text:
|Publication number
|Publication type
|Application number
|Publication date
|Feb 29, 2000
|Filing date
|Jan 23, 1998
|Priority date
|Jan 23, 1998
|Fee status
|Publication number
|Edison T. Hudson
|Original Assignee
|Zevatech, Inc.
|Export Citation
|BiBTeX, EndNote, RefMan
|Patent Citations (64), Non-Patent Citations (2), Referenced by (25), Classifications (5), Legal Events (8)
|External Links: USPTO, USPTO Assignment, Espacenet
1. Field of the Invention
This invention is directed generally to the field of devices for robotically centering components having a surface pattern such as die substrates having a circuit pattern or ball grid array. More particularly, the present invention relates to a method and apparatus for providing offset information to a standard component in-flight registration and orientation system, thereby allowing the accurate placement of a surface pattern of the component for use with either standard "die-up" or flip-chip assembly methods.
2. Background Art
In electronic circuitry manufacturing, automatic placement machines for moving discrete electronic components or semiconductor die (components) from a source location to a target placement area are known in the art. For example, one commonly known type of automatic placement machine includes a mechanical transport such as a pick and place machine. It typically has a pick-up arm capable of movement in two or three dimensions and has a vacuum nozzle for providing a component pick up function. The pick and place machine is used to pick up discrete electronic components such as resistors, capacitors, integrated circuits and the like from a component supply source (e.g., component supply feeders, magazines, and component bins) and place the components on a printed circuit board or on a substrate, collectively known as workpieces. Examples of a typical workpiece include a semiconductor die that has a surface pattern or geometry, a printed circuit board that has electrically conductive traces, a plurality of pads to receive surface mounted components, or a ball grid array. The surface patterns have small dimensions which are getting smaller as the market demands greater component densities. Consequently, it is of importance that the position of each discrete component to be placed as well as the relative location of the workpiece be known to a degree of accuracy suited for such dimensions before placement.
A typical pick and place machine, however, suffers from component placement deviations due to various causes such as mechanical backlash and component movement during the pick-up process. Consequently, various methods and apparatuses have been devised to compensate or correct for such placement deviations.
Providing precise placement of a component using a pick and place system requires the ability to accurately determine the actual position of the component relative to a reference position before the placement of the component at a target placement area. A typical approach includes combining a pick and place machine with a device for measuring the actual position of the component relative to a reference location after the component is picked up but before placement at a target placement area. This approach relies on occluded topography such as the outer perimeter or external shape of a component.
A typical pick and place machine has a vacuum nozzle, known as a quill, that provides a grasping and pick-up function. While grasping the component but before placing the component at a target placement area, the pick and place machine determines the actual position of the component relative to the position of the quill (in-flight position). The in-flight position information is typically in the form of an X-Y coordinate relative to the position of the quill (X-Y deviation) and a theta value relative to a positioning axis such as the vertical, longitudinal axis of the quill. Note that since the quill is typically orthogonal to a grasping surface of the component such as a top surface, the theta value provides the angular deviation of the component relative to the axis of the quill.
By determining the actual position of the component relative to the position of the quill, i.e., the in-flight position of the component, the pick and place machine may determine whether the component is at a predetermined normative X-Y position and angular orientation ("expected position") and if not, compute a corrective offset that is used to correct any deviation of the component from the expected position while the pick and place machine is grasping the component but before placement of the component. By ensuring that the component is at the expected position before placement, precise and accurate placement at a target placement area may be achieved since the actual location of the component is known and may be modified to a predetermined in-flight position before placement.
One approach to obtaining the in-flight position of a component is described in U.S. Pat. No. 4,615,093 to Tews, et al. As seen in FIG. 1A, Tews picks up a component 110 with a pick and place machine 112 and brings the component 110 up to a position scanning station 114, which is mounted and carried with the pick up head of machine 112, so that the in-flight position of the component 110 may be obtained. Position scanning is carried out at any point between pick up and placement. The in-flight position includes the X-Y position of the component relative to a nominal position (the X-Y deviation) and an angular position relative to a positioning axis 116 (the rotational deviation). In FIG. 1B, the method of obtaining the in-flight position of a component 118 by scanning the external dimensions such as the perimeter edge 120 of the component 118 is shown. Specifically, scanning is achieved by using a light source such as a row 122 of individual beam emitting elements 124 or another source of light. Opposite to the light source is a row 126 of receiving elements 128 such as photo-diodes so that the shadow cast by the component 118 may be determined and its positioned determined thereby.
