In an integrated circuit device using a plurality of different power supply voltages, the application of an input voltage exceeding the power supply voltages to an input/output circuit is prevented. When a p-type substrate is used, a plurality n-wells are formed to surround an integrated circuit region on a central portion of the substrate. When an n-type substrate is used, a plurality of p-wells are formed in the same manner. A predetermined power supply voltage is applied to each well to select transistors of the input/output buffer in accordance with the voltage level of an external voltage.

1. Field of the Invention
The present invention relates to a semiconductor integrated circuit device including an input/output circuit having a complementary metal oxide semiconductor (CMOS) structure and, more particularly, to an. input/output circuit that facilitates input/output interfacing with a device that operates at different power supply voltages.
2. Description of the Related Art
The recent advances in the technology of semiconductor integrated circuit devices such as IC and LSI devices greatly depend on element miniaturization represented by scaling. In the old generation of elements having a line width of 1 .mu.m or more, only element dimensions are scaled, whereas the power supply voltage remains at 5 V. In the submicron generation, however, it is becoming difficult to maintain a power supply voltage of 5 V. That is, a decrease in breakdown voltage with a reduction in gate oxide film thickness or a decrease in hot carrier breakdown voltage with a reduction in gate length cannot be neglected. On the other hand, an increase in current consumption with an increase in the number of elements per chip conflicts with the demand for lower power consumption required by portable devices. As described above, from the point of view of elements and users, demands have arisen for lower power supply voltages. In reality, however, the shift of a power supply voltage to 3 V is not smoothly made. This is because if all the ICs of a given system are to be designed to operate at 3 V, some ICs, represented by analog ICs, are not suitable for a reduction in power supply voltage. For this reason, a system including both 3-V and 5-V circuits is inevitably required besides an "all 3-V" system. The present invention is related to interfacing between integrated circuits using different power supply voltages. More specifically, the present invention is applied to integrated circuit devices, such as a microcomputer, a memory, a general-purpose logic, and an ASICLSI, which demand a reduction in power supply voltage.
FIG. 1 shows an input/output circuit normally used for a semiconductor integrated circuit device. In general, an input/output circuit of an integrated circuit (LSI) having a CMOS structure is constituted by a CMOS circuit as in the case of an internal circuit element of the integrated circuit. The input/output circuit includes an output buffer 2 and an input buffer 3, both of which are connected to an input/output terminal 1. The input/output terminal 1 is called a pad on the semiconductor substrate. Such pads are formed on a peripheral portion of the semiconductor substrate. A protective circuit against an externally caused electrostatic discharge is connected between these buffers and the input/output terminal 1. This protective circuit includes a resistor R1 and a diode D1. The output buffer 2 is constituted by an n-channel MOSFET (to be referred to as an NMOS transistor hereinafter) Q1 and a p-channel MOSFET (to be referred to as a PMOS transistor hereinafter) Q2. The input buffer 3 is constituted by an NMOS transistor Q3 and a PMOS transistor Q4. Signals are applied from the transistors Q3 and Q4 to the LSI. Signals A and B from the LSI are respectively applied to the PMOS and NMOS transistor Q2 and Q1 of the output buffer 2. The input/output states of the input/output circuit are shown in the following Table 1:
TABLE 1 ______________________________________ A B Q1 Q2 Input/Output State ______________________________________ L L off on H-level output state H H on ff L-level output state H L off off high-impedance input state ______________________________________
The input/output circuit operates in the following three input/output states. When both the signals A and B are at L level (Low Level), the NMOS transistor Q1 is turned off, and the PMOS transistor Q2 is turned on. As a result, the input/output state of the input/output circuit becomes an H (High)-level output state. When both the signals A and B are at H level (High Level), the transistor Q1 is turned on, and the transistor Q2 is turned off. As a result, the input/output state becomes an L (Low)-level output state. When the signals A and B are at H level and L level, respectively, both the transistors Q1 and Q2 are turned off, the input/output state becomes a high-impedance input state.
The input/output circuit constituted by such a CMOS circuit is widely used for semiconductor integrated circuit devices. However, a voltage lower than a ground potential of 0 V or higher than a power supply voltage Vcc cannot be applied to the input/output terminal 1. If, for example, a voltage exceeding the voltage Vcc is applied to the input/output terminal 1, the p-n junction formed in the drain area of the PMOS transistor Q2 is biased in the forward direction. As a result, a large current flows from the input/output terminal 1 to a power supply Vcc. For this reason, the rated voltage applied to the input/output terminal 1 is generally limited within the range of ground voltage of 0 V+0.5 V (inclusive) to power supply voltage Vcc+0.5 V (inclusive).
However, with the advances in the miniaturization of an integrated circuit having a CMOS structure and an increase in integration degree, it is becoming difficult to conform to such limitations. For a CMOS-LSI using MOS transistors having a gate length of 0.5 .mu.m or less, it is proposed that the power supply voltage, i.e., 5 V, which has been conventionally used, be decreased to nearly 3 V, in order to prevent a deterioration in element reliability due to an increase in the strength of an electric field in an internal element. In addition, a decrease in power supply voltage, i.e., a decrease in signal amplitude, is preferable in terms of prevention of noise in input/output switching of an integrated circuit. CMOS circuits are not used alone in an integrated circuit but are connected to other CMOS-LSIs having various functions to constitute a system. However, it is not assumed that all these CMOS-LSIs operate at a low power supply voltage, and a plurality of integrated circuits having power supply voltages of 3 V and 5 V may constitute a system. Therefore, a voltage of 5 V may be applied, as an H-level input, to an input/output circuit of an integrated circuit having a power supply voltage of 3 V. In this case, as described above, since a forward bias to the p-n junction is generated, a conventional input/output circuit cannot be used directly. This forward p-n junction current may destroy an element.
Conventional master slice type semiconductor integrated circuit devices formed on p-type silicon semiconductor substrates will be described below with reference to FIGS. 2 to 8. FIG. 2 is a plan view of a p-type silicon semiconductor substrate 10. FIG. 3 is an enlarged plan view of a region R in FIG. 2. The region R includes two regions R1 and R2, each having one output buffer formed therein. An n-well 11 used for an input/output circuit is formed on a peripheral portion of the semiconductor substrate 10. This n-well 11 is formed along the respective sides of the substrate 10 to have an annular shape. A plurality of input/output terminals (pads) 1 are formed in a line between the n-well 11 and each side so as to allow a main logic circuit formed in the semiconductor substrate 10 to be electrically connected to an external circuit through the input/output circuit. The semiconductor substrate 10 is connected to the ground potential. Each gate 19 is made of polysilicon. The entire n-well 11 formed on the p-type semiconductor substrate 10 is connected to the same potential (e.g., 5 V). For this reason, external signals corresponding to a plurality of voltage levels are interfaced by using an A1 wiring pattern 12 as an overlying layer as needed. Furthermore, in such a case, only the potential of the source of a PMOS transistor in the n-well 11 is changed. FIG. 3 is a schematic view of a conventional input/output circuit pattern for obtaining two types of outputs, i.e., a 5-V level output Z1 and a 3-V level output Z2, when the n-well 11 is biased at 5 V. FIG. 4 is a circuit diagram of a 3-V level output buffer 2 for this circuit.
At this time, the source of a PMOS transistor P12 is biased at 3 V to obtain a 3-V level output. When an input A2 for a 3-V level output changes to L level (0 V), the PMOS transistor P12 is turned on. As a result, a potential of 3 V is obtained at the output Z2. In this case, however, since the PMOS transistor P12 is formed in the n-well 11 together with another PMOS transistor P11, a back gate voltage of 5 V is commonly applied to the two transistors, resulting in a deterioration in transistor characteristics, e.g., a decrease in speed.
In an integrated circuit incorporating input protection diodes D2 and D3 shown in FIG. 8 since the cathode side of the protection diode D2 is common to an n-well, if the integrated circuit operates at 3 V, a current flows in the circuit through the protection diode D2 on the positive side upon application of a 5 V level input signal. Therefore, such a circuit cannot be used for a system designed to suppress power consumption. In the above-described prior art, since transistors having different voltage levels are formed in one well region, the output voltage level can be changed only by changing the source voltage, resulting in a decrease in speed. In order to prevent such a deterioration in the transistor characteristics of an input/output circuit, the master slice type semiconductor integrated circuit device shown in FIG. 5 has been proposed.
In this device, independent n-wells are formed along the respective sides. A change in potential is performed by two n-wells 113 formed along adjacent sides and connected to a potential of 5 V, and two n-wells 114 formed along adjacent sides and connected to a potential of 3 V. A decrease in speed due to a back gate effect is prevented in such a manner that the n-wells for interfacing circuits at 5 V are biased at 5 V, and the n-wells for interfacing the circuits at 3 V are biased at 3 V. Since a plurality of input/output circuits as units are formed in one n-well region, a pitch d of the pads 1 is decreased, as shown in FIG. 6. FIG. 6 is a plan view showing a portion of an input/output circuit region of the semiconductor integrated circuit device. As is apparent from FIG. 6, however, in this structure, the formation regions of 5-V and 3-V input/output circuits are limited to the respective sides. That input/output circuits cannot be freely arranged is a critical disadvantage to a master slice type semiconductor integrated circuit device. Therefore, as shown in FIG. 7, it is proposed that n-wells be formed in units of input/output circuits. FIG. 7 is a plan view showing a region, of another conventional master slice type semiconductor integrated circuit device, which corresponds to the portion shown in FIG. 5. With this structure, signals having a plurality of levels can be interfaced by biasing special n-wells at the respective interfacing levels.
In this structure, however, since the input/output circuit formation regions must be formed at predetermined intervals, a pad pitch D shown in FIG. 7 is inevitably larger than the pad pitch d shown in FIG. 6. Consequently, the number of pins is greatly decreased, while the chip size is increased. As described above, if the conventional master slice type integrated circuits are used for a system including integrated circuits having a plurality of voltage levels, it is 10 difficult to perform interfacing with satisfactory characteristics.

