There is provided a honeycomb structural body with a high cell density of 600 cells/in2 or greater and excellent catalyst loading properties. In a honeycomb structural body comprising a plurality of cells formed by providing partition walls composed mainly of cordierite, which has the chemical composition SiO2: 45-55 wt %, Al2O3: 33-42%, MgO: 12-18 wt %, in a honeycomb fashion, the density of the cells is at least 600 cells/in2 and the pore volume of the partition walls is at least 30%.

1. Field of the Invention
The present invention relates to a honeycomb structural body, made of cordierite, which can be used as a catalyst carrier in an exhaust gas purification apparatus for an internal combustion engine and, particularly, to a honeycomb structural body with a high cell density.
2. Description of the Related Art
Catalyst carriers for exhaust gas purification apparatuses have conventionally employed a honeycomb structural body 9 such as those shown in FIGS. 6 and 7, wherein partition walls 90 made of cordierite or the like are arranged in a honeycomb fashion to form multiple cells 99. An exhaust gas purification function is exhibited by carrying an exhaust gas purifying catalyst 8 on the surface of the partition walls 90 of the honeycomb structural body 9.
Incidentally, demands have been increasing in recent years for exhaust purification apparatuses with further improved purification functions and smaller sizes.
In order to satisfy the two demands of improved purification function and smaller size, it is effective to raise the cell density (increase the number of cells/in2) of the honeycomb structural body, i.e. to increase the number of cells per unit area. This enlarges the cell surface area and increases the contact area between the exhaust gas and the catalyst.
To exhibit an effect of increased cells/in2 of the honeycomb structural body it is necessary to fully maintain the exhaust gas channel so that no pressure loss occurs. It is therefore essential to avoid clogging of the cells when the catalyst is loaded. However, in high-cells/in2 honeycomb structural bodies of 600 cells/in2 or greater, cell clogging tends to occur, during catalyst loading, more readily than in conventional honeycomb structural bodies of low cells/in2 (400 cells/in2 or lower).
Loading of the catalyst is accomplished by coating the partition walls of the honeycomb structural body with a catalyst slurry, prepared using catalyst components, and drying it. The above-mentioned clogging tends to occur more easily with a higher solid concentration of the catalyst slurry (hereunder referred to as xe2x80x9cslurry concentrationxe2x80x9d). Consideration has therefore been given to reducing the slurry concentration to prevent clogging. However, when it is simply attempted to achieve a low concentration for the catalyst slurry, too little catalyst is loaded by a single catalyst slurry application. It therefore becomes necessary to significantly increase the number of applications of the catalyst slurry, and this results in increased production cost.
The present invention, which has been accomplished in light of these circumstances, is aimed at providing a honeycomb structural body with a high cell density of 600 cells/in2 or greater, and excellent loading properties of the catalyst.
The present invention relates to a honeycomb structural body comprising a plurality of cells formed by providing partition walls composed mainly of cordierite, which has the chemical composition SiO2: 45-55 wt %, Al2O3: 33-42 wt %, MgO: 12-18 wt %, in a honeycomb fashion, the honeycomb structural body being characterized in that the cell density is at least 600 cells/in2 and the pore volume of the partition walls is at least 30%.
The honeycomb structural body of the invention has a high cells/in2, with a cell density of at least 600 cells/in2, as stated above. If the cell density is less than 600 cells/in2 the purification performance will not be significantly improved when the catalyst is loaded to construct the exhaust gas purification apparatus. A higher cell density is more preferred, but limitations exist due to production technology, etc.
In order to achieve a higher cells/in2, it is essential to reduce the thickness of the partition walls. Specifically, the partition wall thickness is preferably no greater than 150 xcexcm. When it exceeds 150 xcexcm there is a risk of increased flow resistance (pressure loss) of the gas. The thickness is thus preferably no greater than 100 xcexcm.
The pore volume of the partition walls, that is, the proportion of the volume constituted by fine pores per unit volume of the partition walls, is 30% or greater. If the pore volume is less than 30% there will be no improvement in the loading property of the catalyst, and it will require multiple repetitions of the step of coating the catalyst slurry containing the catalyst components. On the other hand, if the pore volume is too high the strength of the partition walls will be low.
The pore volume is therefore preferably 35-80%, with an upper limit of 50% being preferred.
The function of the invention will now be explained.
As mentioned above, the honeycomb structural body of the invention has a high cell density of 600 cells/in2 or greater and a partition wall pore volume of at least 30%. Thus, when the catalyst is loaded onto the partition walls, it is possible to both prevent cell clogging and ensure the catalyst loading amount.
Specifically, by increasing the pore volume of the partition walls from the conventional average of 25% to at least 30%, the catalyst loading amount is greater than that according to the prior art when a catalyst slurry of the same concentration is applied. It is thus possible to lower the slurry concentration for loading the same amount of catalyst according to the prior art.
A lower slurry concentration can reduce occurrences of cell clogging.
Consequently, even when achieving a high cell density of 600 cells/in2 or greater, if the pore volume of the partition walls is 30% or greater as explained above it is possible to prevent occurrence of cell clogging while ensuring the same catalyst loading amount as with the prior art.
According to the invention, therefore, it is possible to provide a honeycomb structural body with a high cell density of 600 cells/in2 or greater and with an excellent catalyst loading property.
The thickness of the partition walls is preferably no greater than 80 xcexcm. This allows the pressure loss in the fluid passing through the partition walls to be drastically reduced.
The average roughness Rz of the surface of the partition walls is preferably 1-5 xcexcm. An average roughness Rz outside of the range of 1-5 xcexcm can present the risk of lower adhesion of the catalyst to the partition walls. The reason for this is believed to be that the particle size of alumina powder used as a catalyst component is largely distributed in the range of 1-5 xcexcm.
The mean size of the fine pores formed inside the partition walls is preferably 1-10 xcexcm. If the mean size of the fine pores is less than 1 xcexcm there will be a problem in that the alumina powder will not enter into the fine pores and adhesion will thereby be reduced, while if it exceeds 10 xcexcm there will be a problem of reduced strength of the partition walls.
The honeycomb structural body may be a catalyst carrier wherein a catalyst is loaded onto the surface of the partition walls. The catalyst may be a ternary catalyst for purification of NOx, CO, HC, etc. Specific components include alumina powder, and mixtures of platinum, palladium, etc. In this case, the honeycomb structural body may be applied as a catalyst carrier in a catalytic converter for purification of automobile exhaust gas, for example.
For loading of the catalyst, the catalyst slurry concentration conditions will differ depending on the catalyst components that are loaded, but as an example, it is preferably carried out by coating the partition walls with a catalyst slurry having a solid concentration of no greater than 45%. If the solid concentration (slurry concentration) is greater than 45% a problem is presented of easier clogging in cells of 600 cells/in2 or greater. On the other hand, if the slurry concentration is too low the catalyst loading amount is reduced, and therefore the lower limit for the slurry concentration is preferably 40%.


A source region and a drain region are disposed in a substrate. A gate insulating film is disposed on the substrate. A gate electrode is disposed on the gate insulating film. The gate electrode may include a first gate portion adjacent to the source region and a second gate portion adjacent to the drain region. The first and second gate portions have different work functions from each other.

The inventive concept disclosed herein relates to semiconductor devices, and more particularly, to a semiconductor device including a high voltage transistor.
Semiconductor devices may be classified into memory devices and logic devices. The memory devices may store data and the logic devices may perform a function of operating data or a function of executing a predetermined command.
Semiconductor devices are an important factor in the electronics industry due to their miniaturization, multifunctionality and high speed characteristics. Thus, as the electronics industry develops, there is an ever-increasing demand for higher integration, increased functionality, higher speeds, and better reproducibility and reliability of semiconductor devices. However, these enhanced requirements may be in a tradeoff relation such that improvements in one characteristic must be balanced with reduction in another desirable characteristic. As a result, it is increasingly difficult to satisfy all of the requirements described above at the same time. For instance, as line widths of semiconductor patterns and/or a space between semiconductor patterns are reduced, it is difficult to increase an operation speed of the semiconductor devices. Also, as line widths of semiconductor patterns and/or a space between semiconductor patterns are reduced, it is difficult to retain high reliability and/or reproducibility. The electronics industry is highly competitive and improved characteristics of new semiconductors are continuously being sought.


A circuit board device for fixing an electronic card, which is formed with at least one aperture, includes a circuit board and a securing member. The circuit board includes a board body formed with two through holes, and a socket connector provided on the board body for mating with the electronic card. The securing member includes a pressing plate for pressing against the electronic card, at least one engaging stud projecting from a bottom end of the pressing plate for engaging the aperture, and two resilient engaging arms provided respectively on left and right sides of the pressing plate. The engaging arms extend respectively through the through holes and engage releasably the board body.

1. Field of the Invention
The present invention relates to a circuit board device, and more particularly to a circuit board device for fixing an electronic card and a combined circuit board and electronic card assembly.
2. Description of the Related Art
Currently, the functional requirements of an electronic device (e.g., a notebook computer or a tablet computer) are gradually increasing. A plurality of electronic components are layout on a surface of a circuit board, and thus the space that can be utilized on the surface of the circuit board is limited. A socket connector is also disposed on the surface of the circuit board for mating with an electronic card. After a user inserts the electronic card into the socket connector, screws are passed through through holes in the electronic card and are screwed respectively to studs on the circuit board's surface, thus locking the electronic card on the circuit board.
In the above-mentioned screw locking method, the user needs an assistant tool (e.g., a screwdriver) to perform the screw locking operation. Therefore, assembling of the electronic card on the circuit board is inconvenient and causes a waste of time. Furthermore, since the studs are fixed on the circuit board's surface, when the user intends to insert another electronic card with a greater length into the socket connector, the electronic card is blocked by the studs and thus cannot be inserted into the socket connector. Consequently, electronic cards of different lengths cannot be selectively inserted into the socket connector for use, so that the space on the surface of the circuit board cannot be fully utilized.

