A target assembly in which the sputtering material is not soldered or otherwise metallurgically bonded to a backing plate. Rather, the target, which is homogeneously manufactured of sputtering material, is mechanically coupled (e.g., with bolts) to an adapter, which is itself permanently affixed to the chamber. As a result, the target can be easily uncoupled from the chamber and replaced, without also requiring removal and replacement of a backing plate.

This application is related to previously filed, currently pending U.S. applications Ser. No. 08/390,662, filed Feb. 17, 1995 and a divisional thereof filed Apr. 23, 1996, both having the same title as this application and naming the same inventors, and incorporated herein by reference in their entirety.
This invention relates to targets for plasma sputtering apparatus.
Sputtering processes are typically performed in a vacuum chamber. The chamber includes a target comprised of material, such as Aluminum, to be sputtered. A substrate, such as a semiconductor wafer bearing integrated circuits, is placed in the chamber and the chamber is evacuated. Once the chamber is evacuated, a process gas is introduced into the chamber at a low pressure, and a voltage is applied to the target. Ionized gas in the chamber is accelerated by the electric fields of the target. When the ions impinge upon the target, atoms of sputtering material are dislodged (xe2x80x9csputteredxe2x80x9d) from the target. The dislodged atoms deposit on the substrate, forming, over time, a thin film of target material on the substrate.
The sputtering process described above slowly wears material from the target until, ultimately, the target must be renewed. Typically, this is done by removing the target from the chamber and inserting a new target into the chamber.
FIG. 1 is a cross-sectional view of a typical vacuum chamber 10 for performing a sputtering process, and a target 12 mounted in this chamber. Chamber 10 is generally cylindrical or rectangular in shape, and target 12 is generally disk-shaped and mounts into a circular opening 13 in chamber 10. Wafer 14, which is disk-shaped, is supported inside of chamber 10 by a generally disk-shaped anode 16. Electrical power is applied to the anode 16 with respect to the remainder of the chamber 10.
As shown in FIG. 1, a typical target is manufactured of a backing plate 20 of a metal such as Copper, metallurgically bonded (e.g., soldered) to a target plate having a front face 22 of sputtering material. Backing plate 20 is affixed to a chamber cover 23 by mounting screws 24. Cover 23 is clamped to chamber 10 by means not shown, and supports the front face 22 in a position generally opposite wafer 14. An O-ring inserted into groove 26 prevents leakage into the chamber 10 through the target-chamber interface. During the sputtering process, material from front face 22 is removed and deposited on the wafer 14, while backing plate 20 remains in place.
Over time, a typical target such as that shown in FIG. 1 wears to the extent that the sputtering material on the front face 22 must be renewed. When this occurs, cover 23 is lifted from chamber 10, and target 12 is detached from cover 23 and removed. A new target 12 is then assembled to cover 23, and cover 23 is clamped onto chamber 10, and processing continues.
Backing plates are typically manufactured of expensive metals, and for this reason are typically recycled after use. Once a worn target has been removed from the cover 23, the backing plate and the remaining sputtering material soldered thereto, are returned to the manufacturer. The manufacturer removes the remaining sputtering material from the backing plate, and solders a new target plate having a front face 22 of sputtering material to the backing plate. The target 12, consisting of the recycled backing plate and new front face of sputtering material, is then ready for resale. To ensure that processing facilities promptly return used targets to the manufacturer, manufacturers typically include a core charge in the price of each target sold; this charge is refunded upon return of the used target to the manufacturer.
This process for recycling used targets is inconvenient in that it requires regular shipment of bulky and heavy targets back to the manufacturer. Furthermore, to ensure a sufficient stockpile of targets to avoid downtime, semiconductor fabrication facilities must retain in inventory a number of new targets 12, which involves essentially permanent payment of the core charges associated with the targets held in inventory.
In accordance with the invention, the above disadvantages are overcome by providing a target in which the sputtering material is not soldered or otherwise metallurgically bonded to a backing plate. Rather, the target is mechanically coupled (e.g., with bolts) to the chamber. As a result, the sputtering material can be easily uncoupled from the chamber and replaced, without also requiring removal and replacement of a backing plate.
Specifically, in one aspect the invention features an adapter sized for permanent mounting to the chamber at the same attachment points as the target shown in FIG. 1. The adapter has a central aperture in which the adapter supports a target. Mechanical couplers inserted through the adapter and the target mechanically join the target to the adapter. The target is manufactured homogeneously of sputtering material, and can be separately installed into and removed from the chamber without removing the adapter. As a result, when the target is worn, the target can be replaced without requiring refurbishing of the adapter.
In specific embodiments, the adapter, which may be of Copper, has a generally cylindrical shape, with generally cylindrical supporting walls, a generally radial outer flange sized for mounting to the chamber in place of the prior art target, and a generally radial inner flange for supporting the target. Apertures through the inner flange of the adapter receive the mechanical couplers, which may be bolts. The target, which is a single piece of machined material such as Aluminum or Aluminum Oxide, Titanium, Gold, refractory metals, or other self-supporting materials, has a disk shape, and has threaded apertures in one of its disk shaped surfaces, arranged in mating relation to the apertures in the inner flange of the adapter. Bolts inserted through the apertures in the adapter are threaded into the apertures on the target and thus couple the target to the adapter.
In further aspects the invention features a target having features described above, and a modified chamber integrally incorporating the adapter therein, thus avoiding the need for a separate adapter.
The above and other objects and advantages of the present invention shall be made apparent from the accompanying drawings and the description thereof.

Mechanically joined sputtering target and adapter therefor


A semiconductor system includes a first semiconductor device and a second semiconductor device. The first semiconductor device outputs a power supply voltage and first data. The second semiconductor device generates a control voltage whose level is adjusted in response to the power supply voltage. The second semiconductor device also receives the first data to generate second data having a swing width different from a swing width of the first data. The second data being driven is controlled by the control voltage.

1. Technical Field
Embodiments of the invention relate to semiconductor devices driving data and semiconductor systems including the same.
2. Related Art
Low cost, compact and large capacity semiconductor memory devices for storing data are increasingly in demand with the development of computer systems, electronic communication systems or the like. In addition, low power semiconductor memory devices have been developed to improve energy efficiency.
Meanwhile, various drivers may be employed in dynamic random access memory (DRAM) devices to perform a read operation or a write operation. For example, a driver for driving a global input and output (I/O) line may be used to transmit data to the global I/O line while the DRAM devices performs the read operation, and the driver for driving the global I/O line may also be used to transmit data inputted through data pads (i.e., DQ pads) to the global I/O line while the DRAM devices performs the write operation.
In general, the drivers included in the DRAM devices are realized using MOS transistors, and the MOS transistors operate with a drive voltage which is lower than a power supply voltage (VDD) in order to reduce current consumption during the read operation of the write operation. In such a case, the MOS transistors have to be designed to have a low threshold voltage because an operation voltage (i.e., the drive voltage) of the MOS transistors is lower than the power supply voltage (VDD).

Semiconductor devices and semiconductor systems including the same


This disclosure relates to compositions capable of use in the treatment of spinal cord injuries and related disorders of the central nervous system (CNS), and in particular, compositions including proteoglycan degrading molecules and compositions capable of blocking and/or over coming the activity of neuronal growth inhibitory molecules, as well as fusion proteins which includes a proteoglycan degrading domain and a domain capable of blocking and or over coming the activity of neuronal growth inhibitory molecules.

