Provided is an eco-friendly poly(propylene carbonate) resin composition for a sheet, which is characterized by using a poly(alkylene carbonate) resin developed by efficiently utilizing carbon dioxide, which is a major contributor to global warding, as a main material, and including appropriate additives, such as, a strength modifier, and a flexibilizer, thereby completely solving environmental hazards controversy of the existing polyvinyl chloride resin products; exhibiting excellent mechanical and thermal properties, processability, post processability (printability, embossing and surface treatment, laminating characteristics) and superior anti-flaming property (low smoke density) and elongation characteristics as compared with the existing polyvinyl chloride resin products; and overcoming an extruding production method which is a small-sized production manner, corresponding to a big defect in thermoplastic plastics emerged as substitutes for polyvinyl chloride resin products and thus applying a calendering process method which is a mass production manner.

Sheets including films account for about 30% of poly(vinyl chloride) (PVC) products. Among them, about 8% of the sheets are manufactured by coating a plastic sol where paste poly(vinyl chloride) resin is dispersed in additives such as a plasticizer, a stabilizer, and the like, on a substrate retaining a sheet form, such as, paper or fabric, followed by heating and then cooling, or are subjected to a calendering process.
These PVC sheets are mainly ornamental sheets, tarpaulin, a flooring material, wallpaper, packaging wrap, and the like. The ornamental sheet includes a decoration sheet and an interior sheet, which is a synthetic resin material used for decorating and finishing surfaces of products. The decoration sheet is used as a surface finishing material, such as interior building materials, furniture, electronic products, or the like, and refers to a synthetic resin material sheet having no adhesive layer. That is, it refers to a product where a print layer and a wear-resistant and scratch-resistant transparent film are laminated on a polyvinyl chloride or polypropylene material, and the classification and use thereof are as follows.
ClassificationUseOver-Layinterior and outerior buildingmaterials, doors, floorings,Membranefurniture for living room,shoe shelf, kitchen utensilsWrappingdoor frame, chassisEdgeedges of furnitures and thelikeCoating for steelelectronic goods, such asrefrigerator, air conditioner,and the like
The interior sheet is mainly used as an interior finishing material inside buildings, and refers to a synthetic resin material adhesive sheet where an adhesive agent is coated on one surface of a product. The main uses thereof are interior finishing materials for aircraft, railroad, marine or the like, including interior finishing materials for public buildings.
Tarpaulin is widely used for covers for various vehicles, leisure tents, industrial tents, roof covers for large-sized buildings, advertisement, and even for conveyer belts of various kinds of foods and products and for various rubber boats.
The flooring materials are classified into a residential flooring material for household and a commercial flooring material for public building and office. The wallpaper is classified for multi-use facility and for household. The packaging wrap is classified for household, for business purpose, and for food packaging.
Currently, most sheets are formed of mainly a polyvinyl chloride material, but replacement by olefin, polylactic acid, polyethylene terephthalate, or the like, is progressing due to various and wide regulations put on these products. With respect to environmental hazards controversy and regulatory trends put on polyvinyl chloride products, the cores of the controversy are that a large amount of dioxin, which is an environmental hormone, is generated when polyvinyl chloride itself is burned and a plasticizer, and that a stabilizer used as additives are in the center of worldwide regulations (WEEE/RoHS/REACH(SVCH)). Moreover, large amounts of poisonous gases, such as hydrochloric acid (HCl) and the like, and dioxins, which are fatal to the human body, are generated when polyvinyl chloride products are burned as wastes due to fire or difficulty in recycling. What is worse, it has been currently claimed that polyvinyl chloride itself is registered as EU ROHS restriction materials, and the more importantly, consumer groups are specifically demanding restrictions on the use of polyvinyl chloride products. For example, Greenpeace has spearheaded restrictions on the use of polyvinyl chloride resin in electronic products, and then electronic industries worldwide are copying Greenpeace. In particular, children and housewives, environmental pollution sensitive groups, tend to strongly refuse the polyvinyl chloride products and the trend thereof is increasing, and as a result, government regulations are being introduced.
Alternative materials employing eco-friendly universal plastic have been developed in order to solve problems of the polyvinyl chloride products. However, the alternative materials have problems in that physical properties are problematic, for example, they may be fragile in winter due to deficient flexibility thereof; process additives needs to be further used at the time of a post treatment process due to deterioration in printability, cutability, and adhesion, resulting in burden of expenses; and high costs are required due to producing by extrusion and high cost of the material itself, resulting in low economic feasibility.

Eco-friendly poly(alkylene carbonate) resin composition for high-transparency and high-gloss sheet


Silicon carbide whisker-reinforced ceramic composites are fabricated in a highly reproducible manner by beneficating the surfaces of the silicon carbide whiskers prior to their usage in the ceramic composites. The silicon carbide whiskers which contain considerable concentrations of surface oxides and other impurities which interact with the ceramic composite material to form a chemical bond are significantly reduced so that only a relatively weak chemical bond is formed between the whisker and the ceramic material. Thus, when the whiskers interact with a crack propagating into the composite the crack is diverted or deflected along the whisker-matrix interface due to the weak chemical bonding so as to deter the crack propagation through the composite. The depletion of the oxygen-containing compounds and other impurities on the whisker surfaces and near surface region is effected by heat treating the whiskers in a suitable oxygen sparaging atmosphere at elevated temperatures. Additionally, a sedimentation technique may be utilized to remove whiskers which suffer structural and physical anomalies which render them undesirable for use in the composite. Also, a layer of carbon may be provided on the surface of the whiskers to further inhibit chemical bonding of the whiskers to the ceramic composite material.