Circuit board device and a combined circuit board and electronic card assembly


A control method, apparatus, and system capable of securely distributing a shared secret network encryption key from a host to a wireless peripheral device. The sharing of the secret network encryption key is accomplished without the intervention of a man-machine interface at the peripheral. Embodiments enable a wireless device to receive and store multiple encryption keys, to select the appropriate encryption key depending on the network in range of the device, and thus to freely associate with multiple networks.

1. Field of the Invention
Aspects of the present invention relate in general to the field of communications network access security.
2. Background
The broadcast nature of wireless data transmission makes transmitted information susceptible to interception by third parties. Wireless networks, just like public networks, such as the Internet, must hence be considered insecure. As information transferred wirelessly between electronic devices is often of proprietary nature, there is a need to protect this information from eavesdropping.
Conventionally, one method of securing network access is by using encryption.
In a typical system using encryption, a sender encrypts the information using an encryption engine and an encryption key. The resulting information is rendered unintelligible to any party except to the recipient in possession of the decryption key. The recipient decrypts the received information using a decryption engine and the appropriate decryption key and thus translates the encrypted information into its original readable form.
Traditionally, the same key is used for both encryption and decryption. This is called "private key" or "symmetric" cryptography. Keys that are used for both encryption and decryption are referred to as "symmetric keys." The shared key must remain secret since any party in possession of this key can decrypt information previously encrypted with the key. In order to establish a shared secret key, the key must be distributed among the communicating parties by means of a secure channel.
In public-key cryptography, the encryption key and the decryption key are distinct. The encryption key is public and can therefore be sent to the other party over an insecure communication channel. The decryption key is kept private and never revealed. To encrypt a message for a recipient, the sender uses the recipient's public encryption key. The encrypted message is then sent to the recipient over the insecure channel. The recipient uses its private decryption key to decrypt the received encrypted message.

Encryption key distribution and network registration system, apparatus and method


A composite material is constituted by fine nano-oxide particles, a dispersant, and a transparent resin material. The dispersant includes a polymer of vinyl monomer having a binding acidic group. When φ is a dimensionless number defined by an average particle size (nm) of the fine nano-oxide particles divided by nm, the polymer has a degree of polymerization of an integer of 3 or more and 8×φ or less with the proviso that the integer is a numerical value obtained by dropping a decimal fraction. The composite material is produced through a step of obtaining a dispersant comprising a polymer by polymerizing a vinyl monomer having a binding acidic group in the presence of polyamine or in an aqueous dilute dispersion, and a step of mixing the dispersant, fine nano-oxide particles, and a transparent resin material.

Amorphous thermoplastic resins such as styrene-based resin, acrylic resin and polycarbonate resin and curable resins such as unsaturated polyester resin and diallyl phthalate resin have good transparency to light of wavelengths in the visible region. These resin materials are general-purpose transparent resin materials having low specific gravity and an excellent characteristic well-balanced in terms of mechanical characteristics such as low-temperature moldability, mass-productivity, toughness, flexibility, and shock resistance when compared with inorganic glass materials. However, refractive indices of these transparent resin materials are determined by their constituents, so that the transparent resin materials have a narrow control range of optical characteristics compared with conventional optical glass materials. As one of means for increasing a refractive index of the transparent resin material, an attempt to incorporate, into a resin material, an element having a large atomic number such as bromine or sulfur which is a component contributing to an increase in dielectric constant has been made but there remains a problem that a variable range of the refractive index is still narrow.
In order to remedy such a problem of organic polymeric materials, incorporation of fine particles of inorganic metal oxide, inorganic metal sulfide, or the like into a resin matrix so as to utilize their high refractive indices has been attempted.
For example, Japanese Laid-Open Patent Application (JP-A) Hei 1-306477 has disclosed a hard coating agent, for an optical material, comprising an oxide sol such as an antimony oxide sol and siloxane as a matrix component. In this case, a silane coupling agent or siloxane contributes to dispersion of the colloid. However, in order to apply this coating agent to a bulk material such as a lens, a decrease in particle size of the fine oxide particles in the resin matrix and an improvement in dispersibility of the fine oxide particles remain to be solved as big problems.
In order to improve the dispersibility of the oxide fine particles in the matrix, studies on introduction of a dispersant other than siloxane or a functional group having a dispersing function into the matrix have been made.
JP-A Hei 5-25320 has disclosed a curable composition comprising a thermosetting resin such as acrylic resin or unsaturated polyester resin, an inorganic filler of fine powdery titanium oxide or the like, and a dispersant consisting of a phosphate compound having a terminal aryl group. JP-A 2002-55225 has disclosed an active energy-polymerizable resin layer, as a hard coating surface layer of an optical filter, containing inorganic particles treated with an organic compound having an active energy-curable group and an acidic group such as phosphoric group, sulfonic group or carboxylic group. JP-A (Tokuhyo) 2004-524396 has disclosed a composite composition, as an electric or optic device, comprising inorganic particles and a polymer having a side-chain containing oxysilane group, phosphonate group, sulfide group, amino group, or sulfonate group. JP-A 2002-105325 has disclosed a composition prepared by dispersing ultrafine semiconductor particles in a resin matrix having a polymer chain copolymerized with radical-polymerizable phosphine oxide as a ligand for the fine particles. JP-A 2002-20678 has disclosed a dispersing method of fine metal oxide particles for a coating film, in which an adsorptive segment is imparted to a polymer main chain. In these dispersion methods, interaction between a surface of inorganic fine particle and a functional group such as phosphoric group, phosphine oxide or carboxyl group is ensured but there arises such a problem that a resultant bonding strength is still weak. Therefore, particularly, with respect to particles of a particle size of 10 nm or less, a satisfactory dispersion performance has not yet obtained, so that the use of the resultant dispersoid is limited to a thin coating film. In the case of requiring thermal moldability, it is required that dispersibility of fine nano-oxide particles is not destroyed by flow of a thermoplastic matrix, which makes the surface treating technique of the fine oxide particles further difficult.
The problem of the low dispersibility of the fine nano-oxide particles is also involved, in addition to the transparent optical material, in resin materials required to increase their strength by dispersing fine oxide particles; shielding materials for radiation, ultraviolet rays, visible rays, infrared rays, and the like on the basis of an optical characteristic of fine metal oxide particles; nonlinear materials based on plasmon in fine particles; and the like.
As described above, the dispersing technique for fine oxide particles, particularly those of nanometer size has been required.

Composite material and production process of dispersant


A semiconductor device having high ruggedness is provided. The distance Wm2 between buried regions, positioned at the bottoms of different base diffusion regions and face each other, is set smaller than the distance Wm1 between buried regions positioned at the bottom of the same base diffusion region (Wm1>Wm2). An avalanche breakdown occurs under the bottom of the base diffusion region, and the avalanche current is not passed through a high resistance part immediately under the source diffusion region in the base diffusion region, thereby providing high withstand strength against destruction.

It is an object of the invention to provide a semiconductor device having high breakdown voltage and high withstand strength against destruction.
It is an object of the invention to provide a semiconductor device having high breakdown voltage and high withstand strength against destruction.
In order to solve the above described object, a semiconductor device according to claim 1 includes a resistance layer of a first conductivity type, a plurality of base diffusion regions of a second conductivity type formed in the vicinity of inner surface of the resistance layer and positioned apart from one another, a source diffusion region of the first conductivity type formed in the vicinity of inner surface of each of the base diffusion regions in a region more on the inner side than the edge of each of the base diffusion regions and the source diffusion region has a depth shallower than that of each of the base diffusion regions, a channel region positioned near the edge of each of the base diffusion regions and between the edges of each of the base diffusion regions and edges of each of the source diffusion regions, a gate insulating film positioned at least on each of the channel regions, a gate electrode film positioned on the gate insulating film, and a plurality of buried regions of the second conductivity type provided plurally on the bottom of each of the base diffusion regions and connected to each of the base diffusion regions. Among pairs of adjacent base diffusion regions, between a center of width direction of one base diffusion region and the center of width direction of the other base diffusion region and in a range deeper than the depth of the base diffusion regions and shallower than the bottom of the buried regions, an amount of impurity of the first conductivity type and an amount of the impurity of the second conductivity type are nearly equal. Furthermore, a PN junction between the buried region and the resistance layer is set such that avalanche breakdown does not occur at a voltage at which the buried regions is filled with the depletion layer. Moreover, a width Wm1 of the resistance layer in the part between the buried regions adjacent at the bottom of the same base diffusion region is larger than a width Wm2 of the resistance layer in the part between the buried regions adjacent at the bottoms of the different base diffusion regions.
According to the invention as recited in claim 2, in the semiconductor device according to claim 1, the base diffusion regions have a longitudinal direction, the longitudinal directions are provided parallel to one another, and the buried regions are provided parallel to one another along the longitudinal directions of the base diffusion regions.
According to the invention as recited in claim 3, in the semiconductor device according to claim 1, each of the buried regions includes an active groove formed in the resistance layer and a semiconductor material of the second conductivity type filled in the active groove.
According to the invention as recited in claim 4, in the semiconductor device according to claim 2, widths of the buried regions are equal to each other.
According to the invention as recited in claim 5, in the semiconductor device according to claim 2, lengths of the buried regions are equal.
According to the invention as recited in claim 6, the semiconductor device according to claim 1 includes a plurality of ring-shaped withstand voltage grooves surrounding the base diffusion region and a semiconductor material of the second conductivity type provided in the withstand voltage grooves.
According to the invention as recited in claim 7, the semiconductor device according to claim 1 further includes a source electrode film electrically connected to the source diffusion region and the base diffusion region.
According to the invention as recited in claim 8, the semiconductor device according to claim 1 further includes a drain layer of the same conductivity type as that of the resistance layer and having a higher concentration than that of the resistance layer arranged on a surface opposite to the surface of the resistance layer at which the base diffusion region is formed.
According to the invention as recited in claim 9, the semiconductor device according to claim 1 further includes a collector layer of the conductivity type opposite to that of the resistance layer arranged on a surface opposite to the surface of the resistance layer at which the base diffusion region is formed.
According to the invention as recited in claim 10, the semiconductor device according to claim 1 further includes a Schottky electrode film that forms a Schottky junction with the resistance layer arranged on a surface opposite to the surface of the resistance layer at which the base diffusion region is formed.
According to the invention as recited in claim 11, the semiconductor device according to claim 7 further includes a drain electrode film formed on the surface of the resistance layer on a side having the base diffusion region, and the drain electrode film is electrically connected to the resistance layer and insulated from the source electrode film.
According to the invention as described above, the distance Wm1 between adjacent buried regions among a plurality of buried regions positioned at the bottom of the same base diffusion region is the same as the width Wm1 of the resistance layer between these buried regions. The distance Wm2 between adjacent buried regions positioned at the bottoms of adjacent base diffusion regions can be equal to the width Wm2 of the resistance layer between these buried regions. The distance Wm1 is formed to be larger than the distance Wm2, and avalanche breakdown occurs under the bottom of the part between the buried regions in the base diffusion region.
The source diffusion regions are provided at prescribed intervals along the edge of the base diffusion region, and the source electrode film connected to the source diffusion region is electrically connected to the base diffusion region about the center of a width direction of the base diffusion region.
Therefore, avalanche current generated by avalanche breakdown is not passed through the high resistance part in the base diffusion region under the bottom of the source diffusion region, and therefore high ruggedness can be obtained.
It is noted that when the base diffusion regions and the buried regions are formed in long and narrow shapes, the buried regions are provided parallel in the longitudinal direction of the base diffusion regions.
Accordingly, a semiconductor device with high withstand strength against destruction can be obtained.