Spinal cord injury (SCI) inflicts trauma to the cells and tissues of the central nervous system (CNS) and causes a severe and debilitating condition in the individual. Following SCI, limited regeneration of injured neurons results in permanent disability characterized by some loss of sensation, paralysis and autonomic dysfunction. One reason that neurons fail to regenerate is their inability to traverse the glial scar that develops following SCI. This glial scar contains extracellular matrix molecules including chondroitin sulfate proteoglycans (CSPGs). In vitro studies show that neurons fail to extend processes over CSPG coated surfaces, while in vivo data correlate failure of regeneration with areas of CSPG expression. Within the adult central nervous system (CNS) myelin there are also several identified axon growth inhibitor compounds like myelin associated glycoprotein (MAG), OMgp, and Reticulon 4 or Nogo that have been shown to be inhibitory for the growth of neurons.
The proteglycan degrading enzyme chondroitinase ABC type I has been used to enhance neuronal growth in a dorsal column lesion model of spinal cord injury. It has also been reported that treating a spinal cord injury with NOGO receptor antagonist promotes a certain limited degree of neuronal regeneration. It has further been reported that creating a NOGO knock out mouse resulted in certain limited and inconsistent degrees of neuronal regeneration following dorsal hemisection of the spinal cord.
Experimental treatments for injury to the CNS have utilized the application of chondroitinase to the extracellular space, however the enzyme digests CSPG in the extracellular matrix and not intracellular stores. Furthermore, diffusion of chondroitinase within the parenchyma the essential and distinctive tissue of an organ or an abnormal growth as distinguished from its supportive framework) or between anatomical compartments is limited. The limited access of drugs, imaging agents, and anesthetics, etc. to target cells and/or tissues of the Central Nervous System (CNS) may reduce the usefulness or effectiveness of any of these substances.
The delivery of therapeutic and diagnostic molecules into cells and tissues is, in part, dependent upon extracellular matrices as well as carbohydrates and proteins linked to cell membranes. The extracellular matrix is composed in part of proteoglycans, among them are the chondroitin sulfated proteoglycans (CSPGs). CSPGs are a family of proteoglycans composed of a core protein and covalently linked sulfated glycosaminoglycans. Each proteoglycan is determined by the glycosaminoglycan side chains. For CSPGs these side chains are made up of approximately 40 to 100 sulfated disaccharides composed of chondroitin 4, 6 and dermatan sulfates. The protein component of the CSPG is ribosomally synthesized and the glycosylation occurs in the endoplasmic reticulum and Golgi apparatus. The sugar chains are then sulfated at the 4 or 6 positions by several glycosaminoglycan sulfotransferases.
Transduction proteins may be used to transport polypeptides and polynucleotides cargo across anatomical barriers and into cells. For example, the TAT protein (SEQ ID NO: 2) from the human immunodeficiency virus (HIV) contains a protein transduction domain (PTD) that is involved in the transduction of HIV into cells. The PTD contains an 11 amino acid domain (TAT Peptide) (SEQ ID NO: 3) that is responsible for the activity of the PTD. The TAT Peptide (SEQ ID NO: 3) can be linked to proteins and facilitate the transduction of the proteins into cells. The mechanism of transduction is independent of the molecular weight or chemical properties of the proteins that are linked to the TAT Peptide (SEQ ID NO: 3). In vivo studies show that if a fusion protein consisting of the TAT Peptide (SEQ ID NO: 3) linked to the 120 kd enzyme, beta-galactosidase (β-Gal), is injected into mice, then a robust delivery of β-Gal into a wide variety of cells is observed. When linked to the TAT transduction peptide (SEQ ID NO: 3), β-Gal activity was observed in the brain; without the TAT Peptide (SEQ ID NO: 3), β-Gal was not observed in the brain. Transport across the blood brain barrier is normally restricted to certain hydrophobic small molecules and particular low molecular weight lipophilic peptides. Transport of proteins as large as β-Gal into the brain is usually not possible without substantial disruption of the blood brain barrier, but the TAT Peptide (SEQ ID NO: 3) facilitates transport while leaving the blood brain barrier intact.
Chimeric proteins, also called fusion proteins, are hybrid proteins which combine at least parts of two or more precursor proteins or polypeptides. Chimeric proteins may be produced by recombinant technology, i.e. by fusing at least a part of the coding sequence of one gene to at least a part of the coding sequence of another gene. The fused gene may then be used to transform a suitable organism which then expresses the fusion protein.
Tat Peptide Complexes Frankel et al. (U.S. Pat. Nos. 5,804,604; 5,747,641; 5,674,980; 5,670,617; 5,652,122) discloses the use of Tat peptides to transport covalently linked biologically active cargo molecules into the cytoplasm and nuclei of cells. Frankel only discloses covalently linked cargo moieties that are (therapeutic, diagnostic or prophylactic), and does not teach or suggest the attachment of molecules that facilitate diffusion, plasticity, neurite growth, and axon regeneration. These molecules can include but are not limited to molecules that overcome neurite out growth inhibition, or promote nerve growth such as soluble NOGO antagonists like NgR27-311, neural cell adhesion molecules like L1, neurotrophic factors, growth factors, phosphodiesterase inhibitors, and inhibitors of MAG or MOG. Additionally, deletion mutants may be combined with other compounds that promote remyelination such as neuregulins (GGF2) and antibodies that promote remyelination or proteoglycan degrading molecules to Tat peptides.
Regeneration following SCI is limited because of a variety of obstacles that include the deposition of CSPG at the glial scar, demyelination of axons, lack of trophic support and lack of axonal guidance. A single therapy directed against one aspect of SCI may not be as effective as a combinatorial approach. Fusion proteins with chondroitinase will allow combinatorial therapy with a single protein. Fusion partners for chondroitinase that will be constructed in this proposal were chosen from among proteins that have evidence for efficacy in SCI.
The use of a molecule that has the ability to both degrade extracellular matrix glycoproteins and to block or overcome the inhibitory nature of myelin components may be used to improve the ability of damaged neurons to grow or regenerate compared with either treatment alone. The proteoglycan degrading molecules may also be used advantageously to provide a method of facilitating access and diffusion of substances into cells or tissues through the use of at least one enzyme capable of cleaving proteoglycans and preferably degrading chondroitin sulfate proteoglycans (CSPG).
Embodiments of the present invention include compositions that comprise polypeptides which cleave proteoglycans, polypeptides that block and/or overcome the activity of neuronal growth inhibitory molecules, or a combination of these. The compositions containing the proteoglycan degrading molecule or neuronal growth inhibitory molecules may also include molecules for transduction of the polypeptides across cell membranes and the blood brain barrier. The compositions may be used in the treatment of spinal cord injuries and related disorders of the central nervous system (CNS). The compositions can be used in the regeneration of damaged neurological tissue and facilitate the diffusion and transport of therapeutic molecules capable of blocking and/or overcoming the activity of neuronal growth inhibitory molecules into damaged or diseased tissue.
Embodiments of the present invention include compositions and methods for their use to facilitate delivery and diffusion of therapeutics or diagnostic agents, and preferably agents that promote regeneration of nerves and axons, into cells or tissues. Preferably the composition includes the use of an enzyme capable of cleaving chondroitin sulfate proteoglycans (CSPG) to increase the diffusion of these agents into cells or tissues of the central nervous system.
Compositions of the present invention may include chimeric or fusion proteins capable of systemic use in the treatment of spinal cord injuries and related disorders of the central nervous system (CNS), and in particular, fusion proteins capable of crossing the blood brain barrier. The fusion protein may include a polypeptide transduction domain, a polypeptide domain capable of degrading a proteoglycan, preferably a domain cleaving chondroitin sulfate proteoglycan (CSPG), a polypeptide domain that blocks and or over comes the activity of neuronal growth inhibitory molecules, or any combination of these polypeptide domains that may be used in the treatment of spinal cord injuries and related disorders of the central nervous system (CNS). The various polypeptide domains may be linked or chemically bonded together by polypeptide linkers.
Compositions of the present invention include polynucleotides which encode for the chimeric or fusion proteins capable of systemic use in the treatment of spinal cord injuries and related disorders of the central nervous system (CNS), and in particular, they encode for fusion proteins capable of crossing the blood brain barrier. The polynucleotides which encode for these chimeric or fusion proteins may include a polynucleotide domain encoding for a polypeptide transduction domain, a polynucleotide domain encoding for a polypeptide domain capable of degrading a proteoglycan, preferably cleaving chondroitin sulfate proteoglycan (CSPG), a polynucleotide domain encoding for a polypeptide domain that blocks and or over comes the activity of neuronal growth inhibitory molecules, or any combination of these domains that may be used in the treatment of spinal cord injuries and related disorders of the central nervous system (CNS). The polynucleotide also includes one or more polynucleotide domains that encode for polypeptides that link the domains of the polypeptide together to form the fusion protein.
One embodiment of the present invention is a composition and a method for its use that facilitates the access and distribution of therapeutic and diagnostic agent in the composition into cells, through membranes or into tissues by the use of composition that includes at least one enzyme capable of cleaving proteoglycans, preferably the composition includes a fusion protein having an enzyme capable of cleaving CSPGs. The molecules or agents in the composition may include one or more of Growth factors including, Brain Derived Neurotrophic Factor, Insulin-like Growth Factor, Fibroblast Growth Factor, Ciliary Neurotrophic Factor, Glial Derived Neurotrophic Factor, Transforming Growth Factor, Glial Growth Factor 2, L1, GM1, Vascular Endothelial Growth Factor, Nerve Growth Factor, Immunophilins. Molecules in the composition can include fluorescent or contrast agents for imaging. The agents may include cells for transplant—stem cells, neurons, others, cells as delivery agents, chemotherapeutic agents, antibiotics, antibody therapies, Nogo receptor antagonists, other chondroitinase enzymes. The composition may include a transduction domain, an enzyme capable of cleaving proteoglycans, or both. Preferably the composition includes a fusion protein having a transduction domain, an enzyme domain capable of cleaving proteoglycans, or both. The fusion protein can facilitate the transport or modifies transport of such agents into cells, tissues, and/or otherwise inaccessible locations; and/or to enhance penetration rates, distance of penetration; or provide more even concentration distribution. Preferably the modified transport occurs through the use of at least one enzyme capable of cleaving CSPGs. The compositions can be used for treating a CNS injury, preferably the composition is used in the treatment of neuronal damage from a contusion injury.
Embodiments of the present invention include chimeric proteins of a proteoglycan degrading domain linked to a polypeptide that blocks the action of neuronal growth inhibitors such as but not limited to a Nogo-receptor antagonist (NgR27-311) domain or variant linked to a chondroitinase like chondroitinase ABC I or a variant of chondroitinase having one or more N terminal amino acids deleted. The compound may include chimeric proteins of a proteoglycan degrading domain linked to a polypeptide that is a neural cell adhesion promoter such as an L1 neural cell adhesion promoter domain or variant linked to chondroitinase ABC I or a variant of chondroitinase having one or more N terminal amino acids deleted. The chimeric proteins may include chimeric proteins of a proteoglycan degrading domain linked to a polypeptide that is a glial cell stimulator, such as but not limited to a GGF2 glial cell stimulator or variant linked to chondroitinase ABCI or a variant of chondroitinase having one or more N terminal amino acids deleted.
An E. Coli recombinant expression system and purification process can be used to produce essentially pure and catalytically active chondroitinase ABCI. These methods may be modified for producing chimeras of proteoglycan degrading molecules and other agents.
The chimera may be assayed for chondroitinase enzymatic activity and the specific biological activity of each fusion partner. Methods to measure the activities of the chimera may be modified for those used to measure chondroitinase activity including a spectrophotometric assay, zymography, an HPLC assay to detect CSPG disaccharide digestion products and an in vito neurite outgrowth assay. A neuron growth cone collapse assay can be used to evaluate NOGO receptor antagonists and a neurite outgrowth assay can be used measure L1 activity. GGF2 activity may be measured using a Schwann cell proliferation assay.
The compositions and method of the present invention can be used for the treatment of spinal cord injuries and in the promotion of regeneration of axons. The compositions of the present invention can also be used to promote plasticity, regrowth, repair, and/or regeneration of dysfunctional neurons in the CNS that have been damaged as a result of disease, such as degenerative diseases including Alzheimer's and Parkinson's disease. Advantageously, the use of proteoglycan degrading polypeptides or membrane transducing polypeptides in the compositions of the present invention also promote diffusion and access of damage or diseased tissue to other therapeutic agents promoting the regeneration of neurons.