The present invention relates generally to ceramic composites of ceramic matrices reinforced with about 1 to 60 vol. % of elongated monocrystalline silicon carbide whiskers homogeneously dispersed therein, and more particularly to such composites wherein the whiskers are modified or beneficated to provide a relatively uniform whisker size distribution and the surface chemistry is modified to inhibit chemical bonding of the whiskers to the matrix material.
Recent developments in the strengthening or toughening of ceramic materials for reducing cracking and other deleterious structural problems associated with ceramic materials have enhanced their utilization in ambient temperature as well as high-temperature applications such as in the fabrication of heat engine components, bearings, valves, cutting tools and the like. For example, as described in U.S. Pat. No. 4,543,345 which issued Sept. 24, 1985, ceramic composites have been considerably toughened with respect to cracking by reinforcing the ceramic matrices with elongated monocrystalline silicon carbide whiskers in concentrations of about 10 to 60 vol.%. The ceramic composites are formed by mixing the silicon carbide whiskers with fine ceramic powders such as alumina, mullite, boron carbide, silicon nitride, zirconia, or yttria. These mixtures are blended to provide a homogeneous dispersion of the silicon carbide whiskers therein and are then hot-pressed at temperatures in the range of about 1600.degree. to 1950.degree. C. at pressures in the range of about 28 to 70 MPa for a duration of up to about 2.5 hours to provide SiC whisker-reinforced ceramic composites. These composites are characterized by a significant increase in fracture toughness over that afforded by the matrix material without the inclusion of the silicon carbide whiskers. Alternatively, the silicon carbide whiskers may be blended with the ceramic powders and formed into more intricate shapes than obtainable by hot-pressing by utilizing a pressureless sintering technique as described in U.S. Pat. No. 4,652,413 which issued Mar. 24, 1987. The SiC whiskers may also be incorporated into mullite and alumina matrices toughened with zirconia additions as described in U.S. Pat. No. 4,657,877 which issued Apr. 14, 1987. These patents are incorporated herein by reference.
The silicon carbide whiskers which are homogeneously dispersed within the ceramic matrix material described in the aforementioned patents provide the toughening for the ceramic composite by being contained in the ceramic material with a relatively weak chemical bond at the interface therebetween. Thus, when a SiC whisker-reinforced ceramic composite is subjected to a crack-inducing stress which is sufficient to cause a crack to propagate into the composite, the whiskers effectively act as "reinforcing bars" in that when the crack propagates into the ceramic matrix material and the crack encounters a whisker the weak chemical interface debonds and the crack is forced to change directions and break around the whiskers. The whiskers also "bridge" the crack to deter further crack propagation. Alternatively, if the whisker is excessively chemically bonded to the ceramic matrix material to inhibit "crack-bridging" or whisker pullout, the whiskers will simply break as the crack propagates through the ceramic matrix material since sufficient bonding occurs at the whisker-matrix interface so that the whisker behaves essentially similarly to that of the monolithic ceramic matrix.
Silicon carbide whiskers of essentially a monocrystalline microstructure which are suitable for use in the fabrication of whisker-reinforced ceramic material as described in the aforementioned patents, are presently available from numerous manufacturers in wide variations of size with these whiskers being of a diameter in the range of about 0.1 to about 10 micrometers and a length of about 10 to 200 micrometers. These whiskers have a length to diameter ratio of at least about 10. It has been recently discovered that these commercially available silicon carbide whiskers as supplied by the various manufacturers, are subject to considerable variations in physical and chemical properties with these variations occuring even in batches supplied by the same manufacturer which may adversely affect their utilization for reinforcing ceramic matrices for crack toughening purposes as described above. Further, SiC whiskers, even when of the same dimensions and supplied by the same manufacturer in different lots, have been found to introduce significant differences in the fracture toughness of ceramic composites.
It has been found that these prob}ems are partially due to the fact that each lot or batch of whiskers supplied by any of the various manufacturers contains a considerable percentage of whiskers which have structural anomalies such as holes in the sides, hollow sections, significant diameter variations, length to diameter ratios less than about 10, or defect inclusions, as well as other structural features which detract from the strength of the individual whisker when utilized as a "reinforcing bar" in a ceramic composite. The concentration of the whiskers which are incapable of providing satisfactory ceramic fracture toughening varies from batch-to-batch but is normally in the range of about 1 to 25 wt. % of each batch of whiskers presently provided by the various manufacturers. Included with the defect whiskers is extraneous debris, such as rice hulls and SiC particulates from the whisker manufacturing process, that is associated with the whiskers.
An even more critical problem attendant with the presently supplied SiC whiskers is that the surfaces of the whiskers contain considerable concentrations of impurities or non-silicon carbide metals and compounds which are capable of chemically reacting with the ceramic material forming the matrix for effecting a relatively tenacious chemical bond between the whiskers and the ceramic material. This chemical bonding inhibits the necessary "de-bonding" between the whiskers and the ceramic material needed for providing the whisker crack-bridging, whisker pullout and crack deflecting properties in the ceramic matrix. Of these surface "impurities" it is believed that the most troublesome with respect to providing a chemical bond with the ceramic matrix material are silicon dioxide (SiO.sub.2) and calcium oxide (CaO) since these compounds are glassforming compounds and are usually present in the largest quantities and fuse the whiskers to the ceramic matrix when heated to a temperature greater than about 800.degree. C which normally occurs during the fabrication of the composites such as described in the aforementioned patents. These glass-forming compounds have been found to be present in significant concentrations on the surface of the whiskers presently provided by all of the commercial suppliers with these concentrations varying from manufacturer to manufacturer and from batch to batch from the same manufacturer. Based upon the analyses of the silicon carbide whiskers presently available from each of the several commercial suppliers, it is expected that silicon dioxide on the surface or near surface regions of the whiskers will be in the order of a silicon dioxide-to-silicon carbide ratio in the range of about 0.1 to 1.0. The concentration of calcium oxide is in the range of about 0.5 to 2 wt. % of the whisker.
In addition to the aforementioned impurities of silicon dioxide and calcium or calcium oxide on the surface or near surface regions of the silicon carbide whiskers it has been found that the commercially available whiskers also contain relatively small concentrations of boron, magnesium, iron, chromium, cobalt, manganese, nickel, sodium, zinc, and copper, and oxide-containing compounds thereof which are also capable of effecting a chemical bonding relationship with the ceramic matrix material during the fabrication of the composites.
The presence of the physical anomalies in each batch of the whiskers and the surface impurities on the surface or near surface regions of commercially available silicon carbide whiskers have been found by applicants to be the primary mechanisms responsible for the production of silicon carbide whisker-reinforced ceramics with heretofore essentially unexplainable large variations in fracture toughness even in similarly produced ceramic composites using the same whisker concentrations, sizes, and supplier. Therefore, it is believed that the manufacturers of silicon carbide whiskers are presently providing commercially available whiskers with large batch-to-batch differences in surface impurities and physical anomalies are apparently unaware of the problems that these impurities and physical anomalies cause in the manufacture and reproducibility of silicon carbide whisker-reinforced ceramic composites.
Some silicon carbide whiskers such as those obtained from rice hulls as described in the aforementioned patents and supplied by ARCO Metals, Silag, Operations, Green, S.C., and whiskers in a larger diameter range of about 0.5 to 5 .mu. m as prepared and supplied by Los Alamos National Laboratory at Los Alamos, N. Mex., have sometimes been found to possess a layer of free carbon on the surface of the whisker. It has been discovered by applicants that SiC whiskers with a layer of free carbon essentially covering exposed surface portions thereon did not become sufficiently chemically bonded to the matrix material so as to deter desired crack bridging or deflecting properties of the whiskers. This apparent lack of a "strong" chemical bond between the ceramic matrix material and the whiskers containing the layer of free carbon is believed to occur even if the surface or near surface regions of the whiskers contain silicon dioxide and/or calcium oxide in such concentrations that would, except for the presence of the layer of free carbon, effect a chemical bond of the whisker to the ceramic matrix sufficient to deter crack bridging. This layer of free carbon is believed to act as a barrier between the aforementioned glass-forming compounds and the ceramic matrix material to inhibit or detract from chemical bonding reactions between the whisker and the ceramic material. It has also been determined that this layer of free carbon is not purposely provided by the manufacturer on the surface of the SiC whiskers but is merely a by product of the particular whisker manufacturing process since it has been found that the free carbon on the whisker surfaces varies in concentrations or thicknesses from batch-to-batch with some batches of whiskers essentially lacking a layer of free carbon in a sufficient thickness to inhibit excessive chemical bonding of the whiskers to the matrix material due to the presence of the aforementioned surface impurities on the whiskers.

Ceramic composites reinforced with modified silicon carbide whiskers and method for modifying the whiskers


A light assembly includes an electrically powered light source, a hand-powered electric dynamo and a rechargeable battery. The hand-powered electric dynamo has the capability to power the light source and recharge the battery. A fastener is used to detachably mount the light source, dynamo and battery to the user. In providing the user with a detachably mounted light assembly having the capability to recharge the batteries thereon, a more reliable light source is provided for the user working under extreme and often dangerous conditions.

An individual will mount a lamp to their body in a variety of instances when entering an environment under low ambient light conditions. In order to work effectively in such environments, lamps have been designed to mount to various body portions of an individual to afford hands-free operation. To this end, lamps are known to the art that mount to the head, chest or belt of a user. Such lamps are routinely found in diverse settings that illustratively include mining, cave exploration, building salvage, subterranean excavation and construction, hiking, fishing, and wildlife management. Such conventional lamps are battery powered. The use of batteries to power a lamp worn by a user represents both a source of potential danger and an inconvenience. The reduction in light intensity associated with a failing battery or the catastrophic loss of illumination can jeopardize the safety of a user in a number of settings. Replacement of batteries in such a setting is highly impractical even if the user carries additional batteries. The use of replacement batteries or a backup set of batteries increases the weight burden a user must carry.
Thus, there exists a need for a user-worn lamp including a dynamo that facilitates field or emergency regeneration of the lamp.


An on-die termination includes: a code generator configured to generate a calibration code in response to a voltage of a first node and a reference voltage; a calibration resistor unit connected to the first node, and configured to be turned on and off in response to the calibration code; and a reference resistor unit coupled to the calibration resistor unit, and configured to be turned on and off in response to a control signal.

