Fluorine contained within a photocatalyst layer containing titanium oxide and other metallic oxide semiconductors increases the metallic oxide's photocatalytic activity. The described photocatalyst may be in the form of either film, flake, particulate, or fiber. In addition, it can be used for coating the surface of a base material of various forms, such as sheet, film, flake, particulate, bar, or fiber. When using a base material that has an alkaline-containing glass composition, establishing a fluorine-containing layer, such as a layer of fluorine-containing silicon dioxide and other metallic oxide, between the photocatalyst film and the base material can prevent the deterioration of photocatalytic activity of the photocatalyst layer. The fluorine-containing layer functions as an alkaline barrier that controls the diffusion and migration of alkali metallic ions in the glass fibers, such as Na ions, into the photocatalyst layer. Inorganic fiber- and glass sheet-based photocatalyst bearing materials have an excellent capability to decompose rarefied harmful organic gases, and are suitable for use as interior wall and air filters in super clean enclosed spaces and conveyance spaces for semiconductor production, clean rooms for various other purposes, and office and residential buildings, and for other purposes including air cleaning, antibacterial action, anti-fouling action, and defogging of clear sheets (maintaining hydrophilicity).

Antibacterial oxide semiconductors, such as titanium oxides, zinc oxides, tungsten oxides, and iron oxides, which have high photocatalytic activity and excellent durability, have been introduced as various fixed-type photoreactors that are immobilized on fixed supporters. For instance, Japanese Laid-Open Patent No. 63-97234/1988 discloses an immobilized photocatalyst comprised of particle-, flake-, or fiber-shaped clear material coated with a platinum- or palladium-doped titanium oxide thin film.
The development of a product bearing a photocatalyst with a higher photoreactivity is greatly desired because it broadens the possibility of using such a product as an antipollution material, besides acting as an antibacterial agent.
Among various photocatalytic materials, titanium oxide, which has the highest photocatalytic activity and excellent durability, already has been actually used as an antibacterial agent in a particulate form. Titanium oxide, however, can be excited only by ultraviolet light, the amount of which is limited under actual usage conditions. Accordingly, it can be said that the window glass application for indoor use is best suited for the product, as both artificial illumination and sunlight can be utilized.
However, as the window glass application also requires high clarity of photocatalytic film, titanium oxide particulate-based material does not be utilized. Thus, achieving a photocatalytic film with both high photocatalytic activity and clarity can maximize its performance and significantly broaden potential applications.
Another serious problem with photocatalytic film in window glass application is its significantly reduced reactivity due to Na ion diffusion from the soda-lime glass base material. As a solution to this problem, the use of a Na diffusion-preventing silica undercoat for glass surfaces has been proposed (Paz, et al., J. Mater. Res., Vol. 10, p2842, 1995). It has been reported that this method can achieve photocatalytic activity similar to that of a titanium oxide film coating on a quartz substrate.
Recently, in the field of semiconductors, reduced yield caused by trace organic gases in clean rooms being deposited on substrates has become a serious problem as the density of elements increases. In addition, even in a residential setting, allergic reactions to various plasticizers that may be in construction materials, such as formaldehyde and acetaldehyde, have become a serious concern.
The aforementioned photocatalysts, such as titanium oxide, effectively oxidize organic materials, and can decompose various organic gases existing indoors. Therefore, the photocatalysts have the potential of becoming a key material to solve the above-mentioned reduced semiconductor yield and allergy problems.
However, for a photocatalyst to decompose organic gases, it is essential to improve its reactivity and expand its surface area because the concentration of gases is extremely small.
In the past, various attempts were made to make shoji-screen paper- or glass fiber cloth-based material bear a photocatalyst to decompose organic gases of extremely low concentration (for instance, Japanese Laid-Open Patent No. 1-139139/1989). Although the surface area is large, shoji-screen paper is an organic material itself that, over time, inevitably deteriorates and possibly becomes a new pollutant. This limits the scope of application. Moreover, a photocatalyst directly borne by a glass fiber cloth cannot achieve a high level of photocatalytic activity. This is because alkaline components diffused from the glass reduce the photocatalyst's crystallization property during the process of stabilizing the photocatalyst on the glass fiber.
Accordingly, it is an object of the present invention to provide a photocatalyst that has a higher photoreactivity efficiency and durability, as compared to conventional photocatalysts, a photocatalyst bearing material, and a manufacturing method of the photocatalyst.
Another object of the present invention is to provide a photocatalyst that solves the aforementioned problems of conventional techniques, a photocatalyst bearing material, and a manufacturing method of the photocatalyst.
Yet another object of the present invention is to maintain a high photocatalytic activity even when a base material comprised of alkaline-containing glass composition is used so as to perform excellently in indoor air cleaning, antibacterial and defogging action in offices, hospitals, automobiles and the like.
Furthermore, an object of the present invention is to provide a photocatalyst and a photocatalyst bearing material that solve the aforementioned problems with conventional techniques, and that not only efficiently decompose harmful organic gases, but also have antibacterial, anti-fouling, and defogging functions, when the photocatalyst and the photocatalyst bearing material are used as air cleaning for super clean enclosed space for semiconductor production, conveyance enclosed spaces, clean rooms for various other purposes, office buildings, and automobiles, and are used as interior wall material, window glass, and in air filters. In addition, an object of the present invention is to provide a manufacturing method for the aforementioned photocatalyst and the photocatalyst bearing material.


A device for measuring the concentrations of paramagnetic gases in a gas sample has at least one modulatable magnetic flux source, which has an air gap, to which a gas sample can be fed. A controllable power source, for generating current and voltage signals, is coupled with the modulatable magnetic flux source in order to generate a modulatable magnetic flux within the air gap. Two measuring points are arranged at least partly within the air gap. Each measuring point has an electrically controllable heating device and a heat conduction-measuring unit or resistive measuring device. Each measuring point is coupled with a variable power source to heat the heating device to a working temperature. Each measuring point is coupled with a measuring circuit to measure heat conduction measured signals generated by the heat conduction-measuring unit, from which the concentrations of paramagnetic gases, which are contained in the gas sample, can be derived.