This patent is subject to a terminal disclaimer.

Fusion proteins for the treatment of CNS


A timing signal generating system has a clock signal generating circuit, a synchronizing circuit, a phase code recognizing circuit, and a calibration circuit. The clock signal generating circuit generates at least one first clock signal upon receipt of at least one reference clock signal by controlling an output phase thereof with a digital code signal. The synchronizing circuit hands over signals between a group of circuits operated by the first clock signal and an internal circuit operated by a second clock signal. The phase code recognizing circuit recognizes a phase code when the phases of the first clock signal and of the second clock signal are in a particular relationship. The calibration circuit calibrates a relationship between a value of the recognized phase code and a phase difference between the first and second clock signals. The synchronizing circuit is controlled by using phase code data calibrated by the calibration circuit.

1. Field of the Invention
The present invention relates to a technology for transmitting signals among a plurality of large scale integration ("LSI") chips, among a plurality of elements in a chip or among a plurality of circuit blocks, or for transmitting signals, at high speed, among a plurality of boards or among a plurality of housings. More particularly, the present invention relates to a timing signal generating system, for transmitting signals at high speed, and to a receiving circuit.
2. Description of the Related Art
Recently, the performance of components used in computers and other information processing apparatuses has been greatly improved. In particular, dramatic improvements have been made, for example, in the performance of processors and semiconductor memory devices such as SRAMs (Static Random Access Memories) and DRAMs (Dynamic Random Access Memories). The improvements in the performance of semiconductor memory devices, processors, and the like have come to the point where system performance cannot be improved further unless the speed of signal transmission between components or elements is increased.
Specifically, the speed of signal transmission between, for example, a main storage unit such as DRAM and a processor (between LSIs) is hindering the effort for improving the performance of the computer as a whole. Besides, it is becoming necessary to increase the speed of signal transmission not only between the housing and the board (printed wiring board), such as between a server and a main storage unit or between the servers through a network, but also among the chips, among the elements in the chip and among the circuit blocks due to a high degree of integration of the semiconductor chip, an increase in the size thereof, and a decrease in the power source voltage (decrease in the signal amplitude). Realizing high-speed signal transmission requires a timing signal generating system (receiving circuit) having a synchronizer, and it has been desired to provide a timing signal generating system featuring a short processing time with a small amount of circuitry.
The prior art and the problems associated with the prior art will be described in detail later with reference to accompanying drawings.

Timing signal generating system and receiving circuit for transmitting signals at high speed with less circuitry


Integrated circuit chips include an internal circuit including interconnected semiconductor devices that are configured to provide integrated circuit functionality, and a Test Element Group (TEG) circuit that is configured to allow measuring of electrical characteristics of the semiconductor devices. By providing a TEG circuit in the same integrated circuit chip as the internal circuit, the TEG circuit may accurately represent the electrical characteristics of the interconnected semiconductor devices of the internal circuit of the associated integrated circuit chip. The integrated circuit chip may be coupled to a test apparatus. The test apparatus includes a test probe that is configured to simultaneously contact the internal circuit and the TEG circuit. The test apparatus also can simultaneously test the integrated circuit functionality of the internal circuit, and measure the electrical characteristics of the semiconductor devices via the TEG circuit.

Integrated circuit chips are widely used in consumer, commercial and industrial applications. As is well known to those having skill in the art, integrated circuit chips generally are fabricated in integrated circuit wafers, which may comprise semiconductor materials. The wafers contain an array of scribe line regions that are arranged to provide a plurality of integrated circuit chips in the wafer. After fabrication, the integrated circuit wafer is diced along the scribe lines, to separate (singulate) the individual integrated circuit chips, which are then packaged for use.
As is well known to those having skill in the art, integrated circuit chips generally include internal circuits that include interconnected semiconductor devices such as transistors, diodes, capacitors, optical elements, optoelectronic elements, microelectromechanical (MEM) elements and/or other devices, which are configured to provide integrated circuit functionality, such as a memory device, a microprocessor, an electro optical device, an electromechanical device and/or other analog and/or digital integrated circuit functionality. The internal circuit may also include test circuits for testing the integrated circuit functionality, for example to test for proper operation of the memory device, microprocessor other integrated circuit functionality.
It is also known to provide a Test Element Group (TEG) in the integrated circuit wafer, to allow measuring of electrical characteristics of the semiconductor devices themselves. A TEG circuit may be used to measure electrical characteristics of the semiconductor devices, so that data that is obtained by measuring the TEG circuit during a TEG test may be used, for example, to solve process problems. For example, process problems may be discovered and solved by judging whether each process is carried out correctly using the measured electrical characteristics. In particular, the electrical characteristics of the semiconductor devices generally are not measured directly by measuring the interconnected semiconductor devices in the internal circuit. Rather, a TEG circuit is provided in the scribe area of the semiconductor wafer and/or as one or more discrete TEG chips at various locations in the semiconductor wafer. Since the TEG circuit is formed by the same process that is used to form the interconnected semiconductor devices in the internal circuit, the measure of electrical characteristics of the semiconductor devices in the TEG circuit can provide a measure of the electrical characteristics of the interconnected semiconductor devices in the internal circuit. Thus, electrical characteristics of the semiconductor devices in the chip can be obtained by testing the TEG circuits, i.e. by performing a TEG test.
TEG circuits have been used to test various electrical characteristics of semiconductor devices in an integrated circuit chip, such as the drain current of a transistor, the threshold voltage of an inverter, inter-metal open/short states, contact resistance, capacitance, and/or many other electrical characteristics. As was described above, data obtained through the TEG test may be utilized to estimate process reliability and/or stability. The TEG circuit can be formed in the scribe line regions of the wafer and/or in one or more separate TEG chips in the wafer. Various TEG circuits for measuring electrical characteristics of semiconductor devices in an integrated circuit chip are disclosed in Japanese Laid-Open Patent Application Nos. 2000-332077; 2000-31221; and Ser. No. 09-172049, and in Korean Patent Application Nos. 1997-53226 and 2000-51684. Other TEG circuits are described in U.S. Pat. Nos. 6,372,554; 6,368,943; 6,326,676; 6,326,309; 6,075,373; 5,936,420; and 5,650,961.
FIG. 11 is a flowchart illustrating conventional methods of fabricating and testing integrated circuit chips. As shown at Block S10, a plurality of integrated circuit chips, each including various internal circuits including interconnected semiconductor devices that are configured to provide integrated circuit functionality, are formed in a semiconductor wafer using well-known fabrication processes. Simultaneous with the fabrication of the internal circuits, a TEG circuit also is fabricated in the scribe line regions of the wafer and/or as one or more separate TEG chips in the wafer. Then, at Block S20, the TEG circuits are tested in order to measure electrical characteristics of the semiconductor devices in the internal circuits. An Electric Die Sorting (EDS) test is then performed on the internal circuits of the individual integrated circuit chips in the wafer, in order to determine which chips are properly performing their integrated circuit functionality. The EDS test generally is carried out using a tester that includes a probe card. The probe card includes probes such as needles and/or pins that electrically connect the tester to the chip or chips under test. The probes may be mounted on the probe card. Finally, referring to Block S40, after the EDS test, the good integrated circuit chips are assembled and packaged.
Unfortunately, conventional testing methods as illustrated in FIG. 11 may take an excessive time to perform the TEG test of Block S20 and the EDS tests of Block S30. Moreover, the TEG tests may produce inaccurate results, because the TEG circuits that are formed at the scribe line regions of the wafer and/or in separate TEG chips, may not be representative of the electrical characteristics of all of the integrated circuit chips in a wafer.