The present invention relates to an on-die termination (ODT) device used in various kinds of semiconductor integrated circuits such as memory devices, and more particularly, to an ODT device with improved resolution.
Semiconductor devices are implemented into integrated circuit (IC) chips such as central processing units (CPUs), memories, and gate arrays, and are incorporated into a variety of electrical products such as personal computers, servers and workstations. Most of semiconductor devices include a receiving circuit configured to receive signals from an outside world via input pads and an output circuit configured to provide internal signals to an outside world via output pads.
As the operating speed of electrical products increases, a swing width of a signal exchanged between semiconductor devices gradually reduces to minimize a delay time taken for signal transmission. However, the reduction in the swing width of the signal has a great influence on an external noise, causing the signal reflectance to become more critical at an interface terminal due to an impedance mismatch. Such an impedance mismatch is generally caused by an external noise, a variation of a power voltage, a change of an operating temperature, a change of a manufacturing process, etc. The impedance mismatch may cause a difficulty in a high-speed transmission of data and a distortion in output data. Therefore, if semiconductor devices receive the distorted output signal through an input terminal, it frequently gives rise to problems such as a setup/hold failure and an error in a decision of an input level.
In particular, in order to resolve the above problems, a memory device requiring high-speed performance employs an impedance matching circuit, which is called an on-die termination (ODT), near around an input pad inside an IC chip. In a typical ODT scheme, source termination is performed by an output circuit at a transmitting end, and parallel termination is performed by a termination circuit connected in parallel with respect to a receiving circuit coupled to the input pad.
ZQ calibration refers to a procedure of generating pull-up and pull-down codes which are varied with PVT (process, voltage and temperature) conditions. The resistance of the ODT device, e.g., a termination resistance at a DQ pad in a memory device, is calibrated using the codes obtained from the ZQ calibration. Herein, the term of ZQ calibration is attributed to the fact that the calibration is performed using a ZQ node.
Hereinafter, how the ZQ calibration is performed in an ODT device will be more fully described.
FIG. 1 is a block diagram of a calibration circuit having only a pull-up resistor unit in a conventional ODT device.
The conventional calibration circuit having the pull-up resistor unit includes a comparator 102A, a counter 103A, a reference voltage generator 104A, and a pull-up resistor unit 110A configured with a plurality of parallel resistors which are turned on/off in response to pull-up calibration codes PCODE<0:N>.
The comparator 102A compares a voltage of a ZQ node and a reference voltage VREF (generally, ½VDDQ) generated from the reference voltage generator 104A with each other, thereby generating an up/down signal UP/DOWN. An external resistor 101A and the pull-up resistor unit 110A are connected to the ZQ node. Here, the external resistor 101A has a resistance of 240Ω generally, and particularly it is connected to a ZQ pad on the outside of the ZQ node chip. Therefore, the voltage of the ZQ node is determined through voltage division of the external resistor 101A and the pull-up resistor unit 110A.
The counter 103A receives the up/down signal UP/DOWN to generate the pull-up calibration codes PCODE<0:N>, and the pull-up resistor unit 110A calibrates its resistance according to the pull-up calibration codes PCODE<0:N>.
The calibrated resistance of the pull-up resistor unit 110A affects the ZQ node voltage again, and the above-described operation is then repeated until the ZQ node voltage is equal to the reference voltage VREF. Hence, the calibration is performed so that a total resistance of the pull-up resistor unit 110A is equal to that of the external resistor 101A, e.g., 240Ω in general.
The pull-up calibration codes PCODE<0:N> generated during the calibration are inputted to ODT resistors of an input buffer having the same configuration, and thus used for impedance matching.
However, in the case where the resistance of the external resistor 101A is 240Ω and a target resistance of the ODT resistor actually used in the input buffer is 60Ω (in this case, four ODT resistors which are equal to the calibration resistors are connected in parallel at the input buffer), there must be offsets between resistances of the resistors in the calibration circuit and the resistances of the resistors (i.e., ODT resistors) in the input buffer so that the ODT resistor has a resistance different from the target resistance, that is, the ODT resistor cannot have the resistance of 60Ω. Accordingly, the pull-up calibration codes PCODE<0:N> should be modified in order that the ODT resistor of the input buffer may have the target resistance.
FIG. 2 is a circuit diagram illustrating the conventional reference voltage generator 104A of FIG. 1.
The reference voltage VREF should be ½*VDDQ in general, but a switch option allows the reference voltage VREF to change from ½*VDDQ to other voltage levels, as shown in FIG. 2.
As described above, since the pull-up calibration codes PCODE<0:N> are generated by comparing the reference voltage VREF and the ZQ node voltage with each other, the pull-up calibration codes PCODE<0:N> can be different depending on the changing of the reference voltage VREF.
However, according to this conventional method, resistors included in the reference voltage generator are implemented with an active resistor, which leads to a problem in that a circuit area inevitably increases and further it is difficult to precisely calibrate an offset value, i.e., a difference from the target resistance.
FIG. 3 is a block diagram of a calibration circuit having pull-up and pull-down resistor units in a conventional ODT device.
The calibration circuit adapted to perform ZQ calibration operation includes a first pull-up resistor unit 110B, a second pull-up resistor unit 120, a pull-down drive resistor unit 130, a reference voltage generator 104B, first and second comparators 102B and 105, and pull-up and pull-down counters 103B and 106.
Because the first pull-up resistor unit 110B, the first comparator 102B, and the pull-up counter 103B are performed in the same manner as those of FIG. 1, further description for them will be omitted herein.
As illustrated in FIG. 1, the pull-up calibration codes PCODE<0:N> generated during the pull-up calibration operation are inputted to the second pull-up resistor unit 120, thus determining a total resistance of the second pull-up resistor unit 120. Then, pull-down calibration begins to perform in a manner similar to the pull-up calibration. Specifically, the pull-down calibration performs in such a manner that a voltage of a first node A is equal to the reference voltage VREF using the second comparator 105 and the pull-down counter 106, that is, the total resistance of the pull-down resistor unit 130 is equal to the total resistance of the second pull-up resistor unit 120.
The pull-up and pull-down calibration codes PCODE<0:N> and NCODE<0:N> resulted from the pull-up and pull-down calibration operations are inputted to pull-up and pull-down resistors provided at input/output pads, which are similarly configured as the pull-up and pull-down resistor units of the calibration circuit of FIG. 3, thus determining the resistance of the ODT device. In a memory device, resistances of pull-up and pull-down resistors at a DQ pad are determined.
FIGS. 4A and 4B are graphs illustrating resistance variations of a pull-up resistor unit at input/output pads versus the pull-up calibration codes PCODE<0:N> when a target resistance is set to 60Ω and 40Ω, respectively.
In FIGS. 4A and 4B, an X-axis denotes the pull-up calibration code PCODE<0:N> expressed as a decimal number equivalent to a binary pull-up calibration code, and a Y-axis denotes a resistance of a pull-up resistor unit at input/output pads in ohms.
Referring to FIGS. 4A and 4B, while the target resistances that the pull-up resistor units at the input/output pad must have are merely 60Ω and 40Ω, respectively, a width of resistance variation of the pull-up resistor unit is considerably great. The resistance of the pull-up resistor unit changes greatly as the pull-up calibration codes PCODE<0:N> change by each one level, as well.
As such, since the resistance of the pull-up resistor unit greatly changes with respect to the variation of the pull-up calibration codes PCODE<0:N>, it is difficult to accurately match the resistance of the pull-up resistor unit to the target resistance. Accordingly, there is a problem in achieving an accurate impedance matching of the ODT device, causing a speed of a semiconductor device employing the ODT device to be degraded.
Of course, it is possible to increase the resolution of the ODT device by increasing number of resistors connected to the pull-up resistor unit in parallel and more finely fractionating the pull-up calibration codes PCODE<0:N>. However, this leads to a drawback that a total circuit area must be increased, which is a trade-off relationship with high-resolution performance.


A multi-chip package comprises a package substrate having bond fingers disposed thereon. A first chip have center bonding pads formed on a substantially center portion thereof. The first chip is disposed on the package substrate. Insulating support structures are formed on the first chip located outward of the bonding pads. A bonding wire is connected between one of the bond fingers and at least one of the center bonding pads. A second chip has is disposed over the bonding wire and overlying the insulating support structures.

1. Field of the Invention
The present invention relates to semiconductor devices and, more particularly, to a semiconductor multi-chip package and a method of manufacturing the same.
2. Description of Related Art
Conventional semiconductor chips have either a center pad configuration, wherein bonding pads 12 are formed on a center region of the chips, or a peripheral pad configuration, wherein bonding pads 14 are formed on a peripheral region of the chips. FIG. 1A is a plan view of a semiconductor chip having a center pad configuration and FIG. 1B is a plan view of a semiconductor chip having a peripheral pad configuration. The center pad configuration is generally more suitable for achieving high-speed operation of semiconductor devices.
Currently, the semiconductor industry is expending significant resources toward forming semiconductor multi-chip packages that can meet the demand for high packing density in high-speed, multi-functional semiconductor devices. As part of such efforts, the industry has proposed semiconductor multi-chip packages that include stacked chips having a peripheral pad configuration.
One such conventional multi-chip package is shown in FIG. 2. Referring to FIG. 2, a semiconductor multi-chip package includes stacked chips 20, 40, each having a peripheral pad configuration. The chips 20, 40 are stacked one on top of the other with a spacer 30 placed between them. Unfortunately, however, the multi-chip package of FIG. 2 cannot be assembled using a lower chip with a center pad configuration, because the center pads do not provide sufficient room between them for placement of a spacer.
FIG. 3 illustrates one conventional attempt to provide a semiconductor multi-chip package 32 having a lower chip 32 originally configured having a center pad configuration, i.e., pad wiring patterns (not shown) formed on a center region thereof ("center pad wiring patterns").
FIGS. 4 and 5 illustrate a technique for redistributing center pad wiring patterns 36 to peripheral bonding pads 38, in which an actual wire bonding process is performed. Referring to FIGS. 3-5, a conventional multi-chip package 32, according to this example, includes stacked chips 32, 34 originally configured having a center pad configuration. The center pad wiring patterns 36 of the semiconductor chips 32, 34 are redistributed from a center region to a peripheral region using redistribution patterns 39.
In other words, the center pad wiring patterns 36 are connected to the peripheral bonding pads 38 through the redistribution patterns 39. This allows for a spacer 37 to be placed between the bonding pads 38 on the lower chip 32 to form a multi-chip package 300 comprising stacked chips 32, 34 with the center pad wiring patterns 36.
Unfortunately, however, the cost of redistributing the pad wiring patterns is considerably high, and the process and package reliability are yet to reach desirable levels. Accordingly, a need remains for a reliable and cost-effective method of manufacturing semiconductor multi-chip packages using chips having a center pad configuration.

Semiconductor multi-chip package and fabrication method


A code is received. The code conveys data about a quantized coefficient that corresponds to a pixel of an image file. A decoding mode and a version of a code mapping format for decoding the received code is determined. The decoding mode and the version of the code mapping format dynamically change based on a previously-decoded code. The received code is decoded, during the decoding mode, according to the version of the code mapping format to obtain the data about the quantized coefficient.

For transmission of a JPEG image file, the JPEG image file is organized according to 8×8 blocks of pixels and a discrete cosine transform (DCT) is performed on each 8×8 block. After the application of the DCT, the data for each pixel in a block undergoes quantization. After the DCT and quantization, each JPEG block comprises a set of quantized coefficients prior to transmission. The process of quantization affects the accuracy of each coefficient, thereby causing some loss with regard to the image's resolution and appearance. The JPEG format applies entropy encoding to encode each quantized coefficient for transmission of the JPEG image file to an image recipient.
Upon receipt of the entropy-encoded quantized coefficients, the image recipient reverses the entropy encoding in order to obtain the JPEG image file's quantized coefficients. The quantization and the DCT can be reversed as well to obtain image data for the recipient to sufficiently reconstruct and display the JPEG image file.