Paramagnetic methods, which are based on the fact that oxygen molecules are paramagnetic based on their permanent magnetic dipole moment, whereas most other gases are diamagnetic, are frequently used to determine the oxygen concentration in gases. It is generally known that the heat conductivity changes in paramagnetic gases (for example, O2 and NO) under the effect of magnetic fields. The cause of this behavior is obviously the fact that paramagnetic gases have a permanent magnetic moment, but this is not normally manifested towards the outside because of the thermal motion of the molecules. However, a sufficiently strong external magnetic field ensures that the magnetic dipole moments of the individual molecules are aligned. This brings about, on the one hand, a change in susceptibility, which leads to an increase in magnetic flux, and, on the other hand, a certain molecular arrangement becomes established in the gas, as a result of which the possibility of transmitting heat energy to adjacent molecules by shocks is limited. Consequently, the heat conductivity of the gas changes to a small extent.
In a prior-art measuring device, which is based on this phenomenon, the gas sample to be analyzed is located in a cylindrical vessel, in the longitudinal axis of which a thin measuring wire heated to a working temperature is arranged. If the heat conductivity of the gas changes due to an external magnetic field, this brings about a change in the resistance of the measuring wire, which change can be determined with a measuring bridge.
Complex fresh gas mixtures, which contain in most cases a binary basic mixture of oxygen and nitrogen, laughing gas or xenon and one of the common inhalation anesthetics (for example, desflurane, sevoflurane, isoflurane, enflurane, and halothane), are at times used in anesthesia for respirating patients in medical technology. It is frequently necessary for monitoring the patient to also carry out a determination of the gas concentrations during the expiration phase of the patient. The gas mixture additionally contains carbon dioxide, water vapor and possibly other metabolites, for example, ethyl alcohol, methane and acetone, besides said gases, during the expiration phase. Concerning the relevant gas concentrations, interest is limited here mainly to oxygen, carbon dioxide and the anesthetic as well as the dynamic changes of these components over time. Therefore, there is a need for cost-effective measuring devices, which detect such gases at the required resolution and possibly free from cross sensitivities. Several independent sensors, which are optimized for the particular target gas, are usually used for this.
It is known, for instance, the use of multichannel infrared optical analyzers with heat radiation sources, which are used to measure infrared-active gases and are capable of analyzing a gas mixture at a plurality of wavelengths for their absorption properties. Based on the spectra, which are recorded at least partly, the individual gaseous components can then be determined in terms of their concentration if they have sufficient and specific IR absorptions. However, gases such as oxygen, nitrogen, helium and xenon cannot be detected with this method.
Furthermore, sensors based on infrared laser diodes, which are capable, based on the narrow-band emission characteristic, to resolve the likewise narrow absorption lines of oxygen are known. However, a minimum absorption length, which leads to an unfavorable size of the sensor, is necessary because of the small absorption cross sections to carry out a concentration measurement with sufficient accuracy with this method. Moreover, interactions occur between the gases involved, which may at times require a correction of the measured O2 concentration values. Furthermore, this method is not suitable for the direct determination of the other gas components. Finally, this method, like the above-mentioned methods as well, is relatively expensive because of the high-quality optical components, especially because the laser diodes used have aging effects, which limit their service life.
Even though electrochemical sensors represent a cost-effective alternative to the IR optical methods, they meaningfully permit only a measurement of the oxygen concentration and—with great restrictions—of the carbon dioxide concentration. Anesthetic gases and noble gases cannot be measured in this manner.
In fixed electrolyte sensors, for example, those known from DE 20 2004 015 400 U1, a solid, for example, zirconium dioxide, assumes the task of an ion conductor. Thus, even though such sensors do have primarily a good selectivity for oxygen, they bring about decomposition processes in medical gas mixtures under certain circumstances because of the high operating temperature that is necessary to make ion conduction possible. The halogenated hydrocarbons commonly used in anesthesia are, in particular, no longer stable at operating temperatures of about 600° C. and at times produce highly toxic reaction products. In addition, laughing gas, which is also used in anesthesia, tends to decompose into nitrogen and oxygen at temperatures beginning from 400° C. and toxic nitrogen oxides may be formed as well. The oxygen released in this process will then lead to a falsely elevated concentration display. Oxygen concentrations can be reasonably measured with this principle of measurement in nitrogen/oxygen mixtures only. Other gases do not lend themselves to the analysis. However, this method is capable of detecting the flow parameter, which is likewise important, if the sensor is used in the mainstream.
Gas sensors based on heat conductivity are known from the literature, which operate either with heated metal wires or with resistive heating structures, which are applied to the membranes of microstructured silicon elements. The fact that the excess temperature of the wire or of the microstructured heating structure becomes established at a given electric heating energy as a function of the heat conduction properties of the carrier structure and of the gases surrounding the heating means is utilized in these sensors. The concentration ratios of binary gas mixtures can be unambiguously determined with such structures if the components of these mixtures have sufficiently different specific heat conductivities. Gas mixtures containing more than two components cannot be measured with this method. In particular, nitrogen/oxygen mixtures with additions of, for example, water vapor or CO2 cannot be meaningfully analyzed with this because of the similar specific heat conductivities of O2 and N2.
A gas sensor based on heat conduction, which utilizes the fact that the heat conductivity values of gases have certain temperature dependences, whose extent depends on the molecular structure of the gas in question, is known from EP 0 285 833 A2. It is proposed in that document that the gas sample to be analyzed at different measuring temperatures one after another and the concentrations of the different gases be inferred from the heat conductivity values measured at different temperatures. Mixtures containing three or more components can thus be analyzed, in principle. However, the requirement for this is a linear independence of the measured data sets, which is guaranteed in the normal case to a limited extent only. In addition, the sequential measurement in time presupposes a stable composition of the gas mixture at least for the duration of the analysis. The additional pneumatic means necessary for this make such a sensor expensive and adversely affect the overall size. Selective measurement of the oxygen concentration is not possible in this manner.
Documents DE 100 37 380 A1, DE 102 51 130 A1 and DE 102 41 244 C1 describe means that utilize the magnetic field-dependent heat conductivity of the oxygen component in gas mixtures for the concentration determination. The magnetic flux density is cyclically varied in these means in the measuring gap of an electromagnet and the heat conductivity of the gas mixture, which varies in the process, is detected with a heat conductivity measuring chip, which is likewise located in the measuring gap. The measuring chip has a heating means for this on a microstructured membrane, with which heating means part of the membrane is brought to a certain excess temperature, and a temperature-measuring unit, which is designed, for example, as a thermocouple (thermopile) and with which this temperature can be determined. In the presence of a paramagnetic gas, for example, oxygen, the specific heat conductivity of the oxygen component in the gas mixture changes due to cyclic modulation of the magnetic field, and this change will in turn lead to a variation of the measured temperature value, which can be determined, among other things, with a lock-in method. Since the magnitude of the temperature variations is also affected by the heat conduction properties of the other gases of the mixture, certain nonlinearities arise in the sensor characteristic, which depend on the nature of the gas components present.

Device for measuring the concentration of paramagnetic gases


Embodiments of the invention are directed to systems, methods and computer program products for providing targeted location-based communications. An exemplary apparatus is configured to receive an encoded signal, decode the encoded signal such that embedded data is retrieved, send the embedded data a remote server; and receive a message based at least partially on sending the embedded data. Another exemplary apparatus is configured to provide the encoded signal by receiving data input, receiving a host signal, embedding the data input within the host signal such that an encoded signal is generated, and transmitting the encoded signal. A third exemplary apparatus is configured to provide the targeted communications by storing one or more messages associated with an entity, receiving data, selecting at least one of the one or more messages based at least partially on the data received, and sending the at least one of the one or more messages selected.

Typically, businesses have no way to identify consumers that are within their business location or to provide targeted communications to consumers who are present in the location. This limits the business to alternative means for providing consumers with relevant information as they frequent these locations. For example, merchants typically utilize mailing services to provide consumers with coupons, special in-store deals or sales ads. These methods fail to provide real-time location-specific communications, such as promotional offers, to consumers.

System for targeting location-based communications


A method for fabricating a semiconductor module includes: bonding a semiconductor substrate onto a first insulating resin layer; dicing the semiconductor substrate into a plurality of individual semiconductor devices; widening the spacings between the adjacent semiconductor devices by expanding the first insulating resin layer in a biaxially stretched manner; fixing the plurality of semiconductor devices to a flat sheet, with a second insulating resin layer held between the plurality of semiconductor devices and the flat sheet, and removing the first insulating resin layer; stacking the plurality of semiconductor devices, a third insulating resin layer, and a metallic plate, in this order, so as to form a laminated body having electrodes by which to electrically connect the device electrodes to the metallic plate; forming a wiring layer by selectively removing the metallic plate and forming a plurality of semiconductor modules; and separating the semiconductor modules into individual units.

1. Field of the Invention
The present invention relates to a method for manufacturing semiconductor modules.
2. Description of the Related Art
Portable electronic devices, such as mobile phones, PDAs, DVCs and DSCs, are gaining increasing sophistication in functions and features. And to be accepted by the market, they have to be smaller in size and lighter in weight, and for the realization thereof, there is a growing demand for highly-integrated system LSIs. On the other hand, these electronic devices are desired to be easier or handier to use, and therefore the LSIs used in those devices are required to be more functionally sophisticated and better performing. For this reason, the higher integration of LSI chips is causing increases in I/O count (the number of inputs/outputs), which in turn generates demand for smaller packages. To satisfy both these requirements, it is strongly desired that semiconductor packages suited for the high board density packaging of semiconductor components be developed. To meet such needs, a variety of packaging technologies called CSP (Chip Size Package) are being developed.
A method of manufacturing semiconductor modules of such a CSP type has been proposed as follows as a method to reduce the number of processes. In other words, this conventional method is such that semiconductor constructions having external connection electrodes are first arranged on a base plate in such a manner as to be mutually apart slightly from each other, and an insulating layer is formed in a periphery-side surface of the semiconductor constructions. Then, the semiconductor constructions and the insulating layer are covered with an insulating film, and a metallic sheet (metallic plate) having bump electrodes is disposed on the insulating film. Then, the bump electrodes are connected to the external connection electrodes by having the bump electrodes bite into the insulating film. After this, a rewiring is formed by patterning the metallic sheet, thereby completing the fabrication of the semiconductor module.
In the above-described method for manufacturing the CSP-type semiconductor modules, a semiconductor wafer on which a plurality of semiconductor devices are formed are diced into pieces with the semiconductor wafer fixed firmly to a dicing tape or the like. Those divided into individual semiconductor devices by the dicing are separated one by one from the dicing tape with the result that those separated are arranged on the base plate serving as a support in such a manner that they are mutually apart slightly from each other. This is how semiconductor modules are formed.
Also known is a wafer expansion unit, so-called an expanding apparatus, which is used to separate the individual semiconductor devices from the dicing tape. The wafer expansion unit expands a wafer fixed to a wafer sheet in such a manner that the wafer sheet (dicing tape), to which the diced wafers are fixed, is clamped and set on an upthrust table (collet type) and thereby the wafer sheet is thrust upward. Expanding the wafer provides a gap (space) between adjacent semiconductor devices, so that each semiconductor device can be easily separated from the dicing tape.
As described above, in the conventional method for manufacturing the CSP-type semiconductor modules, the individual semiconductor devices are separated one by one from the dicing tape with the result that those separated are arranged on the base plate serving as a support in such a manner that they are mutually apart slightly from each other. This is how semiconductor modules are formed. Accordingly, it takes time to arrangement the semiconductor devices, thus causing a drop in production efficiency of semiconductor modules.