Shindengen Electric Manufacturing Co., Ltd.


A method for testing a semiconductor component includes the steps of bonding an interconnect to the component to form bonded electrical connections, applying test signals through the bonded electrical connections, and then separating the interconnect from the component. The bonding step can be performed using metallurgical bonding, and the separating step can be performed using solder-wettable and solder non-wettable metal layers on the interconnect or the component. During the separating step the solder-wettable layers are dissolved, reducing adhesion of the bonded electrical connections, and permitting separation of the component and interconnect. The interconnect includes interconnect contacts configured for bonding to, and then separation from component contacts on the components. A system includes the interconnect, an alignment system for aligning the substrate to the interconnect, a bonding system for bonding the component to the interconnect, and a heating system for heating the component and the interconnect for separation.

Semiconductor manufacture includes various test procedures wherein the integrated circuits on semiconductor components are evaluated. One such test, known as burn-in, subjects the components to elevated temperatures, while test signals are applied to the integrated circuits contained on the components. Typically, burn-in testing is performed on individual packaged semiconductor components, which are connected in parallel on a burn-in board having individual sockets for the components. The burn-in board is designed for placement in a burn-in oven in electrical communication with test circuitry of a host controller. The test circuitry is designed to apply test signals which electrically "exercise" the integrated circuits. The components being tested are sometimes referred to as the devices under test (DUTs).
Semiconductor components can also be tested using carriers which function as temporary packages for singulated components, such as dice and chip scale packages. For example, burn-in testing of unpackaged dice can be used to certify the dice as known good dice (KGD). U.S. Pat. No. 5,796,264 to Farnworth et al. entitled "Apparatus For Manufacturing Known Good Semiconductor Dice" discloses a system for burn-in testing unpackaged dice. U.S. Pat. No. 5,519,332 to Wood et al., entitled "Carrier For Testing An Unpackaged Semiconductor Die" discloses an exemplary burn-in carrier for singulated dice. Both of these issued patents are assigned to the assignee of the present application, Micron Technology Inc. of Boise Id. This type of carrier includes an interconnect having test contacts configured to make temporary electrical connections with device contacts on the device under test (DUT). Later generation carriers are configured for burn-in testing chip scale packages having device contacts in the form of terminal contacts, such as solder balls, in an area array.
Rather than being performed on individual components, burn-in testing can also be performed at the wafer-level wherein multiple components, such as dice or packages, are contained on a common substrate, such as a semiconductor wafer. Wafer-level testing of semiconductor components has been practiced since at least 1990, as exemplified by U.S. Pat. No. 5,539,324 to Wood et al., entitled "Universal Wafer Carrier For Wafer-level Die Burn-In", also assigned to Micron Technology Inc. The '324 patent discloses a carrier for housing a wafer for burn-in testing having contact tips which electrically engage bond pads on the devices under test (DUTs).
Another wafer-level test apparatus is disclosed in U.S. Pat. No. 5,570,032 to Atkins et al., entitled "Wafer Scale Burn-In Apparatus And Process", also assigned to Micron Technology, Inc. The apparatus in the '032 patent includes a printed circuit board which mates with the wafer under test (WUT), and includes electrically conductive pillars for contacting the bond pads on the devices under test (DUTs). The apparatus also includes heating elements and cooling channels configured to generate the elevated temperatures necessary for burn-in.
A more recent wafer-level burn-in test system is disclosed in U.S. Pat. No. 6,788,094 B2 to Khandros et al., entitled "Wafer-level Burn-in And Test", assigned to FormFactor Inc. of Livermore, Calif. The system in the '094 patent includes a test substrate that mates with the wafer under test (WUT). Metallic spring contact elements on the test substrate or the wafer, make the individual electrical connections with the devices under test (DUTs).
One important aspect of any wafer-level test system are the individual electrical connections with the contacts on the devices under test (DUTs). A single wafer can include a large number of components (e.g., several hundred dice or packages), and each component can include a large number of device contacts (e.g., 50 to 200 bond pads or terminal contacts) having a small size (e.g., 5 mils or less), and a small pitch (e.g., 10 mils or less). Accordingly, the system must make tens of thousand of separate electrical connections with the wafer.
This requires the test contacts of the test system to be accurately aligned with the device contacts on the devices under test (DUTs) prior to making the electrical connections. In addition, the test contacts are preferably capable of making low resistance (ohmic) electrical connections with the device contacts. For making low resistance connections relatively large forces are sometimes used to bias the test contacts against the device contacts. These large biasing forces can damage the wafer, the test contacts and the device contacts. Spring type contacts are particularly vulnerable to bending and distortion under large contact forces.
To make low resistance electrical connections, the test contacts must also contend with native oxide layers (e.g., AlO2) on the device contacts. These oxide layers have a much higher electrical resistance than the underlying metal of the device contacts. Accordingly, some prior art test contacts include structures for penetrating or scrubbing the device contacts. Again, these penetrating structures can require relatively large contact forces, and can damage the device contacts. The test contacts are also subject to oxidation, and attract contaminants, such as dirt and metal flakes, which can add to the contact resistance.
The present invention is directed to a test method using an interconnect configured to make low resistance electrical connections with components having large numbers of small closely spaced contacts. In addition, the interconnect can be configured to test wafer sized components or die sized components.

Method for testing semiconductor components using bonded electrical connections


A tub or shower surround kit, system, and method are disclosed. An example system for constructing a tub surround, shower surround, and wall covering includes a plurality of components including at least one panel, at least one edge component, and at least one interconnecting component. The example system also includes a tongue or lip of a first of the plurality of components configured to fit into a groove of a second of the plurality of components. The example system also includes a tongue or lip of the second of the plurality of components to fit into a groove of the first of the plurality of components. Any number of the plurality of components are connected adjacent a desired wall geometry to provide an assembled version of the tub surround, shower surround, and wall covering.

Shower and tub surrounds have been around since the advent of shower bases and tubs. The surrounds are provided as a decorative finish, and to prevent water from striking or splashing the adjacent walls, potentially damaging the walls. Shower and tub surrounds may be made of tile glued to the walls, or may be made as solid slabs (e.g., granite slabs), or as plastic or fiberglass coverings. These options may be expensive, and do not provide for any variation in the surround.

Tub or shower surround kit system and method


Provided is an electrically driven vehicle (10) loaded with a driving storage battery (20) charged by electric power supplied from a power supply outside the vehicle, including an occupant detection sensor (70) for detecting whether or not an occupant is in the electrically driven vehicle (10), rotation sensors (80) for detecting presence/absence of rotations of wheels (90) provided to the electrically driven vehicle (10), and a charge control unit (60) for determining whether or not a state in which the occupant detection sensor (70) detects that the occupant is not in the electrically driven vehicle (10) and the wheel rotation sensors (80) detect that the wheels (90) are not rotating has continued for a predetermined period, and starting, when the charge control unit (60) determines that the state has continued for the predetermined period, the charge of the driving storage battery (20).