Entropy coding for recompression of images


Exemplary embodiments of the present disclosure relate to a clock distribution network for a scan design, which may include, for example, a clock signal network(s), and a plurality of partitioned clock signal networks coupled to the clock signal network(s) through a controlling logic(s); where the controlling logic(s) may be configured to stagger a clock signal from the clock signal network(s), and where each of the partitioned clock signal networks may be connected to a group of flip-flops. A first partitioned clock signal network of the partitioned clock signal networks may be connected to a first group of flip-flops and a second partitioned clock signal network of the partitioned clock signal networks may be connected to a second group of flip-flops, and where the first group of flip-flops may be different than the second group of flip-flops. The controlling logic(s) may include a shift register(s).

Generally, in a scan design, the shifting of test data may result in excessive switching of the data stored in the flip-flops. Typically, in functional or system modes, there are generally only certain bursts of activity which only activate or load certain areas of a design. If a compression procedure is utilized, the data may be loaded all at once. This, however, may end up creating a lot of activity in the design, which may result in more power or voltage needed to load all of the data at once. This is generally more than what a chip may be designed for. In fact, loading of data all at once may end up creating up to a 50% average switching activity, at one time. For example, if every volume of information in the flip-flops that exists is changed, or is loaded, every other clock cycle, thus, there may be a constant power usage (e.g., 50% usage) at every cycle if the loads are alternated. This is too much power for a typical system. When there is a lot of power drawn (e.g., too much power), much more than a system was designed for, voltage droop may occur. For example, a significant voltage drop may be seen during each clock cycle.
In a typical power grid, which distributes power to different elements (e.g., different gates), a voltage drop (e.g., from an ideal voltage) may occur due to a significant amount of current being drawn based on every other data load (e.g., data switching). Since data is loaded in continuous bursts, data is always being loaded, and there is constantly a large power draw, which may result in the voltage droop. Additionally, responses are captured in flip-flops (e.g., scan chains) which may be shifted out to be observed (e.g., to observe them and determine whether a certain fault has manifested). Generally, there is limited or no control over these responses, which may result in a random mix of 0's and 1's being loaded or read, which are unnecessary bits, and which contribute to power usage. During functional operation there may be an average of 2-20% power usage (e.g., range). However, with continuous bursts, there may be up to a 50% power usage.
If there is a full scan design, artificial sequences of 0's and 1's may be generated to limit the number of transitions because there may be direct control with every single change. However, with various compression procedures, there generally are multiple don't care bits loaded. These compression procedures may leverage these don't care bits. However, there is limited or no control over these don't care bits, which may contain an arbitrary number of transitions. Don't care bits generally take the form of randomly assigned 0's and 1's, which may also increase switching and power usage.
Thus, it may be beneficial to provide an exemplary system, method, computer-accessible medium, and circuit for clock shifting in a scan design, which may overcome at least some of the deficiencies presented herein above.


A single use dental maintenance device embodies rows of nylon felt like strips adhered to a nonporous elastic tube and said strips coated with toothpowder. The opened end of the elastic tube is adhered to the inside of a paperboard cylinder in which elastic tube is folded and sealed with polyethylene film. By the user pushing his or her index finger thru the designated opening unfolds the tube over the index finger and allows the user to clean and polish teeth in a manner similar to brushing.

1. Field of the Invention
The present invention relates to a device to maintain dental health. More specifically the present invention pertains to a device to maintain dental health in a efficient and convenient manner when not having at one's disposal a toothbrush and toothpaste.
2. Prior Art
Maintaining dental health has always been a standard practice in daily hygiene, accomplish ed by the act of "brushing" one's teeth with a brush attached to a handle whereas the brush is covered with toothpaste to facilitate cleaning and polishing. Accordingly people who's lives take them away from their residence daily, encounter this ongoing problem and in general have one way to maintain their teeth, that is by the use of a toothbrush and toothpaste, unfortunately the act of carrying a toothbrush with toothpaste thru the day has been an inconvenience and a practice rarely done,as so noticed by the inventor. One way of solving the problem has been the use of a collapsible handle with a removable head toothbrush, but the inherent inconvenience still remains, where does one place toothpaste and brush and more importantly the remembering of taking it daily.
No device is known that will allow an available and quick way to brush and polish teeth when in public restrooms.


A semiconductor chip device includes a first semiconductor chip adapted to be stacked with a second semiconductor chip wherein the second semiconductor chip includes a side and first and second conductor structures projecting from the side. The first semiconductor chip includes a first edge, a first conductor pad, a first conductor pillar positioned on but laterally offset from the first conductor pad toward the first edge and that has a first lateral dimension and is adapted to couple to one of the first and second conductor structures, a second conductor pad positioned nearer the first edge than the first conductor pad, and a second conductor pillar positioned on but laterally offset from the second conductor pad and that has a second lateral dimension larger than the first lateral dimension and is adapted to couple to the other of the first and second conductor structures.

1. Field of the Invention
This invention relates generally to semiconductor processing, and more particularly to stacked semiconductor chip devices and methods of making and assembling the same.
2. Description of the Related Art
A typical conventional flip-chip packaged semiconductor chip consists of a laminate of several layers of different materials. From bottom to top, a typical package consists of a base or carrier substrate, a die underfill material, an array of solder joints and the silicon die. For some designs, a thermal interface material and a lid or heat spreader top off the stack. In some designs the carrier substrate includes a ball grid array to connect to another circuit board. Each of the layers of the package generally has a different coefficient of thermal expansion (CTE). In some cases, the coefficients of thermal expansion for two layers, such as the underfill material and the silicon die, may differ by a factor of ten or more. Materials with differing CTE's strain at different rates during thermal cycling.
Some conventional chip packages incorporate stacked dice. Like a conventional package substrate, a conventional die typically includes plural layers of different materials, such as a bulk semiconductor layer, an active device layer, and multiple metallization layers interspersed with dielectrics. Such metallization may be on the front and backside of the die. Not surprisingly, the layers of the conventional die have different CTE's.
Thus for a conventional stacked dice and carrier substrate arrangement, the multitude of different CTE's will tend to produce differential strain rates that can produce warping of the carrier substrate and the silicon dice. If the warping is severe enough, several undesirable things can occur.
One risk associated with stacked dice warping is solder joint delamination. If the warping is severe enough, some of the solder joints between the stacked dice can delaminate or fracture and cause electrical failure.
Another pitfall associated with die warping is the potential difficulty in establishing metallurgical bonds between interconnects of the mating dice. The warping causes the lower surfaces of interconnect structures of one or both the stacked dice to be non-planar. Depending on the direction of warping, the interconnects at the outer edges of one of the dice may be either higher or lower than those near the interior. If a given interconnect of one die is too far away from a corresponding interconnect on the other die at the time of reflow, the interconnects may not merge to form a solder joint after reflow and leave an open circuit.
The present invention is directed to overcoming or reducing the effects of one or more of the foregoing disadvantages.

Method of manufacturing and assembling semiconductor chips with offset pads


An internal voltage generating circuit includes a supply voltage driving unit, an internal voltage driving unit, and a driving control unit. The supply voltage driving unit is configured to compare a voltage division signal of a supply voltage with a bias voltage, generate a first pull-up signal, and drive the supply voltage in response to the first pull-up signal. The internal voltage driving unit is configured to receive the supply voltage, generate a second pull-up signal, and drive an internal voltage. The driving control unit is configured to select the first pull-up signal or a power supply voltage as a third pull-up signal.

Embodiments of the present invention relate to an internal voltage generating circuit, and more particularly, to an internal voltage generating circuit that can reduce the power consumption by controlling a supply voltage driving force according to the level of an interval voltage.
In general, a semiconductor memory device receives a power supply voltage VDD and a ground voltage VSS from an external device to generate an internal voltage necessary for an internal operation. Examples of the voltages necessary for the internal operations of a memory device include a core voltage VCORE supplied to a memory core region, a high voltage VPP used to drive a word line or used in the event of overdriving, and a back-bias voltage VBB supplied as a bulk voltage of an NMOS transistor of a core region.
Meanwhile, a bit line pre-charge voltage VBLP supplied to pre-charge a bit line pair BL/BL in a pre-charge operation and a cell plate voltage VCP supplied to a memory cell are driven by the core voltage VCORE. Thus, a sufficient number of core voltage driving circuits are configured to rapidly supply a current necessary to generate the bit line pre-charge voltage VBLP and the cell plate voltage VCP.
A known core voltage driving circuit drives a core voltage VCORE when performing an active operation, and stops the driving of the core voltage VCORE when not performing the active operation. However, even when the active operation is in progress, if the bit line pre-charge voltage VBLP and the cell plate voltage VCP reach a target level, there is no need to apply the core voltage VCORE in order to generate the bit line pre-charge voltage VBLP and the cell plate voltage VCP. However, even when there is no need to apply the core voltage VCORE in order to generate the bit line pre-charge voltage VBLP and the cell plate voltage VCP, the known core voltage driving circuit continues to drive the core voltage VCORE, thus causing unnecessary power consumption.