Integrated circuit chips and wafers including on-chip test element group circuits, and methods of fabricating and testing same


Single vector constructs for expression of an immunoglobulin molecule or fragment thereof and methods of making and using the same are described. The vectors comprise a self-processing cleavage sequence between a first and second immunoglobulin coding sequence allowing for expression of a functional antibody molecule using a single promoter. The vector constructs include the coding sequence for a self-processing cleavage site and may further include an additional proteolytic cleavage sequence which provides a means to remove the self processing peptide sequence from an expressed immunoglobulin molecule or fragment thereof. The vector constructs find utility in methods for enhanced production of biologically active immunoglobulins or fragments thereof in vitro or in vivo.

The use of antibodies as diagnostic tools and therapeutic modalities has found increasing use in recent years. The first FDA-approved monoclonal antibody, Rituxan® (Rituximab) was approved in 1997 for the treatment of patients with non-Hodgkin's lymphoma and soon thereafter 1998, Herceptin®, a humanized monoclonal antibody for treatment of patients with metastatic breast cancer was also approved. Numerous antibody-based therapies are showing promise in various stages of clinical development. One limitation in widespread clinical application of antibody technology is that typically large amounts of antibody are required for therapeutic efficacy and the costs associated with sufficient production are significant. Chinese Hamster Ovarian (CHO) cells and NSO2 myeloma cells are the most commonly used mammalian cell lines for commercial scale production of glycosylated human proteins like antibodies. Mammalian cell line production yields typically range from 50-250 mg/L for 5-7 day culture in a batch fermentor or 300-600 mg/L in 7-12 days in fed batch fermentors. Non-glycosylated proteins can be successfully produced in yeast (e.g., insulin production by Novo Nordisk) or E. Coli (e.g., insulin production by Eli Lilly, and Fab production by Celltech).
Previous attempts to express a full length antibody/immunoglobulin molecule via recombinant DNA technology using a single vector have met with limited success, typically resulting in unequal levels of expression of the heavy and light chains of the antibody/immunoglobulin molecule, and more particularly, a lower level of expression for the second gene. The unequal expression of heavy and light chains within the cell results in an overall low yield of full length antibody. In order to express high levels of a fully biological functional antibody from a single vector, equimolar expression of the heavy and light chains is required. Additionally, conventional vectors relying on dual promoter regulation of gene expression are invariably affected by promoter interaction (i.e., promoter interference) which may compromise equimolar expression of the genes. Other factors that limit the ability to express two or more coding sequences from a single vector include the packaging limitation of the vector itself. For example, in considering the appropriate vector/coding sequence, factors to be considered include:packaging capacity of the vector (e.g., approx. 4,500 bp for AAV), which can limit the size of expressible coding sequences; the duration of in vitro/in vivo expression of the recombinant protein by a vector-transfected cell or organ (e.g., short term expression for adenoviral vectors); the cell types infected by the vector if a viral vector is used; and the desired expression level of the gene product(s) which is generated. The requirement for controlled expression of two or more gene products together with the packaging limitations of viral vectors such as adenovirus and AAV, limits the choices with respect to vector construction and systems for expression of immunoglobulins or fragments thereof.
In order to express two or more protein or polypeptide sequences from a single vector, two or more promoters or an internal ribosome entry site (IRES) sequence are used to drive expression of individual genes. The use of two promoters within a single vector can result in low protein expression due to promoter interference. When two genes are linked with an IRES sequence, the expression level of the second gene is often significantly weaker than the first gene (Furler et al., Gene Therapy 8:864-873, 2001).
The linking of proteins in the form of polyproteins in a single open reading frame is a strategy adopted in the replication of many viruses including picomaviridae. Upon translation, virus-encoded proteinases mediate rapid intramolecular (cis) cleavage of a polyprotein to yield discrete mature protein products. Foot and Mouth Disease viruses (FMDV) are a group within the picomaviridae which express a single, long open reading frame encoding a polyprotein of approximately 225 kD. The full length translation product undergoes rapid intramolecular (cis) cleavage at the C-terminus of a 2A region occurring between the capsid protein precursor (P1-2A) and replicative domains of the polyprotein 2BC and P3, and this cleavage is mediated by proteinase-like activity of the 2A region itself (Ryan et al., J. Gen. Virol. 72:2727-2732, 1991); Vakharia et al., J. Virol. 61:3199-3207, 1987). Ryan designed constructs identifying the essential amino acid residues for expression of the cleavage activity by the FMDV 2A region. 2A domains have also been characterized from aphthoviridea and cardioviridae of the picomavirus family (Donnelly et al., J. Gen. Virol. 78:13-21, 1997).
There remains a need for improved gene expression systems for expression of full length immunoglobulins and fragments thereof which provide advantages relative to currently available technology (i.e., the use of an IRES or two or more promoters).
The present invention addresses this need by demonstrating the feasibility and use of a single vector construct which encodes a self-processing peptide for expression of a biologically functional polypeptide, such as an immunoglobulin or fragment thereof.

Compositions and methods for enhanced expression of immunoglobulins from a single vector using a peptide cleavage site


An infant food formulation substantially approximating human milk in fatty acid composition comprising a mixture of DHA and EPA in a ratio of approximately 3:2 by weight, immunoglobulins to mimic the immunoglobulin content of mother's milk, a source of protein, a source of carbohydrate, a source of ash, and sufficient water to provide an easily assimilable infant formula, the DHA, the EPA, and the immunoglobulins being encapsulated in capsules having a diameter of less than 350.mu..