Method for manufacturing semiconductor modules


A method for processing data after an unlicensed spectrum is released, and user equipment are disclosed. The method includes: when user equipment determines that a base station has released an unlicensed spectrum, monitoring, by the user equipment, release time for which the unlicensed spectrum is released a release time for which the unlicensed spectrum is released; when the release time does not exceed a time threshold, pausing, by the user equipment, a data processing process attached to the unlicensed spectrum, and resuming the data processing process after the base station re-acquires the unlicensed spectrum; and when the release time exceeds the time threshold, terminating, by the user equipment, the data processing process attached to the unlicensed spectrum, and selecting a licensed spectrum to start a new data processing process, or after the base station re-acquires the unlicensed spectrum, starting a new data processing process.

According to the latest released Federal Communications Commission (Federal Communications Commission, FCC) white paper on International spectrum, an unlicensed spectrum or a permit-free spectrum (unlicensed spectrum) resource is greater than a licensed spectrum resource. The unlicensed spectrum includes a frequency band used for an industrial, scientific and medical (ISM, Industrial, scientific and medical) device or the like. For example, there are three frequency bands 902-928 MHz, 2400-2484.5 MHz, and 5725-5850 MHz in the United States of America, and 2.4 GHz is an ISM frequency band shared by countries. Main technologies used in the 2.4 GHz ISM frequency band are: wireless fidelity (WiFi, Wireless Fidelity) or wireless local area network (WLAN, wireless local network), Bluetooth, Zigbee (Zigbee), and the like. WiFi is based on the Institute of Electrical and Electronics Engineers (IEEE, Institute of Electrical and Electronics Engineers) 802.11 standards, for example, 802.11 a, 802.11b, 802.11g, 802.11n, and 802.11ac. WiFi generally uses the 2.4 GHz ISM frequency band and the 5 GHz frequency band. For example, the 802.11ac may use a 5 GHz unlicensed spectrum. In Europe and Japan, ranges of frequencies that can be used by the 802.11 ac include 5170 MHz-5330 MHz and 5490-5710 MHz. In addition to the foregoing frequency ranges, a frequency range of 5710-5730 MHz is also supported in the United States of America. 802.11ac channelization (channelization) may support bandwidths of 20 MHz, 40 MHz, 80 MHz, and 160 MHz.
The unlicensed spectrum is shared by many users, and the users may use different radio access technologies (RAT, radio access technology), for example, LTE, WiFi, and Bluetooth (Bluetooth). Before transmission, LTE, WiFi, and Bluetooth devices using the unlicensed spectrum need to first listen to whether the spectrum is idle, that is, "listen before talk (LBT, Listen before Talk)", to avoid interference to another user who is using the unlicensed spectrum. There also is a corresponding specification for a maximum occupation time after a user acquires the unlicensed spectrum. The user needs to release the unlicensed spectrum after using the spectrum for a particular time, and start to contend for the unlicensed spectrum after the user is idle for a particular time, so as to provide a fair competition opportunity for all users to use the unlicensed spectrum.
However, currently in the prior art, there is a lack of a corresponding processing mechanism after an unlicensed spectrum resource is released.

Method for processing data after unlicensed spectrum is released, and user equipment


An image formation method of developing a latent electrostatic image formed on a latent-electrostatic-image bearing member to a visible toner image by a one-component type developer consisting essentially of a toner is carried out by the steps of forming numerous micro closed electric fields near the surface of a developer-bearing member by causing the developer-bearing member to selectively hold electric charges on the surface thereof; supplying the developer to the surface of the developer-bearing member to hold the toner on the surface of the developer-bearing member by the micro closed electric fields; and developing a latent electrostatic image to a visible toner image by the toner. The toner is composed of a binder resin, a coloring agent and a quaternary ammonium salt serving as a charge controlling agent.

1. Field of the Invention
The present invention relates to an image formation method of developing a latent electrostatic image to a visible image using a toner which comprises a binder resin, a coloring agent and a charge controlling agent comprising a quaternary ammonium salt.
2. Discussion of Background
In conventional image formation apparatus, such as electrophotographic copying machines, printers and facsimile apparatus, in which latent electrostatic images are formed on a latent-electrostatic-image bearing member and developed to visible images by a developer, dry type development units using a powder-like developer are widely used.
As such powder-like developers, a two-component type developer comprising a toner and a carrier, and a one-component type developer comprising a toner without containing a carrier, are conventionally known.
A two-component type development method using the above two-component type developer is capable of yielding relatively stable, good recorded images, but has the shortcomings that the deterioration of the carrier is easily caused, and the mixing ratio of the toner and the carrier tends to change while in use, so that the maintenance of an apparatus using this method is complicated. Furthermore, the apparatus using the two-component type development method is relatively oversized.
From the above viewpoints, the primary focus of attention is on a one-component type development method using the one-component type developer, which does not have the above-mentioned shortcomings of the two-component type development method.
There are two types of one-component type developers. One is of a type which consists of a toner, while the other is of a type which consists of a mixture of a toner and an auxiliary agent.
Furthermore, there are two types of toners. One is a magnetic toner which contains magnetic particles, and the other is a non-magnetic toner which does not contain magnetic particles.
Generally, the above-mentioned magnetic particles are not transparent. Therefore, it is difficult to obtain clear color images including full-color images and multi-colored images by use of the magnetic toner. Therefore, it is preferable to employ the one-component type development method using the non-magnetic toner when the color images are to be obtained.
In U.S. patent application Ser. No. 597,881 (filed Nov. 12, 1990) and Ser. No. 674,161 (filed Mar. 25, 1991), Suzuki et al. disclose an image formation method in which a one-component type developer comprising a non-magnetic toner, when necessary with addition of auxiliary agents thereto, is supplied to the surface of a developer-bearing member which is rotatably driven to transport the developer into a development zone, where a latent-electrostatic-image-bearing member is directed to the above-mentioned developer-bearing member, so that the latent electrostatic images formed on the latent-electrostatic-image-bearing member are developed to visible images, characterized in that numerous micro closed electric fields are formed near the surface of the developer-bearing member by selectively causing the surface of the developer-bearing member to support electric charges, the charged toner is attracted by these closed electric fields to deposit the developer on the surface of the developer-bearing member, thereby developing the latent electrostatic images to visible toner images.
This method has many advantages over the conventional methods, including the advantage that the intensity of the electric fields can be significantly increased in comparison with the case where the conventional methods are employed, since a number of micro closed electric fields are formed near the surface of the developer-bearing member, and therefore a large amount of sufficiently charged toner can be deposited on the developer-bearing member and transported into the development zone.
According to the inventors of the present invention, however, in the above image formation method of forming numerous micro fields near the surface of the developer-bearing member, it is difficult to form a toner layer with a uniform thickness on the developer-bearing member in a stable manner when a conventional non-magnetic toner comprising a coloring agent and a resin is employed for the development of a latent-electrostatic image. The toner layer formed on the developer-bearing member becomes thin and accordingly the amount of the toner to be used for development is decreased. As a result, the following problems occur: The density of the obtained images is low, the toner layer is not uniform, and the images and the background are fogged. Furthermore, a thin film of toner is formed on the developer-bearing member, which is a so-called filming phenomenon. When this phenomenon takes place, the effect of the micro fields is reduced, and eventually the amount of the toner held by the developer-bearing member is decreased and it becomes difficult to supply a sufficient amount of the toner to the latent-electrostatic-image bearing member.


A three-phase switched reluctance machine has a rotor, a first stator and a second stator. The rotor, first stator and second stator are coaxially and concentrically disposed. The rotor and both the first stator and second stator have corresponding poles. Only one of the stators has coils wound about its poles, while the other stator does not have any coils. A defined relationship between the number of rotor poles, the number of stator poles on the first stator and the number of stator poles on the second stator may improve the torque quality of the switched reluctance machine.

The following is not an admission that anything discussed below is part of the prior art or part of the common general knowledge of a person skilled in the art.
Electric machines have been applied as motors and generators in a wide range of industries for more than a century. A reluctance machine is an electric machine in which torque is produced by the tendency of the movable part of the machine to move into a position where the inductance of an excited winding is maximized. A switched reluctance machine is a type of a reluctance machine where the windings are energized as a function of the position of the movable part of the machine. Various examples of switched reluctance machines have been described.
U.S. Pat. No. 9,647,520 of Tojima et al. purports to describe a double stator switched reluctance rotating machine that includes an annular rotor, an outer stator that is disposed outside the rotor, and an inner stator that is disposed inside the rotor, and has a structure in which the outer and inner stators are connected to each other in parallel.
U.S. Pat. No. 9,621,014 of Yang et al. describes a double-rotor switched reluctance machine that includes a stator, a first rotor, and a second rotor. The stator and the first rotor operate as a first electric machine and the stator and the second rotor operate as a second electric machine. Each electric machine has an output torque profile that fluctuates periodically between a maximum and a minimum instantaneous torque. The double-rotor switched reluctance machine is configured so that when the first and second electric machines are operated at a common electrical frequency, the first and second maximum instantaneous torques are temporally offset, thereby reducing the overall torque ripple of the switched reluctance machine. Yang also describes a double-rotor switched reluctance machine that is configured so that the first and second rotors are radially offset from each other to reduce a net radial force imposed on the stator by the operation of the first and second electric machines.
United States Patent Application Publication No. 2011/0316366 of Abbasian et al. purports to describe a switched reluctance apparatus and method of operating the same. The apparatus has an inner stator having a plurality of poles, a rotor disposed radially outward of the inner stator and having a plurality of segments serving as poles, and an outer stator disposed radially outward of the rotor and having a plurality of poles. A respective winding is disposed between every pair of adjacent poles of either stator. The apparatus operates with a plurality of separately excitable phases, a given phase being excited by energizing the windings corresponding to the given phase. Excitation of a given phase causes induction of magnetic fluxes traversing a region substantially confined to the region of the stators and rotor segments corresponding to the given phase, and causes a substantial amount of flux to enter rotor segments not in the radial direction but perpendicular to the radial direction.