An oil water mixture heating apparatus comprises a metal outer barrel with a helical trough formed inside, a metal inner barrel held in the metal outer barrel to form a helical passage with the helical trough, a first and a second guide cap coupled on two sides of the metal outer and inner barrels, a first and a second seal cap coupled respectively on the first and second guide caps, a first and a second holder fixedly located on outer sides of the two seal caps and an electric heater encasing the metal outer barrel. When combustible oil or oil water mixture enters the helical passage and are heated by the electric heater, the oil or oil water mixture also is constantly blended in the helical passage so that it is heated rapidly to a required temperature and forms a finer oil water mixture.

FIGS. 1 and 2 show a heating apparatus 1 for oil water mixture combustion systems to heat oil or oil water mixture.
The heating apparatus 1 comprises a barrel 11, a metal tube coil 12 and an electric heater 13. The metal tube coil 12 winds helically on the barrel 11, and the electric heater 13 encases the metal tube coil 12 to provide overall heating. The metal tube coil 12 consists of metal tubes 121 that form point contact between each other. And the electric heater 13 and the metal tube coil 12 also form point contact mutually. Hence there are gaps 14 and 15 formed between the barrel 11, electric heater 13 and the metal tubes 121 that become heat dissipation spaces, and the contact area of the electric heater 13 is smaller during heating and heat transfer speed is slower, and a longer time is needed for heating to reach a required temperature. There is still room for improvement.


A hydraulically damped rubber bearing, that supports a vibrating mechanical subassembly on a substructure, has an actuator with an electromagnetic drive mechanism associated with a fluid filled chamber. The drive mechanism is responsive to performance characteristic controls which are electrically connected to at least one signal emitter in the subassembly and have a final stage in the front of a power amplifier.

The invention concerns a hydraulically damped rubber bearing that supports a vibrating mechanical subassembly on a substructure, whereby an actuator with an electromagnetic drive mechanism is associated with a fluid filled chamber and the drive mechanism has performance characteristic controls that are connected to a signal emitter in the subassembly and have a final stage in the form of a power amplifier.
A rubber bearing of this type is known from German Patent No. 3,433,255 (U.S. Pat. No. 4,638,483 issued Jan. 27, 1987). The actuator, subject to the controls, optimally compensates all the unwanted vibrations occasioned by the subassembly during previously determined operating states. For this purpose the actuator is controlled in accordance with a graph of empirically determined optimal responses plotted as functions of parameters obtained from the subassembly and characterizing particular operating states. One such parameter for example is revolutions per minute. In the automotive field this approach allows the optimal isolation of vibrations occasioned at a particular number of revolutions by the particular gear engagement, by the throttle setting, and by the vacuum in the intake manifold for example. The spectrum of unwanted vibrations that can and do occur in actual driving situations is, however, only inadequately dealt with by this method. Furthermore, the use of control data, which are highly complicated to obtain and plot, makes sense only as long as no secondary alterations occur in the system as such--a change in the weight of the mass being cushioned for example and/or an age-dictated change in the resilience of the rubber components of the bearing cannot be tolerated.
A hydraulically cushioned rubber bearing is known from German Patent No. 3,918,753. The actuator-drive mechanism is designed to suppress acoustically active vibrations with particular effectiveness when it is operated as intended. The specific control technology required is not mentioned.

Hydraulically damped rubber bearing that supports a mechanical subassembly


The invention relates to restricting flow through a vascular access site such as an arteriovenous (AV) fistula or a graft using intravascular measurements to guide the procedure. The invention provides systems and methods for using intravascular detection to guide the restriction of flow through an AV fistula or graft. An intravascular instrument such as an imaging catheter or guidewire with measuring capabilities is inserted into a vessel proximal to an access site and used to evaluate the access site, which is banded to obtain healthy flow as indicated by the intravascular instrument. In certain aspects, the invention provides a method for improving a hemodialysis fistula or graft by inserting an intravascular instrument into a vessel proximal to the fistula or graft, making a measurement with the intravascular instrument, and restricting flow through the fistula or graft until the measurement obtains a predetermined value.

Healthy kidneys remove waste and minerals from the blood. When kidneys fail, harmful waste builds up in the body, blood pressure may rise, and the body may retain excess fluid and not make enough red blood cells due to insufficient erythropoietin production. Hemodialysis is a common method for treating kidney failures and involves flowing blood through a filter to remove wastes. For hemodialysis, an arteriovenous (AV) fistula is created that connects an artery to a vein, or optionally an AV graft is created by using a tube to connect the artery to the vein. Organizations such as the National Kidney Foundation generally agree that fistulas are the best type of vascular access. A fistula is deemed to be ready for use, or mature, once adequate blood flows through it. However, too much blood flow can cause serious adverse consequences. For example, a high flow fistula can lead to hemodialysis access-induced distal ischemia, cardiac overload, or both.
Distal ischemia is associated with a lack of blood flow to the extremities and is characterized by symptoms of ischemia, and in extreme cases, tissue death. High flow through the fistula can also compromise cardiac function, causing cardiomegaly.

Systems and methods for improving an AV access site

PHILIPS IMAGE GUIDED THERAPY CORPORATION


A 3D scanner system for detecting and/or visualizing cariogenic regions in teeth based on fluorescence emitted from said teeth, the 3D scanner system including data processing means configured for mapping a representation of fluorescence emitted from the teeth onto the corresponding portion of a digital 3D representation of the teeth to provide a combined digital 3D representation.

US20080063998 describes a technique wherein one fluorescence image and one reflectance image are combined to form an image in which the contrast between a cariogenic region and a sound tooth structure is heightened in the 2D image.
US2008094631 describes a system with intraoral camera and measuring device. The measuring device is capable of collecting color, translucency, fluorescence, gloss, surface texture and/or other data for a particular tooth from the measuring device which then may be combined with images captured by intraoral camera.
Optical 3D scanners for recording the topographic characteristics of surfaces within the intraoral cavity, particularly of the dentition, are known in the prior art (e.g., WO2010145669). Examples of commercially available 3D intraoral scanners are 3Shape TRIOS, Cadent iTero, Sirona Cerec, and 3M Lava C.O.S.
The size of any probe element in intraoral scanners is limited because it has to fit into the human mouth. Accordingly, the field of view of such scanners is smaller than the object of interest in many applications, which can be multiple neighboring teeth or an entire dental arch. Hence, intraoral 3D scanners rely on "stitching" several sub-scans, each representative of a field of view, but obtained in multiple positions, e.g., by moving the 3D scanner along the dental arch. The 3D scanner records a series of sub-scans that are to be stitched to yield an overall digital 3D representation of the surface topography for the scanned part of the intraoral cavity. A sub-scan represents a depth map for a given relative position and orientation of the 3D scanner and the patient's intraoral cavity. To obtain multiple sub-scans, the 3D scanner is moved along the intraoral cavity or some region thereof and potentially also angled differently. The 3D scanner is to be moved and angled such that at least some sets of sub-scans overlap at least partially, in order to enable stitching. The result of stitching is a digital 3D representation of a surface larger than that which can be captured by a single sub-scan, i.e. which is larger than the field of view of the 3D scanner. Stitching, also known as registration, works by identifying overlapping regions of 3D surface in various sub-scans and transforming sub-scans to a common coordinate system such that the overlapping regions match, finally yielding the overall scan. The Iterative Closest Point (ICP) algorithm is widely used for this purpose.

This patent is subject to a terminal disclaimer.

3D intraoral scanner measuring fluorescence


A network access method, an authentication method, a communications system, and relevant devices are provided to support implicit authentication based on subscriber line information in Internet Protocol version 6 (IPv6). The authentication method includes: receiving a request message sent from an Access Node (AN), wherein the request message carries subscriber line information and a Link-Local Address (LLA); sending an access request to an Authentication, Authorization and Accounting (AAA) server according to the subscriber line information; receiving an authentication result indicating the authentication is successful; determining whether an address matching the LLA carried in the request has been stored in the BNG; and storing the LLA in the BNG, if the address matching the LLA is not stored in the BNG.

The existing Digital Subscriber Line (DSL) network architecture evolves to the Internet Protocol (IP) Quality of Service (QoS)-enabled architecture based on Ethernet aggregation and connectivity. In this background, the general DSL reference architecture is shown in FIG. 1.
In FIG. 1, T is a reference point between User Equipment (UE) and a Residential Gateway (RG) in a Customer Premises Network (CPN); U is a reference point between the RG and an Access Node (AN) (namely, a Digital Subscriber Line Access Multiplexer (DSLAM)). In an access network, an aggregation network exists between the AN and a Broadband Remote Access Server (BRAS) or a Broadband Network Gateway (BNG), and V is an Ethernet aggregation reference point between the AN and the BRAS/BNG in the access network. A10 is a reference point between the access network and the service provider, and this reference point can connect an application service provider to a network service provider who owns the access network, or, in a roaming scenario, this reference point connects the network service provider to a visited access network. The CPN is interconnected with the access network through a DSL access technology. For a Passive Optical Network (PON), the AN is an Optical Line Termination (OLT) or an Optical Network Unit (ONU), and the CPN is interconnected with the access network through access technologies such as PON.
The DSL network architecture in the foregoing technical solution, however, supports only Internet Protocol version 4 (IPv4). With exhaustion of the IPv4 addresses, the DSL network architecture evolves to Internet Protocol version 6 (IPv6), which is an inevitable trend.
In IPv4, a Dynamic Host Configuration Protocol (DHCP) message carries subscriber line information to implement implicit user authentication. IPv6 may employ stateless address allocation. However, the prior art does not disclose how to implement implicit authentication based on subscriber line information in the case of stateless address allocation.