In the past, ready-to-feed infant formulas have been prepared by the appropriate blending of ingredients, including varying proportions of selected animal fats to yield a composition having a protein, mineral, carbohydrate, and fatty acid composition approximating that of human milk fat. However, the fatty acids of such artificial formulations have not been as well absorbed by the infant, or by experimental animals, e.g., the laboratory rat, as are the natural fatty acids in milk.
Canadian patent No. 927,187 discloses a dietary product intended to adapt cow's milk to the requirements of human infants, and to make the cow's milk similar to human milk. The lipid component of this dietary product is preferably a mixture of vegetable oils with soy lecithin and eventually with milk fats.
Canadian Patent No. 927,188 discloses an edible fat composition intended to resemble that of human milk fat. This composition includes various proportions of oleic oil; oleo oil; a seed oil comprising at least one or more of soybean oil, corn oil, peanut oil, sunflower seed oil, and cottonseed oil; coconut oil and/or babassu oil; and soy lecithin.
The dietary products and fatty acid compositions disclosed in these patents rely upon edible oils, soy lecithin, and/or milk fats to form the lipid component. However, these oils do not contain the C.sub.20 and C.sub.22 omega-6 and omega-3 fatty acids which are present in human milk. Accordingly, these preparations do not provide a balance of fatty acids that are similar in composition to that of human milk.
It is known that the composition of dietary fat is a major determinant of tissue composition during the formative stage in the growth and development of an organ. An analysis of human milk at day 16 of lactation was used to estimate infants' daily intake of C.sub.20 and C.sub.22 omega-3 and omega-6 fatty acids. The study indicated that significant amounts of these fatty acids are normally received by the infant fed human milk.
Past studies have not resolved the nutritional biochemical question of how much and which essential fatty acids should be provided in a dietary formula to premature infants to ensure normal synthesis of nerve tissues. Such tissues would normally contain high levels of long-chain metabolites of essential fatty acids as basic structural material. In particular, it is important that the quantities of the C.sub.20 and C.sub.22, omega-3 and omega-6 fatty acids be limited to appropriate ranges in a dietary formula. Insufficient supply of these fatty acids would interfere with brain development. Over-feeding of these fatty acid could distort normal prostaglandin metabolism and thus have adverse effects on the infant's physiology. For example, providing too much of these fatty acids could result in over-production of prostaglandins in the gut, which could lead to a hyperactive gut and diarrhea.
Studies on the composition of human milk have identified further substances not found in many cow's milk-based formulas. Recently, it has been shown that human milk contains physiologically active concentrations of prostaglandins, specifically prostaglandin E.sub.2, prostaglandin F.sub.2.alpha., and the metabolites of prostaglandin I.sub.2, namely 6-keto-prostaglandin F.sub.1.alpha.. These prostaglandins and their metabolites are present in human milk at all stages of lactation and change in concentration during lactation in a manner analogous to the development of the infant's capacity to absorb nutrients. For example, in approximately the first three weeks of infant life, the level of these prostaglandins and their metabolites increases in human milk, as does the infant's capacity to absorb nutrients.
It is known that prostaglandins affect functions related to nutrient absorption. Thus, in the human a variety of physiological functions are affected in the gut by prostaglandins, e.g., gastric acid and mucous secretion, smooth muscle contraction, local circulation, nutrient transport, and absorption.
However, providing the optimum ratio of the omega-3 and omega-6 C.sub.20 and C.sub.22 fatty acids in an infant formula is essential in order to provide early nutrition. For a growing infant, DHA is more important that EPA. For example, DHA is required for growth of the retina, and 70% of the lipid sheath of nerves is composed of DHA. DHA is also required for brain and nerve development. Therefore, it is important that an infant formula provide sufficient DHA to the infant. Naturally occurring sources, such as fish oil, are generally used as a source of EPA and DHA for infant formula. For example, in U.S. Pat. No. 4,670,285, Clandinin et al. disclose an edible fat formula for feeding infants wherein the omega- and omega-6 fatty acids are derived from fish oil. Unfortunately, the ratio of EPA to DHA in fish oil is the reverse of what is required by a growing infant, and an insufficient amount of DHA is present in the formula.
A number of other infant formulas have been commercialized in an attempt to duplicate the nutritional value of mother's milk. However, to date, none of these formulas has proven completely acceptable in terms of infant nutrition, particularly for premature infants.
Tomarelli et al., in U.S. Pat. No. 3,542,560, disclose an infant formula having a fat similar to the fat in human milk, including palmitic acid.
Cannalonga et al., in U.S. Pat. No. 3,558,323, disclose a vitamin-containing composition in beadlet form, the vitamins being generally fat-soluble vitamins, which can then be incorporated in milk. When these beadlets are dispered in milk, they impart no off-flavor to the milk, and the beadlets can be mixed with spray-dried skim milk powder without affecting the stability of the powder.
Roberts, in U.S. Pat. No. 4,112,123, discloses a nutritionally balanced food composition for patients having abnormal catabolic states. These compositions include protein obtained from the ultra-filtration of sweet or acid wheys and contain .beta.-lactoglobulin, .alpha.-lactalbumin, immunoglobulins, and serum albumin. This food made be prepared in dried powder form to be reconstituted with a liquid. The powder may include encapsulated and embedded minerals.
Durst, in U.S. Pat. No. 4,800,087, discloses pharmaceutical compositions comprising a pharmaceutical core comprising a pharmaceutically active dose of a compound and a microencapsulating polymer which coats the pharmaceutical core and is capable of masking the taste of the active compound. The polymer coating does not fracture or release active ingredients when tabletted and/or chewed. These capsules may be included in a liquid formulation, although infant formula is not disclosed.


An information processing apparatus operable in a first power state and a second power state includes a noncontact communication unit configured to be driven by power of a radio wave from a mobile terminal and to communicate with the terminal, a storage unit configured to store data necessary for authentication, which the noncontact communication unit has received from the terminal in the second power state, a control unit configured to recover, when the noncontact communication unit receives data from the terminal in the second power state, the information processing apparatus from the second power state to the first power state, and a transmission unit configured to transmit, after the information processing apparatus has been recovered to the first power state by the control of the control unit, the data necessary for authentication stored in the storage unit to an authentication unit.

Field of the Invention
The present invention relates to an information processing apparatus, a method for controlling the same, and a storage medium.
Description of the Related Art
An information processing apparatus such as an image forming apparatus has hitherto been provided with an authentication function for controlling permission/inhibition of use for a user. One of such methods uses a Radio Frequency Identification (RFID) tag. According to this method, in the image forming apparatus that includes a tag reader/writer, information is read from an integrated circuit (IC) card which a RFID tag has been embedded in and which has come close, and then authentication is performed based on the information.
However, this method needs power for operating the reader/writer. As a result, when a device is set in a power saving state, the authentication function does not operate unless power is supplied to the reader/writer. On the other hand, when power is supplied to the reader/writer, the device is not set in a sufficient power saving state.
In recent years, a technology referred to as Near Field Communication (NFC) that is one of near field wireless communication units (or noncontact communication units) compatible to the RFID has started to be mounted in a mobile terminal such as a smartphone or a tablet personal computer (PC).
Three operation modes are defined according to NFC specifications. A first is a reader/writer mode that enables an operation equivalent to that of the reader/writer. A second is a card emulation mode that enables an operation equivalent to that of the RFID tag. A third is a peer-to-peer mode that enables transmission/reception of various data via the NFC. In the NFC, an operation can be performed while switching these modes.
There has been offered a technology for compensating for an issue when the reader/writer is used in the power saving mode of the device by switching the operation modes in the NFC as discussed in Japanese Patent Application Laid-Open No. 2011-60046 (JP 2011-60046). According to the technology discussed in JP 2011-60046, a noncontact communication device operates in the reader/writer mode when power has been supplied from an apparatus, and in the card emulation mode when power has been supplied from a battery. During the operation in the card emulation mode, the noncontact communication device transmits information regarding the apparatus to a communication partner. This enables transmission of information of some type even in the power saving state.
However, according to the aforementioned conventional technology, it is only the information of the device that is transmitted to the communication partner. When a user logs in to use the apparatus in the power saving state, the user must perform a recovery operation in order to make the apparatus recover from the power saving state. To perform authentication after the recovery, the user must hold up the mobile terminal again to the device. Thus, the technology lacks convenience. In the mobile terminal, which of the card emulation mode and the reader/writer mode should be used to carry out communication is not uniquely determined. As a result, an operation is cumbersome for the user, and user's operation time may increase.

Information processing apparatus, method for controlling the same, and storage medium


The present disclosure relates to an orally administered pharmaceutical formulation containing an inclusion complex formed as varenicline or a pharmaceutically acceptable salt thereof is included in cyclodextrin. The pharmaceutical formulation can improve convenience of medication by effectively masking the bitter taste of the drug and the irritation during swallowing, can provide the oxidation stability of varenicline and can improve the solubility of the drug.

Varenicline has the following chemical formula:

Varenicline is also called 5,8,14-triazatetracyclo[10.3.1.02,11.04,9]-hexadeca-2(11),3,5,7,9-pentane or 7,8,9,10-tetrahydro-6,10-methano-6H-pyrazino[2,3-h][3]-benzazepine. Varenicline and a pharmaceutically acceptable acid addition salt thereof are mentioned in International Patent Publication No. WO1999/35131.
Varenicline binds to the neuronal nicotinic acetylcholine receptor and is useful in regulating cholinergic action. Accordingly, varenicline is useful in treating various conditions or diseases, for example, inflammatory bowel disease (non-limiting examples: ulcerative colitis, pyoderma gangrenosum and Crohn's disease), irritable bowel syndrome, spasmodic dystonia, chronic pain, acute pain, celiac sprue, pouchitis, vasoconstriction, anxiety, panic disorder, depression, bipolar disorder, autism, sleep disorder, jet lag syndrome, amyotrophic lateral sclerosis (ALS), cognitive impairment, hypertension, bulimia, anorexia, obesity, cardiac arrhythmia, gastric acid hypersecretion, ulcer, pheochromocytoma, progressive supranuclear palsy, drug dependence and addiction (dependence on or addiction to, e.g., nicotine (and (or) tobacco products), alcohol, benzodiazepine, barbiturate, opioid or cocaine), headache, migraine, spasm, traumatic brain injury (TBI), obsessive-compulsive disorder (OCD), psychosis, Huntington's chorea, tardive dyskinesia, hyperkinesia, alexia, schizophrenia, multi-infarct dementia, age-related cognitive decline, epilepsy (including absence epilepsy), Alzheimer's disease (AD), Parkinson's disease (PD), attention deficit hyperactivity disorder (ADHD) and Tourette syndrome.
Varenicline tartrate is sold as a 1-mg or 0.5-mg tablet and is used as a smoking cessation aid to treat nicotine addiction or reduce tobacco addiction or consumption.
Varenicline can be administered through various routes. When considering the convenience of carrying and medication, it may be provided specifically as an oral formulation, more specifically an intraoral dispersible formulation. However, varenicline has a characteristic bitter taste and may cause an unpleasant sensation when swallowing. Therefore, it is not easy to be prepared into a formulation for oral administration, particularly an intraoral dispersible formulation whose taste is directly felt during oral administration, e.g., an orally dissolving film, an orally disintegrating tablet, a suspension, a suspension tablet, a rapidly disintegrating tablet, an orally disintegrating capsule, an orally disintegrating granule, an orally disintegrating troche, a sublingual tablet, a powder and/or a chewable tablet. Especially, it is difficult to be used as an active ingredient of an orally administered pharmaceutical formulation for treating a condition or a disease requiring regular medication for a long period of time.