Semiconductor input/output circuits operating at different power supply voltages


Medical systems, devices and methods for creation of autologous tissue valves within a mammalian body are disclosed. One example of a device for creating a valve flap from a vessel wall includes an elongate tubular structure having a proximal portion and a distal portion and a longitudinal axis; a first lumen having a first exit port located on the distal portion of the elongate tubular structure; a second lumen having a second exit port located on the distal portion of the elongate tubular structure; a recessed distal surface on the distal portion of the elongate tubular structure, wherein the recessed distal surface is located distally to the first exit port; and an open trough on the recessed distal surface extending longitudinally from the first exit port.

Venous reflux is a medical condition affecting the circulation of blood, such as in the lower extremities or neck. The valves in the vessel that normally force blood back towards the heart cannot function properly. As a result, blood flows backwards, causing unwanted clinical problems such as ulceration or even multiple sclerosis when chronic cerebrospinal venous insufficiency is present. Applicant of the subject application determines that new systems and methods for treating venous reflux would be desirable.

Systems and methods for endoluminal valve creation


A vehicle headrest assembly includes a head restraint operably coupled to a vehicle seatback and having a head support surface. A flexible member includes a top portion operably coupled to the head restraint. The flexible member includes an intermediate portion adjacent the head support surface, a lower portion, and an upper back support disposed on the vehicle seatback and defining an elongated slot through which the flexible member extends. An actuation system is operably coupled to the lower portion of the flexible member. The actuation system operates to move the flexible member through the slot between a deployed position and a non-deployed position.

Vehicle seating assemblies commonly include a headrest assembly coupled with an upper portion of the seatback to support a passenger's head. In some instances, the headrest assemblies may include posts extending from the headrest to the seatback, allowing the headrest to be adjusted up and down relative to the seatback. Accordingly, these seating assemblies have limited adjustability to support the passenger's head.

Integrated thin flex composite headrest assembly


A method is disclosed for network knowledge-based diagnosis comprising the machine-implemented steps of creating and storing one or more symptoms, wherein each symptom comprises a set of information elements that represent one or more network events that may be potentially received from a computer network; associating a weight value with each information element of the one or more symptoms; associating a confidence time interval value with each of the one or more symptoms; receiving one or more network events from elements in the computer network; and determining a set of one or more candidate diagnoses of a problem indicated by the received network events, by (a) selecting one or more symptoms that include at least one of the received network events and (b) using functions that map the selected symptoms to one or more candidate diagnoses, based on all weight values of events in the selected symptoms and the confidence time interval values of the selected symptoms.

The approaches described in this section could be pursued, but are not necessarily approaches that have been previously conceived or pursued. Therefore, unless otherwise indicated herein, the approaches described in this section are not prior art to the claims in this application and are not admitted to be prior art by inclusion in this section.
Network administrators need effective tools for determining what problems have occurred in computer networks, especially large, complex networks of the type owned and operated by service providers. Many existing solutions for event correlation and generating network diagnostics are not suitable for real-time monitoring and on-line diagnosis, because they require complex computational models and are computationally expensive. Operation support systems (OSS) commonly incorporate topology models and event models that add to the computational costs, which can lengthen the time for the OSS to provide feedback to an administrator, increasing the time at which corrective action is taken.
Further, many existing systems inadequately track event information structures that are communicated by network elements. For example, a network element may emit multiple events associated with a single problem, but due to routing complexities and network latency, the events arrive at the OSS at different times or out of order. Accounting for temporal dependencies and considering event reordering issues imposes challenging responsibilities on such systems. In a typical approach, when an OSS receives one event, a plurality of problem diagnoses may be possible, and the OSS determines a single diagnosis only when a specified set of events arrives in a specified order. Thus, a single event {e1} may lead to numerous diagnoses, while a full set {e1, e2, e3, e4} precisely identifies the faulty element. Until the full set of events is received, the OSS cannot be used to isolate a network problem.
The failure of these systems to keep track of temporal dependencies and appropriately handle event reordering is one of the main reasons for developing customized event correlation in an OSS. Solutions that do not require complex or rich models and provide a lightweight implementation, potentially suitable for implementation inside the network element, are better.
Further, the geographic distribution of network elements in a network may introduce a variable delay, making the accuracy of event patterns that are tightly related to time particularly inappropriate for real-time monitoring and diagnosis. In networks that guarantee clock synchronization for validating the temporal relationship of events, time-based relationships can be effectively used for event correlation.
Delay and Internet Protocol (IP) routing mechanisms may introduce event reordering, because event packets may follow different paths to reach their destination. In such networks, the relative ordering of the events is no longer guaranteed. For networks that guarantee bounded time delays and guarantee correct event ordering, then the concept of progressive patterns for event correlation can be used.
However, many networks have desynchronized sub-network behavior, uncontrollable delays, and event reordering. For these networks, approaches based on temporal relationships and progressive patterns are no longer useful; other mechanisms are needed to evaluate and diagnose network behavior.
In some approaches, dependencies among symptoms and diagnoses are captured through policies. Policies express a logical diagnosis under known conditions of topology, event delivery, and network transport properties. As topology (or configurations of the logical interactions) may also change, the mapping rules of symptoms and diagnosis must be revised.
A network diagnosis is a possible hypothesis about faulty components in the network. A diagnosis may be passive or active. Model-based passive diagnosis systems collect information and analyze it. Many approaches have been used to analyze information, e.g., Bayesian networks, Petri Nets, artificial Neural Networks, rule-based methods, model-based networks, etc. Active diagnosis systems apply additional tests to the results of the passive diagnosis.
Diagnosing network problems is a very time-consuming activity. Therefore, having performance-oriented knowledge-based methods and mechanisms to speed-up the diagnosis would be beneficial.
In one class of prior approaches to this problem, topology-dependent and model-based correlation and diagnosis processes, using root-cause analysis, have been implemented. For example, InCharge from Smarts, NetCool from MicroMuse, and OpenView from Hewlett-Packard implement these approaches. These solutions are mainly based on dependency models and topology definition and discovery of network elements and/or applications. These mechanisms are intended for out-of-the-box processing and require considerable CPU power and memory.
In another approach, network problems, symptoms and diagnoses are defined in a rule-based markup language (RBML). The markup language is also used to define rules that specify when a particular diagnosis is indicated by one or more symptoms. RBML is described in co-pending U.S. application Ser. No. 10/714,158, filed Nov. 13, 2003, of Keith Sinclair et al. RBML is primarily a language and environment in which to execute rules implemented in that language. It is a mechanism that operates on the knowledge of network behavior in the form of a set of rules but it does not impose any specific model of network behavior. With RBML it is not possible to map a set of events to multiple possible diagnoses. RBML does not account for events that may arrive in any order. Further, all events defined in a rule must occur to trigger the action defined in the rule.

Method and apparatus for generating diagnoses of network problems


A system and method is disclosed for restricting a remote control interface port of a set-top box configured to broadcast multimedia programs over a provider network. A change schedule that changes communication parameters may restrict the remote control interface port. The operating frequency or the code set used to transmit data and commands may be changed at random or at predefined intervals. The set-top box, the remote control, or an external network device may initiate the change schedule. Encryption of communications between the set-top box and the remote control unit may also be performed to protect the set-top box from unauthorized access.

1. Field of the Disclosure
The present disclosure generally relates to providing multimedia content, and more specifically, to restricting set-top box remote control functions.
2. Description of the Related Art
Multimedia content such as broadcast programs may be provided to a customer via a set-top box located at the customer premises. In some cases, set-top boxes are controlled remotely by apparatuses that, without authorization, retransmit broadcast programs over the Internet, for example.

System and method for restricting access to a set-top box


A cache server receives wear usage information associated with a storage device, and receives an object to be cached in the storage device. The cache server also determines whether to store the object in the storage device based on the wear usage information. The cache server provides the object to the storage device for storage when it is determined that the object is to be stored in the storage device, and prevents the object from being stored in the storage device when it is determined that the object is not to be stored in the storage device.