Certain aspects of the present disclosure generally relate a dual feedback loop regulator. For example, the regulator may include a first amplifier having an output coupled to an output node of the regulator, the output node further coupled to a first feedback path and a second feedback path of the regulator. A first input of a second amplifier may be coupled to the first feedback path and a second input of the second amplifier may be coupled to a reference path. The regulator may also include a transconductance stage having a first transistor and a first current source, the first transistor and the current source coupled to the first feedback path and the second feedback path, and a transimpedance stage coupled to the transconductance stage and an input of the first amplifier.

Power management integrated circuits (power management ICs or PMIC) are used for managing the power requirement of a host system. A PMIC may be used in battery-operated devices, such as mobile phones, tablets, laptops, wearables, etc., to control the flow and direction of electrical power in the devices. The PMIC may perform a variety of functions for the device such as DC to DC conversion, battery charging, power-source selection, voltage scaling, power sequencing, etc. For example, a PMIC may be used for voltage regulation and may feature a low-dropout (LDO) regulator.

Fast transient response low-dropout (LDO) regulator


A computer-implemented method and system for generating a layout of kitchen cabinets is provided. The method and system can be used for recommending an acceptable kitchen cabinet layout that would optimize both functionality and visual appearance of a kitchen. The method includes the steps of receiving, by a computer, attributes that define a virtual kitchen and receiving, by the computer, attributes and placement information for an appliance. The computer generates the virtual kitchen and populates the virtual kitchen with cabinets. The computer generates a first suggestion for kitchen cabinet layout, wherein the first suggestion satisfies the criteria of balance, economical and minimization of filler space. The step of generating the first suggestion can be done by using a neural-network-based evaluation function combined with a search algorithm.

The kitchen is often the most used room in a home and it hosts a variety of connected elements including appliances, cabinets, countertops and fixtures. Kitchen layout presents unique challenges at least because an effective kitchen layout encompasses accommodating flexibility in placing appliances, providing a functional and ergonomic work flow layout, and optimizing visual appearance. For example, an effective kitchen layout should, at least desirably, provide sufficient cabinet storage and countertop space, which in turn align with well-positioned appliances, as well as collectively support a functional and ergonomic environment. An effective kitchen layout should also, at least desirably, provide a visually pleasing environment.
When designing a kitchen layout, a skilled designer typically considers several factors, such as prominent visual and/or architectural features of one's home, the dimensions of the kitchen, the locations of electrical outlets, how the home owner uses or would like to use the kitchen, how many people will likely use the kitchen at one time, and the home owner's preferred cooking and storage style. The skilled designer typically weighs and balances these factors to create an effective kitchen layout that aims to optimize both the functionality and visual appearance of a kitchen. Typically, a consumer will want the designer to consider cost criteria as well. The knowledge and expertise involved in optimally balancing these factors are unlikely to be possessed by amateur designers. Instead, such amateur designers typically rely on intuition and often create functionally ineffective and/or visually inferior kitchen layouts.
Computer implemented systems are available to assist a user to create and visualize a kitchen layout. Some example systems include 2020 Design™'s kitchen and bathroom software and KitchenDraw™'s kitchen design software. However, such systems do not mitigate a user's lack of knowledge and expertise required to design an acceptable kitchen layout. Such systems simply display a user-inputted design in three dimensions and do not automatically generate kitchen layouts, let alone kitchen layouts that optimize a number of criteria, including, for example, functionality, visual appearance and/or cost.
There is a general desire for an improved computer-implemented method and/or system for generating a layout of kitchen cabinets. There is also a general desire for an improved computer-implemented method and/or system for generating an acceptable kitchen cabinet layout that would optimize (e.g. according to some optimization metrics) a number of criteria, including, for example, functionality, visual appearance and cost.
The foregoing examples of the related art and limitations related thereto are intended to be illustrative and not exclusive. Other limitations of the related art will become apparent to those of skill in the art upon a reading of the specification and a study of the drawings.

Method and system for kitchen cabinet layout


A mechanism and method for easily replacing a zipper of a zippered hardside luggage, wherein one side of a zipper is fixed to an upper case body by an upper zipper fastener, and the other side of the zipper is fixed to a lower case body by a lower zipper fastener; the upper zipper fastener and the lower zipper fastener have a respective notch; a removable notch fastener is arranged at the joint between the upper case body and the lower case body at the notch; and the replacement method comprises: firstly removing the notch fastener, pulling out the old zipper from the notches of the upper zipper fastener and the lower zipper fastener, then passing a new zipper through the notches of the upper zipper fastener and the lower zipper fastener, and finally mounting the notch fastener.

In the current industry of luggage, a zipper used in a zippered hardside luggage is a personalized easily-worn component, and needs to be often replaced according to the customer's requirements for different colors or due to the damage during the use. In the existing process for manufacturing a luggage, the fixation of a zipper is generally achieved, as shown in FIGS. 1 and 2, by fixing a zipper 1 to a soft rubber strip 2 (or leather) using a needle and thread and then adhering the soft rubber strip to a case body 3 and a case cover 4 using glue. However, in the actual use of a luggage, the luggage manufactured by the process mentioned above generally has the problems:
(1) when a zipper of a luggage needs to be replaced, it is required to spend a lot of labor and time to remove the glue on the case body and the case cover for adhering the old zipper and then fix a new zipper with glue, by which the replacement efficiency is very low and the operation is tedious;
(2) when replacing a zipper, the soft rubber strip (or leather) for fixing the zipper also needs to be replaced at the same time, so that the replacement cost of zipper is high, which is not good for the control of the manufacturing cost of luggage; and
(3) the zipper is adhered to the case body and the case cover using glue, by which the fixed effect is poor and the service life is also short.

Mechanism and method for easily replacing zipper of zippered hardside luggage

GUANGZHOU WINTIMES ALUMINUM PRODUCTS CO., LTD.


A method and apparatus used in the method for securing at least two ends of a triangularly-shaped bandanna. The apparatus includes a generally flat article having three apertures there through. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical diclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR 1.72(b).

This invention relates generally to pet bandannas and, more particularly, to a method and apparatus for tying a bandanna around the neck of a pet.
It is well known to hang a piece of cloth around the neck of an animal and, in particular, the neck of a pet such as a dog, cat, potbelly pig, or rabbit as an accessory or a fashion statement. The cloth is usually triangular in shape and, besides being colorful, may include a design or picture. The cloth is usually referred to as bandanna or neckerchief.
Pet, and in particular canine, bandannas are well known. For example, U.S. Pat. No. DES 423,150 to Vignere discloses an ornamental design for a dog scarf. Retail outlets, for example, pet superstores, sell pet bandannas.
In some instances, the bandannas can be impregnated with a chemical insecticide or perfume to achieve a desired effect (i.e., as a flea and tick repellent and/or to cover the smell of a pet). For example, U.S. Pat. No. 5,465,689 to Winder discloses a flea and tick repellant bandanna for pets.
The present invention is a method and apparatus for quickly attaching a bandanna around the neck of a pet. The method involves the use of the apparatus. In addition, the apparatus may also complement the bandanna by manipulating the shape or appearance of the apparatus. For example, the apparatus can be shaped into a well-known object. In the drawings, the apparatus is shown as a bone (an item typically associated with dogs). However, this apparatus can be shaped into virtually any object (e.g., a pumpkin or bat if the bandanna has a Halloween theme associated with it). Further, the apparatus can be painted a particular color. For instance, the pumpkin can be painted orange to further complement and for keeping with a particular theme.
The accompanying drawings, which are incorporated in and form a part of the specification, illustrate the embodiments of the present invention and, together with the following description, serve to explain the principles of the invention. For the purpose of illustrating the invention, embodiments which are presently preferred are shown in the drawings, it being understood, however, that the invention is not limited to the specific instrumentality or the precise arrangement of elements or process steps disclosed.
In the drawings:
FIG. 1 is a top view of the apparatus in accordance with the present invention;
FIG. 2 is a front side view of the apparatus illustrated in FIG. 1 taken along lines 2xe2x80x942;
FIG. 3 is a right side view (from the perspective of the reader) of the apparatus illustrated in FIG. 1 taken along lines 3xe2x80x943;
FIG. 4 shows a pet scarf or bandanna which is designed to be tied around a pet""s neck and illustrates the first step in a method of securing the bandanna about the pet""s neck in accordance with the present invention;
FIG. 5 illustrates the second step of the method;
FIG. 6 illustrates the third step of the method;
FIG. 7 illustrates the fourth step of the method;
FIG. 8 illustrates the fifth step of the method; and
FIG. 9 is an isometric view of the bandanna as it hangs from the neck of a dog with the ends of the bandanna secured in accordance with the present invention.