1. Field of the Invention
The present invention relates to an electrically driven vehicle and a charge control method for the electrically driven vehicle, and more particularly, to an electrically driven vehicle loaded with an electric power storage device charged by electric power supplied from a power supply outside the vehicle, and a charge control method for the electrically driven vehicle.
2. Description of the Related Art
In recent years, consciousness to the environment has been increasing. Accordingly, an electrically driven vehicle such as an electric vehicle or a plug-in hybrid vehicle, which is loaded with a driving storage battery which can be charged by electric power supplied from a power supply outside the vehicle, and employs a motor operated by the driving storage battery as a power supply, is gaining attention.
The electrically driven vehicle is charged during being parked, by connecting a power supply outside the vehicle and the electrically driven vehicle with each other using a charge cable. In this way, the charge cable is connected to the electrically driven vehicle during being externally charged, and, when the electrically driven vehicle moves from the parking location during the charge, the connected charge cable is disconnected, and arc discharge is generated from connection terminals, resulting in a possible damage of the connection terminals and the like. Therefore, Japanese Patent Application Laid-open No. Hei 09-322313 describes an electrically driven vehicle, which enables charge only if a shift position of an automatic transmission for driving the vehicle is in a parking range, and which includes a lock mechanism for preventing the shift position from moving during the charge.
However, if the vehicle is chargeable only when the shift position is in the parking range, the charge will not start in a case where a user connects the charge cable, but forgets to operate the shift position to the parking range. In addition, because the charge cable is connected outside the vehicle, it is not always the case that the user confirms the start of the charge. In this case, there may occur a problem in that the user cannot use the electrically driven vehicle because the charged amount is not sufficient when the user wants to use the electrically driven vehicle.

Electrically driven vehicle and charge control method for electrically driven vehicle


A method for detecting the spoofing of a signal from a satellite in orbit. A receiver can be located on an aircraft to receive an apparent satellite signal. The method can include determining at least two characteristic signatures of the signal including a power level, and indicating the apparent satellite signal is a spoofed satellite signal.

In general, satellite-based communication and navigation systems provide location and time information for nautical, aeronautical, locomotive, and automotive vessels. Satellite communication and navigation systems can occur anywhere on or near the Earth where there is an unobstructed line of sight between the vessel and one or more satellites. Satellite communication and navigation systems have a variety of applications on land, at sea, and in the air.
Aircraft rely on satellite communication for navigation and information (e.g., weather) systems. Spoofing occurs when a signal is sent to the aircraft to intentionally feed misinformation to the navigation and information systems of the aircraft. For example, a spoofed satellite navigation signal may attempt to cause an aircraft to fly off course. An ability to authenticate satellite signals protects against spoofing. Some techniques to authenticate satellite signals may rely on unique characteristics of the signals, and therefore cannot be applied to all satellite signals.


A call processing method and apparatus are provided as a call processing solution. An example method comprises acquiring multimedia data from a calling subscriber before a call ends, where the calling subscriber is a subscriber that initiates the call, determining whether the call satisfies a preset call processing condition according to the multimedia data from the calling subscriber, and processing the call if the call processing condition is satisfied.

During a common phone call, a called party usually decides whether to pick up the phone, that is, answer the call, based on a current situation. If after a period of waiting, the called party still does not pick up, the calling party may access a voice mailbox of the called party to leave the called party a message. After leaving the message, the calling party hangs up and the call ends. The called party may access the voice mailbox to listen to the message, though in this case the called party may have already missed some important calls.


The appliance includes an appliance body (12) as well as a system for producing microbubbles (20) and a system for producing an ultrasound signal beam (22) in a frequency range which activates at least some of the microbubbles. The appliance includes at least one of the following: (a) an array of ultrasound transducer elements (40) which produce a plurality of ultrasound signal beams; (b) an amplitude modulation assembly (51) for modulating the amplitude of the ultrasound signal; and (c) a frequency modulation system (61) for changing the frequency of the ultrasound signals over a selected range, to impact a range of microbubble sizes.

Ultrasound-induced cavitation of air microbubbles to clean biofilm off of teeth surfaces, as well as below the gum line, is generally known. An example of such ultrasonic technology is shown in U.S. Pat. No. 5,138,733 to Bock. Other examples include U.S. Pat. No. 3,809,977 to Balamuth and U.S. Pat. No. 7,269,873 to Brewer et al. Further, there have been commercial dental appliances which utilize an ultrasound/microbubble approach to cleaning teeth. Such appliances, however, typically have one or more significant disadvantages.
First, while the cleaning action produced by cavitation of the microbubbles generally can be strong in the vicinity of some of the bubbles, not all of the bubbles are strongly active, and even the ones which are active tend to remain in a single position longer than necessary to clean an area around that position. Overall cleaning action is thus believed to be weaker than otherwise could be the case with the typical number of bubbles available and with the same ultrasound excitation.
Further, cleaning is spotty on a macroscopic level. Certain regions on the surfaces of the teeth will exhibit strong cleaning, while others exhibit almost no cleaning at all. This is possibly due to variations in ultrasound intensity caused by interference effects due to reflection of the ultrasound off the various teeth surfaces.
Still further, adequate bubble concentration is difficult to maintain in the teeth recesses where the cavitation could actually have the most beneficial effect, because of ineffective cleaning by scrubbing. This lack of bubble concentration is likely due to the destruction of bubbles by the same ultrasound which would ordinarily produce cleaning.
Accordingly, an ultrasound/microbubble system is desired to either complement existing manual or power toothbrushes or mouthpieces, or to be used alone in order to produce a significant cleaning effect on the teeth, along the gum line and in the interproximal areas of the teeth.

Ultrasonic teeth cleaning appliance having spatial, temporal and/or frequency variations


Control method for obtaining enough blank time available for operations of a CPU other than switching by employing only a single D/A converter is disclosed. Since data to be processed comprise data requiring fast and slow responses, this method makes fast analog signals converted from fast response data to be delivered during every storing cycle through a specified analog switch group and slow analog signals converted from slow response data to be delivered following the fast analog signal during a distributed individual storing cycle through a periodically selected other analog switch group, thereby obtaining enough time available for operations of the CPU other than switching. The CPU operates a specific one of a plurality of analog switch groups every storing cycle and operates each of the remaining switch groups sequentially every storing cycle.

1. Field of the Invention
The present invention relates to a control method of a multi-channel digital-to-analog (D/A) converting circuit.
The invention is particularly concerned with a control method of a multi-channel digital-to-analog converting circuit for switchingly converting mutiple channel signals with a single D/A converter at no sacrifice of a high repetition rate operation and enabling the reduction of an operation time of a CPU (central processing unit) employed for the switching operation.
2. Description of the Prior Art
FIG. 1A illustrates a circuit diagram of a multi-channel digital-to-analog converting circuit of the prior art. Reference numeral 21 indicates an interface circuit (I/O) to interface a CPU (central processing unit) 26 to each of analog switch groups 24A to 24D. Interface circuits 22A to 22D interface bus signals 32A to 32D connected with the CPU 26 to each of D/A converters 23A to 23D. Each of D/A converters 23A to 23D converts each of bus signals 32A to 32D applied through each of interface circuits 22A to 22D to each of analog signals 33A to 33D.
Analog switch groups 24A to 24D consist of eight analog switches SA.sub.1 to SA.sub.8, SB.sub.1 to SB.sub.8, SC.sub.1 to SC.sub.8 and SD.sub.1 to SD.sub.8, respectively, for time-divisionally transmitting analog signals 33A to 33D delivered from D/A converters 23A to 23D. Reference numerals 25A.sub.1 to 25A.sub.8, 25B.sub.1 to 25B.sub.8, 25C.sub.1 to 25C.sub.8 and 25D.sub.1 to 25D.sub.8 are analog voltage storing circuits for momentarily storing analog signals 34A.sub.1 to 34A.sub.8, 34B.sub.1 to 34B.sub.8, 34C.sub.1 to 34C.sub.8 and 34D.sub.1 to 34D.sub.8 which are respectively applied through analog switches SA.sub.1 to SA.sub.8, SB.sub.1 to SB.sub.8, SC.sub.1 to SC.sub.8 and SD.sub.1 to SD.sub.8.
The CPU 26 sends an analog switch control signal 31 to each of analog switch groups 24A to 24D, respectively, through the interface circuit 21 and bus signal 32A to 32D as digital signals to each of D/A converters 23A to 23D through each of interface circuits 22A to 22D and instructs a ROM (read-only memory) 27 to read the instruction data and a RAM (random access memory) 28 to write and read the data.
An operational principle of the circuit will be described below. Stored data are read as bus signals 32A to 32D from the RAM 28 upon receiving instructions, which are read from the ROM 27, and the signals 32A to 32D are applied to each of D/A converters 23A to 23D through each of interface circuits 22A to 22D.
Each of analog signals 33A to 33D, which are converted to analog by each of D/A converters 23A to 23D, is time-divisionally delivered from each of analog switches SA.sub.1 to SA.sub.8, SB.sub.1 to SB.sub.8, SC.sub.1 to SC.sub.8 and SD.sub.1 to SD.sub.8 forming each of analog switch groups 24A to 24D which are switched on or off by receiving the analog switch control signal 31 from the CPU 26 through the interface circuit 21.
Each of analog voltages 34A.sub.1 to 34A.sub.8, 34B.sub.1 to 34B.sub.8, 34C.sub.1 to 34C.sub.8 and 34D.sub.1 to 34D.sub.8, which is time-divisionally obtained through each of analog switches to SA.sub.1 to SA.sub.8, SB.sub.1 to SB.sub.8, SC.sub.1 to SC.sub.8 and SD.sub.1 to SD.sub.8, is momentarily stored by each of analog voltage storing circuits 25A.sub.1 to 25A.sub.8, 25B.sub.1 to 25B.sub.8, 25C.sub.1 to 25C.sub.8 and 25D.sub.1 to 25D.sub.8. As an analog voltage storing circuit 25A, etc., a circuit shown in FIG. 1B can be employed which comprises an analog voltage storing capacitor 29 and a high input impedance operational amplifier 30.
The above-described operation of four channels, which comprise four D/A converters 23A to 23D, is respectively executed in parallel as shown in a time chart of FIG. 1C.
Referring to FIG. 1C, each of groups of analog switches SA.sub.1 to SA.sub.8, SB.sub.1 to SB.sub.8, SC.sub.1 to SC.sub.8 and SD.sub.1 to SD.sub.8 switches synchronously with each other and each analog voltage storing capacitor 29 (FIG. 1B) is charged an analog voltage every repetition of charging cycle times. Thus, the charging operation of each capacitor 29 in four channels in parallel makes the processing time of CPU 26 (FIG. 1A) rather reduced and allows CPU 26 to have long blank time Tc available for other operations than switching.
Another circuit diagram of the prior art is shown in FIG. 2A, wherein like reference numerals and symbols represent like elements which correspond to those in FIG. 1A.
The circuit diagram shown in FIG. 2A differs from that shown in FIG. 1A in the point that a single D/A converter 23 converts a bus signal 32 through an interface circuit 22 to analog to obtain an analog output 33 which is distributed to each of analog switch groups 24A to 24D.
As shown in FIG. 2B, illustrates an operational timing of this circuit, analog switches SA.sub.1 to SA.sub.8 of one analog switch group 24A are switched on at first and each analog voltage storing capacitor 29 (FIG. 1B) is charged during every charging cycle time. After that, other analog switches SB.sub.1 to SB.sub.8 are switched on and each analog voltage storing capacitor 29 is charged alike. Thus, analog switches SA.sub.1 to SA.sub.8, SB.sub.1 to SB.sub.8, SC.sub.1 to SC.sub.8 and SD.sub.1 to SD.sub.8 are switched successively and the like operation continues repeating.
A time required for switching each of analog switches SA.sub.1 to SA.sub.8, SB.sub.1 to SB.sub.8) SC.sub.1 to SC.sub.8 and SD.sub.1 to SD.sub.8 is e.g. 1 ms as shown in FIG. 2B and the charging cycle time of the analog voltage storing capacitor 26 is 4 ms+Tc (blank time), resulting in little blank time Tc for the CPU.
A circuit diagram of the prior art shown in FIG. 1A provides a relatively high repetition rate operation, leaving long blank time Tc available for other operations of CPU 26 than switching because each analog voltage storing capacitor 29 is charged in each of four channels in parallel. However, the circuit comprising four sets of D/A converters and interface circuits is expensive in cost.
Another circuit of the prior art shown in FIG. 2A is simple and not expensive because only a singal set of a D/A converter and an interface circuit is employed. However, switching operation of each of analog switches under the software control of a CPU 26 requires the CPU 26 occupied for a long time with not enough blank time available for other operations of the CPU 26 then switching because of a long analog voltage charging cycle time as shown in FIG. 2B. Another CPU is therefore required for other operations.