Double-stator single-winding switched reluctance machine


An injection-molding half-mold has a base plate (1), a nozzle-carrying plate (2), a cavity-carrying plate (3), and a hot runner (4) to which there are associated a plurality of resistive elements (6) connected externally to a power supply source via at least an electric conductor (9, 19) lead connected to an appropriate external connector. The nozzle-carrying plate (2) can be removed from the hot runner (4) without any need for either the electric conductor lead (9, 19) or the connections of the latter to the resistive elements (6) to be disconnected

The present invention refers to the main component parts of an injection mold adapted to enable a plastic substance in its fluid, i.e. molten state, usually just after the extrusion thereof, to be injected into appropriate cavities for forming related preforms. In particular, the present invention applies, in a preferred manner, to machines adapted for molding a plurality of plastic articles at the same time, ie. the so-called xe2x80x9cpreformsxe2x80x9d that are intended for subsequent processing by blow molding into appropriate final containers, especially plastic bottles.
Although reference will be made in the following description, mainly for reasons of greater descriptive convenience, to a machine for moulding preforms of plastic material, as this is used in combination with the preliminary steps of melting and extrusion of said plastic material, it will be appreciated that the present invention shall be understood as applying also to other kinds of uses or applications, as far as these fall within the scope of the appended claims.
It is generally known in the art that, during the preform molding operation, use is generally made of a molding machine comprising a stationary half-mold, which is firmly joined to the structure of the same machine, and a moving half-mold, which preferably moves in a vertical direction and is selectively closable into an appropriate position against the stationary half-mold.
In prior-art solutions, the stationary half-mold usually comprises a base plate 1, a nozzle-carrying plate 2, a cavity-carrying plate 3, at least a hot runner 4, a plurality of nozzles 5, a plurality of resistive elements 6 associated with the hot runner, and a plurality of resistive elements 7 associated with the nozzles 5.
The nozzle-carrying plate 2 is in the shape of a U turned upside down, and is arranged in an intermediate position between the base plate and the cavity-carrying plate. This is illustrated in FIGS. 1 and 2, which are views of the three different plates in assembled and separated positions thereof, respectively.
The resistive elements 6 are connected to a power supply source (not shown) via a respective plurality of electric conductor leads 9. Each one of them is furthermore inserted in a wall of the nozzle-carrying plate and passes therethrough, coming out on the outside thereof, where it is connected to a respective terminal clamp of an appropriate connector 14.
The resistive elements 7 that are associated with the nozzles 5 in the nozzle-carrying plate 2 are in turn connected to a power supply source (not shown) via a respective plurality of electric conductor leads 11, connecting the respective resistive element 7 to a respective terminal clamp comprised in the same connector 14 that already connects the above-described electric conductor leads 9.
It is therefore obvious that each one of the electric conductor lead 11 is contained, as shown in the Figures, in the body of the nozzle-carrying plate 2.
All this is anyway largely known to ail those skilled in the art and is only reviewed here shortly in order to more effectively introduce the technical context which the present invention actually refers to.
During the practical use of the mold, there are quite frequently occurring such operating conditions as to make it necessary for access to be gained most conveniently and easily, as well as with a maximum extent of freedom in intervening, to the hot runner or the nozzles. In the majority of the cases, these operating conditions are brought about by the maintenance needs of the hot runner, e.g. due to a failed heating element requiring replacement, or due to a nozzle having plugged up, or, more simply, due to the hot runner itself needing to be cleaned up and cleared of slag and scum depositing therein after a prolonged use.
In all those circumstances in which the nozzle-carrying plate 2 must be disassembled and separated from the hot runner, the need logically arises for all conductor leads 9 to be first disconnected from respective terminal clamps (not shown) in order to be able to disengage the nozzle-carrying plate 2 from the hot runner and then remove the plate 2. However, the disconnection of all the terminal clamps involved in such an operation is considerably time consuming, i.e. requires a lot of time during which the whole plant must of course be kept at a standstill, ie. inoperative.
Upon conclusion of the planned maintenance or similar intervention, the reverse operation must be then carried out to re-connect all the conductor leads to respective terminal clamps. This obviously requires a further lot of time and, therefore, this puts a further downtime penalty on the whole plant.
In other words, such operations of disconnecting and reconnecting the above cited conductor leads, which are inherently rather long and delicate to carry out, demand a considerable extension of the machine downtime and an equally considerable increase in the number of man-hours spent with respect to the time and man-hour requirements of the actual maintenance intervention. Such an extension is hardly compatible with the productivity requirements placed on such machines, which are designed and made for heavy-duty operation, i.e. so as to be able to operate in a substantially continuous manner.
Based on the above considerations, it is therefore a main purpose of the present invention to provide a type of stationary half-mold which is adapted to do away with the above described drawbacks, is capable of being easily implemented using readily available and, therefore, cost-effective materials and techniques, and is further easy, reliable and safe to use.
Such an aim of the present invention, along with further features thereof, is reached in a type of mold that is made and operates as recited in the appended claims.

Injection molding apparatus having a nozzle carrying plate


A method and apparatus for producing a magnetic attachment mechanism is described. A method is provided for determining the magnetic field axis of an element prior to machining it. The magnetic field axis can be used as a reference to machine an outer surface of the magnetic element at a desired angle. The method provides a means to more precisely align magnetic field axes of corresponding magnets in a magnetic attachment system.

1. Field of the Described Embodiments
The described embodiments generally relate to magnets and methods and apparatuses for producing a magnetic attachment system. More particularly, the present embodiments describe magnets for use in releasable attachment techniques well suited for portable electronic devices.
2. Description of the Related Art
Magnets, which produce a magnetic field, are typically used to attract or repel another object. The magnetic field can produce a force that pulls on ferromagnetic materials, such as iron. The magnetic field produced by a magnet also attracts or repels other magnets.
Magnets can be used as an attachment mechanism for various objects. A common example is a refrigerator magnet that can be used to attach objects, such as paper, to a refrigerator. Magnets can also be used as an attachment means in place of mechanical fasteners in electronic devices, such as portable computing devices. Recent advances in portable computing includes the introduction of hand held electronic devices and computing platforms along the lines of the iPad™ tablet manufactured by Apple Inc. of Cupertino, Calif. These handheld computing devices can be configured such that a substantial portion of the electronic device takes the form of a display used for presenting visual content leaving little available space for an attachment mechanism that can be used for attaching an accessory device.
It is desirable for these portable computing devices to be as small and thin and light as possible. Conventional attachment techniques that require mechanical fasteners can add unwanted weight, bulk, and complexity to the device as well as detract from the overall look and feel of the handheld computing device, thereby degrading the appearance of the handheld computing device. Therefore, a mechanism for releasably attaching together at least two objects is desired. It is desirable for such a mechanism to be small and thin while being capable of producing enough force to attach two objects together and maintain such attachment.

Method and apparatus for producing magnetic attachment system


A heat pump type water heating apparatus is provided that includes a refrigeration cycle circuit having a first refrigerant and water heat exchanger to perform a heat exchange between a first refrigerant and water, and a first refrigerant and second refrigerant heat exchanger to perform a heat exchange between the first refrigerant and a second refrigerant. The heat pump type water heating apparatus may also include a cascade circuit having the first refrigerant and second refrigerant heat exchanger to operate jointly with the refrigeration cycle circuit, the cascade circuit also having a second refrigerant and water heat exchanger to perform a heat exchange between the second refrigerant and water, and a water heating channel connected to the first refrigerant and water heat exchanger and the second refrigerant and water heat exchanger so water passes through the first refrigerant and water heat exchanger and then through the second refrigerant and water heat exchanger.

1. Field
Embodiments of the present invention may relate to a heat pump type water heating apparatus that heats water using a refrigerant.
2. Background
A heat pump is an air conditioner that transmits a low-temperature heat source to a high temperature zone and/or that transmits a high-temperature heat source to a low temperature zone using exothermic and endothermic reactions of a refrigerant.
The heat pump may include a compressor, a condenser, an expansion device, and an evaporator. A heat pump type water heating apparatus may heat water using a refrigerant so as to supply hot water, thereby minimizing consumption of fossil fuel.
The heat pump type water heating apparatus may include a compressor to compress a refrigerant, a refrigerant and water heat exchanger to heat water using the refrigerant compressed by the compressor, an expansion device to expand the refrigerant having passed through the refrigerant and water heat exchanger, and an evaporator to evaporate the refrigerant expanded by the expansion device.
In the heat pump type water heating apparatus, the refrigerant compressed by the single compressor may heat water in a single refrigerant and water heat exchanger so the water heated by the refrigerant and water heat exchanger may be used. As a result, increasing the water heating temperature may be limited, and optimum control based on a water temperature may not be easy.