A service provider is an entity (e.g., a business or an organization) that sells bandwidth provided by a network (e.g., the Internet, a data network, a telecommunication network, etc.) associated with the service provider. Service providers may include telecommunications companies, data carriers, wireless communications providers, Internet service providers, cable television operators offering high-speed Internet access, etc. The rapid growth in the transmission of, for example, video content, audio content, images, and software downloads, is creating much higher bandwidth demands on service providers, with sharp bandwidth peaks that may be due to suddenly popular objects or the occurrence of events.
In order to address such higher bandwidth demands, service providers deploy proxy cache devices, such as, cache servers, in their networks. The cache servers can cache popular objects (e.g., data corresponding to video content, audio content, images, software downloads, etc.), which enables the service providers to optimize network utilization and to save on the backhaul bandwidth costs. In one example, the cache servers may store the objects in storage devices that have a limited number of write operations before failure, referred to as limited usage storage devices herein. Examples of such limited use storage devices include storage devices based on NAND flash technology.
In limited usage storage devices, each storage unit or page has a limited number of erase/write cycles before the page can no longer retain data reliably. Erase/write cycles are required when content of a physical page must change or update, such as when new content needs to be written to the page. In order to guarantee the lifetime (e.g., three years, five years, etc.) of a limited usage storage device, the limited usage storage device must perform some type of erase/write cycle throttling. For example, the storage device may utilize the erase limitations to lengthen write operation times, which may ensure that device usage remains under a particular number of erase/write operations for a given period of time. However, lengthening write operations times may degrade the performance of the storage device. Wear leveling is an industry standard technique used to lengthen the lifetime of a limited usage storage device, but wear leveling fails to provide lifetime guarantees. Wear leveling changes the mapping of logical storage addresses to physical storage addresses over time, so that repeated writes to the same storage address will not wear out a specific part of the storage device.

Managing lifetime of limited usage storage devices in a caching system


Devices, systems and methods are disclosed which relate to a USSD assisted remote ring tone control service allowing a first mobile device to remotely add a ring tone and activate the ring tone of a second mobile device. A first mobile device contains a remote ring-tone control logic. The remote ring-tone control logic interacts with a USSD gateway server to send a ring tone to a second mobile device and remotely activates the ring tone. This requires authorization by a policy server which is in communication with the USSD gateway server. Once authorized, the first mobile device can upload a ring tone to a ring tone cache or find a ring tone on a network. The first mobile device then sends a URL to the second mobile device pointing to the ring tone either in the ring tone cache or elsewhere on the network. The second mobile device then downloads the ring tone. Once the download is confirmed the second mobile device activates the ring tone. The next time the first communications device makes a call to the second mobile device, the ring tone sounds through the second mobile device.

1. Field of the Invention
The present invention relates to controlling the ring tone of a mobile device. More specifically, the present invention relates to remotely controlling the ring tone of a mobile device via a USSD gateway server.
2. Background of the Invention
Wireless communications devices, such as cellular telephones, have become tremendously popular. It is estimated that there were 3.3 billion cellular phone subscriptions at the end of 2007. Close to 80% of the world now enjoys cellular coverage, a figure only increasing as new networks appear. Along with the abundance of cellular telephones comes the demand for new and improved services. It is no longer enough to just place and receive calls, users want it all.
Since introduction of ring tone service to wireless users, wireless operators have seen a rapid increase in usage of this service. The volume of ring tone downloads has been rising at an incredible pace in recent years. Data service revenue generated from ring tone downloading contributes a big part of the average revenue per user (ARPU) with respect to data among all wireless operators who offer such a service. The ring tone has been seen as a great way for personalization and individual representation.
Nevertheless, current ring tone service is only offered as a "server to mobile" service. A user downloads the service on his/her device and uses it on his/her own device. In certain instances a ring tone can be shared with another user, such as by copying it to another mobile device, but there are few mobile devices that allow this in a user-friendly manner. Carriers hesitate to make this process user-friendly for fear of facilitating copyright infringement and other digital rights management issues.
At the same time, users are still using the same communication process they have been using since the invention of the telephone. A call is placed, the caller waits through rings for the callee to answer, then they can talk. Nowadays, if the callee does not answer, the caller has an opportunity to record a voice message. However, this seems like a rather long process for a device with so many technological advances.
There is a service that connects mobile devices through a wireless network for digital communication. It is a USSD gateway server. USSD stands for Unstructured Supplementary Service Data. USSD is a means of transmitting information or instructions over a GSM/UMTS network. USSD has some similarities with short message services (SMS) since both use the GSM/UMTS network's signaling path. Unlike SMS, USSD is not a store and forward service and is session-oriented. When a user accesses a USSD service, a session is established and the radio connection stays open until the user, application, or time-out releases it. This has more in common with Circuit Switched Data than SMS. USSD text messages can be up to 182 characters in length.
What is needed in the art is a way to give callers the ability to control the ring tone on the callee's mobile device. The system should make use of more recent technologies in order to make the process fast and simple. The system also needs to handle copyright infringement and other digital rights issues as well.


A management system for managing computer resources assigned by a hypervisor to one or more logical partitions and/or one or more appliance partitions in a multi-user computer system receives login information from a new user logging into the computer system through a service interface (e.g. a hardware management console) or a non-service interface, builds a conflict list, and sends the conflict list for presentation to the new user. The new user is notified of any users that are logged into any part of the computer system that could conflict with the new user's actions. Such users may be logged into the computer system through service and/or non-service interfaces. In one embodiment, the new user can choose to continue logging in irrespective of any conflicts shown. After choosing to continue, the new user is preferably requested to input an end-time. This end-time may be displayed, in turn, to all subsequent users that log into any part of the computer system that could cause conflict. The management system is preferably a component of the hypervisor.

1. Field of Invention
The present invention relates in general to the data processing field. More particularly, the present invention relates to a method, apparatus and computer program product for managing resources assigned to one or more logical partitions and/or one or more appliance partitions in a multi-user computer system.
2. Background Art
Computer systems typically include a combination of hardware and software. The combination of hardware and software on a particular computer system defines a computing environment. Different hardware platforms and different operating systems thus provide different computing environments. In recent years, engineers have recognized that it is possible to provide different computing environments on the same physical computer system by logically partitioning the computer system resources into different computing environments. Such a computer system is often referred to as a multipartitioned computer system. The IBM Power Systems (formerly IBM System i and System p) computer system developed by International Business Machines Corporation is an example of a computer system that supports logical partitioning. If logical partitioning on such a computer system is desired, partition manager code (referred to herein as a "hypervisor") is installed that allows defining different computing environments on the same platform. Once the hypervisor is installed, logical partitions may be created that define different computing environments. The hypervisor manages the logical partitions to assure that they can share needed resources in the computer system while maintaining the separate computing environments defined by the logical partitions.
A computer system that includes multiple logical partitions typically shares resources (e.g., processors, memory, persistent storage, and other physical hardware) amongst the logical partitions. For example, a computer system with a single CPU could have two logical partitions defined, with 50% of the CPU assigned to each logical partition, with 33% of the memory assigned to the first logical partition and 67% of the memory assigned to the second logical partition, and with two different I/O slots assigned to the two logical partitions, one per partition. Once logical partitions are defined and shared resources are assigned to the logical partitions, each logical partition acts as a separate computer system. Thus, in the example above that has a single computer system with two logical partitions, the two logical partitions will appear for all practical purposes to be two separate and distinct computer systems.
Input/Output (I/O) adapters can be exclusively assigned to (also referred to herein as being "owned by") logical partitions (LPARs) or shared by LPARs through an appliance partition known as a virtual I/O server (VIOS) partition. For example, a VIOS partition allows Ethernet and storage devices to be virtualized and served out to LPARS on a server. The actual physical hardware is owned by the VIOS partition, while the LPARs own virtual devices associated with the physical hardware. As a result, the VIOS partition is considered a service partition with authority to make any changes to the hardware, which in turn could affect the virtual devices being used by the LPARs. The LPARs do not have any direct access to the physical hardware owned by the VIOS partition.
Operations of the different partitions in one or more computer systems may be controlled through a hardware management console (HMC), which is a form of a service partition. In one embodiment, a hardware management console is a separate computer system from which a system administrator, for example, may perform various functions including assignment of hardware resources to each logical partition, as well as reassignment of resources to different logical partitions. In other embodiments, a hardware management console may be installed directly on the system being managed (e.g., IBM's Integrated Virtualization Manager, VMWare Server).
Servers and other computer systems generally support multiple methods for access to partitions, both through service interfaces, such as hardware management consoles, and non-service interfaces. As a result, there is always the potential for a user of a computer system to step on another user of the computer system unknowingly.
In a multi-user server environment, for example, there are typically multiple operating systems, a system management utility, and a hypervisor—with all these areas owning/using different pieces of hardware. So, no one area has full knowledge of what actions are taking place elsewhere on the computer system. Therefore, determining that one action will cause a conflict with another is not always very straight forward (but could be in some situations).
Conventional management systems for managing the partitions are based on calendar entries. Unfortunately, the users of computer systems having such conventional management systems must be regimented about their use. Forgetting to make an entry, check entries, or making a mistake in the calendar can result in two different users logging on to different parts of the same computer system and causing issues for each other.
For example, there may be a server administrator using a hardware management console (HMC) to work on a serviceability action for hardware owned by a partition while another user is trying to run tasks on the partition that requires that same hardware. Today there exists no way for these users to realize that they could cause issues for one another unless both users are regular with the conventional management system's calendars and both users remember to verify the calendar entries. With the complexity of computer systems such as servers, there are often multiple administrators and they too could cause conflicts of the computer system if the conventional management system's calendar is not adhered to regularly.
Thus, while conventional management systems attempt to prevent these issues from occurring, they occur nonetheless because such systems depend on the users' awareness and regularity with respect to calendar updates and verification. The safeguards that are provided through such conventional management systems are no longer sufficient, especially given the size and complexity of computer systems such as servers and the number of partitions the users' may be dealing with.
Therefore, a need exists for an enhanced mechanism for managing resources assigned to one or more logical partitions and/or one or more appliance partitions in a multi-user computer system.