Control method of multi-channel digital-to-analog converting circuit


A system for recording computed tomography image data of an object in an object area comprises an X-ray source and an X-ray detector arranged at either side of the object area, the X-ray source having a flying focal spot from which X-rays is emitted and the X-ray detector comprising pixels arranged in at least one row for recording images of the object. A device is provided for rotating the X-ray source and the X-ray detector with respect to the object around an axis of rotation, while the at least one row of pixels record images of the object. The X-ray source comprises means for moving the flying focal spot of the X-ray source from an original position and in a direction essentially opposite to the direction the X-ray source moves during the rotation, and the X-ray detector is provided with means for time delay summation such that pixel signal values of the at least one row of pixels are shifted one pixel and summed with pixel signal values obtained in a following recording of an image, wherein the shifting and summing of pixel signal values are performed repeatedly and the pixel signal values are shifted in a direction essentially opposite to the direction the X-ray detector moves during the rotation.

Computed tomography scanning (CT scanning), also denoted computerized tomography or computed axial tomography (CAT), is an imaging method employing imaging by sectioning or 3D reconstruction. In the CT-scanning an X-ray source and an X-ray detector are arranged opposite one another on an arrangement that rotates around an object. The X-ray source transmits radiation through the object and the X-ray detector measures the attenuated radiation. The radiation is converted to an electrical signal, a computer processes these signals and the desired images can be provided.
An important improvement of the two-dimensional scanning was made with the introduction of the so-called spiral or helical scan. Instead of scanning the object on a two-dimensional basis, the object is scanned on a three-dimensional basis. In particular, the table on which the object rests moves through the scanning field at a constant speed while the X-ray tube and X-ray detector rotates around the object. Digital geometry processing is used to generate a three-dimensional image of the internals of an object from a large series of two-dimensional X-ray images taken around a single axis of rotation.

Computed tomography scanning system and method


A branching control unit includes a logic gate and a NAND circuit that can receive transfer permission for each branching designation. The branching control unit further includes a transfer request unit receiving respective outputs of the logic gate and NAND circuit. The transfer request unit sends a data transfer request to a branching designation when the logic gate or NAND circuit is rendered active. Since transfer permission can be received for each branching designation to send a transfer request, a data waiting state depending upon the data holding state of another branching destination will no longer occur. Thus, a data driven type information processing apparatus and method of transferring a data packet at higher speed in a data transmission path can be provided.

1. Field of the Invention
The present invention relates to a data driven type information processing apparatus and method. More particularly, the present invention relates to a configuration of a branching unit including a self-synchronous transfer control circuit and a data transfer control method.
2. Description of the Background Art
Multi-media data processing that contains images requires a large amount of data to be processed at high speed. Particularly, the need arises for high-speed execution of a large amount of operations in image processing. A data driven type information processing apparatus is proposed as a processor accommodating such needs.
A data driven type information processing apparatus executes a process only after all the input data required for a certain process are available and resources such as a processing unit required for that process has been allocated.
For example, a data transfer apparatus employing an asynchronous handshake method is used as a data driven type information processing apparatus. This handshaking method employed in a data driven type information processing apparatus is one method of data transfer for conducting data transfer autonomously by transmitting/receiving a transfer request signal requesting data transfer and a transfer permission signal indicating whether data transfer is permitted or not between circuit blocks to transfer data (referred to as "data transmission path" hereinafter). The transfer request signal is referred to as a "SEND" signal, and a transfer permission signal is referred to as an "ACK" signal, hereinafter.
The operation of a data driven type information processing apparatus is disclosed in, for example, Japanese Patent Laying-Open No. 2001-331472. The data driven type information processing apparatus disclosed in this publication will be described hereinafter.
FIG. 7 represents a configuration of a data packet applied conventionally and in the present invention.
Referring to FIG. 7, a data packet DP includes a destination node number field F1 storing a destination node number ND#, a generation number field F2 storing a generation number GN#, an instruction code field F3 storing an instruction code OPC, and a data-field F4 storing data DATA.
The generation number serves to identify data groups that are processed in parallel from each other. The destination node number serves to identify input data with the same generation number from each other. The instruction code serves to indicate the instruction to be applied on the data.
FIG. 8 represents a configuration of a data transmission path.
Referring to FIG. 8, a data transmission path 100 includes a self-synchronous type transfer control circuit (referred to as "C element" hereinafter) 101A, and a data holding circuit formed of a D type flip-flop (referred to as "pipeline register" hereinafter). The meaning of "self-synchronous" will be described in detail afterwards.
Upon receiving a SEND signal from an input node CI, C element 101A provides an ACK signal from an output node RO. C element 101A also provides a SEND signal from output node CO, and receives an ACK signal at an input node RI. The operation and configuration of C element 101A will be described afterwards.
Pipeline register 101B receives a clock pulse provided from an output node CP of C element 101A to input and output a data packet.
FIG. 9 is a waveform diagram of signals input to and output from respective nodes of C element 101A of FIG. 8.
At time t1-t3, the SEND signal applied to input node CI attains an L level (logical low), whereby C element 101A receives a data packet transfer request. At time t2, C element 101A pulls down the ACK signal output from output node RO to an L level to inhibit reception of an additional data packet.
When the SEND signal applied to input node CI attains an H level (logical high) at time t3, input of a data packet to pipeline register 101B of FIG. 8 is completed. At time t4, the ACK signal from output node RO attains an H level indicating that data packet transfer is permitted, whereby C element 101A allows input of a data packet again.
At time t5, C element 101A pulls down the SEND signal that is to be output from output node CO to an L level to request transfer of a data packet, whereby output of the data packet is initiated.
When the clock pulse from output node CP is switched to an L level at time t7, the SEND signal from output node CO attains an H level at time t8. Thus, an output operation of a data packet ends.
As described above, data transfer control carried out in an asynchronous manner with at least a preset delay time in accordance with signals SEND and ACK is referred to as "self-synchronous transfer control", and a circuit that conducts self-synchronous transfer control is referred to as "self-synchronous transfer control circuit".
FIG. 10 represents an application of a data transmission path in a data driven type information processing apparatus.
Referring to FIG. 10, a data packet is sequentially transferred from pipeline register 104A to pipeline registers 104B and 104C. During such transfer, the data packet is processed by logic circuits 103A and 103B.
A data packet is not transmitted from pipeline register 104A to pipeline register 104B during the period of time pipeline register 104B retains a data packet. In the event of pipeline register 104B not retaining a data packet or just at the stage of data packet output, a data packet is transferred from pipeline register 104A to logic circuit 103A, and then to pipeline register 104B.
FIG. 11 represents a specific circuit configuration of C element 101A. Referring to FIG. 11, C element 101A includes a flip-flop 105A, an inverter 105G inverting the signal provided from an output Q of flip-flop 105A, and a flip-flop 105B providing a signal from an output node CP via a delay circuit 105E when set, and providing a signal from an output node CO when reset.
Flip-flop 105A is set upon receiving a SEND signal of an L level from the C element of the preceding stage not shown to provide a signal from output Q. The output signal is inverted by inverter 105G to become the ACK signal towards the C element of the preceding stage.
Flip-flop 105B is set upon receiving a signal of an L level from a NAND circuit 105C. When flip-flop 105B is set, a signal is provided from output node CP. The output signal from output node CP functions as a control signal of data output with respect to the pipeline register of a succeeding stage. When flip-flop 105B is reset, a signal is provided from output node CO, which becomes the SEND signal towards the C element of the succeeding stage.
NAND circuit 105C receives the SEND signal from the C element of the preceding stage through input node CI, and the ACK signal from the C element of the succeeding stage through input node RI. Furthermore, NAND circuit 105C receives a signal that is output when flip-flop 105B is reset, and a signal from output Q of flip-flop 105A.
FIG. 12 is a block diagram of a 2-input 2-output type router employed in a data driven type information processing apparatus of prior art and the present invention. A router is a device employed in the transfer of a data packet between processing units as well as between a processing unit and an external source.
Referring to FIG. 12, a router 106 includes branching units 106A and 106B, and junction units 106C and 106D.
A data packet applied to an input node IN1 is provided from either an output node OUT1 or an output node OUT2. Similarly, a data packet applied to an input node IN2 is provided from output node OUT1 or output node OUT2.
FIG. 13 is a block diagram of a conventional branching unit 106A of FIG. 12.
Referring to FIG. 13, branching unit 106A includes a branching control unit 107. Branching control unit 107 includes a C element 107A, an OR circuit 107C receiving a branching permission signal BEIN applied at an input node BE to indicate the branch destination of a data packet and a SEND signal from C element 107A, a logic gate 107D, and an AND circuit 107E receiving an ACK signal from junction units 106C and 106D shown in FIG. 12. The SEND signal is applied from output node COA to junction unit 106C, as well as from an output node COB to junction unit 106D.
To which of junction units 106C and 106D in FIG. 12 the SEND signal is to be transmitted is specified by branching permission signal BEIN. Depending upon whether branching permission signal BEIN attains an L level or H level, a SEND signal of an L level indicative of a transfer request is provided from either output node COA or output node COB.
The ACK signal indicating permission of transfer is applied to AND circuit 107E from input nodes RIA and RIB. A signal of an H level is output from AND circuit 107E in response to the ACK signals from respective branch destinations both attaining an H level representing a data transfer permitted state. The H level signal output from AND circuit 107E is applied to input node RI of C element 107A. Thus, C element 107A receives permission of data transfer.
FIG. 14 represents a specific example of C element 107A of branching control unit 107 of FIG. 13. Referring to FIG. 14, branching control unit 107 includes C element 107A. The configuration of C element 107A is similar to that of C element 101A of FIG. 11.
FIG. 15 is a waveform diagram of signals shown in FIG. 14.
Referring to FIG. 15, the operation of branching control unit 107 during time t1-t4 is similar to that of C element 101A of FIG. 9. Therefore, description thereof will not be repeated.
When ACK signals ACKIN1 and ACKIN2 both attain an H level at time t5, ACK signal ACKIN of an H level indicating transfer permission is applied to input node RI of C element 107A at time t6.
At time t9, SEND signal SNDOT1 of an L level is provided from output node COA to junction unit 106C of FIG. 12, whereby output of a data packet is initiated.
FIG. 16 is a block diagram of a conventional 1-input 4-output branching unit constituting another router.
Referring to FIG. 16, a branching unit 109 includes a C element 109A, an OR circuit 109F and logic gates 109G-109I receiving a branching permission signal applied through input nodes BEA and BEB and a SEND signal from C element 109A, and an AND circuit 109J receiving an ACK signal from respective branch destinations.
Likewise the branching control unit of FIG. 13, the transmission destination of a SEND signal is determined in accordance with a combination of the logic levels of branching permission signals applied to input nodes BEA and BEB.
The ACK signal from each branch destination applied through input nodes RIA, RIB, RIC and RID is applied to AND circuit 109J. Likewise AND circuit 107E of FIG. 13, AND circuit 109J outputs a signal of an H level in response to the ACK signals from respective branch destinations attaining an H level indicating a data transfer permitted state. C element 107A receives an ACK signal of an H level indicating permission of data transfer from AND circuit 109J.
At the conventional branching unit disclosed in Japanese Patent Laying-Open No. 2001-331472, output of a SEND signal from a C element to the branch destination will not be initiated unless all the plurality of branch destinations of data attain a data transfer permitted state.
As shown in the timing chart of FIG. 15, for example, SEND signal SNDIN attains an H level at time t3, and input of a data packet is completed. Since ACK signal ACKIN1 attains an H level at time t3, junction unit 106C of FIG. 12 attains a data input allowable state at time t3. However, since SEND signal SNDOT1 of an L level is not transmitted to junction unit 106C until time t9, transfer is not requested. Therefore, a data packet waiting state occurs at a conventional branching unit, posing the problem of data retention.