Method and apparatus for securing a bandana


Microelectronic imaging devices and associated methods for attaching transmissive elements are disclosed. A manufacturing method in accordance with one embodiment of the invention includes providing an imager workpiece having multiple image sensor dies configured to detect energy over a target frequency. The image sensor dies can include an image sensor and a corresponding lens device positioned proximate to the image sensor. The method can further include positioning standoffs adjacent to the lens devices while the image sensor dies are connected to each other via the imager workpiece. At least one transmissive element can be attached to the workpiece at least proximate to the standoffs so the lens devices are positioned between the corresponding image sensors and the at least one transmissive element. Accordingly, the at least one transmissive element can protect the image sensors while the image sensor dies are still connected. In a subsequent process, the image sensor dies can be separated from each other.

Microelectronic imagers are used in digital cameras, wireless devices with picture capabilities, and many other applications. Cell phones and personal digital assistants (PDAs), for example, are incorporating microelectronic imagers for capturing and sending pictures. The growth of microelectronic imagers has been steadily increasing as they become smaller and produce better images with higher pixel counts.
Microelectronic imagers include image sensors that use Charge Coupled Device (CCD) systems, Complementary Metal-Oxide Semiconductor (CMOS) systems, or other solid-state systems. CCD image sensors have been widely used in digital cameras and other applications. CMOS image sensors are also quickly becoming very popular because they are expected to have low production costs, high yields, and small sizes. CMOS image sensors can provide these advantages because they are manufactured using technology and equipment developed for fabricating semiconductor devices. CMOS image sensors, as well as CCD image sensors, are accordingly "packaged" to protect their delicate components and to provide external electrical contacts.
An image sensor generally includes an array of pixels arranged in a focal plane. Each pixel is a light sensitive element that includes a photogate, a photoconductor, or a photodiode with a doped region for accumulating a photo-generated charge. Microlenses and color filter arrays are commonly placed over imager pixels. The microlenses focus light onto the initial charge accumulation region of each pixel. The photons of light can also pass through a color filter array (CFA) after passing through the microlenses and before impinging upon the charge accumulation region. Conventional technology uses a single microlens with a polymer coating, which is patterned into squares or circles over corresponding pixels. The microlens is heated during manufacturing to shape and cure the microlens. Use of microlenses significantly improves the photosensitivity of the imaging device by collecting light from a large light-collecting area and focusing the light onto a small photosensitive area of the sensor.
Manufacturing image sensors typically includes "post-processing" steps that occur after the microlens array is formed on a workpiece. Accordingly, it is necessary to protect the microlens array during these post-processing steps to prevent the microlens array from becoming contaminated with particles that might be released during these steps. One approach to addressing the foregoing manufacturing challenge is to attach individual image sensor dies to a substrate, tape over the corresponding sensor arrays, and then use a molding process to form "standoffs" to which a cover glass is mounted. The cover glass can accordingly protect the image sensor during subsequent processing steps, and becomes part of the sensor package.
One drawback with this approach is that it is performed at the die level and accordingly cannot protect the sensor arrays during processing steps that occur before the dies have been singulated from a corresponding wafer or other larger workpiece. Another drawback with this approach is that a mold release agent is typically used to release the die from the mold machine in which the standoffs are formed. However, the mold release agent tends to inhibit the adhesion of adhesive compounds, which are required to attach the cover glass. Accordingly, the standoff surfaces must typically be cleaned (e.g., with a plasma process) before attaching the cover glass. This additional cleaning step increases the cost of manufacturing the die, and reduces manufacturing throughput.


A pixel driving circuit is used to drive a pixel structure having a plurality of pixel units. The pixel driving circuit includes data lines; selecting circuits having a data input terminal connected to one of the data lines, a first output terminal connected to a red subpixel unit of a pixel unit, a second output terminal connected to a green subpixel unit of the pixel unit, and a third output terminal connected to a blue subpixel unit of the pixel unit; scanning lines; voltage-variation circuits having an input terminal to receive the scanning signal, an output terminal connected to one of scanning lines. Each of the voltage-variation circuits is selectively operable in a voltage-regulated state or a conduct state.

The present disclosure relates to the field of liquid crystal display technology, and more particularly, to a pixel driving circuit and a liquid crystal display circuit with the pixel driving circuit.
With the rapid development of small and medium-sized electronic display industry, consumers have stricter requirements for quality of medium and small-sized LCD liquid crystal displays such as resolution. Improvements in display quality are inextricably linked to the transmission rate of display data and signal integrity. FIG. 1 illustrates a signal-driven structure of 1:3 which is more commonly adopted in small and medium-sized liquid-crystal display (LCD) screens of the related art. FIG. 2 illustrates a Demux driving timing of RGB-RGB corresponding to the signal-driven structure. A shortcoming of the driving timing is that MUX is turned on at a higher frequency, causing higher power consumption of the MUX circuit. As for a small-sized display screen such as a cellphone, a large amount of power consumption is one of fatal impediments. Therefore, research and design personnel in the industry proposed a Demux driving timing of RGB-BGR, as shown in FIG. 3. As FIG. 3 illustrates, the driving timing may reduce the frequency of turning on MUXR and MUXB by half, thereby greatly reducing the power consumption of the LCD display screen.
Another problem for the driving timing is that the voltage level of the R data has two Drops because of the coupling effect of capacitance, as FIG. 4 illustrates. The first Drop is a decrease ΔV1 when MUXR is turned off. The second Drop is a decrease ΔV2 when Gate is turned off. G subpixel is the same at this time. But for the B data, only one Drop is on the first row; that is, the Drop is a decrease ΔV2 only when Gate is turned off. To sum up, the data voltage imposed on the R\G subpixel and the data voltage imposed on the B subpixel is different in the process of display so that the voltage imposed on the R\G subpixel and the voltage imposed on the B subpixel are different at last. Even if the display effect is the same grayscale, the display brightness of the R\G subpixel is different from the display brightness of the B subpixel, which shows color shift when the consumers view the images.
Therefore, it is urgent to improve the defected related art.

Pixel driving circuit and liquid crystal display circuit with the same

Wuhan China Star Optoelectronics Technology Co., Ltd.


A collar-form, nodal connection between the ends of beams and the outside of a column including (a) column-mount node components, joined to and distributed around the outside of the column at a defined location along its length, (b) planar beam-mount node components connected to beam ends and arranged in a collar form circumsurrounding the column-mount node components, with adjacent beam-mount node components possessing adjacent lateral sides including confronting load-compression faces that lie in planes which are disposed at angles of substantially 45-degrees relative to the respective planes of their associated beam-mount components, and (c) for each pair of adjacent beam-mount-component lateral sides, operatively connected nut-and-bolt structure extending through the associated beam-mount components' lateral sides, appropriately tightened within the overall nodal connection to produce compression in confrontingly adjacent load-compression faces which is effective within the connection to promote column-circumsurrounding load delivery from the beams through the connection to the column.