Managing conflicts between multiple users accessing a computer system having shared resources assigned to one or more logical partitions and one or more appliance partitions


A modular connector having multiple ports, comprising a housing having a first end and a second end, a first optical port on the first end, a second optical port on the first end, a third optical port on the second end, a fiber bragg grating (FBG) within the housing optically connected to the first port, said FBG configured to reflect a set wavelength back and away from the first port, a coupler within the housing optically connected to the FBG, the second port, and the third port; and wherein each of said optical ports, once connected, is capable of supporting the housing without additional support.

The present invention relates generally to optical connectors. More particularly, the present invention relates to a modular connector for an optical network including wavelength division multiplexing (WDM) capability.
Due to the increasing electronic traffic on optical networks, maximizing bandwidth per each optical fiber utilized in transmitting optical signals is becoming a necessity. Optical fibers are capable of transmitting multiple wavelengths at various frequencies in order to maximize the amount of information that can be carried on a single optical fiber in a communication network. Of course, eventually particular wavelengths being carried on an optical fiber will need to be separated. The process of combining, transmitting, and separating signals of different wavelengths is referred to as wavelength division multiplexing (WDM).
Conventional WDM systems utilize numerous, bulky, discrete components that are connected using a myriad of optical fibers. If the number of wavelengths to be separated or added to an optical system is large, the amount of required discrete components dictates the use of a large enclosure to contain all the elements. WDM systems therefore require planning and close matching of laser characteristics with wavelength combiners (multiplexers) and separators (demultiplexers).
Accordingly, there is a need for a modular, inexpensive, and easy-to-use wavelength multiplexer (mux) and demultiplexer (demux) that is capable of being used selectively to reduce parallel fiber connections down to a single fiber link.
An object of the present invention is to provide a modular wavelength division multiplexing (WDM) connector capable of being retrofitted to existing parallel fiber connections.
A second objective of the present invention is to eliminate racks currently required for conventional WDMs in favor of a self-supportive connector or adapter.
A third object of the present invention is to reduce to the cost of WDM systems by integrating numerous discrete components into a single module.
A fourth object of the present invention is to reduce failures and defects associated with systems utilizing multiple discrete components.
A fifth object of the present invention is to provide the flexibility of a modular design to WDM systems based on individual laser transmitters.
In that regard, the present invention provides a modular connector having multiple ports, comprising a housing having a first end and a second end, a first optical port on the first end, a second optical port on the first end, a third optical port on the second end, a fiber Bragg grating (FBG) within the housing optically connected to the first port, said FBG configured to reflect a set wavelength back and away from the first port, a fiber coupler within the housing optically connected to the FBG, the second port, and the third port; and wherein each of said optical ports, once connected, is capable of supporting the housing without additional support.

Modular wavelength division multiplexing (WDM) connector


A valve train device for switching a lift of gas exchange valves of an internal combustion engine includes a camshaft. A cam group includes at least two cams disposed on the camshaft. At least one lever is mounted axially displaceably relative to the camshaft and is in contact with one of the at least two cams and includes an actuation region for a direct or indirect actuation of at least one gas exchange valve. An adjustment unit is operatively connected to the lever so as to displace the lever. The unit includes at least one rotatable adjustment shaft, at least one sleeve having at least one guide track mounted on the shaft non-rotationally and axially displaceably, an engagement element fixed to a housing and engaging permanently in the at least one guide track and supporting the at least one sleeve with respect to the housing, and a further engagement element.

Valve train devices may have an apparatus for switching the lift of gas exchange valves.
A variable valve train is described in US patent specification U.S. Pat. No. 4,354,460, in which a displaceable rocker arm is provided so as to switch between two axially adjacent cams having different cam contours for actuation of the associated gas exchange valve. To this end, a hydraulic unit is provided, with which the rocker arm can be axially displaced on a rocker arm shaft arranged parallel to the camshaft. To this end, a hydraulic piston is provided, to which hydraulic pressure can be applied alternately and which moves a piston rod fastened to the piston. The piston rod is guided within the rocker arm shaft and is connected to the respective rocker arm via recesses. Spring assemblies are arranged on the piston rod and temporarily store the energy for switching the rocker arm until the axial displacement of the rocker arm is released. Each rocker arm of an internal combustion engine is thus displaced axially by means of a plurality of cylinders upon actuation of the hydraulic piston at an accordingly predefined moment in time during encroachment of the base circle overlapping the cams. To actuate the gas exchange valve, a bucket tappet is used, of which the diameter corresponds at least to the displacement path of the rocker arm so that the rocker arm contacts the bucket tappet in each switching position and can thus actuate the gas exchange valve.
Patent specification DE 33 19 755 C2 describes a valve actuation/switching apparatus for an internal combustion engine, in which the two cams, each associated with a gas exchange valve, are partitioned to reduce the necessary switching path of the rocker arm. Each of the two cams is therefore partitioned into two sub-cams. Due to the alternating arrangement of the partitioned cams, the axial displacement of the rocker arm on the rocker arm shaft provided therefor eon be reduced by half of the original cam width. The overall space is thus reduced.

Valve train for internal combustion engines for actuating gas exchange valves

IAV GmbH Ingenieurgesellschaft Auto und Verkehr


A method for manufacturing a semiconductor device, includes sequentially forming a first insulation film and a dummy gate electrode on a semiconductor substrate; forming a lightly doped junction region by using the dummy gate electrode as a mask, forming a first spacer on a side wall of the dummy gate electrode, and then forming a heavily doped junction region. The method further includes forming a second insulation film on the semiconductor substrate where the heavily doped junction region is formed, and removing the dummy gate electrode to form a cavity exposing a portion of the first insulation layer; forming a second spacer on a side wall of the cavity; sequentially forming a gate insulation film and a gate conductor on the second spacer, and then removing the second insulation film and a portion of the gate insulation film; and forming a salicide film on a top of the gate conductor and in the lightly doped junction region.

As semiconductor devices are gradually becoming more highly-integrated, a short-channel transistor fabrication technology is required. However, a short-channel effect which reduces the effective channel length occurs due to the lateral diffusion of source/drain diffusion layer. In general, the short-channel effect reduces the amount of ion implantation in a lightly doped junction region, thus minimizing the effect thereof.
In addition, as the length of a gate electrode is shortened, a narrow line effect occurs. Since the narrow line effect disturbs the formation of salicide, the effect of disturbance is minimized in such a manner to change the type of metal layers in order to deposit a salicide film.
However, the reduction of the amount of ion implantation in a lightly doped junction region gives rise to problems such as deterioration caused by a hot carrier effect becomes more noticeable and the resistance of the lightly doped junction region is increased. Moreover, the formation of salicide is disturbed by the narrow line effect, thereby leading to an increase in the resistance of a gate electrode. This causes a transistor operating signal of a semiconductor device to be distorted, which lowers the reliability of the semiconductor device.
Besides, new equipment should be used in order to change the type of metal layers. This makes the productivity of semiconductor devices decreased owing to the introduction of high-cost production facilities.

Method of manufacturing semiconductor device


X-rays enter an airtight chamber through a beam duct, pass through a transmission window, and expose a wafer and mask disposed outside the airtight chamber. The wafer and mask are held by a wafer chuck and a mask holder, respectively. The mask holder includes a pressure sensor, which detects variations in the atmospheric pressure. An output from the pressure sensor is converted into a change in the intensity of the x-rays by an arithmetic unit, and is transmitted to a control unit, which controls a driving unit of a shutter. By thus controlling the moving speed of the shutter in accordance with variations in the atmospheric pressure, it is possible to prevent variations in the amount of x-ray exposure of the wafer.