Data driven type information processing apparatus and method of increasing transfer speed of data packet


A device for inspecting apparatus from sites of difficult access and comprising inspection apertures for that purpose, for instance aircraft power plants. The device is affixed by a selected adapter, matching the particular inspection aperture and its vicinity, to the inspection aperture through which an endoscope is inserted and, after the desired object of inspection has been found, is affixed.

The invention concerns a device for guiding and affixing an endoscope and a matching adapter. This device is technically applicable wherever inspections are required of sites of difficult access such as cavities or machine components by visual examination using an optical means, for instance rigid or flexible endoscopes. This applies in particular to monitoring drive systems of all kinds, especially aircraft power plants, and as regards latter, their blades and combustion chambers.
When inspecting components inside machines, the observer must be able to recognize these components in problem-free manner in order to be able to spot the last damage. This is possible only using a device to guide and affix an endoscope anywhere. The endoscope no longer must be held by the observer.
In order to explain the state of the art, the industrial use of endoscopes will be illustrated with reference to aircraft power plants. At those places of the power plant where provision is made for inspection of the inside, plugs are located in the powerplant casing and are screwed loose; there are also blank flanges of pipe connectors that will be removed.
A rigid or flexible endoscope is inserted through the opening so created, which may assume various diameters, and thereby checking will start. During the entire examination the observer is holding the endoscope and, depending on where he stands or his physical constitution, his body may sway. Ascertained damages must be located again and comparative photographs must be made. The observations so made must be corroborated by other expert person(s).
Optimal observation is impossible because the endoscope is held freely while the body may sway. It must be made possible to the observer to assure problem-free recognition of the components over the entire distance between the close and far recognition points without himself having to hold the endoscope. Only in this manner shall it be possible to discover the tiniest damages and relocate them again. Work based on the present state of the art is highly time-consuming and hence expensive, moreover endoscopes are frequently damaged and as a result cause longer inspection times and also substantial costs for repairs or new acquisitions of endoscopes. Endoscopes incur damage by being tilted in the inspection aperture and by being moved over its sharp-edged threads. The optics is often damaged by hitting the edge of this inspection aperture.
Where second or third persons are involved, it is time-consuming and difficult to relocate previously ascertained damages because other angles of view and hence observed scenes follow from the free holding of the endoscope. Where comparison photographs must be take, the cost in time increases because the endoscope is not fixed in place and blurred images arise from motion. In that case the endoscope most of the time will be tilted to prevent it from moving.
Known devices for guiding an endoscope are for flexible ones and no longer are used in the present generation of powerplants.
U.S. Pat. No. 4,298,312 and also British patent 20 33 973A describe a device with a tubular segment of present curvature through which an endoscope may be moved but cannot be affixed.
These known devices are applicable only to special cases.
The same condition holds for the German patent document 37 07 368 A1 with the assembly plate described therein with the holding elements for a guiding tube.
That invention entails another drawback, namely that depending on the application, the stop means and joints and the many connections by clamps require substantial set-up time and following frequent use, they will convert the individually applied forces into device damage.
The object of the British patent 20 33 973 A suffers from the further drawback that the guide tube is axially displaced by a screw and therefore there is no possibility of rotating the tube and hence the endoscope; moreover the affixing of the tube by a further screw acting on the outer tube ipso facto damages same and thereby axial displacement is hampered where not impossible.
In the U.S. patent mentioned above, the flexible endoscope is not held in the tube and therefore must be corrected when the tube is axially displaced.

Device for guiding and affixing an endoscope


The present invention provides a tricyclic compound represented by general formula (I), a pharmaceutical salt thereof, or a stereoisomer thereof exhibits excellent antibacterial activity against Gram-negative bacteria resistant bacteria thereof, and also being excellent in terms of safety. Furthermore, the present invention provides production processes, pharmaceutical compositions comprising a tricyclic compound, a pharmaceutically acceptable salt thereof, or a stereoisomer thereof as an active ingredient and use thereof as a pharmaceutical agent. The compounds of the present invention are useful for the treatment and/or prevention of disease such as complicated urinary tract infections (cUTIs), nosocomial pneumonia, intra-abdominal infections (IAIs) or bacteremia.