Preparation, comprising inclusion complex of varenicline or pharmaceutically acceptable salt thereof, for oral administration


A process for preparing a vinyl chloride copolymer which comprises polymerizing a vinyl chloride monomer or a mixture of a major proportion of a vinyl chloride monomer with a minor proportion of a copolymerizable monomer and at least one crosslinking agent selected from polyhydric alcohol diglycidyl ether diacrylates and dimethacrylates. The crosslinking agent is added to the reaction system after polymerization of the vinyl chloride monomer or the mixture proceeds to a certain extent. By this, the resultant copolymer has good processability and good mechanical and electric characteristics.

1. Field of the Invention
This invention relates to a process for preparing vinyl chloride copolymers capable of forming polyvinyl chloride moldings wherein the vinyl chloride copolymers have good workability and the molding articles have good matte properties on the article surface, good compression set, good resistances to creep and heat and good electric characteristics.
2. Description of the Prior Art
Thermoplastic elastomer compositions mainly composed of vinyl chloride resin have better formability (forming processability) than other compositions, e.g. rubbers, in that they can be formed easily by extrusion or injection. However, they are disadvantageous in that the resultant moldings have poor compression set and poor creep resistance with poor matte properties of the molding surface.
One of known techniques of overcoming the disadvantage is a method wherein the vinyl chloride resin is made higher in degree of polymerization, for which a crosslinkable monomer is added upon polymerization of vinyl chloride to increase an apparent degree of polymerization. However, this method is not advantageous in that the forming workability becomes considerably worsened with an attendant problem that expected physical properties develop only when using a specific type of processing machine or a specific type of technique.

Process for preparing vinyl chloride copolymers with diacrylate of polyhydric alcohol


A temperature control method for vehicle seat heating includes: when turning on or switching to a heating level, determining a heating period at present according to a temperature value corresponding to a current Negative Temperature Coefficient (NTC) sensor, the heating period including an initial heating stage, an approaching stage and a steady stage; and segmentally controlling the on-off of a seat heating apparatus according to a heating strategy corresponding to each heating period, so that the seat surface temperature reaches to and stabilizes at an expected target temperature of the level. Further disclosed are a corresponding temperature control apparatus for the vehicle seat heating and a temperature control system for the vehicle seat heating. By adopting the temperature control method for the vehicle seat heating, the seat surface temperature can quickly reach to and stabilize at the expected temperature value, and thus the use experience of a user is improved.

Usually, the seat heating of cars are controlled by setting the Heated/Ventilated Seat Modules (HVSMs) in the seats.
For the existing HVSM module, in order to improve comfort of the seat heating, the following control objectives are expected:
a) The seat surface temperature is increased to an expected temperature value from an environmental temperature as soon as possible and stabilizes around this temperature value, i.e., it is expected that a time from the seat heating is turned on to the seat surface temperature is stabilized at the expected value is as short as possible.
b) After being increased to the expected temperature value, the seat surface temperature should change within a certain set fluctuation range all the time (for example, the fluctuation range is generally set at ±1° C.). The seat surface temperature should not exceed the expected value, particularly at a highest level.
In the conventional art, to achieve the above goals, a seat heating pad supplier generally measures corresponding resistances of an Negative Temperature Coefficient (NTC) temperature sensor in a seat heating apparatus (such as a heating pad) when the seat surface temperature stabilizes at temperature values required by three heating levels in a certain set constant environmental temperature (in terms of a demand of a vehicle plant. For example, 23° C. required by General Motors Corporation and 30° C. required by Ford Motor Company). After obtaining the NTC resistances corresponding to the three heating levels, an HVSM module supplier takes the NCT resistances as target values in a control algorithm. When the seat heating is turned on and the NTC resistance is reduced along with the increase of the temperature to be close to a target resistance at a certain distance, a controller in the HVSM module starts to intervene the temperature control, turns off/on the seat heating at a certain duty ratio, and gradually changes a duty ratio of a control circuit, so that the NTC resistance approaches to the target resistance slowly and smoothly. When the NTC resistance reaches to the target resistance, the controller controls the seat heating work at a fixed duty ratio, so that the seat surface temperature stabilizes around the expected value.
However, an existing control method of a present seat heating controller supplier generally can meet the objective b). With regard to the objective a), because of the problems of a time point when the controller intervenes the temperature control and the temperature control method, there are the following three situations: first, the time when the controller intervenes the temperature control is too early, which results in that the seat surface temperature is reduced due to a heating power before reaching to the expected value, the heating rate is slowed down and the seat surface temperature may reach to the expected temperature value for a relatively long time (for example, some vehicle needs 40 min to complete the above process); second, the time when the controller intervenes the temperature control is too late, resulting in that the seat surface temperature exceeds the expected value (or referred to as an overshoot); and third, during a process from the controller intervenes the temperature control to the seat surface temperature stabilizes at last, since the control method is not perfect enough, the fluctuation range of the seat surface temperature is relatively large, for example, beyond ±1° C.
Therefore, the existing temperature control method and the effect for the vehicle seat heating have more or less shortages, such as, the seats are heated too slowly or overheated, or the seats is cold or hot now and then, so that the user experience is affected.

Temperature control method, device and system for vehicle seat heating


An energy transfer system includes a power transfer mechanism, a first system, and a second system. The first system includes a first pump-motor operatively connecting the first system to the power transfer mechanism and a regenerative system operatively connected to the first pump-motor. The second system is operatively connected to the power transfer mechanism. Power is transferred between systems by the power transfer mechanism. A method of energy transfer is also provided.

Machines often use one or more hydraulic actuators to accomplish a variety of tasks. These actuators are fluidly connected to pumps on the machine that provide pressurized fluid to chambers within the actuators. As the pressurized fluid moves into or through the chambers, the pressure of the fluid acts on hydraulic surfaces of the chambers to effect movement of the actuator and a connected work tool or implement. When the pressurized fluid is drained from the chambers it returns to a low pressure sump on the machine. A significant amount of energy may be required to operate a plurality of hydraulic actuators. In order to increase efficiency, some machines use regenerative systems to recover energy during the operation of such hydraulic systems.
Mobile machines also use some type of propulsion system to drive the machine such as a hydraulic system or a hydrostatic system. These propulsion systems may include a regenerative system to increase the efficiency of operation.
Energy that is recovered by a regenerative system may be stored in various types of energy storage devices or systems. For example, energy recovered in a hydraulic system is often stored in a hydraulic accumulator, and energy stored in an electrical system is often stored in a battery or capacitor system. However, certain inefficiencies exist when storing energy as well as when subsequently converting it back into usable power. Accordingly, some machines share energy between systems. U.S. Pat. No. 7,472,546 discloses a hydrostatic regenerative braking system that stores energy in a hydraulic accumulator. The stored energy may be subsequently used by directing pressurized hydraulic fluid as desired to propel the machine or to drive a secondary steering system.


This invention relates to medicaments and their use in the alleviation of inflammation and pain in joints.

Pain or loss of movement in joints is a common occurrence, particularly among the elderly or those who have suffered damage to cartilage, bone surfaces or ligaments. Conventional methods of treatment include the administration of corticosteroids by injection into the site of the inflammation. However, relief tends to be temporary and long term use can carry a number of contraindications.


A switch mode power supply (SMPS) system includes a rectifying circuit for coupling to an AC input voltage and a transformer having a primary winding for coupling to the rectifying circuit and a secondary winding coupled to the primary winding. The system also has a power switch coupled to the primary winding and a control circuit coupled to the power switch. The control circuit is configured to control current flow in the primary winding such that an envelope waveform formed by peak points of current pulses is in phase with the magnitude of the AC input voltage. Moreover, the SMPS system is configured to provide a constant average output current.

The present invention relates generally to switch mode power supply (SMPS) systems. More particularly, embodiments of the invention relate to methods and circuits for controlling and improving the power factor of SMPS systems.
Switch mode power supply (SMPS) systems have many advantages over conventional linear regulated power supplies. These advantages include smaller volume, better stability, and higher power efficiency. As a result, SMPS has found widespread applications, such as televisions, set-top boxes, and video recorders, portable telephone chargers, personal digital assistants (PDAs), and even certain automated tooth brushes. In recent years, as light emitting diode (LED) technologies are becoming more mature, SMPS systems are widely used as drivers for LED devices, including as drivers in white-light bulb replacement applications.
However, conventional SMPS for LED lighting systems suffer from many limitations. As an example, when an SMPS is used to drive an LED, it generally needs to provide a constant output current in order to maintain stable brightness of the LED. When used with different AC power sources, for example, 110V vs. 220V, conventional LED lighting devices often need to be customized for the local power sources. Often a different control circuit is required, or an additional power source selection circuit is needed.
Moreover, unlike conventional incandescent light bulbs, LED lighting devices do not behave like a purely resistive load in an AC circuit. Therefore, conventional LED light bulbs often do not provide desirable efficiency in the utilization of the AC power supply. The efficiency of an AC electric power system can be measured by "power factor". As used herein, the power factor of an AC electric power system is defined as the ratio of the real power flowing to the load to the apparent power in the circuit. Real power is the capacity of the circuit for performing work in a particular time. Apparent power is the product of the current and voltage of the circuit. A recent U.S. energy efficiency standard requires an LED with greater than a 5 W power rating to have a power factor no lower than 0.7. A European standard requires an LED with more than 25 W to have a power factor higher than 0.94. Conventional devices often cannot meet these standards.
Furthermore, in home or hotel lighting applications, traditional incandescent light bulbs are often used with a silicon dimmer device to adjust the brightness. Conventional LED lighting devices often cannot accommodate a dimmer circuit, and cannot provide the brightness adjustment capability.
Therefore, more efficient and cost-effective techniques for improving power supply systems for LED lighting applications are highly desired.