1. Field of the Invention
This invention relates to an x-ray exposure apparatus for exposing a pattern on a substrate, such as a wafer or the like, using soft x-rays or the like, and a semiconductor-device manufacturing method using such an apparatus.
2. Description of the Prior Art
X-ray exposure apparatuses have been proposed which use synchrotron radiation (SOR) light or other kinds of soft x-rays, and in which the portion of the optical path of illuminating light which is located before a mask is disposed in a vacuum or in a He atmosphere to reduce the attenuation of x-rays, while the mask, a substrate (such as a wafer or the like) units to carry these components, and the like are disposed in air.
An exposure method which utilizes x-rays as illuminating light is effective for printing a circuit pattern having a fine line width which is less than the limit of the resolution of a reduction projection exposure apparatus which utilizes ultraviolet rays.
In order to realize such a fine line width, each of the factors which cause errors in the accuracy of the line width must be controlled within a predetermined accuracy.
These factors, for example, relate to accuracy in the production of the mask, a resist process for the wafer, and the resolution of the exposure apparatus.
An x-ray exposure apparatus, in general, adopts a so-called proximity exposure method in which an exposure operation is performed while a mask is disposed close to a wafer. In this method, the line width of a pattern to be exposed is influenced, for example, by Fresnel diffraction due to pattern edges of the mask, and the half shadow of illuminating light. The degree of such influence varies in accordance with variations in the amount of exposure, which is the product of the exposure time and the intensity of illuminating light or the absorption power of a resist.
Accordingly, in order to increase the resolution of the exposure apparatus and precisely control the line width of a pattern to be printed, it is necessary to precisely control the amount of exposure.
The specifications of the necessary control accuracy of the amount of exposure of an exposure apparatus are calculated in the following manner.
If the target accuracy of the line width of a pattern is assumed to be .+-.5% for a line width of 0.3 .mu.m, the line width must be controlled within a range of 0.3.times.0.05=0.015 (.mu.m). If the portion of the overall error allocated to the printing accuracy of the exposure apparatus is assumed to be half the overall value, then the permissible variation in printing accuracy equals 0.015.times.1/2=0.0075 (.mu.m). That is, variations in the line width caused by the exposure apparatus must be controlled within 0.0075 .mu.m.
The influence of control accuracy of the amount of exposure on the line width due to Fresnel diffraction and half shadow of the light source of the apparatus is described, for example, in NTT R & D, April 1990, p. 605.
According to the result of experiments in this report, the line width changes 0.002 .mu.m when the amount of exposure changes 1%. This value substantially coincides with the result of calculation made in consideration of Fresnel diffraction and the like.
Accordingly, in order to provide accuracy in the line width of less than 0.0075 .mu.m, the following relationship must be satisfied: EQU 0.2.times..DELTA.D/D<0.0075 EQU .DELTA.D/D <0.0375,
where, .DELTA.D/D is the control accuracy of the amount of exposure.
That is, the control accuracy of the amount of exposure must be controlled within 3.75%.
The following factors which cause errors in the amount of exposure can be considered.
These factors comprise variations in the intensity of the light source, variations in the reflectivity of an x-ray mirror used in an x-ray optical system for expanding the exposure region and selecting x-rays having a predetermined wavelength, variations in the thickness of a partition window between the air and a He atmosphere or a vacuum-tight chamber for guiding illuminating light, variations in the density of He or the air in the optical path of illuminating light due to variations in the temperature or pressure of He or the air, variations in the thickness of a mask membrane, accuracy in the setting of the exposure time, and the like.
Among these factors, variations in the pressure of the air have the following influence.
If x-rays having a wavelength of 10 .ANG. pass a distance of 10 mm in air having a pressure of 1 atm, the intensity of the x-rays is attenuated about 90%. If the pressure changes 1% in this state, the intensity of the x-rays after passing that distance changes about 2.3%.
This value is not a negligible amount since the combined factors which cause errors in the amount of exposure must be controlled within the accuracy of about 3.75%.

X-ray exposure apparatus and semiconductor-device manufacturing method


A method, system and article of manufacture to provide debugging of a computer system from firmware. A debugger in a first computer system is initialized during the pre-boot phase of the first computer system, the debugger to operate from a firmware environment of the first computer system. A communication channel of the first computer system is initialized to enable a second computer system to be communicatively coupled to the first computer system. The debugger is entered in response to a debug event. The first computer system is examined with the debugger. In one embodiment, the firmware of the first computer system operates in accordance with an Extensible Firmware Interface (EFI) specification.

1. Field of Invention
The field of invention relates generally to computer systems and, more specifically but not exclusively, relates to debugging of a computer system from firmware.
2. Background Information
In typical computer architecture, the initialization and configuration of the computer system by the Basic Input/Output System (BIOS) is commonly referred to as the pre-boot phase. The pre-boot phase is generally defined as the firmware that runs between the processor reset and the first instruction of the Operating System (OS) loader. At the start of a pre-boot, it is up to the code in the firmware to initialize the system to the point that an operating system loaded off of media, such as a hard disk, can take over. The start of the OS load begins the period commonly referred to as OS runtime. During OS runtime, the firmware may act as an interface between software and hardware components of a computer system. As computer systems have become more sophisticated, the operational environment between the OS level and the hardware level is generally referred to as the firmware or the firmware environment.
Debugging errors and malfunctions in a deployed computer system can be difficult and expensive. When a problem is not repeatable in a laboratory, a technician must travel to the site of the computer system in order to evaluate the system. In some cases, the technician will attach an In-Circuit Emulator (ICE) to monitor the platform operations. Such probes may cost up to $25,000 each. Some ICEs are sandwiched between the central processing unit (CPU) and the motherboard, while others are connected to the platform via a Joint Test Action Group (JTAG) port on the motherboard. If the problem appears to occur randomly in several systems in a network, it becomes impractical and cost prohibitive to install multiple ICE's across multiple machines. Also, the technician often has to stay at the customer's location waiting for the error to repeat itself.
Current software debuggers have limited capabilities. They exist only during the OS runtime phase and do not provide debugging support during the pre-boot phase of the computer system. These debuggers are often OS applications so changes to a system's OS may require changes to the debugger.

Method and system to provide debugging of a computer system from firmware


A target for sport goal is configured to attach to a cross member of a goal, such as a hockey goal, a soccer goal, lacrosse goal, and other such goals. The target includes a sleeve member that has an interior radius corresponding to that of the intended goal to which it is mounted. Attachment slots receive an attachment strap to secure the sleeve to the cross member. Suspension slots are disposed to receive a suspension strap that secures a target in a desired orientation relative to the length of the sleeve. The target is configured such that the target provides an audible or visual indication when the target is struck by a game object, such as a puck, a ball, or the like.

The present invention relates to goal sports, and more particularly to a target for sports goals.
With an empty sports net, such as hockey, soccer, lacrosse, and the like, it is difficult to verify that the athlete's shooting accuracy is improving when they are taking a shot on goal. Other goal target devices either detach when struck or continue to swing when connected to the net and struck by the puck, ball, or other game object. This is inconsistent during team practices where shots come in succession.
As can be seen, there is a need for an improved goal target that is durable and secured into place, with a minimal residual swing.


Techniques involve determining a first slice distribution used to build first storage units in a first pool; in response to a determination that the first pool is expanded to a second pool, determining, at least based on a sum of the slices having been used to build the first storage units, a second slice distribution of updated slices used to build the first storage units in the second pool; determining, based on the first distribution and the second distribution, a first available number of slices and a second available number of slices available for building second storage units in the second pool, the second storage units being different from the first storage units; and determining, at least based on the first available number and the second available number, the number of the second storage units allowed to be built. Accordingly, available capacity allowed for building can be accurately estimated.

Before the mapper allocates storage units from Redundant Arrays of Independent Disks (RAID), the mapper will query how many storage units are currently available for the RAID. The RAID has to loop over all RAID resiliency sets (RRS) and sums up all available RRS capacity. The agreement between the mapper and RAID is that if the RAID promises that the mapper can allocate a predetermined number of storage units, the mapper should be able to allocate the predetermined number of storage units immediately without failure.
This means that RAID should perform the estimation based on the current utilization of each disk. When the slice pool is expanded by adding some new disks, the RAID may regroup disks into the new RRS and then reassign the existing disks to the new RRS group. Based on the storage unit reassignment, the RAID will rebalance to re-layout the storage units. At this time, when the mapper asks RAID for available capacity, the situation after rebalancing should be taken into account for the estimation of the available capacity.

Method for storage management, electronic device and computer program product


An electromechanical transmission includes a rotor supported by a rotor hub that has at least one passage formed therein for providing cooling fluid flow to the rotor. Preferably, cooling fluid is provided to the passage through an orifice to control flow rate. An inner diameter of the rotor is supported by the rotor hub and fluid is pooled by the rotor hub opposite the rotor inner diameter for cooling thereof. Preferably, fluid is thrown by centrifugal force from the rotor hub onto rotor ends and then onto an inner diameter side of stator windings of a stator surrounding the rotor. A method of cooling an electromechanical transmission is also provided.

Hybrid electric vehicles offer potential improvements in fuel economy and further reductions in emissions. A hybrid electric vehicle incorporates a traditional internal combustion engine combined with an electromechanical transmission having one or more electric motor/generators arranged in series or parallel and gearing arrangements such as planetary gear sets. The electric motor/generators assist in propulsion or energy absorption (storage) depending on the mode of operation. As with any energy conversion device, the motor/generators are less than 100 percent efficient, and reject some energy as heat. Efficient removal of this waste heat is required in order to achieve the objective of a fuel-efficient vehicle.

Electric motor/generator and method of cooling an electromechanical transmission


The present invention relates to a diamond-like coating for piston ring surfaces, comprising, an underlayer, a gradient layer and an AM layer, wherein the AM layer is a diamond-like coating doped with doping elements. The doping elements are one or a combination of at least two selected from the group consisting of Cr, Si and Ti, and the content thereof shows a cyclical change in a form of a sine wave fluctuation along with the thickness change of the AM layer. As compared with the conventional single-layer structure or gradient layer structure, the AM layer of such diamond-like coating has a multi-cycle transition structure since the content of the doping elements in the AM layer of such diamond-like coating shows a cyclical change in a sine wave fluctuation form. On the basis of having high wear-resistant and low friction coefficient, it is beneficial to decrease the internal stress of the coating, increase the tenacity of the coating, ensure the increase of the thickness of diamond-like coating, and improve the durability of piston ring of diamond-like coating at the same time.