An electronic assembly is disclosed comprising a molded dielectric connector means including an electronic package mounted therewithin, the connector means 80 being adapted to be secured to a framework. The connector means includes first and second molded member 82,110 securable together at an interface. The first molded member has outwardly facing surface portion including an interconnection region 94, and includes compliant spring portions 90 integral therewith portions and extending outwardly therefrom at the interface. The compliant spring portions 90 are adapted to be deflected by the second molded member 110 upon assembly of the molded members. Circuit means 92 are included on the first molded member 82 and are defined along the outside surface portions and extending along outwardly facing surface portions of the compliant spring portions 90 and further extending to interconnection region 94. The second molded member 110 includes a portion engagable with the compliant spring portion 90 and circuit means 164, defined on said engagable portion. Upon assembly of the first and second molded members the conductive portions 164 of the second molded member 110 are held under compression against the spring circuit surface 91 and upon mounting the assembly to said framework, the interconnection section 94 of the first molded member circuitry is electrically connected to corresponding contact means along the framework. In the preferred embodiment, resilient member 93 is used to support the spring arm portions 90 to minimize stress on the spring portions 90.

There is an increasing need for multi-circuit packages for use with electronic assemblies and in the computer industry. As both complexity and miniaturization increases, the need for smaller size, lighter weight packaging and reliability has generated the need for connectors having the ability to reliably connect a large number of electrically conductive traces on closely spaced centerlines in compact areas. Furthermore, there are a number of electronic devices that utilize liquid crystal display units, and circuitry on glass panels and the like that cannot be electrically connected by means of individually soldered connections. The requirements of the industry have generated a class of connectors known as elastomeric connectors which can be disposed between circuitry on for example a printed circuit board and also on a glass panel to interconnect corresponding circuits while avoiding the use of solder. The elastomeric member provides sufficient normal force to maintain the electrical interconnection of the circuits yet the member has sufficient compliancy so as not to damage the glass or other panels.
U.S. Pat. No. 4,820,170 discloses one such layered elastomeric connector in which succeeding layers of dielectric material and conductive material are alternated so as to provide a plurality of closely spaced but electrically isolated conductive areas. Typically the elastomeric connector is a rectangular block such that each layer is exposed on all four sides of the block, thus enabling interconnection between circuits on parallel planes or between circuits on planes that meet at essentially right angles. Since the elastomeric connector is compressible and will expand outwardly when subjected to pressure, means must be provided to support the elastomeric block in order to control the direction of expansion and maintain the block in appropriate alignment and to provide dimensioned stability for the block. In using such an elastomeric connector, therefore, a separate support housing or a special cavity within a connector housing is required. These additional parts for providing interconnection add to the number of pieces that must be molded or otherwise formed in order to achieve and maintain the desired interconnection.
Instrument panels for automobiles, airplanes, computers and other equipment often include electronic packages such as digital clocks and the like which require interconnection to fragile surfaces such as glass panels having conductors thereon for example liquid crystal display units (LCDs). Typically such panel mounted electronic assemblies contain at least one printed circuit board having a variety of electronic components thereon, a housing for the components, electrical connectors interconnecting these components and at least one elastomeric connector to join the circuitry to an LCD or the like.
It is desirable, therefore, to provide a means for making electronic assemblies such as panel mounted assemblies with a minimum number of parts.
It is further desirable to minimize the steps in manufacturing such an assembly.
It is also desirable to have an assembly that is relatively lightweight and compact while maintaining the desired electronic capabilities of the more complex prior art devices.
The use of compliant spring arm contact members for providing surface mounting for components to surfaces such as circuit boards is known. These compliant spring arm member, however, are typically made of metal that has been stamped and formed into the desired configuration. While suitable for many applications, metal spring arms are not typically suitable for surface interconnection to fine line circuitry on panels such as glass panels and the like. Furthermore the stamping and forming of metal requires further manufacturing steps.
It is desirable, therefore, to have a compliant spring arm section formed essentially of dielectric material, which will eliminate the problems of possible damage to the surface of the glass as well as have a sufficient compression force to maintain electrical contact with the surface conductors.
Furthermore, it is desirable to maintain the features of spring contacts while eliminating stamping and forming steps required for metal members thus providing a cost effective method for manufacturing.


A data execution control method and system for a mobile phone are provided. The execution method and system control the execution of user data stored in the mobile phone on the basis of access/execution authentication levels assigned to multiple Subscriber Identity Modules (SIMs). The data execution control method includes receiving a key input requesting execution of a user data, reading subscriber information from the SIM, determining whether an execution password corresponding to the subscriber information among previously registered execution passwords and executing the user data if an execution password corresponding to the subscriber information.

1. Field of the Invention
The present invention relates to a system and method for the control of data execution. More particularly, the present invention relates to a data execution control method and system that are capable of controlling the execution of specific user data on the basis of access authentication levels assigned to multiple Subscriber Identity Modules (SIMs).
2. Description of the Related Art
With the advance of mobile computing and wireless communication technologies, mobile phones have been developed to accommodate various mobile communication services across networks. Such mobile phones have expanded user mobility so as to provide a user with voice and data connectivity anytime and anywhere, even on the move. Also, advanced applications and extended storage capability of such mobile phones allow the user to perform various Internet-based services such as searching for information (for example, stock exchange, weather, sports, and traffic information), chatting and playing games online, and downloading multimedia contents (for example, video and audio files).
In certain wireless communication technologies, a Subscriber Identity Module (SIM) is used for storing network specific information used to authenticate and identify subscribers on the network. The SIM is a removable smart card such that the user can change phones by simply removing the SIM card from one mobile phone and inserting it into another mobile phone.
In other words, a single mobile phone can be used by multiple users simply by each user inserting their own SIM card. However, in this case, the user data owned by a specific user (for example, private information and pay contents files) may be unwantedly shared with other users. That is, a secondary user can access the data, which is stored by a primary user in the mobile phone, by inserting his/her own SIM card which is different from the primary user's.
In the case of pay contents, since the contents paid by one user may be played or rendered by other non-paid users having different SIM cards, such content share can be a loss in view of the content provider.
Also, sharing a mobile phone with multiple users having different SIM cards may cause another problem in association with Digital Rights Management (DRM) contents.
If the DRM content purchased by a user is allowed to be played only a limited number of times and the DRM content is played by other users accidentally or intentionally, the content play times may run out, thereby wasting money in view of the user who purchased the DRM content.
Also, the conventional SIM-based mobile phone is disadvantageous in terms of privacy, since a user's specific private data can be exposed by other SIM card owners.

Data execution control method and system therefor


A pixel array with flexible circuit layout is disclosed, which comprises: a substrate, having a first surface; a plurality of scan lines; and a plurality of data lines; wherein the plural scan lines are disposed on the first surface while each has a profile defined by a non-linear first function, and the plural data lines are disposed on the first surface while each has a profile defined by a non-linear second function. When the pixel array is adapted for a flexible display and the display is being bended, the flexible circuit layout of the pixel array of the invention can effectively reduce the risk of the snapping of the conductive wires used in the pixel array so that the flexibility and reliability of the flexible display are enhanced.

The marketplace continues to demand lighter and thinner portable electronic devices. As a result, portable electronic device manufactures require lighter, thinner flat panel displays (FPDs) which are preferred to be flexible or rollable. The attraction of a flexible screen is obvious. Product design, for example, can form a flexible screen in a curve, enabling unheard-of form factors for cell phones shaped like a lipstick or flat TVs that fit in your pocket. Nevertheless, it is important to have every semiconductor element used in the flexible FPD to be also flexible, which is especially true for the fragile conductive wires. That is, if the conductive wires used in a circuit layout of a pixel array flexible FPD is snapped by the stress/stain caused by the bending of the FPD, the FPD may not be able to function normally.
In a convention pixel array adapted for flexible displays, no matter it is a scan line or is a data line of the circuit layout of the pixel array, each is designed and laid out by using a single straight conductive wire. Please refer to FIG. 1, which is a schematic view showing the circuit layout of a conventional pixel array adapted for flexible displays. In the pixel array 100 of FIG. 1, both the scan lines 110 and data lines 120 are straight lines such that the conductive wires of the pixel array 100 are easy to snap when the pixel array 100 is subjected to an external force causing the stain of the conductive wires to exceed a tolerable limit. Most of the prior-art technology relating to the manufacturing of flexible displays are focused on either the improvement of semiconductor manufacturing process, or the materials used for making the flexible substrate and the micro-electronic components of the flexible displays. It is noted that there is never a technology trying to overcome the aforesaid snapping problem caused by unevenly distributed stress while bending by using a specifically designed pixel array with flexible circuit layout.
Therefore, it is in need of a pixel array with flexible circuit layout, being adapted for a flexible active/passive display, which is capable of effectively reducing the risk of the snapping of the conductive wires used in the pixel array so as to enhance the flexibility and reliability of the flexible display.