In FIG. 2 U.S. Pat. No. 5,278,634 to Skunes et al. refines the approach taken by Tews et al. by obtaining the in-flight position of a surface mount-type component 210 using a sensor system 212. The sensor system 212 is comprised of a light source 214 which is passed through a collimating lens 216 and then through an aperture 218 to create a wide beam or stripe of collimated light 220 which is focused past the body of the component 210 being aligned to strike a multi-element CCD sensory array 222. The sensor system 212 is mounted directly on the carrying mechanism for the surface mount component placement machine such as a pick and place machine. During transit of the component between the source of the component and the target placement area, the component is rotated forming a shadow on the detector array while the array is monitored. When the minimum width of the shadow is detected, the correct angular orientation is determined, the average of the edges of the shadow when compared with the center of the quill determines the coordinate (X, Y) location of the component on the quill. Two alignment operations normally occur, each displaced by 90 degrees. Thereafter, the sensor sends correcting signals to the component placement machine to assure the correct angular position and the correct X,Y position for the component to be placed at the target placement location by the component placement machine. Thus, Skunes et al. like Tews et al. relies on the external dimensions such as the perimeter edges of the component to produce the necessary shadows that are monitored by the sensor array.
U.S. Pat. No. 5,559,727 to Deley et al. discloses an approach that is very much like the approaches disclosed by Tews et. al. and Skunes et al. Deley et al. discloses combining a positioning sensing system with a mechanical transport which are mounted on a movable frame with each other. In FIG. 3, the position sensing system 310 includes projecting a wide beam of collimated light 312 on a component 314 whose position is to be determined. The unblocked rays of light 316 are received and processed by an intermediate series of lenses 318 and an aperture 320. The rays of light are then directed as an image onto a linear array sensor 322 having a plurality of high density pixel sensors whose position is known relative to the pick up tool. The component 314 whose position is to be determined is rotated in the imaging field. A computer/controller (not shown) is coupled to the linear array sensor and an encoder for producing sets of X, Y and theta data indicative of the refocused collimated light rays projected onto the linear array sensor 322 and the computer/controller is programmable for analyzing the digital data for determining the X, Y, and theta position of the component on the pick up tool. Deley et al. relies on the external dimensions or shape such as the perimeter edges of the component and/or component leads to produce a wave form representing the varying silhouette of the component when the component is rotated in front of the sensing system.
However, as will be described in more detail below, the above approaches to determining the in-flight position of the component are ill-suited for use with components that include semiconductor dies having high density surface patterns since they measure the external dimensions of the die, i.e., the perimeter edges rather than the position of the circuit pattern disposed on the die. Thus, any measured position obtained reflects the actual position of the die not the surface pattern disposed thereon.
As generally known, the use of semiconductor die with either die up or flip-chip assembly methods includes removing die having a surface geometry or pattern such as a circuit pattern from a source location and placing the die to a new location for subsequent assembly. Since semiconductor die as well as other types of small components having lithographic or printed patterns are typically produced in an arrayed manner on a wafer, removal of each die from the wafer includes the sawing or dicing of the wafer, thereby producing individual component die as known in the art. Once the sawing or dicing process has been completed, placement of each die typically includes using a mechanical transport such as the types described above to place each die at a new location for subsequent assembly.
Placement of the die is critical since any subsequent assembly to be done to the die requires knowledge of the actual position, i.e., the X-Y position and angular orientation, of the circuit pattern on the die. For example, a subsequent assembly after dicing may include wire bonding the interconnects located within the circuit pattern. A process that inherently requires knowledge of the actual position of the circuit pattern in order to obtain the precise location of the interconnects requiring wire bonding.
As disclosed by Tews et al., Skunes et al., and Deley et al., the actual position of the component is calculated by measuring the external features of the component that provide an occluded topography such as the leads or package body of a discrete component. The same approach may be used for semiconductor die where the occluded topography used is the perimeter edges of the die. The perimeter edges of the die are used to obtain the actual position of the die. The actual position of the die is used in turn to calculate the X-Y position and angular orientation ("extrapolated position") of the circuit pattern using the centroid, i.e., mean center, of the circuit pattern as a point of reference. The extrapolated position of the centroid of the circuit pattern is not measured but assumed to be at a constant offset from the actual position of the perimeter edges of the die.
However, relying on the perimeter edges of a die to extrapolate the position of the circuit pattern is not well-suited to semiconductor die having very high surface pattern densities. Such densities leave very little room for variances between the actual location of the die pattern and the perimeter edges of the die. Specifically, although the pattern on the surface of a die is highly accurate and may be ensured to vary less than 0.5 microns as currently known in the art, the perimeter edges are less accurate and vary up to 25 microns.