A piston ring is one of the key parts of internal-combustion engine, and the abrasion thereof has a very important effect on overall fuel consumption of the engine. At present, vehicle engines (especially diesel engines) are developed in the direction of high mechanical loads, high output power (high heat load), low fuel consumption and low exhaust emission. Therefore, the piston ring tends to be thinner and lighter, which requires that the piston ring should have a very high strength (e.g., thermal fatigue strength), wear resistance, scuffing resistance, and sliding property which will not bring too much abrasion to the cylinder jacket.
In order to increase the efficiency and lifetime of the piston system, wear-resistant coatings with high hardness are widely used. Although hard coatings can greatly improve the wear-resistant lifetime of the friction pair of the cylinder jacket and piston ring, they have little effect on the friction coefficient during their relative motions.
One of the current effective solutions is to deposit a non-crystalline carbon coating having low friction and low wear characteristics, such as, for example, DLC (diamond-like carbon) coating, also called diamond-like coating.
Diamond-like coating shows wide application prospects in mechanical, electronic and biomedical science fields due to its high hardness, ultra-low friction coefficient, high wear resistance and corrosion resistance. However, the domestic well-known diamond-like coating has a smaller thickness, generally smaller than 5 μm, not exceeding 10 μm. Although such thinner diamond-like coating shows excellent low friction properties, such diamond-like coating cannot achieve the permanent function realization of engines to the piston ring surfaces under heavy pressure conditions because of insufficient durability.
At present, the bottleneck for promoting the application of the diamond-like coating mainly lies in that the diamond-like coatings prepared according to the current methods have higher internal stress. The greater the thickness of the coating, the larger the stress performance. When the thickness goes beyond 10 μm, peeling of the coating easily happens due to the high internal stress of the coating itself, so as to restrict the coating to have a greater thickness. In order to further extend the ability of diamond-like coating as functional protective coating, it is important to develop a suitable ultra-thick diamond-like coating.

Diamond-like coating for piston ring surfaces, piston ring and processes for preparing the same


The joining method for members according to the present invention includes: providing an aluminum component including an insertion hole provided with a rib in at least part of an edge part, and a hollow steel pipe; inserting the steel pipe into the insertion hole of the aluminum component; and expanding and deforming the steel pipe to join the steel pipe to the aluminum component by press-fitting.

A thin steel plate with high strength, which is called as high-tension steel, has been increasingly used for a structural member of an automobile. Such a high-tension steel is effective for weight reduction and safety improvement, but is heavier than a low specific gravity material such as aluminum. The high-tension steel has problems such as decrease of forming easiness, increase of a forming load, and decrease of dimensional accuracy due to its high strength. In order to solve these problems, in recent years, multiple-material approach has been adopted, in which extrusion molded products, cast products, or press molded products made of aluminum with a smaller specific gravity than that of steel plates is utilized together with steel parts.
In the multiple-material approach, joining of steel parts and aluminum parts involves a problem. In the welding technique typified by spot welding, a brittle intermetallic compound (IMC) is generated at the interface between a steel plate and an aluminum plate, so that practically applied joining techniques include electromagnetic forming bonding, screw fastening typified by bolts and nuts, friction stir welding (FSW), rivets, self-piercing rivets (SPR), mechanical clinching, and adhesion.
In press-fitting by electromagnetic forming, a solenoid formed coil is inserted into a pipe component fitted to a mating component, and followed by applying impact current to the coil so that induced current is induced in the conductive pipe by change in a magnetic field generated by applying impact current. Electromagnetic force is generated between magnetic field generated by the primary current of the coil and induced current flowing in the opposite direction along the circumferential direction of the pipe. This causes that the pipe receives outward moving force, and thus is enlarged and deformed to join the pipe to the mating component by press-fitting. This joining method is suitable for copper and aluminum, which are highly electrically conductive, and is practically used in parts of joining of automobile components.
JP 2007-284039 A discloses a press-fit joining technology by electromagnetic forming for multiple-material approach. In the technology of JP 2007-284039 A, a bumper reinforcement made of a metal material and having a hollow section is expanded and deformed by electromagnetic forming, and accordingly, fitted and joined to a hole provided to a bumper stay made of aluminum alloy.


A likelihood generation device is included in a receiving apparatus that receives a code-modulated signal including n−k information bits and k parity bits in N-dimensional arrangement, where N is a natural number greater than or equal to four, and n and k are natural numbers with k<n. The likelihood generation device includes: a temporary likelihood determination unit to determine, by using a table that includes an L-dimensional address space and stores a likelihood in each of the L-dimensional address spaces, likelihoods of an information bit and a parity bit that are transmitted by the code-modulated signal received, where L is a natural number with L<N; and a likelihood correction unit to update, among the likelihoods determined by the likelihood derivation unit, the likelihood of the information bit on a basis of a rule for generation of the parity bit.

In systems where long-distance, large-capacity transmission is carried out over optical fibers, low-cost achievement of high-speed, high-density signal demultiplexing and low-cost reduction of performance degradation associated with the transmission are challenging.
Transmission capacity per optical fiber can be increased if an optical transmission apparatus that transmits optical signals carries out dense wavelength multiplexing in order to make a plurality of optical carrier waves or optical sub-carrier waves, which are sub-carriers, carry different information items. The optical carrier waves and the optical sub-carrier waves that undergo multiplexing here are referred to as channels. Furthermore, the transmission capacity can also be increased even by using multi-level modulation.
Conceivable methods for achieving long-distance transmission and large-capacity transmission include using m-ary phase-shift keying (mPSK) and using m-ary quadrature amplitude modulation (mQAM). In other words, an increased number of constellation points for an increased number of transmission bits per symbol enables increased transmission capacity. In mPSK and mQAM, a signal is typically assigned to an in-phase axis (I axis) and a quadrature-phase axis (Q axis).
Polarization multiplexing is a known method of doubling the number of transmission bits per symbol. With polarization multiplexing, a signal can be assigned to two independent orthogonal polarization components, namely, a vertically polarized wave and a horizontally polarized wave.
In an optical transmission system where polarization multiplexing mPSK or polarization multiplexing mQAM is used, a receiving end uses a digital coherent method in which mixed interference is caused between a receive signal and continuous light produced by a local oscillation light source for coherent detection, and the electrical signal obtained by the coherent detection undergoes digital signal processing for compensation. In the digital coherent method, dual-polarization (DP) quadrature PSK (QPSK) is widely used (refer to, for example, Non-Patent Literatures 1 and 2).
In mPSK and mQAM, m is typically two raised to the power n (n: an integer greater than or equal to one), and thus n-bit information communication is enabled. Meanwhile, restricting typical signal constellations in mPSK and mQAM to improve the performance is code modulation that is being examined (refer to, for example, Non-Patent Literatures 3 and 4). In the simplest conceivable example, bits for communication in one block are (n−1) in number, and constellation points are prepared for the n bits in that one block. The (n−1) bits for communication are exclusive-ORed for generation of one parity bit to carry out communication using constellation points for n bits. Working on, for example, two orthogonal polarizations, two orthogonal phases, and a plurality of time slots all together is a typical method of constructing a block. N-dimensional modulation is the name used when coordinate axes are N in number. N is an integer greater than or equal to one. The N-dimensional modulation has a limited improvement in performance compared with an error correction code that has a long code length. However, the N-dimensional modulation is advantageous in that the number of information bits and the number of parity bits can be varied in relation to each other, so that spectral efficiency can be flexibly varied. For example, polarization switched-QPSK (PS-QPSK) that achieves three bits per symbol is a predominant intermediate solution between typical DP-QPSK that achieves four bits per symbol and DP-binary phase-shift keying (DP-BPSK) that achieves two bits per symbol.
In long-distance optical transmission, it is necessary to achieve the optical signal-to-noise ratio that corresponds to, for example, a bit rate, modulation, and a detection method in order to ensure the signal quality at a receiving end. To this end, signal transmission requires high optical power, and when this is the case, waveform distortion ascribable to nonlinear optical effects in the optical fiber causes degraded signal quality. The nonlinear optical effects can be classified broadly into effects that take place in a channel and effects that take place between channels.
Self-phase modulation (SPM) is one example a nonlinear optical effect that takes place in a channel. In narrower definitions, SPM is classified as intra-channel SPM (ISPM), intra-channel cross-phase modulation (IXPM), intra-channel four-wave mixing (IFWM), or the like. Furthermore, nonlinear optical effects that take place between channels include cross-phase modulation (XPM), four-wave mixing (FWM), and cross-polarization modulation (XPolM). The nonlinear optical effects more markedly take place in a channel and between channels when a signal is of high optical power density, when the optical power density of a signal varies greatly, and when the transmission distance is long. Moreover, in the case of the nonlinear optical effects that take place between channels, there is a long correlation between polarization states of respective optical signals of the channels in a transmission line when local chromatic dispersion is small in the transmission line or when the wavelength spacing between channels that undergo wavelength multiplexing is small. Continued interaction leads to markedly degraded quality.
By restricting the possible combination of constellation points, code modulation reduces power variation in optical signals and thus can also improve tolerance to the nonlinear optical effects. In the 4-dimensional 2-ary amplitude 8-ary PSK (4D-2A8PSK) described in Patent Literature 1, for example, four dimensions formed by two orthogonal polarizations, two orthogonal phases, and one time slot form one block, and each of the polarizations has a 2-ary amplitude 8-ary PSK (2A8PSK) signal constellation. With 4D-2A8PSK, bits used communication in one block are six in number, and constellation points are 256 in number for eight bits in that one block. FIG. 13 illustrates bit mapping and symbol mapping for 4D-2A8PSK. The left side of FIG. 13 illustrates a 4D-2A8PSK signal constellation in an X-polarization plane as well as in a Y-polarization plane, and the correspondence between four bits to transmit and each of the constellation points. Each of the three bits on the left side of the comma are information bits, while a single bit on the right side of the comma is a parity bit. As illustrated in FIG. 13, in communication using 4D-2A8PSK, of the six information bits for communication, three bits are Gray-coded and are assigned to the phase of an X-polarized wave, and the other three bits are Gray-coded similarly and are assigned to the phase of a Y-polarized wave. Moreover, these six bits are exclusive-ORed to generate one parity bit that is assigned to the amplitude of the X-polarized wave, and a second parity bit is obtained by inversion of the first parity bit assigned to the amplitude of the X-polarized wave and is assigned to the amplitude of the Y-polarized wave. In this way, with 4D-2A8PSK, the eight bits in total are transmitted in one block. As such, optical signal power per time slot is constant with respect to any bit combination. Although 4D-2A8PSK that achieves the constant optical signal power can achieve a spectral efficiency of six bits per symbol, which is the same as that of DP-8QAM, 4D-2A8PSK has high tolerance to the nonlinear optical effects compared with DP-8QAM with which optical signal power varies depending on bit combination. The 4D-2A8PSK that allows transmission of six information bits in one block is hereinafter referred to as 6b4D-2A8PSK.