Pixel array with flexible circuit layout having respective scan and data line profiles with predetermined wave construction so as to evenly distribute any strain on the respective scan and data lines to withstand stress and be flexible

Industrial Technology Research Instituti


A power distribution apparatus 30 comprises an outboard distribution unit 36, an inboard distribution unit 32, a feeder cable 34 electrically interconnecting the inboard and outboard distribution units 32, 36, a generator line 40 whereby a generator output can be supplied, in use, to the outboard distribution unit 36, and switch means C1, C3, C5 operable to control the electrical connections between the feeder cable 34 and the inboard and outboard distribution units 32, 36 and between the generator line 40 and the outboard distribution unit 36.

This invention relates to a power distribution apparatus, and in particular to a power distribution apparatus suitable for use on an aircraft.
A multi-engined aircraft typically has one or more electrical generators mounted to and arranged to be driven by each of the aircraft's engines. The operation of each generator is usually controlled by a fuselage mounted generator control unit. Electrical power generated by the generators is transmitted along long, heavy feeder cables to a power distribution panel which is also typically fuselage mounted.
The electrical loads of wing or nacelle located equipment of modern aircraft are increasing as electrical power is used in the actuation and control of a number of wing located devices, and electrical power is also increasingly being used in de-icing equipment. Long, heavy feeder cables are thus required to carry electrical power from the power distribution panel to such equipment. The power requirements of such equipment are high, with the result that the feeder cables are of large dimensions, and the need to provide redundancy results in the feeder cables contributing significantly to the aircraft weight, for example they may weigh a couple of hundred kilograms.
In order to improve the efficiency of aircraft it is desired to reduce weight, where possible, and it is an object of the invention to provide a power distribution apparatus whereby a weight reduction can be achieved.


To implement a calling party number anonymous service in an IP telephone service. An IP telephone terminal adds the setting of requesting a Pool IP address along with a normal IP address to a REGISTER message directed from the IP telephone terminal to an SIP server and requests the assignment of a temporary IP address if receiving an anonymous call incoming request message. The SIP server makes the temporary assignment of the Pool IP address and notifies the temporary IP address to a called party IP telephone terminal by adding it to an INVITE message, if the called IP address of the anonymous call incoming request INVITE message is the IP telephone terminal. The called IP telephone terminal receiving the assignment of the temporary IP address can make the connection, communication and disconnection processes employing the temporary IP address as the self IP address in the following dialog.

1. Field of the Invention
The present invention relates to a communication system, a session control management server and a session control method, and more particularly to a communication system, a session control management server and a session control method for performing a response process in the case of receiving an anonymous call incoming request, with the session control in the internet.
2. Description of the Related Art
At present, with the spread of the internet, an IP telephone service using the internet is provided by each carrier and an Internet Service Provider (ISP). Also, in the IP telephone service, a Voice over IP (VoIP) communication for transferring voice data with an Real Time Transport Protocol (RTP) packet is performed by establishing a channel (session) between the terminals before starting the communication.
As a main session control protocol for making the session establishment and disconnection between the terminals, an Session Initiation Protocol (SIP) is specified for controlling the session between the terminals via an SIP server.
An SIP message is composed of a start line part and a header part for carrying the request or response information and a message body part for describing the session content, in which an Session Description Protocol (SDP), for example, is employed to describe the session content, and the other party of communication is identified by a request Uniform Resource Identifier (URI) described in the start line part. Also, in a process of establishing the session, the RTP packet communication conditions between the terminals, such as calling the receiver, each protocol for voice or video, and the bit rate, are decided.

Communication system, session control management server and session control method


The present invention is a process for stripping coated plastic materials wherein the plastic is coated with a copper inner layer, and at least one outer layer formed of either nickel or chromium. Alternatively, the plastic can be coated with at least two outer layers formed of nickel and chromium. The process employs a combination of physical and chemical processing. First, the plated plastic is crushed by mechanical means to form a plurality of plated plastic particles. These particles can then be scrubbed to remove the nickel and/or chromium outer layers from the copper-coated plastic material. The nickel and/or chromium layers can be separated from the copper-coated plastic material. The copper-coated plastic material is treated with a chemical solution to dissolve the copper inner layer. the copper metal is thus separated from the plastic material. The chemical solution used to dissolve the cooper inner layer can be regenerated to a form in which it can be reused to successively treat additional samples of copper-coated plastic material, once the nickel and/or chromium are removed from the plated plastic material.

In the chemical industry, it is desirable to recycle costly heavy metals used in various chemical processes, to reduce processing costs. Recycling heavy metals is also desirable because it reduces pollution of the environment.
Plastics which are plated with heavy metals are used in a variety of applications, including the semiconductor and construction industry. Plated plastics are also used for radio parts, automobiles and other vehicles, and decorative wares. These plastics can be stripped of their heavy metals, and the metals can be reclaimed for use in other applications.
The most common prior art process used to strip metals from plated plastics is a ferric chloride leaching process. The plated plastics used in this process typically are coated with three layers of heavy metals. The plastic material is coated with a copper inner layer, and the outer layers are comprised of nickel and chromium. FIG. 1 shows a diagrammatic illustration of the prior art method of stripping plated plastics by ferric chloride leaching.
In the prior art method, the plated plastics are first crushed into smaller particles. The heavy metals are then "leached" from the plastic or dissolved into solution by treatment with ferric chloride. Thus, all three layers of heavy metal, copper, chromium and nickel, are dissolved into solution with each other. This is represented by the redox Equations 1 and 2, shown below. ##EQU1##
The plastic is stripped free of the metals, but the metals are not separated distinctly from each other. Therefore, the metals are not in a form in which they can be reused and the cost of separating them from each other is extremely high.
After leaching with ferric chloride, the copper in solution is cemented to low grade powder as represented by Equation 3 below. EQU Cu.sup.2+ +Fe.sup.0 .fwdarw.Fe.sup.2+ +Cu.sup.0 [ 3]
The chromium and nickel metals, however, fail to be separated effectively from each other due to their similar chemical properties. These metals accumulate in large quantities with each successive treatment of plated plastic sample by the ferric chloride solution. This results in heavy accumulation of nickel and chromium in the spent liquor of the process, causing accumulation of toxic pollutants.
After the cementation step, the spent ferrous chloride liquor is chlorinated to regenerate a ferric chloride solution as shown by Equation 4 below. EQU 2Fe.sup.2++Cl.sub.2 .fwdarw..sup.2 Fe.sup.3+ +2Cl.sup.- [ 4]
The ferric chloride solution can then be reused to treat successive plated plastics and strip heavy metals from them.
The prior art ferric chloride method has several disadvantages. The valuable metals of nickel and chromium are unable to be separated distinctly and economically from each other. In addition, due to the heavy pollutants which result in ferric chloride processing, this method is very costly.
Accordingly it is an object of the present invention to provide a process for stripping plated plastics in which heavy metals are separated from each other and recovered in a form which can be reused in other chemical processes.
Another object of the present invention is to provide a process for stripping plated plastics which reduces pollution of the environment.
It is a further object of the present invention to provide a process for stripping plated plastics which is less costly than prior art methods.
It is a further object of the present invention to provide a process for stripping plated plastics in which heavy metals can be reclamated in high yield without chemical processing, thereby making the process more economical.
The process for stripping plated plastics of the present invention has other objects and features of advantage which will become apparent from, or are set forth in more detail in, the accompanying drawings and the following description of the Best Mode of Carrying Out the Invention.

Process for stripping plated plastic materials

Industrial Technology Research Institute


The invention relates to a pressure sensor with an MEM structure (micro electro mechanical structure), which has a hollow housing in which a semiconductor chip with a pressure-sensitive area is arranged. In its interior and with parts of the semiconductor chip, the housing is covered by a first plastic compound, which has a lower level of deformation than a second plastic compound, which partly covers the pressure-sensitive area of the semiconductor chip.