There has been a worldwide increase in the number of infections caused by Gram-negative bacteria. The resistant Gram-negative bacteria has been a serious global health concern as is evident from U.S. Centers for Disease Control and Prevention (CDC) report on Antibiotic Resistant Threats in the United States, 2013.
Gram-negative bacteria are common causes of intra-abdominal infections (IAIs), urinary tract infections (UTIs), nosocomial pneumonia, and bacteremia. Escherichia coli, Klebsiella pneumoniae and Pseudomonas aeruginosa are important pathogens accounting for 27% of all pathogens and 70% of all Gram-negative pathogens causing healthcare-associated infections (Sievert D M, et al., Infect Control Hosp Epidemiol. 2013; 34:1-14). P. aeruginosa is the most common Gram-negative cause of nosocomial pneumonia and the second most common cause of catheter-related UTIs and E. coli is the most common cause of UTIs (Sievert D M, et al., Infect Control Hosp Epidemiol, 2013; 34:1-14). Cases of UTI caused by extended spectrum beta lactamase (ESBL)-producing E. coli and K. pneumonia as well as P. aeruginosa, including multidrug-resistant (MDR) strains are increasing (Zilberberg M D, et al., Infect Control Hosp Epidemiol. 2013; 34:940-946).
Treatment options for infections caused by Gram-negative bacteria and resistant bacteria thereof are very limited. Therefore, there is a serious need for a new antibiotic having a novel mechanism of action to meet the needs of the patients.
As such benzoxaborole compounds have been known which inhibit leucyl-tRNA synthetase (LRS enzyme), for example WO 2012/33858, WO 2011/60199, WO 2011/49971, WO 2011/037731, WO 2010/080558, WO 2009/140309, WO 2008/157726 and WO 2008/70257. The PCT publication WO 2013/154759 provides a combination of an amino acid or amino acid salt that is capable of being acylated onto tRNAleu by LRS and a benzoxaborole compound.
Other references disclosing benzoxaborole as a structural moiety includes WO2014/173880, WO2014/149793, WO2014/121124, WO2014/07831, WO2013/78070, WO 2011/094450, WO 2011/063293, WO 2011/022337, WO 2011/019616, WO 2011/019612, WO 2011/19618, WO 2011017125, WO 2010/45503, WO 2010/45505, WO 2010/027975, WO 2010/028005, WO 2009/111676, WO 2007/146965, WO 2007/131072, WO 2007/095638, WO 2007/78340, WO 2006/089067 and WO 2005/013892.
However, none of the cited references disclose tricyclic benzoxaborole compounds, provided in the present invention, as antibacterial agents targeting Gram-negative bacteria and resistant bacteria thereof for the treatment and/or prevention of bacterial infections, for example intra-abdominal infections (IAIs), complicated urinary tract infections (cUTIs), nosocomial pneumonia or bacteremia.
WO2015/21396, WO2015/16558 and WO2013/93615 disclose tricyclic boron compounds. None of the aforementioned specifically contemplates any compound provided in the present invention.
GSK2251052 (benzoxaborole compound) is the first antibacterial investigational drug of this class, as reported, for example, by Zane et al., in a poster Safety, tolerability, and pharmacokinetics of a novel Gram-negative antimicrobial, in healthy subjects, 21st European Congress of Clinical Microbiology and Infectious Diseases, 2011, Milan, Italy. The clinical development of GSK2251052 (or AN3365) has been discontinued due to the identification of microbiological findings of resistance in the Phase 2b trial for the treatment of complicated urinary tract infections (O'Dwyer K, et. al Antimicrob Agents Chemother. 2015; 59(1):289-98). It has been considered that such benzoxaborole compounds are not suitable for applying to clinical settings.
However, compounds of the present invention have been found to be suitable for applying in clinical settings. They have much improved profile over AN3365, for example 1) in terms of resistance on treatment, 2) no significant shift in MICs in Pseudomonas efflux deleted and over-expression strains, 3) retains activity in human urine, 4) lacks putative site of metabolism and is stable in human S9. Pseudomonas has strong efflux mechanism that is responsible for resistance to existing drugs. Compounds of the present invention works on such efflux over-expressing clinical isolates. In addition, compounds of the present invention were found to be safe and efficacious.
Thus, the present invention provides a great hope for a new antibiotic to meet the challenges of a serious global health concern due to Gram-negative bacteria and resistant bacteria thereof causing bacterial infections including, but not limited to, intra-abdominal infections (IAIs), complicated urinary tract infections (cUTIs) or nosocomial pneumonia.

Tricyclic benzoxaboroles as antibacterial agents


An artificial cervical vertebrae composite joint is composed of two upper and lower fixing members disposed vertically symmetrically, a cervical vertebrae body member, and two connection members, the cervical vertebrae body member being connected between the fixing members through the connection members. The fixing members each have an L shape and comprise a front wing part and a base part. A locking screw hole is formed in the front wing part, and a skidproof groove provided with an inverted tooth and a protrusion is disposed on a middle portion of the base part. A bone grafting hole is transversely disposed through a middle portion of the cervical vertebrae body member, and two cavities are disposed on both upper and lower sides of the cervical vertebrae body member at an axial center of the cervical vertebrae body member to mount the connection members. The connection member has one end mounted in the cavity by means of a fixing ring, and another end connected with the fixing member to form a stable sliding-trough type ball-and-socket joint.

1. Field of the Invention
The present invention relates to a device for reconstructing cervical vertebrae after subtotal resection of cervical vertebrae body, and particularly to an artificial cervical vertebrae composite joint. The artificial cervical vertebrae composite joint is achieved by means of bionics of physiological reconstruction in three aspects of anatomy, stability and motion of cervical vertebrae by simulating normal cervical vertebrae.
2. Description of the Related Art
Clinically, subtotal resection of cervical vertebrae body mostly needs to be performed for infection, tumor, and degenerative disease of cervical vertebrae and then the resected segment of the cervical vertebrae needs to be reconstructed. Currently, reconstruction methods clinically commonly used mainly comprise two methods, that is, segmental bone graft fusion and replacement of artificial vertebral body. A method of bone graft fusion as a current standard method of clinically reconstructing cervical vertebrae after subtotal resection of cervical vertebrae body is to fill a defect segment with autograft bone issue or xenoma bone issue while adding internal fixation to reconstruct stability of the cervical vertebrae. The method achieves reconstruction of stability of the cervical vertebrae by bone fusion between the grafted bone and upper and lower cervical vertebrae bodies to eliminate pain. However, the reconstruction method is not ideal anatomical reconstruction and causes the reconstructed segment to lose movability completely and thus affects entire movement function of the cervical vertebrae. In addition, the method also results in degradation of intervertebral disk of adjacent segments due to stress concentration in the long term. There are various designs of artificial vertebral body so far, but in all of the designs, stability of cervical vertebrae is reconstructed by means of bone graft fusion, self fixation or additional internal fixation and there are the problems that movability of the segment is lost and intervertebral disk of adjacent segments degrades in the long term. Therefore, the reconstruction of the various designs is not real physiological reconstruction. All of few artificial vertebral bodies designed in consideration of motion reconstruction finally fail due to their motion mode different from physiological motion mode or bad stability. Currently, clinical non-fusion reconstruction has become development trend. Based on the reconstruction, products such as artificial hip, knee, ankle, and elbow joints and artificial intervertebral disk are produced, and are clinically largely applied to achieve quick cure, good effect, and stable clinical long-term effect. Generation of the artificial intervertebral disk undoubtedly has epochal significance for vertebral column surgery. Currently, the artificial intervertebral disk has gadually matured. Non-fusion reconstruction of a single segment of cervical vertebrae generates excellent products such as Bryandisc and Prestige. However, currently, there has not yet been a good method to solve the problem of non-fusion reconstructing after subtotal resection of cervical vertebrae. Therefore, the present applicant designed an artificial cervical vertebrae composite joint in prophase. It is manifested by primary biomechanical to research that a ball-and-socket joint of the artificial cervical vertebrae composite joint retains movability of the cervical vertebrae to a certain degree and that a new concept is provided in the way of the non-fusion reconstruction. Based on the design, the present applicant further researches normal motion mode of cervical vertebrae and concludes by synthesizing past research that motion of the cervical vertebrae is not simple rotation, but is a coupling motion of rotation and translation. The rotation is coupled with relative displacement between adjacent cervical vertebrae bodies while the adjacent cervical vertebrae bodies rotate, and the upper cervical vertebrae body has a variable center of rotation relative to the lower cervical vertebrae body. Therefore, the primary design of the artificial cervical vertebrae composite joint, that is, the ball-and-socket joint, has a fixed center of rotation, and the motion mode of the joint is a simple rotation, and greatly different from the motion mode of normal cervical vertebra.
According to document retrieval made by the present applicant, so far there is not a method capable of designing the joint in consideration of stability, movability, and particular coupling motion mode of cervical vertebrae to really achieve physiological reconstruction. Only if a particular artificial joint is designed to simulate the motion mode of the normal cervical vertebra, bionics of the reconstruction of the cervical vertebrae is really achieved.

Artificial cervical vertebrae composite joint


To reduce the thickness and improve the operability. It includes a first housing and a second housing placed on top of each other, and connecting means to connect the first and second housings, the connecting means being interposed between the first and second housings, wherein the connecting means engages with the first housing so as to be slidable in at least one direction with respect to the first housing, and engages with the second housing so as to be rotatable with respect to the second housing.

In recent years, the miniaturization of mobile phone terminals has advanced, and to improve the effective use of space and the usability, sliding-type structures in which a housing with a display formed thereon and another housing with a keyboard formed thereon are placed on top of each other have become more common. In such sliding-type mobile phone terminals, for example, a display is provided on the upper housing and a keyboard and the like are provided on the lower housing. In this way, a user can always view the display. Further, by sliding one housing with respect to the other housing in a lengthwise direction or a crosswise direction, the keyboard is exposed, and thereby a user can operate the keyboard.
Meanwhile, in recent years, more and more functions have been incorporated into mobile phone terminals, let alone the telephone call function and the data communication function. For example, terminals equipped with a TV viewing function and a game function have been released, and as a result, the demand for such a feature that a user can view the display from various directions has been growing. That is, in the past when mobile phone terminals have been used only for telephone calls and emails, viewing the display in the portrait position is sufficient for their purposes. However, when they are used for one-seg use, browser use, game use, and the like, a feature that the display can be viewed in a landscape position significantly improves the usability. As a result, nowadays, mobile phones having various structures capable of changing the orientation of the display are being developed.
For example, in mobile phones disclosed in Patent documents 1, 2 and 3, when a first housing on the LCD side is slid, part of the keys arranged on a second housing on the microphone side is exposed. Further, when the first housing is rotated, all the keys arranged on the second housing are exposed. In this way, with the capability of rotating the display, it is possible to dispose some keys, which are used when the first housing is rotated, in the part of the second housing exposed by the rotation. Further, for example, the slid state is used for telephone calls, emails, and the like, whereas the rotated state is used for purposes, for which the lengthwise direction of the LCD is oriented in the horizontal direction, such as one-seg and games.
Further, mobile phones disclosed in Patent documents 4, 5 and 6 are electronic equipment formed by further placing a third housing on the first and second housings. Further, these three housings adopt such a structure that they are connected in a freely movable manner so that they can mutually slide, rotate, and open/close. By adopting the three-tiered structure like this, some keys can be disposed in the middle housing and thereby different keys can be used according to the purpose. For example, keys on the second tier and keys on the third tier can be used according to the orientation of the display.
[Patent Document 1]
    Japanese Unexamined Patent Application Publication No. 2007-116712[Patent Document 2]    Japanese Unexamined Patent Application Publication No. 2005-147401[Patent Document 3]    Japanese Unexamined Patent Application Publication No. 2007-49294[Patent Document 4]    Japanese Unexamined Patent Application Publication No. 2007-179525[Patent Document 5]    Japanese Unexamined Patent Application Publication. No. 2004-40490[Patent Document 6]    Japanese Unexamined Patent Application Publication No. 2007-174617