High power-factor control circuit and method for switched mode power supply


A micropore open cell foam composite and a method for manufacturing a micropore open cell foam composite wherein the micropore open cell foam composites comprise a micropore open cell foam having an open cell content of greater than about 80% volume and an average pore size of about 200 microns or less and a phase change material in the open cell foam in the amount of 80% volume or greater.

Field of the Invention
This invention relates to an improved micropore open cell foam composite and a method for manufacturing the micropore open cell foam composites of the invention. The micropore open cell foam composites of the invention comprise a micropore open cell foam having an open cell content of greater than about 80% volume and an average pore size of about 200 microns or less and a phase change material in the open cell foam in the amount of 80% volume or greater.
Vaccines, antibiotics, and other temperature sensitive materials must typically be stored and transported under conditions wherein a narrow temperature range can be maintained for an extended period of time. Small size vacuum panel insulated refrigerators able to maintain a temperature of about 4xc2x0 C. may be used for storage of vaccines and antibiotics. Vacuum panel insulated shipping containers have been used to transport the temperature sensitive materials from the refrigerator storage location to the end use location which may be at remote sites. Therefore, the shipping box must be capable of maintaining the temperature sensitive materials at the desired temperature for an extended period of time.
Vacuum panel insulation alone is not sufficient to keep antibiotics, vaccines and other temperature sensitive materials within the critical range of temperature required for the duration of the transit time. Accordingly, shipping containers capable of maintaining the temperature over a narrow range for an extended period of time may utilize vacuum panel insulation in the walls of the container and a phase change material in the interior of the container.
Phase change material compositions store and release large quantities of energy, in melting and freezing, and are selected such that the phase change materials are capable of maintaining the temperature within the desired range.
In one method of storing and transporting temperature sensitive materials, such as vaccines, the materials are removed from a storage refrigerator, placed in a vacuum panel insulated shipping container and surrounded on all sides with packages of phase change material. There are a number of ways in which the phase change material can be contained to minimize or eliminate the problems of expansion and contraction associated with melting or freezing and, thereby, prevent any leakage of the phase change material, in a liquid state, through small opening or cracks in the packaging material. Examples of these methods include containment in phase change material/silica gels and dry powders, melt mixes of phase change materials/high-density polyethylene/ethylene/vinyl acetate copolymers/silica, in cross-linked pellets of high density polyethylene and imbibed into various porous substrates (e.g., plasterboard).
The prior art systems available are based on refrigerator systems that freeze water to provide thermal storage temperatures of 0xc2x0 C. or below. Exposure of temperature-sensitive medicinals such as vaccines, etc., to these low temperatures frequently results in irreversible damage due to freezing of water which is an essential component to many of these medicinal products. On the other hand, storage of the medicinals at temperatures greater than about 10xc2x0 C. can also cause irreversible damage to the medicinals.
The present invention is a micropore open cell foam composite comprising an open cell foam having an open cell content greater than 80% volume and an average pore size of about 1 to 200 microns and a phase change material wherein the phase change material is contained in the interstices of the micropore open cell foam in the amount of about 80% volume or greater. The micropore open cell foam composites of the present invention are useful in combination with insulating panels used in insulating various structures where it is desirable to maintain the interior temperature of the structure at a constant temperature plateau which is different from the temperature outside the structure. In one manifestation of the invention, the micropore open cell foam composites are employed in portable containers for storing and transporting temperature-sensitive materials such as medicinals, e.g. vaccines, antibiotics, etc., to remote locations which lack adequate means for providing conventional temperature control.
In another aspect of the invention, methods for manufacturing the micropore open cell foam composites are described. In accordance with one method of manufacturing the open cell foamed composites, the phase change material is imbibed at reduced pressure (vacuum) into the open pores of the micropore foam. Alternatively, elevated pressure imbibing can be substituted for the vacuum imbibing. Micropore open cell foam composites of the present invention are characterized by the ability to incorporate very high volumetric concentrations of phase change materials in the micropore open cell foams, up to greater than 80% by volume. Micropore open cell foam composites in accordance with the present invention can be subjected to repeated freezing and thawing cycles without xe2x80x9cooze outxe2x80x9d of the phase change material.
It is also possible to imbibe some materials by capillary attraction alone, without the application of either vacuum or pressure, into a hydrophilic micropore polyurethane open cell foam.
Micropore open cell foam composites in accordance with the present invention may contain relatively high volumetric concentrations of phase change material which can be particularly useful in applications where the available space is limited. The higher total loading of the phase change material possible with the micropore foam composites prepared in accordance with the present invention result in longer time-at-temperature (hold time) than with other methods of phase change material containment (e.g., PCM/silica gels or dry powders, or the melt mix of phase change material/high-density polyethylene/ethylene-vinyl acetate copolymer/silica).
In a particular embodiment of the invention, a micropore open cell foam composite is described which is particularly useful for use in a shipping container designed for transporting temperature-sensitive materials, such as antibiotics and vaccines. Many antibiotics and vaccines must be maintained within a critical range of temperature between 0 to 10xc2x0 C. Shipping containers constructed of vacuum panel insulation alone are unable to maintain these temperature sensitive materials within the critical range of temperature required. A micropore open cell foam composite in accordance with the present invention, comprising specific percentages of a linear crystalline alkyl hydrocarbon blend of C-14, C-15, and C-16 carbon chains, when used in conjunction with a vacuum panel insulated container, is capable of maintaining the temperature sensitive materials at approximately 6xc2x0 C. for an extended period of time. This particular phase change material blend, in sufficient quantity in the insulated shipping containing, has the necessary thermal storage capacity to keep the temperature sensitive material at a nearly constant temperature of about 6xc2x0 C. for 40 hours, or longer, in transit.

Micropore open cell foam composite and method for manufacturing same


A hole driver for driving a hole in a semiconductor memory device, including a first bank controller for generating a control signal for controlling a X-hole of a first bank in response to a row active signal and a precharge signal for the first bank, a second bank controller for generating a control signal for controlling a X-hole of a second bank in response to a row active signal and a precharge signal for the second bank, a block address enable means for generating a common block address enable signal in response to output signals of the first and the second bank control means and a common block address predecoder for predecoding block address signal for each bank in response to the common block address enable signal.