Likelihood generation device, receiving apparatus, likelihood generation method, and optical transmission system


A voltage converter is disclosed which converts an open circuit voltage from approximately 80 volts to about 120 volts DC. The voltage source which is converted is supplied by a welding machine. The converted voltage is used to power electric tools while drawing a relatively small amount of power from the welding machine. The converter includes a housing with two input leads for connection to the welding machine and an output receptacle in which electrical tools are plugged to receive power. Inside the housing are the components of the voltage conversion circuitry which latter is adapted to convert to an output voltage at the desired level. In an alternative arrangement, the circuit may produce an AC output voltage instead.

1. Field of the Invention
The present invention relates generally to voltage converters, and more particularly, to a converter adapted to convert the power output by a welding machine to the level of a wall socket, i.e. approximately 120 volts.
2. Description of the Prior Art
Voltage converters generally are well known. For example, U.S. Pat. No. 4,486,646 dated Dec. 4, 1984 discloses an apparatus and method for generating a ramp voltage and using it as a control signal in the electrode circuit of an arc welder. U.S. Pat. No. 4,907,246 dated Mar. 6, 1990 describes a magnetically controlled variable transformer for controlling AC output power. U.S. Pat. No. 4,943,699 discloses a power supply for both arc welding and plasma cutting. U.S. Pat. No. 4,943,763 dated Jul. 24, 1990 discusses a ferroresonant transformer having dual outputs which are electrically and magnetically isolated. This includes a core, primary coil and two pairs of secondary windings. Each secondary winding having an output terminal. Finally, U.S. Pat. No. 4,948,987 discloses a secondary power source having a voltage level stability substantially independent from otherwise influential changes in primary power circuit levels.
Frequently, it is desirable to use more than one electrical device at a work site where a welding machine is being used. Conventional welding machines are usually powered by a portable gasoline engine generator at a work or construction site. The voltage output of such generators although quite adequate to power the welding apparatus is usually insufficient to power a conventional electrical power tool, for example. The present invention eliminates the need for a separate source of electrical power for such ancillary electrical tools or other devices by enabling the latter to merely be plugged into the welding set and its source of power.
The voltage converter of the present invention is attached to the welding apparatus and provides a power source for other electrically powered tools within the workers' easy reach. This invention, therefore, eliminates the need for a separate electrical power source dedicated solely to the ancillary electrical tools. Other advantages of the present invention will become evident from the ensuing description.


The present invention relates to a process for making self-patterning substrates comprising the steps of providing electrically conductive traces on a substrate; pre-coating the substrate with at least a layer of complementary reactant electrically resistant reactant formulations; altering the conductivity of complementary reactant formulation selectively upon application of external source of energy and a self-patterning substrate using the said process.

Printed circuit boards are used in a wide variety of electronic devices. The boards serve to support the electronic circuit components of the devices while "printed" filaments of conductive material (called traces) on the surface of the insulating board substrate, supply power to and interconnect the circuit components mounted on the board surface. In multilayer boards, some of the traces run between insulating layers in the interior of the board.
Printed traces or coatings perform the same function as wires but have several advantages over wires. For instance, since the traces are printed on the board, they are considerably less bulky than wire. Printed traces also eliminate the need for labor required to interconnect electronic components with wire, such as cutting the wire to appropriate lengths, stripping insulation off the wire, soldering individual wires to component leads, etc.
The electrical circuits on a substrate (e.g., printed circuit boards) are generally manufactured using etching/lithography technologies that involve time consuming processes (i.e., electroplating, masking, etching, etc.) and expensive tooling. For example U.S. Pat. No. 4,448,804 (by Amelio, W. J. et. al), U.S. Pat. No. 6,046,107 (by Lee, C. et. al), U.S. Pat. No. 6,951,604 (by Katayama, N. et. al) detail the electroplating of metals onto non-conductive surfaces and flexible boards. The solvents used in etching process are often corrosive and limit the choice of substrates for printing conductive patterns. Consequently, conventional etching processes are not economically viable for rapid prototyping and/or low volume/customized manufacturing of electric circuits. For these reasons, direct printing of conductive patterns has attracted tremendous attention in recent years.
The printing of electrically conductive inks has been known for quite some time (dating back to one of the early U.S. Pat. No. 3,043,784 by Remer, R. K. which discloses the formulation of carbon particles based conductive inks). Further improvements to the concept of generating electrically conductive coatings including graphite, metal flakes and metal coated glass spheres could be found in the U.S. Pat. No. 4,410,307 (by Collins, E. J. et. al. in the context of flash lamp array circuits); U.S. Pat. No. 5,098,771 (by Friend, S. O. on the use of carbon fibrils for conductive inks), U.S. Pat. No. 6,555,024 (by Ueda, T. et. al on formulation of pressure sensitive conductive ink formulations). Further, U.S. Pat. No. 5,286,415 by Buckley, M. S. et. al., report the formulation of aqueous, silver metal based conductive inks for thick film formation. However, all of the above mentioned patents suffer from the limitations of using conductive particles (i.e., carbon or graphite or metal particles) that provide only certain range of conductivities (typically low when compared to metal traces) with low printing resolutions and have prolonged curing times. Further, the above ink formulations are amenable to a few specific printing methods, materials and coating thicknesses and have limited applications and relevance in the context of modern printed electronics (e.g., PCBs, digital displays, RFID tags and photovoltaic cells) that demand faster and cost effective manufacturing processes.
WO 03/050824 by Johan, L. et. al discloses the formation of conductive traces using polyanions and intrinsically conductive polymers. However, organic conductors have poor stabilities compared to their inorganic counterparts such as metals and metal oxides, which exhibit wide range of conductivities and a variety of functional properties. Therefore, the metal or metal oxides based conductive coatings disclosed herein offer distinct chemical, physical, electrical and functional properties that cannot be obtained by organic conductive coatings.
Park, B. K. et. al report the direct writing of copper conductive patterns in Thin Solid Films, 515, 2007 (7706-7711) using inkjet printing methods, where copper particles were dispersed in the premixed solvent followed by ball milling for 12 hours and filtering through a 5 μm nylon mesh prior to printing. Finally, the printed coatings are sintered at high temperature under vacuum conditions. Although, the patterns generated are granular and have reasonable conductivities, and resolutions, the cumbersome processes involved makes it impractical for any commercial applications.
Physical Vapor Deposition (PVD), sputtering and Chemical Vapor Deposition (CVD) and related techniques are known to produce high quality conductive patterns, but high equipment, materials, and related costs, and low productivity make them difficult to be cost competitive against direct printing methods that are continuous. Therefore, there exists a need for printing a broad range of conductive elements and patterns with varying degree of viscosities, chemical compositions and functionalities using a simple printing methodology that is faster, continuous and cost effective. The present invention of self-patterning substrates eliminates the limits of several of the existing electronic feature printing methodologies by accommodating a wide range of coating techniques, viscosities and chemical composition by taking advantage of pre-coated single or multilayer complementary reactant coatings formulations that are electrically resistant or insulating and generate conductive patterns/coatings in response an external source of energy.
The present invention provides an alternate direct printing method for generating conductive traces on rigid and flexible substrates that are pre-coated either in part and/or in full with single and/or multiple layers of complementary chemical reactant formulations, which are electrically resistant. The transformation of resistant layers selectively into conductive traces on demand by an external energy source (such as localized source of heat, spark, microwave, pressure, light or laser or optical or electromagnetic or photochemical radiation) results in required conductive patterns with high resolution. The complementary reactant formulations may also be coated onto rigid or flexible substrates bearing conductive surfaces so that the conductive layers could be selectively turned into electrically resistant layers in order to generate conductive patterns in a subtractive fashion. These self-patterning substrates offer rapid and cost effective methods for printing electrical circuits for a variety of applications, such as Printed Circuit Boards (PCBs), antennas (RFID), flex/micro circuits, customized/disposable electronics, digital displays, photovoltaics, transistors, medical diagnostics and drug delivery devices.