Portable information processing terminal


An improved French horn includes a coiled tubular body having a bell end, a curved inlet end and a plurality of valves formed thereon between the bell end and the inlet end for controlling a flow of air through the French horn. A mouthpipe has a mouthpiece end, a curved outlet end and a substantially straight section between the mouthpiece end and the outlet end. A pipe detachably interconnects the inlet end of the coiled tubular body and the outlet end of the mouthpipe. The pipe is configured so that the interconnected mouthpipe may be situated at either one of two positions relative to the body, including a first position in which the substantially straight section of the mouthpipe is substantially tangential to the coiled tubular body, and a second position in which the substantially straight section of the mouthpipe is away from the first position and close to the valves of the coiled tubular body.

1. Field of the Invention
The present invention relates to a French horn and, more particularly, to an improved French horn which is adjustable to be played by either an adult or a child.
2. Description of Related Art
The French horn, one of the brass wind instruments, is popular for its favorable and resounding tone that it produces. As shown in FIG. 5, such a conventional horn typically includes a mouthpipe (90) fixedly connected to a coiled tubular body (92) with a plurality of keys (94) arranged at a side of valves (96) for controlling a flow of air through the horn. Because neither the mouthpipe (90) nor the keys (94) are adjustable in their positions relative to the coiled tubular body (92), it is difficult for a child to play the conventional horn.
Therefore, it is an objective of the invention to provide an improved French horn to mitigate and/or obviate the aforementioned problems.

No. 162, Chung Shan 2nd Rd., Lu Chou City


A system associated with predicting authentication of a device user based on a joint features representation related to an echo-signature associated with a device is disclosed. The system performs operations that include emitting acoustic signals in response to a request for processing of a profile associated with the device. The system receives a set of echo acoustic signals that are tailored based on reflection of the acoustic signals from unique contours of one or more depth portions associated with the user relative to a discrete epoch. One or one or more region segments associated with the echo acoustic signals are extracted in order to train a classification model. A classification model is generated based on the one or more region segments as extracted. A joint features representation based on the classification model is generated. A vector-based classification model is used in the prediction of the joint features representation. The system determines whether the joint features representation is associated with the echo-signature based on the prediction of the joint features representation.

Historically, user authentication on smartphones is pivotal to many important daily applications, such as social networks, shopping, banking and other modern-based activities. Central to the user authentication is the balancing between desired security and convenience. A solution must be secure yet easy to implement. A series of efforts have been undertaken to address this problem.
The most basic and traditional method, using a PIN number, has both usability (e.g., the pass code forgotten by the user) and security (e.g., shoulder-surfing attacks) issues. Face based authentication can be easily spoofed by images or videos of the user. For example, any simple twists such as requiring eye blinks are vulnerable to video attacks. Iris scan is probably the most secure method; however, it requires special sensors currently unavailable on most commercially available mobile devices.
Fingerprint sensors, while convenient for authentication, are facing the practical challenge posed by the trend of ever-increasing screen size, which leaves little space for fingerprint sensors. Another example, Apple's FaceID®, packs a dot projector, a flood illuminator and an infrared depth sensor in a small area in order to sense the 3D shape of the face, thus generally achieving effective security while saving space. However, the special sensors still use precious frontal space and costs extra (˜5% of its bill of materials) on an already expensive device for consumers.
Hence, efficient and effective user authentication on smartphones or other mobile devices should satisfy both security and convenience to the user, which remains an inherently difficult balancing art. As mentioned, Apple's Face ID® is the latest of such efforts, but comes at the cost of additional hardware requiring dot projector, flood illuminator and infrared camera.
In particular, the history of smartphone authentication includes using traditional Personal Identification Number (PIN) or a text/graphical password that is the earliest and still most widely used for smartphone user authentication. Despite the simplicity, the PIN or password can be easily peeked by someone close by the user device. Speech recognition is easy to spoof when the voice is recorded, or the voice is otherwise closely imitated by advanced learning algorithms. BreathPrint® senses the user's breath sound, which may change significantly when the user has intense exercises. Vision based face recognition is vulnerable to camouflaged images. Although eye blinks can enhance its security, a recorded video can still spoof the system. Fingerprint sensors have achieved great security and convenience. However, the sensor takes a lot of precious space, and forging one from fingerprints from the user has proven to be a practical solution. More advanced fingerprint sensors use ultrasonics to penetrate the skin and construct 3D imaging, but such sensors are generally not available on most smartphones, and would increase costs. Apple's FaceID® uses special TrueDepth sensors, bringing extra hardware costs and requiring significant design changes. Intel's RealSense® is a similar technology, but it is costly and power-computation heavy, unsuitable for mobile devices.
Hence, there is a need for an acoustics echo-signature based authentication system that leverages active and novel acoustic sensing of unique facial depth of a user combined with visual features for user authentication, which can achieve high balanced accuracy using existing hardware.
In order to achieve resilient, secure and easy-to-use authentication using acoustic signals and visual aspects, the following remain challenges: 1) echo signals are highly sensitive to the relative position between the user's face and the device (i.e., pose), which makes it more difficult to extract reliable pose-insensitive features for robust authentication; 2) smartphones usually include multiple speakers and microphones. The determination of which are most suitable, and what are the best sound signals to implement remain critical to authentication performance; and 3) sophisticated signal processing, feature extraction and machine-learning techniques are required for expedient user registration and real-time authentication.
Therefore, it is desirable to implement a user authentication system embedded in the smartphone or mobile device without requiring any additional hardware such as sensors.
It is further desirable to implement an acoustic based echo-signature authentication system and related method that emits nearly inaudible sound signals from the earpiece speaker of the user's smartphone device in order to "illuminate" the user's face. The extracted acoustic features from the echoes are combined with visual facial landmarks detected from the frontal camera and used to authenticate the user, without requiring any additional hardware components are added to existing smartphone devices.
Since the echo-signature acoustics features depend on unique 3D facial geometries of a user, the echo signature system cannot be easily spoofed by images or videos as 2D visual face recognition systems. Such systems can be implemented with only commodity hardware, thus avoiding the extra costs of special sensors in solutions implemented by for example, Apple® Face ID®. Experiments with both humans and non-human objects such as images, photos, and sculptures indicate that echo-signature performs with 93.75% balanced accuracy and 93.50% F-score, while the average precision is 98.05%, and no image/video based attack was observed to succeed in any spoofing.
It is further desirable to implement a novel user authentication system that creates an echo signature by leveraging an existing earpiece speaker and frontal camera, which can be readily deployed on most phones. Costly special sensors (e.g., depth or iris) are not required that also require more hardware space to embed such components in the devices. The echo-signature authentication system combines acoustic features from a customized CNN feature extractor and facial landmark features from vision algorithms as the joint feature description of the user.
It is further desirable to implement authentication that does not require the user to remember and use any passcode, thus avoiding the usability issues as PIN numbers. The acoustic features depend on 3D facial geometries of the individual user and thus is more resilient to image/video attacks that easily spoof 2D visual based approaches. Similar to FaceID, echo signature does not require direct touching of the screen or phone by the user, thus avoiding issues such as for example, moist fingers that pose difficulties to fingerprint sensors.
It is further desirable to implement an acoustic emitting signal suitable for considerations including any hardware limitations, sensing resolution, and audibility to humans. In certain embodiments or aspects, novel acoustic signal processing techniques are implemented for reliable segmentation of echoes from the face.
It is further desirable to implement a novel user authentication system, which leverages acoustics and/or vision for secure, convenient and effective user authentication, without requiring any additional special hardware other than a known smartphone device.
It is further desirable to implement a novel echo signature authentication system that actively emits almost inaudible acoustic signals from the earpiece speaker of the smartphone device in order to "illuminate" the user's face, and authenticate the user by the unique features extracted from any of the echoes and acoustic signals that bounce off the 3D facial contour of a user's face.
It is further desirable to effectively combat the required changes in phone-holding poses and instead implement the echoes (i.e. acoustic signals) that bounce off the 3D facial contours of a user. In certain aspects or embodiment an end-to-end hybrid machine learning framework is implemented, which extracts representative acoustic features using a convolutional neural network, and fuses vision and acoustic features to a support vector machine (SVM) for final authentication.
In certain aspects or embodiments, a Convolutional Neural Network (CNN) is trained to extract reliable acoustic features, which may also be further combined with visual facial landmark locations that are in turn, input into a binary Support Vector Machine (SVM) classifier for the final layer of authentication of the user.

System and method associated with user authentication based on an acoustic-based echo-signature

Abstract: A corresponding method and computer-readable device are also disclosed.

THE RESEARCH FOUNDATION FOR THE STATE UNIVERSITY OF NEW YORK