The invention relates to a pressure sensor which is subjected to an external pressure, having a semiconductor chip which has a pressure-sensitive area, and a process for producing such a pressure sensor.
Such pressure sensors constructed on the basis of semiconductor materials and using what is known as the MEM technique or microelectromechanical technique are used for automotive applications, such as motor vehicle tires, and exhibit a high failure rate with increased requirements in relation to increased attack of aggressive media and increased accelerative loadings.
It is an object of the invention to provide a pressure sensor which withstands the increased requirements in relation to environmental influences, to accelerative and external pressure loadings and attacks of aggressive media.
According to the invention, the pressure sensor has a semiconductor chip having a pressure-sensitive area which is subjected to an external pressure, and contact areas which are arranged on a pressure-insensitive area of the semiconductor chip. The semiconductor chip is arranged in a hollow housing which has a housing base on which the semiconductor chip is adhesively bonded. The hollow housing additionally has a housing wall which surrounds the semiconductor chip and through which flat conductors project with an internal section into a housing interior. External sections of the flat conductors project out of the housing wall. Arranged between the contact areas of the semiconductor chip and the internal sections of the flat conductors are connecting elements which connect predetermined contact areas electrically to corresponding internal sections.
The connecting elements, the internal sections and the contact areas within the surrounding housing wall are covered by a first plastic compound. The pressure-sensitive area of the semiconductor chip is at least partly covered by a second plastic compound. Because of its material characteristics, under the same external pressure loading, the first plastic compound is subjected to lower deformations than the second plastic compound.
This pressure sensor according to the invention has the advantage that, as a result of extensive covering of the. pressure-insensitive areas within the housing of a first plastic compound with a negligible deformation, the deformation loadings at increased external pressure are reduced, in particular for deformation-sensitive components such as the connecting elements. As a result of limiting the highly deforming second plastic compound to a pressure-sensitive area of the sensor, the remaining areas and components within the housing are protected against distortions and displacements as a result of tensile, compressive and shear stresses during deformation of the pressure-sensitive area.
The pressure sensor according to the invention is able to satisfy the increased requirements on temperature-cycle resistance and pressure resistance and erosion resistance with respect to aggressive media without failing. A pressure sensor protected in this way by two different plastic components can advantageously be used for continuous operational monitoring of the tire pressure in rotating vehicle tires up to a tire pressure of 100 MPa without it being possible to determine large temperature hysteresis values in the operating temperature range between xe2x88x9250xc2x0 C. and +150xc2x0 C. The scatter in the temperature response is likewise reduced as compared with pressure sensors merely having a silicone gel covering on all sides.
The first plastic compound preferably has a thermosetting plastic made of an epoxy resin or a silicone resin. These resins, with appropriate fillers, can exhibit a coefficient of thermal expansion which is matched to the coefficient of expansion of the semiconductor material and/or the material of the hollow housing. The hollow housing has either a ceramic substance or a plastic material. In the ceramic substance or the plastic material, a transition layer of a flat conductor is embedded in such a way that an internal section of the flat conductor projects into the interior of the hollow housing and an outer section of the flat conductor projects outward from the housing wall.
The flat conductor is anchored in the hollow housing by the transition section. In order to support the internal section, the hollow housing can have a ledge on the housing inner wall, to which the internal section of the flat conductor is fitted. This ensures secure bonding of a bonding wire between a contact connection area of the internal section of the flat conductor and a bonding wire which is intended to connect the flat conductor to contact areas on the pressure-insensitive areas of the semiconductor chip.
In the event of thermal loading, in particular the flat connections between the bonding wire and the contact connecting area and the bonding wire and the contact area are endangered if, in these intrinsically pressure-insensitive areas of the pressure sensor, highly deformable plastic protective layers made of a resilient elastomer are applied. It is therefore advantageous to protect these areas not serving as sensors against thermal stresses and severe deformations of a covering plastic compound such as the second plastic compound. Furthermore, the first plastic compound adheres both to the pressure-insensitive areas of the semiconductor chip and to the inner walls of the hollow housing, so that the interfaces between the first plastic compound and semiconductor chip and also between the first plastic compound and the hollow housing are protected against aggressive media.
The second plastic compound preferably has a plastic gel of a resilient elastomer based on silicone. In this case, the high resilience permits protection of a membrane of semiconductor material arranged underneath in the pressure-sensitive area of the semiconductor chip without hysteresis effects building up. Such resilient elastomers are based on dimethyl polysiloxane or phenyl polysiloxane and can be used for operating temperatures in the range from xe2x88x9255xc2x0 C. to +200xc2x0 C. or xe2x88x92120xc2x0 C. to +200xc2x0 C., depending on the base material. A further preferred resilient elastomer is based on fluorosiloxane and can be used at operating temperatures between xe2x88x9255xc2x0 C. and +175xc2x0 C. Fluorosiloxanes of this type can be used in particular for the vehicle sector, since they are resistant with respect to fuels and solvents.
For resilient elastomers of this type, based on silicone, the energy loss factor at a predefined pressure cycle frequency, of the order of magnitude of minus four powers of ten, is extremely low, so that such a second plastic compound follows the deformations of the pressure-sensitive area of the semiconductor chip with negligible energy loss. Furthermore, elastomers based on silicone have the advantage that they can form intensive adhesion to silicone resins. The risk of microcracks in the interface between the first plastic compound and the second plastic compound can therefore be reduced if a silicone resin is used as the first plastic compound and an elastomer based on silicone is used as the second plastic compound.
The hollow housing can have a housing cover with an opening which leaves the pressure-sensitive area and the second plastic compound free. A housing cover of this type can advantageously be matched to the inner dimensions of the housing wall, by its external:dimensions permitting a clearance fit with respect to the inner dimensions of the housing wall of the hollow housing. Following the application of the first plastic compound and still before the crosslinking of the resin, this housing cover is pressed onto said resin, at the same time any joints with respect to the housing wall being sealed off. A second plastic compound can be introduced into the opening that leaves the pressure-sensitive area of the semiconductor chip free, before or else after the fitting of the housing cover.
In order to construct the semiconductor chip as a pressure sensor, the semiconductor chip has a hermetically sealed cavity under reference pressure. This cavity can have a cylindrical shape which is surrounded by a rigid semiconductor wall of semiconductor chip material. This cylindrical shape is sealed off on one side by a pressure-sensitive membrane of semiconductor chip material. This membrane of semiconductor chip material can thus form the pressure-sensitive area of the semiconductor chip. For this purpose, the membrane of semiconductor chip material can have at least one sputtered-on electrode a few nanometers thick, via which an electrical signal, which corresponds to the flexure of the membrane under pressure loading, can be generated.
The cavity in the semiconductor chip material is sealed off hermetically with respect to the housing base by means of a gas-tight adhesive layer between the housing base and the semiconductor wall. If, for example, a tire pressure is applied to the pressure sensor, the membrane of semiconductor chip material bulges inward, so that the distance between the electrode arranged on the membrane and an electrode fitted to the housing base decreases. In this way, for example, the resonant frequency of an RC tuned circuit or an LC tuned circuit may be shifted, so that the frequency shift represents a measure of the flexure of the membrane and therefore a measure of the external pressure with respect to the reference pressure in the cavity. A pressure sensor of this type according to the invention has the advantage that, on account of the two different plastic covering compounds, it is protected against aggressive media and, secondly, on account of the resilience of the semiconductor chip material, it is able to measure large external pressure changes without being damaged and with a negligible energy or attenuation loss.
In order to be able to apply supply voltages and supply currents to the contact areas of the semiconductor chip and to be able to pick up pressure-specific electrical signals from the pressure sensor, the flat conductors have external sections projecting out of the housing wall of the hollow housing. These external sections of the flat conductors can be arranged at the level of an outer underside of the base or at the level of the inner upper side of the housing base. An arrangement at the level of the inner housing base ensures that the underside of the housing base consists entirely of hollow housing material, as a result of which the flat conductors are embedded in a better protected and better anchored manner in the housing wall of the hollow housing. The anchoring of the flat conductors with their transition sections in the housing wall can be improved further if the flat conductors do not project rectilinearly through the housing wall but if the flat conductors additionally have a Z-shaped angled section within the housing wall.
The pressure sensor according to the invention can withstand external pressure loadings such as occur in vehicle tires and, furthermore, can withstand without damage extreme accelerations such as occur during the rotation of vehicle tires. The pressure sensor according to the invention is therefore suitable to be arranged as a permanent pressure sensor in the rotating vehicle tire. Furthermore, the pressure sensor can be used in motor vehicles at all locations which, firstly, are subjected to high mechanical loadings and, secondly, are subjected to environmental influences, in particular aggressive media.
A pressure sensor can be produced by the following process steps.
First of all, a hollow housing is provided, specifically with an incorporated semiconductor chip which has a pressure-sensitive area and pressure-insensitive areas. The hollow housing also has an opening which leaves at least the pressure-sensitive area free. The housing and the semiconductor chip are already connected to one another via corresponding electric connecting elements in such a way that external sections of flat conductors have access to the electrodes of the semiconductor chip. The hollow housing with semiconductor chip and connecting elements is then covered by a first plastic compound, while sealing the surfaces of housing inner walls and also surfaces of the pressure-insensitive areas of the semiconductor chip. During this application of a first plastic compound, the pressure-sensitive area of the semiconductor chip is left substantially free. A second plastic compound is then applied to the pressure-sensitive area of the semiconductor chip, while sealing the interfaces between the first and second plastic compound in a gas-tight manner.
Owning to its material characteristics and owing to its geometrical construction, the first plastic compound differs from the second plastic compound in that, given identical external pressure conditions, lower deformations occur in the first plastic compound. This process has the advantage that a pressure sensor is formed which has a covering made of two different plastic components, which differ fundamentally in their deformation behavior. Thus, deformations which occur in the pressure-sensitive area are not transmitted to the deformation-sensitive connecting elements.
Both the application of a first plastic compound and the application of a second plastic compound can be carried out using a simple dispensing technique. On the other hand, it is possible by means of molding to apply the first plastic compound first of all, which can be made of a deformation-resistant thermosetting plastic, and then to apply the resiliently deformable second plastic compound to the pressure-sensitive areas of the semiconductor chip by means of dispensing, spinning on or varnishing on. These techniques can also be carried out in an extremely inexpensive and cost-effective manner, so that the process costs remain low.
A large number of semiconductor chips with pressure-sensitive areas, such as are required for incorporation in a hollow housing, can be produced simultaneously and in parallel in the following manner.
First of all, semiconductor chip positions are defined on a semiconductor wafer. Then, a plurality of cavities are etched in at the semiconductor chip positions from the rear side of the semiconductor wafer. This wet-chemical etching by means of alkalis or acids or dry etching by means of a reactive plasma is continued until a translucent and/or pressure-sensitive membrane remains on the upper side of the semiconductor chip, in the semiconductor chip positions.
Then, electrodes can be applied selectively to the pressure-sensitive membranes on the semiconductor wafer, that is to say on its upper side. Electrodes of this type can be structured as a capacitor plate or as a measuring strip or as a filter pattern as an electrode of a travelling wave amplifier. Contact areas, which are connected to the electrodes via conductor tracks, are then applied to the pressure-insensitive upper side of the semiconductor wafer, that is to say in the areas in which there is no membrane. In addition, passive and active semiconductor components relating to integrated circuits and evaluation structures can already be introduced into the pressure-insensitive areas of the semiconductor chip. Finally, the semiconductor wafer is divided up into individual semiconductor chips having a cavity and a pressure-sensitive membrane and also contact areas.
One advantage of this process is that, for a plurality of semiconductor chips, both the cavities for a reference pressure and also sensor electrodes, contact areas and control and evaluation circuits are produced in parallel and simultaneously on a semiconductor wafer.
In parallel with the production of suitable semiconductor chips, hollow housings with a housing base, including the embedding of transition sections of flat conductors in housing walls, can be pressure die-cast or pressure-pressed on a flat lead frame. Pressure die-casting is used when hollow plastic housings are to be produced, while pressure pressing with subsequent sintering is preferred for hollow ceramic housings. A flat lead frame of this type can have a plurality of hollow housings one behind another on a flat conductor strip and in rows beside one another at appropriate component positions.
In an automatic fitting machine, the semiconductor chips can then be bonded with their cavities onto the housing bases of the hollow housings, sealing off the cavities in a gas-tight manner. After fitting, the flat lead frame having a plurality of hollow housings, which now have the semiconductor chips, can be put into a bonding machine, in which internal sections of the flat conductors are connected electrically to contact areas of the semiconductor chip via bonding wires. A process of this type is also -suitable for the mass production of pressure sensors, so that cost-effective production becomes possible.
Finally, as mentioned above, the first plastic compound is already applied, in which the connecting elements are embedded. The uncovered pressure-sensitive area of the semiconductor chip is then covered by the second plastic compound, as mentioned above. Finally, a further housing cover can be fitted to the hollow housing, leaving the pressure-sensitive area free and leaving the second plastic compound free.
In summary, it should be recorded that a pressure sensor according to the invention with an MEM structure (micro electro mechanical structure) has a pressure-transmitting layer in the form of a gel over the MEM structure, and this pressure-transmitting layer of gel can be reduced to a surface minimum without exerting stresses on the remaining part of the semiconductor chip, if the semiconductor chip is covered in a low-stress manner by means of two different processes and two different materials. For this purpose, in a trough-like body of a hollow housing, contact is made with the semiconductor chip and, by means of these two different processes, two different materials are applied. A pressure sensor of this type with MEM structure exhibits the following advantages in the functional tests:
low-stress encapsulation with improved accuracy of the MEM output,
improved adhesion between the encapsulation materials used, so that for the first time a required media compatibility for a tire pressure sensor is achieved,
for the first time, fulfilment of the required mechanical acceleration tests for such a tire pressure sensor,
optimization of the plastic compounds to the MEM structure of the semiconductor chip.
In essence, the invention comprises a combination of globtop around the semiconductor chip and also on the pressure-insensitive surface of the semiconductor chip, and a pressure-transmitting silicone gel in the smallest possible amount on the pressure-sensitive area of the semiconductor chip.