Process for making self-patterning substrates and the product thereof


Mixed alkoxylated alcohol-hydroquinone or alkoxylated alcohol-resorcinol borates are effective multifunctional antioxidants for lubricants.

This application is directed to novel additive products comprising mixed alkoxylated alcohol-hydroquinone or resorcinol borates which when incorporated into oils of lubricating viscosity or greases thereof provide superior lubricant compositions having excellent antioxidant activity and antiwear performance.
Lubricants, such as lubricating oils and greases, are subject to oxidative deterioration at elevated temperatures or upon prolonged exposure to the elements. Such deterioration is evidenced, in many instances, by an increase in acidity and in viscosity, and when the deterioration is severe enough, it can cause metal parts to corrode.
Antioxidants or oxidation inhibitors are used to minimize the effects of the oil deterioration that occurs. The degree and rate of oxidation will depend on temperature, air and oil flow rates and, of particular importance, on the presence of metals or contaminants that may catalytically promote oxidation. Antioxidants generally function by prevention of chain peroxide reaction and/or metal catalyst deactivation.
Water (moisture) is another critical problem. In spite of even extraordinary precautionary efforts, water is found as a film or in minute droplets in vessels containing various hydrocarbon distillates. This brings about ideal conditions for corrosion and damage of metal surfaces of the vessels and the materials contained therein. Also in the lubrication of internal combustion engines, for example, significant quantities of water are often present as a separate phase within the lubricating system. Another serious problem in respect to metallic surfaces in contact with adjacent metallic surfaces is wear caused by the contact of such surfaces.
One material capable of simultaneously and effectively coping with these and related problems is highly desirous. It has now been found that the use of these novel mixed hydroquinone or resorcinol-alkoxylated alcohol borates provides exceptional antioxidant, antiwear and corrosion inhibiting activity with potential antifatique, friction reducing, antirust and high temperature stabilizing properties.
The use of hydroquinone and resorcinol is well known because of their antioxidant properties in a variety of petroleum and non-petroleum products.
The use of borates has found extensive application in such diverse areas as grease additives, brake and hydraulic fluids, and fuel and combustion additives.
The use of alkoxylated alcohols or alkoxylated phenols has been widely reported as having beneficial multifunctional characteristics in a variety of fuel and lubricant applications.
It is an object of this invention to provide lubricant compositions of improved multifunctional capability, e.g., antioxidant, antiwear and antirust/anticorrosion characteristics. It is a further object to provide novel lubricant additive products derived from mixed alkoxylated hydroquinone or resorcinol borates.

Mixed alkoxylated alcohol-hydroquinone/resorcinol borates-antioxidants


Provided is a molded body with a hollow portion comprising tetrafluoroethylene and perfluoro(alkyl vinyl ether) copolymer, which is obtained by heat treating a molded body with a hollow portion obtained by melt molding tetrafluoroethylene and perfluoro(alkyl vinyl ether) copolymer having a melt flow rate of 0.1 to 100 g/10 min when measured with a load of 5 kg and a measurement temperature of 372±0.1° C. in accordance with ASTM D1238. The heat treatment is carried out at a temperature from 130° C. below the melting point of the copolymer to the melting point of the copolymer. The molded body exhibits excellent blister resistance when utilized in contact with harsh chemicals and under harsh operating conditions.

Fluorine resins have excellent chemical properties, electrical properties, mechanical properties and surface properties and are used in a wide range of applications. Among these fluorine resins, copolymers of tetrafluoroethylene (TFE) and perfluoro(alkyl vinyl ether) (PAVE) (such copolymers also commonly referred to as PFA in this field) demonstrate the desirable properties of a fluorine resin, but also have excellent heat resistance, chemical resistance, purity (can be manufactured chemically inert without containing additives), and stress crack resistance. Furthermore, because they have melt fluidity (i.e., are flowable when molten), they also have a property where thermal melt molding is possible. Therefore, they are used for manufacturing semiconductors and liquid crystals, or as molding materials for pipes that transport a variety of chemicals used in chemical plants, and the like. They are also used as molding materials for pipe joints, storage containers, pumps and filter housings, tubes and fittings. In particular, PFA pipes are commonly used in the transport of liquid chemicals.
PFA molded bodies demonstrate excellent chemical resistance. However, because they are utilized in manufacturing semiconductors or liquid crystals, and in chemical plants and the like under extremely severe chemical, thermal, and physical environments as well as compound environments thereof, they are subjected to physical damage due to chemical attack, sudden temperature and pressure changes, impregnation and permeation of chemical liquids and gases, and interactions thereof. Consequently, it is known that blisters, which are swelling or bubble-like structures, and microcracks are known to occur in the molded body. When blisters occur in a molded body such as a tube or the like, the outer surface develops bumps, and there is a possibility that long-term use will be impaired.
In chemical liquid supply pipes made of PFA, it is known that a small amount of chemical liquid will permeate through the walls of the pipe, and methods to reduce the amount of chemical liquid permeation have been proposed. For example, reducing the amount of permeation of nitric acid by using a terpolymer, where PFA has been modified by a long chain perfluoro vinyl ether, has been proposed in Japanese Unexamined Patent Application 2001-151852 (Patent Document 1). However, the occurrence of blisters cannot be controlled even when this method is used. Furthermore, a method of coating a PFA tube with a resin having a lower permeability has been proposed in Japanese Unexamined Patent Application 2007-292292. With this method, the degree of adhesion at the interface between the PFA and the coating resin is weak, and the occurrence of blisters at the interface has been reported.

PFA molded body with excellent blister resistance and method of controlling occurrence of blisters in PFA molded body

CHEMOURS-MITSUI FLUOROPRODUCTS CO., LTD.


Shaped medical devices, e.g. stents, having improved mechanical properties and structural integrity are disclosed. The devices comprise shaped polymeric hydrogels which are both ionically and non-ionically crosslinked and which exhibit improved structural integrity after selective removal of the crosslinking ions. Process for making such devices are also disclosed wherein an ionically crosslinkable polymer is both ionically and non-ionically crosslinked to form a shaped medical device. When implanted in the body, selective in-vivo stripping of the crosslinking ions produces a softer, more flexible implant having improved structural integrity.

1. Field of the Invention
This invention relates to medical devices comprising polymer hydrogels having improved mechanical properties.
2. Description of Related Art
Medical devices adapted for implant into the body to facilitate the flow of bodily fluids, to serve as vascular grafts or for other purposes have been developed. Typically, these devices include stents, catheters or cannulas, plugs, constrictors, tissue or biological encapsulants and the like.
Typically, many of these devices used as implants are made of durable, non-degradable plastic materials such as polyurethanes, polyacrylates, silicone polymers and the like, or more preferably from biodegradable polymers which remain stable in-vivo for a period of time but eventually biodegrade in-vivo into small molecules which are removed by the body by normal elimination in the urine or feces.
Typical of such biodegradable polymers are polyesters, polyanhydrides and polyorthoesters which undergo hydrolytic chain cleavage, as disclosed in U.S. Pat. No. 5,085,629; crosslinked polysaccharide hydrogel polymers as disclosed in EPA 0507604 A-2 and U.S. Pat. No. 5,057,606 and other ionically crosslinked hydrogels as disclosed in U.S. Pat. Nos. 4,941,870, 4,286,341 and 4,878,907.
EPA 0645150 A-1 describes hydrogel medical devices prepared from ionically crosslinked anionic polymers, e.g. polysaccharides such as calcium alginate or ionically crosslinked cationic polymers such as chitosan, cationic guar, cationic starch and polyethylene amine. These devices are adapted for more rapid in-vivo disintegration upon the administration of a chemical trigger material which displaces crosslinking ions.
Hydrogels offer excellent biocompatibility and have been shown to have reduced tendency for inducing thrombosis, encrustation, and inflammation. Unfortunately, the use of hydrogels in biomedical device applications has often been hindered by poor mechanical performance. Although many medical device applications exist where minimal stresses are encountered by the device in-vivo, most applications require that the device survive high stresses during implantation. Hydrogels suffer from low modulus, low yield stress and low strength when compared to non-swollen polymer systems. Lower mechanical properties result from the swollen nature of hydrogels and the non-stress bearing nature of the swelling agent, e.g., aqueous fluids.
Accordingly, there is a need in the art to provide shaped medical devices which not only offer the advantages of polymer hydrogels in terms of biological compatibility, but which also have improved mechanical properties, e.g. improved strength and modulus properties, such that they retain their shape and stiffness during insertion into the body, such as by delivery through an endoscope, and which also can swell and soften inside the body to enhance patient comfort.

Medical devices comprising cross-linked hydrogels having improved mechanical properties