ice pick-type probe. One end of the tapered spring tip attachment fits on the ice pick-type probe, and the other end terminates in a straight length of wire. The purpose of this spring attachment is to provide a smaller gauge tip for insertion into sockets too small for the ice pick probe. In other words, the Fodali tip uses a spring merely as a connector for attaching the straight wire probe end to a tapered ice pick-type probe.
U.S. Pat. No. 3,885,848 to Brouneus (the "Brouneus reference") is directed to a method of making an electrical connection with a flat surface contact using a conical spring. The contact member is a conically spiraled length of electrically conductive resilient wire including spirals that progressively increase in size. A cylindrical helix is electrically connected to the small end of the volute helix. An electrically conductive terminal member may be inserted into and secured within the cylindrical helix. The wide end of the conical spring may be electrically connected to a flat conductive surface. Compressing the volute helix moves the spirals of the helix into contact with a flat surface. The volute helix would return to its original position if not held in place.
Problems with exemplary ground connections include, but are not limited to, that they do not hold themselves in place, they are not able to be used in an axial application, they have poor compliance, they have poor or little radial adjustment, they have poor axial compliance, and they are not adjustable or are only adjustable in one direction.


A series of electronic components stored in a tape include a plurality of electronic components each arranged such that a first main surface faces a bottom surface of a cavity. In each electronic component, on a first side surface, a thickness in a width direction of a first terminal electrode at a first main surface side is smaller than a thickness in the width direction of the first terminal electrode at a second main surface side, and on a second side surface, a thickness in the width direction of a second terminal electrode at the first main surface side is smaller than a thickness in the width direction of the second terminal electrode at the second main surface side.

1. Field of the Invention
The present invention relates to a series of electronic components stored in a tape, a manufacturing method for a series of electronic components stored in a tape, and an electronic component.
2. Description of the Related Art
To date, a large number of electronic components such as multilayer ceramic capacitors are used in a variety of electronic devices. For example, as an example of an electronic component, in Japanese Unexamined Patent Application Publication No. 2013-201417, a multilayer ceramic capacitor is described in which signal terminal electrodes are provided on first and second end surfaces of a ceramic body and grounding terminal electrodes are provided on first and second side surfaces of the ceramic body.
Usually, a multilayer ceramic capacitor is mounted on a mounting substrate using a bonding material such as solder. Consequently, it is required that the multilayer ceramic capacitor have high moisture resistance reliability in the multilayer ceramic capacitor mounting structure.

Series of electronic components stored in a tape, manufacturing method for series of electronic components stored in a tape, and electronic component