Pressure sensor and process for producing the pressure sensor


A scanning microscope includes an objective arranged in an illuminating beam path to focus an illuminating light bundle onto a sample. A scanning unit is arranged upstream of the objective to deflect the illuminating light bundle such that it is focused by the objective executes a scanning movement on the sample. A detection unit is arranged in a detection beam path to receive a detection light bundle not deflected by the scanning unit. For spectral influencing of the detection light bundle, the detection unit contains a spectrally selective component which has an active surface with a spectral edge which varies with the location of incidence of the detection light bundle on the active surface. The active surface is arranged in the detection beam path at the location of an image of an objective pupil, or in a position at which a variation of the spectral edge is compensated for.

A scanning microscope of the type specified above is used, for example, in fluorescence microscopy, in which fluorescent dyes are stimulated to emit fluorescence radiation with the aid of an illuminating light bundle. In this application, stimulation light in the form of the illuminating light bundle is guided in a scanning movement over the sample. This scanning movement is realized by means of a scanning unit arranged upstream of the objective, said scanning unit generally comprising one or more movable scanning mirrors and a scanning optical system, which directs the illuminating light bundle onto the entry pupil of the objective. The fluorescence radiation stimulated in the sample by the illuminating light bundle is guided back into the scanning microscope by the objective and is fed in the form of a detection light bundle to a detection unit, which generally contains various lenses for shaping and diverting the detection light bundle as well as a detector which finally detects the detection light bundle.
While descanned detectors are conventionally used in confocal microscopy, non-descanned detectors (NDD) are used in other microscopy applications such as, for example, multiphoton microscopy, light sheet or single-plane microscopy or multispot or multi-foci microscopy. A descanned detector firstly receives the detection light bundle after it has been guided back to the scanning unit and has been converted back by said scanning unit into a fixed detection light bundle. A fixed light bundle of this type is also the illuminating light bundle before it strikes the scanning unit. In contrast, a non-descanned detector receives the detection light bundle without this having previously been fed back to the scanning unit. Thus, the detection light bundle arrives at the detector without influencing by the scanning unit.
In multiphoton microscopy, by non-linear effects, only fluorescent dyes in a spatially limited simulating focus, produced by the illuminating light bundle focused on the sample, are stimulated to emit fluorescence radiation. The entire fluorescence radiation which comes from the stimulating focus can now be detected by the non-descanned detector, taking into account the known position of the stimulating focus. Since the illuminating light bundle is guided over the sample in a scanning movement, a three-dimensional sample image can consequently be produced.
Various beam splitters and filters which spectrally influence the detection light bundle in the desired manner are generally located in the detection beam path of a scanning microscope. Thus, beam splitters may, for example, be used to split the detection light bundle into various separate beams depending on the wavelength, which beams are then fed to various detection channels which in each case contain their own detector. The wavelength range to be detected can be determined for each detector by means of optical filters.
In particular, point detectors (for example photomultipliers, avalanche photomultipliers or hybrid photodetectors), line detectors or surface detectors or array detectors (for example CCD, EMCCD, CMOS, sCMOS or QIS (quanta image sensor)) can be used as detectors.
In confocal microscopy, spectral detectors are also increasingly being used which allow the user to freely select the wavelength ranges to be detected before recording the image. In a spectral detector of this type, the detection light bundle is separated, for example by means of a prism, into its spectral proportions and the wavelength ranges to be detected are selected from these.
In contrast, the use of such flexibly usable spectral detectors in non-descanned applications was previously not readily possible as the detection light bundle in the detection unit executes a scanning movement there, which does not occur in the confocal application owing to the return of the detection light bundle to the scanning unit. Non-descanned detectors have therefore hitherto been equipped with conventional interference filters or interference beam splitters, the spectral characteristics of which are fixed, i.e. cannot be varied by the user during the experiment.
It is proposed in DE 10 2006 034 908 A1, in a scanning microscope, to use a spectrally selective component in the form of an edge filter, the limit wavelength of which, also called the spectral edge, varies along the filter (graduated filter). In this case, the spectral edge of the filter separates a wavelength range of the transmission from a wavelength range in which no transmission takes place.
The use of an edge filter of this type with a locally variable spectral edge allows the user to adjust the spectral characteristic of the detector as desired. However, problems also occur here which have been recognized by the present inventors and are not addressed in DE 10 2006 034 908 A1. An adequately steep spectral edge, i.e. an adequately sharp limit wavelength, can only be realized when the detection light bundle striking the filter has an adequately small diameter. Each increase in the bundle diameter inevitably leads to a reduction in edge steepness. The smaller the edge steepness, the less precise is the spectral characteristic of the detector.
Moreover, the spectral edge position of the filter depends on the angle of incidence at which the detection light bundle strikes the filter. The present inventors have recognized that this is disadvantageous, in particular in a non-descanned detector, in which the angle of incidence of the detection light bundle varies as a result of the scanning movement of the illuminating light bundle.