This invention relates to column and beam frame system, and in particular to a novel structural interconnect organization—specifically a collar-form nodal connection between a beam and a column—involving the quick setting, into full-moment-capability, of correctly design-positioned columns and beams. In one form of the invention set forth herein, a form which is useful in applications where tightened nut-and-bolt incorporation within a nodal connection is not needed, or optional, the invention proposes what is referred to as a floating, nondestructably disconnectable, discontinuous, full-moment nodal connection between the end of a beam and the side of a column. In another form of the invention, and one which is especially focused upon in this continuation application, the connection of the invention features orthogonally adjacent, collar-forming structural elements, referred to as beam-mount components, that are (a) disposed orthogonally with respect to one another, collaboratively circumsurrounding the outside of a column in a cooperative, collar-form arrangement, and (b), inclusive of adjacent lateral sides near the corners of a column, defined with parallel, planar, load-compression faces, also referred to herein as corner facets, which face toward one another, and which play important roles within an overall nodal connection, along with collaborating, tightened nut-and-bolt assemblies, in promoting column-circumsurrounding load delivery from a beam to a column.
The invention description presented herein, characterized, as it is, correctly, as forming a continuation from the above-identified '808, immediate-predecessor, patent application, includes substantially and directly all of the specification text included in that predecessor case, along with the incorporation of appropriate text augmentation that has been included in order to identify clearly a feature of the invention subject matter, which, while contained definitively in the predecessor case, is now featured and focused upon in the context of the claims presented in the present application.
A preferred, overall form of the invention is described herein principally with reference to a unique, bearing-face collar-interconnect structure which joins adjacent columns (the sides thereof) and beams (the ends thereof) at nodes of intersection between them in a manner whereby, when a column and a beam are brought, through gravity lowering of a beam into place, into correct, design-intended, relative positions, they become instantly gravity-set substantially against further relative motion unless disassembled, and instantly stabilized in correct, full-moment and positional relationship with respect to one another.
This condition of immediately gravity-set nodal connection defines the above-described, floating, nondestructably disconnectable, discontinuous, full-moment nodal connection between the end of a beam and the side of a column. No additional hardware is required to establish this character of connection, and specifically no hardware of a nature which extends (flows) between, and bridges with continuity, the interfacial discontinuity which exists between a so-connected column and beam is needed just to establish a basic, full-moment relationship in the connection. The nodal, collar-interconnect structure employed to create such a discontinuity connection includes, as do all connections described herein, what are referred to as column-mount and beam-mount node structures, also referred to herein as collar structures, that are joined to the sides of columns, and to the ends of beams, respectively.
Regarding the herein especially highlighted, and discussed, unique feature of the invention, mentioned above, respecting circumsurrounding delivery of loads from a beam to a column, appropriately tightened nut-and-bolt assemblies are, beyond what is described above as the basic "discontinuity" column-to-beam relationship, additionally employed so that the gravity-set full-moment connection which becomes gravity-established between each connected beam and a column, as just described above, becomes circumsurroundingly developed all around the outside of that column in relation to each associated, individual column/beam connection. In this context, one can view the invention as proposing a collar-form, nodal connection between the end of a beam and the outside of an elongate, orthogonal-cross-section column, with this connection featuring                (a) column-mount node structure, including column-mount components, joined to and distributed around the outside of the column at a defined location along its length,        (b) collar-form beam-mount node structure gravity-seated on the column-mount structure in a manner forming therewith a full-moment connection between the column and the beam, including orthogonally adjacent, cooperatively interactive, beam-mount components, one for each of the column's sides, each extending within a plane disposed adjacent a column side, and collectively circumsurrounding the column outwardly adjacent the column-mount node structure, one of the beam-mount components being associated with, and joined to, the mentioned beam end, and adjacent beam-mount components possessing adjacent lateral sides including substantially parallel, planar, load-compression faces, or corner facets, that lie in planes which are disposed at angles of substantially 45-degrees relative to the respective planes in which their respective, associated beam-mount components lie, and        (c) for each pair of adjacent beam-mount-component lateral sides, operatively connected nut-and-bolt structure extending adjacent these sides through the associated beam-mount components, appropriately tightened within the overall nodal connection to produce compression in the load-compression faces which is effective within the connection to promote column-circumsurrounding load delivery from the associated beam, through its joined beam-mount component, to the column.
Continuing with a generalized discussion, as mentioned, the invention proposes a column-beam quick-set interconnect structural system wherein the ends of beams are joined to columns at the mentioned nodes of intersection through collar-form structures, spoken of above, that, when in completed collar form, circumsurround the sides and the long axes of columns, to deliver, through confronting column-mount and beam-mount, node-structure bearing faces, compressive, "mount-to-mount" loads which are derived from moment loads experienced by the beams. These collar-form structures are configured individually in such a manner that, as the end of a prepared beam approaches its correct, design-intended position relative to a column, the collar structures both (a) guide these two components toward that correct relative disposition, and (b) instantly gravity-set and stabilize these components exactly as they arrive at that position. Not only does this very special action occur in accordance with the invention, so also occurs the then instant gravity-set-and-stabilized establishment of a basic full-moment interconnection between the subject column and beam. A full collar form is not necessary for the establishment of a full-moment connection to become established between a side of a column and an end of an individual beam, and thus between the relevant column and beam, per se.
As will be seen, the invention is intended for use in conjunction with upright tubular columns, each of a character having plural sides preferably distributed equiangularly and orthogonally around, and in common spaced relations relative to, the associated column's long axis.
The interconnect structure of the invention uniquely is designed for fully compatible use between a beam and a column on any and every side of such a column. No matter which column side is involved, essentially exactly the same-character, full-moment, column-beam interconnection develops with it and a connected end of an associated beam. In other words, the invention is designed so that every full-moment connection created by it on each and every side of a column is always functionally the same. This feature of the invention can be visualized, therefore, as offering a kind of "omni-directional" functional symmetry relative to the long axis of a column. This symmetry concept will be more fully explained herein as the description of a preferred form of the invention unfolds below.
One other point should be mentioned here before advancing to a fuller discussion of the preferred collar-form of column-beam interconnection. It is this. Immediate same-invention predecessor structures of mine did not necessarily invoke the collar-form connection approach. They did, however, embody what I think of as being a "drop-and-set" principle of full-moment interconnection, i.e., the principle of gravity-set connection mentioned above, as well as the principle just referred to above as omni-directional functional symmetry. Drawing FIGS. 11-13, inclusive, herein illustrate interconnect components in three different ones of these predecessor versions of the invention.
Returning now to the discussion involving a collar-form interconnection, the delivery through compression of moment loads carried from beams to columns involves the development in the columns of vertically offset reverse-direction compression loads which create related moments in the columns. With respect to each and every lateral load that is experienced by a building frame, or disassemblable frame structure constructed in accordance with the invention, all lateral loads are essentially equally shared by all of the columns, and a consequence of this is that, in comparison to building frame structures built conventionally, a building frame structure constructed in accordance with this invention prevents any single column from carrying any more load than is carried by any other column. As will become apparent, this important feature of the invention, as it performs, enables a building or other frame structure to be constructed in such a way as to exceed minimum building code requirements in many instances, and thus open the opportunity for using a building frame, etc. in accordance with this invention in settings where conventional frame structure would not meet code requirements.
The nodal connections which result from practice of the preferred form of the present invention function to create, when the mentioned nut-and-bolt assemblies are in place and tightened appropriately relative to the column-mount and beam-mount nodal components to draw the mentioned load-compression faces in them toward one another, what is referred to as three-dimensional, multi-axial, moment-coupling, load transfer interconnections and interactions between beams and columns.
Focusing on the specific load-delivery interaction which occurs between a given single column and a connected single beam that bears a moment load, this load is coupled compressively into the column by the associated, single, nodal collar structure at plural bearing-face regions which are angularly spaced about the column's long axis. Compressive load-transfer coupling is not constrained to just one plane of action, or to just one localized region of load delivery. Compression couplets are created to take fuller advantage of columns' load-handling capabilities.
The illustrative and preferably proposed nodal collar structures include inner components—column-mount node structures—which are anchored, as by welding, to the outside surfaces of columns, and an outer collar which is made up of components—beam-mount node structures—that are suitably anchored, also as by welding, to the opposite ends of beams. The inner and outer collar components are preferably and desirably formed by precision casting and/or machining, and are also preferably pre-joined to columns and beams in an automated, factory-type setting, rather than out on the construction job site. Accordingly, the invented collar components lend themselves to economical, high-precision manufacture and assembly with columns and beams, which can then be delivered to a job site ready for accurate assembly.
Importantly, and as was mentioned above herein respecting circumsurrounding load delivery which occurs around the outside of a column according to the invention, the beam-mount components (node structures) in the inner collar, with respect to pairs of orthogonally adjacent such components, possess adjacent lateral sides which include substantially parallel, planar, load-compression faces that lie in planes which are disposed at angles of substantially 45-degrees relative to the respective planes in which their respective, associated beam-mount components lie.
As will become apparent from an understanding of the respective geometries proposed by the present invention for the collar components, these components play a significant role during early building-frame assembly, as well as later in the ultimate performance of a building.
At the regions of connection between beams and columns, and with respect to pairs of adjacent columns standing upright approximately correctly (vertically) in space on a job site, as beams are lowered into horizontal positions, the outer collar components that they carry at their opposite ends seat under the influence of gravity through special, angular, bearing-face geometry provided in them and in the confronting inner column components. This bearing-face geometry effectively guides and collects a lowered beam, and the associated two columns, into stabilized, gravity-locked conditions, with these now-associated beam and column elements then essentially correctly aligned and positioned in space relative to one another. Male/female cleat/socket configurations formed in and adjacent the confronting bearing-face portions of the inner and outer collar components function under the influence of gravity, during such preliminary building construction, not only to enable such gravity locking and positioning of the associated frame components, but also to establish immediate, full-moment stability, even without further assembly (hardware introduction) taking place at the nodal locations of column-beam intersections.
Following preliminary frame assembly, appropriate tension bolts are introduced into the collar structures, and specifically into the components of the outer collar structures, effectively to lock the inner and outer collar structures in place against separation, and to introduce, through internal tension, circumsurrounding load-bearing conditions of local compression into the angular, load-compression faces in the lateral sides of the outer collar structures, i.e., in the beam-mount structures. As mentioned, such tension load bearing action plays an important role in the way that the structure of the present invention gathers and couples beam moment loads multidirectionally into columns, but is not a contributor to the basic establishment of column/beam, gravity-set moment connections.
Confronting faces between the inner and outer collar components function as bearing faces to deliver, or transfer, moment loads (carried in beams) directly as compression loads into the columns. In particular, these bearing faces deliver such compression loads to the columns at plural locations which are angularly displaced about the long axes of the columns (because of the axial encircling natures of the collars). Such load distribution takes substantially full advantage of the load-carrying capabilities of the columns with respect to reacting to beam moment loads.
Accordingly, a building frame structure assembled in accordance with this invention results in a quickly assembleable, remarkably stable and capable frame, wherein all lateral loads transfer via compression multiaxially, and at distributed nodes, into the columns, and are born in a substantially relatively evenly and uniformly distributed fashion throughout the entire frame structure. The full-moment nodal interconnections, or connections, which exist according to this invention between beams and columns through the beam-mount and column-mount structures are, as can be seen clearly in the drawings, contactive, compound-angle, confronting, planar-bearing-face engagements. Such a frame structure requires no bracing or shear walls, and readily accommodates the later incorporation (into an emerging building) of both outer surface skin structure, and internal floor structure.
These, and various other, features and advantages which are offered by this invention will become more fully apparent as the description that now follows is read in conjunction with the accompanying drawings.

Collar-form, full-moment structural connection with angular, confronting, load-transfer, corner facets