A hole driver of a row address path for a semiconductor memory device is disclosed.
Generally, a semiconductor memory device has a row address path and a column address path. Blocks configuring the row address path and signals are represented as a symbol xe2x80x98Xxe2x80x99 and blocks configuring the column address path and signals are represented as a symbol xe2x80x98Yxe2x80x99.
The row address path includes a row control block, a row address strobe (RAS) signal generating block, an address latch block and a X-hole block.
FIG. 1 is a block diagram illustrating the row address path. The semiconductor memory device, i.e., specially, DRAM has a plurality of banks. Two banks BANK0 and BANK1 are shown in FIG. 1. Each bank has a plurality of sub blocks including a cell array. A sense amplifier S/A is disposed between each sub block. Each bank further has an X-hole including a row decoder X-DEC, a sense amplifier control unit, a wordline (W/L) enable control unit and an X-DEC control unit.
The semiconductor memory device has a hole driver or driver circuit for driving the X-hole, the hole driver including a bank control unit and a block address pre-decoder BAX. The bank control unit drives the sense amplifier control unit S/A and the W/L enable unit in the corresponding X-hole by receiving an output of a row address strobe signal generating block (not shown) and the block address pre-decoder drives the X-decoder control unit in corresponding X-hole by pre-decoding an address outputted from an address latch block (not shown) under control of the bank control unit.
In addition, when the output of the block address pre-decoder BAX is directly applied to the row decoder X-DEC, since drivability of the output thereof decreases due to a high load, a local address pre-decoder LAX is further included in the X-DEC control unit in the X-hole.
FIG. 2 is a block diagram illustrating the conventional hole driver in FIG. 1.
As shown, the hole driver includes a first bank control unit 22, a second bank control unit 24 and a block address pre-decoder 20. The first bank control unit 22 receives a row active pulse signal ractzp13x and a row precharge pulse signal rpcgzp13x outputted from the row address strobe signal generating block (not shown) and generates bank active pulse signals bxatvp16 and bxatvp22, bank precharge pulse signals bxpcgzp19 and bxpcgzp21, a wordline clear signal wlcz and a wordline enable control signal bsenz. The second bank control unit 24 receives the bank active pulse signal bxatvp22, the bank precharge pulse signal bxpcgzp21 and the wordline clear signal wlcz and generates a sense amplifier operation starting signal bsg. The block address pre-decoder 20, which includes a plurality of sub blocks BAX01, BAX23, BAX45, BAX678, BAX9A and BAXBC, pre-decodes the row address signals at-row less than 0:12 greater than  outputted from the row address latch block (not shown) in response to the bank active pulse signal bxatvp16 and the bank precharge pulse signal bxpcgzp19.
FIG. 3 is a circuit diagram illustrating the second bank control unit 24 in FIG. 2.
As shown, the second bank control unit 24 includes a first driver 30, a first inverter latch 31, a first delay 32, a second driver 33, a second inverter latch 34 and a pulse generator 35. The first driver 30 includes a PMOS transistor M1 and an NMOS transistor M2, whose gates receives the bank precharge pulse signal bxpcgzp21 and the bank active pulse signal, respectively. The first inverter latch 31 includes two inverters INV1 and INV2 connected to an output of the first driver 30 and the first delay 32 delays an output of the first inverter latch 31 for a predetermined time. The second driver 33 includes an NMOS transistor M7 whose gate receives the wordline clear signal wlcz, an NMOS transistor M8 whose gate receives an output signal of the first delay 32 and a PMOS transistor whose gate receives the wordline clear signal wlcz, wherein the transistors M9, M8 and M7 are connected in series between a power supply voltage xvdd and a ground voltage. The second inverter latch 34 includes an inverter INV5 connected to an output terminal of the second driver 33 and a PMOS transistor M10 for supplying a power supply voltage to the output terminal of the second driver 33 by receiving an output of the inverter INV5 to a gate thereof. The pulse generator 35 generates the sense amplifier operation starting signal bsg by receiving an output signal of the second inverter latch 34.
The first delay 32 includes a plurality of unit delays 36. The unit delay 36 includes a CMOS inverter INV3 having a resistance R connected a pull-down terminal thereof, MOS transistors M3, M4, M5 and M6 and switches S1, S2, S3 and S4 configuring a capacitor load and an inverter INV4.
The pulse generator 35 includes a second delay 37 for delaying an output signal of the second inverter latch 34 for a predetermined time, a NOR gate NOR1 receiving the output signal from the second inverter latch 34 and an output signal of the second delay 37, inverters INV6, INV7 and INV8 for buffering an output signal from the NOR gate NOR1 and outputting the sense amplifier operation starting signal bsg. The second delay 37 includes a plurality of unit delays, which are the same with those of the first delay 32.
The output signal of the second bank control unit 24, that is to say, the sense amplifier operation starting signal bsg is a flag signal for notifying when a driving operation of the sense amplifier is carried out after corresponding wordlines are completely enabled by inputting all row address signals to the X-hole and charge sharing operation for a bitline and a memory cell is completed.
FIG. 4 is a circuit diagram illustrating a first sub block BAX01 in the block address predecoder 20 (see FIG. 2).
As shown, the first sub block BAX01 receives the row address signal at_row less than 01 greater than  and outputs predecoded row address signals Bax01 less than 0:3 greater than . A circuit for generating the BAX01 less than 0 greater than  signal includes a driver 41, a latch 42 and a buffer 43. The driver 41 consists of a PMOS transistor M11 and NMOS transistors M12, M13 and M14 connected in series between a external voltage Vext and a ground voltage. The bank precharge pulse signal bxpcgzp19 is applied to a gate of the PMOS transistor M11. The bank active pulse signal bxatvp16, an address signal atz less than 0 greater than  and an address signal atz less than 1 greater than  are applied to gates of the NMOS transistors M12, M13 and M14, respectively. The address signal atz less than 0 greater than  is an inverted row address signal at_row less than 0 greater than  and the address signal atz less than 1 greater than  is an inverted row address signal at_row less than 1 greater than . Also, an address signal at less than 0 greater than  is an inverted address signal atz less than 0 greater than  and an address signal at less than 1 greater than is an inverted address signal atz less than 1 greater than  shown in FIG. 4.
The latch 42 consists of two inverters INV9 and INV10 and an output of the driver 41, which is a junction of the PMOS transistor M11 and the NMOS transistor M12, is connected to an input of the inverter INV10. The buffer 43 includes a plurality of inverters INV11 and INV12 for outputting the Bax01 signal.
Circuits for generating the predecoded Bax01 less than 1 greater than , Bax01 less than 2 greater than  and Bax01 less than 3 greater than signals are similar to the circuit for generating the Bax less than 0 greater than  signal. The differences are that the address signals at less than 0 greater than  and atz less than 1 greater than  are applied to generate the Bax01 less than 1 greater than  signal instead of the address signals atz less than 0 greater than  and atz less than 1 greater than  and the address signals atz less than 0 greater than  and at less than 1 greater than  are applied to generate the Bax01 less than 2 greater than  signal. Also, the address signals at less than 0 greater than and at less than 1 greater than  are applied to generate the Bax01 less than 3 greater than  signal.
If a row active command is applied from an external circuit, a row address strobe (RAS) signal and an address signal are inputted at the same time, so that the row active pulse signal ractzp13x signal is generated. The first bank control unit 22 of the hole driver generates the bank active pulse signal bxatvp16 by receiving the row active pulse signal ractzp13x. The block address predecoder 20 receives the bank active pulse signal bxatvp16 and latches corresponding row address signals until the precharge command is applied from the external circuit. Namely, the corresponding address signals have to be latched until the precharge command is inputted after a plurality of address lines Bax01 less than 0:3 greater than , Bax23 less than 0:3 greater than , Bax45 less than 0:3 greater than , Bax678 less than 0:3 greater than , Bax9A less than 0:3 greater than  and BaxBC less than 0:3 greater than  are enabled by activating corresponding bank.
Recently, in a memory device, specifically, e.g., a synchronous memory device, while one of banks is active, since another bank can be activated, the address lines connected to the block address predecoder have to be independently configured for each bank. Since the address lines connected to the block address predecoder is maintained in an active state by a precharge mode, a plurality of banks cannot share the block address predecoder.
Accordingly, a large area is occupied by the block address predecoder at each bank and the number of address lines is increased, so that there is a problem that the size of semiconductor memory chip must be increased which is contrary to the trends in this industry.
Therefore, a hole driver or driver circuit is disclosed capable of reducing the chip size of a semiconductor memory device by sharing the block address predecoder with a plurality of banks.
One disclosed hole driver or driver circuit comprises: a first bank control unit for generating a control signal for controlling a X-hole of a first bank in response to a row active signal and a precharge signal for the first bank; a second bank control unit for generating a control signal for controlling a X-hole of a second bank in response to a row active signal and a precharge signal for the second bank; a block address enable unit for generating a common block address enable signal in response to output signals of the first and the second bank control means; and a common block address predecoding unit for predecoding block address signal for each bank in response to the common block address enable signal.

Hole driver in semiconductor memory device


The hot core engine compartment of a turbojet engine is cooled by the metered flow of cooling air exhausted through a laminar flow nacelle system. This arrangement reduces the need for extracting bypass ram air from the engine performance cycle for cooling purposes and thereby improves specific fuel consumption and engine efficiency. A turbocompressor pump driven by bleed air from the core engine compressor draws cooling air through the laminar flow nacelle system and pumps the air into a manifold surrounding the core engine.

1. Field of the Invention
The present invention relates in general to cooling the core engine area of a turbojet propulsion system and relates particularly to the use of waste air from a laminar flow nacelle system as a source of engine core compartment cooling air.
2. Description of Prior Developments
Conventional turbojet propulsion systems include a core compartment cooling system which bleeds cooling air from the air cycle of the propulsion system. This cooling air is extracted through a variable bypass valve and directed to a manifold which distributes the air around the engine core compartment. Because this cooling air bypasses the core engine and escapes combustion, it detracts from the efficiency and performance of the propulsion system.
A system previously unrelated to the core compartment cooling system is known as a laminar flow nacelle system. This system improves the performance of turbojet engines by reducing drag around the fan cowl and engine nacelle by drawing air into the cowl from points along its outer surface. A pump is used to draw the air into the cowl and to exhaust the air into the engine fan compartment where it flows to atmosphere through a fan cowl vent port. The energy of the exhausted air is lost once the air enters the atmosphere. It would be advantageous to use this exhausted air for some additional engine function rather than to simply exhaust it to atmosphere.
Accordingly, a need exists for increasing the efficiency of a turbojet core engine compartment cooling system and for applying the exhaust air from a laminar flow nacelle system to some useful purpose.