The position of the perimeter of semiconductor die varies from die to die because typically more than one die are produced from a single silicon wafer and must each be sawed to produce an individual die. But the dicing or sawing process has a limited best accuracy of being greater than 25 microns. Due to factors such as the wearing of the dicing saw and set-up inaccuracies, the sawed edges comprising the perimeter of each die are typically off-center and vary relative to the centroid of the circuit pattern on the surface of the die. As die features become smaller and denser in new semiconductor designs, the accuracy needed in automatic assembly systems has increased.
Consequently, using the perimeter of the die as an accurate and consistent reference to the centroid position and orientation of the die surface pattern is ill-suited for placement purposes for such dies.
Also, another approach as known in the art is to measure the circuit pattern rather than using the perimeter edge of the die prior to picking up the die with a mechanical transport such as a pick and place system. However, placement is carried out "blind" and without regard to any errors introduced by the mechanics of picking-up the die ("pick-up errors"). These pick-up errors affect placement accuracy of the circuit pattern disposed on the die and must be compensated for in a later step of the assembly process such as through wire-bonder offset correction.
The present invention provides for the accurate placement of an object having a surface pattern by relating the perimeter of the object to the surface pattern, such as a circuit pattern of a semiconductor die. This includes illuminating the object at its front and rear faces and viewing the object with a machine vision system. Front-side illumination of the surface pattern enables the machine vision system to obtain an image of the actual position of the circuit pattern or other pattern of interest on the front of the component. Rear illumination provides a silhouette of the perimeter edges of the component enabling the machine vision system to obtain the actual position of the perimeter edges of the component. A corrective offset from a normative feature location, such as the centroid defined by the perimeter edges of the component, is then calculated. The machine vision system is coupled to a conventional automatic component placement system that uses an in-flight perimeter registration and orientation system. The corrective offset from the machine vision system is used to adjust the position calculated by the conventional perimeter registration system to precisely place the component with respect to features of interest on the component, such as a selected group of contact pads or interconnect features found in a semiconductor circuit pattern, rather than with respect to the mere outline of the component.
Accordingly, it is an object and advantage of the present invention to provide an improved automatic placement machine for and method for placement of components having a surface pattern disposed thereon.
More particularly, it is an object and advantage of the present invention to enable an automatic placement machine to determine the X-Y position and angular orientation of the surface pattern (such as the interconnect features or contact pads of a circuit pattern) disposed on the die relative to the perimeter of the die and to combine this information with a second measurement of the die centroid using the perimeter of the die in order to produce an exact correction factor before placement.
Furthermore, it is an object and advantage of the present invention to extend the concept of measuring a component to be picked and placed by machine to uses that are specific to the assembly of semiconductor dies using either standard "die-up" or flip-chip methods.
These and many other objects and advantages of the present invention will become apparent to those of ordinary skill in the art from a consideration of the drawings and ensuing description of the invention.
FIG. 1A is a side view schematic drawing showing a prior art pick and place machine having a position scanning station between the source location and the target placement location.
FIG. 1B is a schematic drawing showing the position scanning station described in FIG. 1A. The scanning station employs a light source and a plurality of sensors.
FIG. 2 is a schematic drawing showing the elements of another prior art scanning station employing a light source and a plurality of sensors.
FIG. 3 is a schematic drawing showing another sensing system that projects a beam of light directed at a component and received by a linear sensor array.
FIG. 4A is a side view schematic drawing of a presently preferred embodiment of the present invention integrated with an automatic placement machine that uses a conventional in-flight perimeter registration system.
FIG. 4B is a diagram of the typical field of view as seen from a scanner according to a presently preferred embodiment of the present invention showing die channels as light-colored areas demarcating semiconductor die as a result of back lighting or illumination.
FIG. 4C is a diagram of the typical field of view as seen from a scanner that also shows the saw cuts imaged as light areas as a result of back lighting or illumination.
FIG. 5 shows a flowchart for a method of in-flight centering according to a presently preferred embodiment of the present invention.
FIG. 6 is a schematic diagram of a semiconductor die with two fitted lines X,Y that are each applied to an irregular perimeter edge to forming an intersection.
Those of ordinary skill in the art will realize that the following description of the present invention is illustrative only and is not intended to be in any way limiting. Other embodiments of the invention will readily suggest themselves to such skilled persons from an examination of the within disclosure.
Turning now to FIG. 4A, an automatic placement machine 400 using the present invention is depicted. The apparatus of the present invention provides a machine vision system 402 that is integrated with a conventional automatic component placement system 404 that uses an in-flight perimeter registration and orientation system 408. In-flight perimeter registration and orientation system 408 is any type of placement system that is capable of placing a die 412 at a placement location by determining the centroid of the perimeter edge 420 (see FIGS. 4B-4C) through the measurement of occluded topography. One such in-flight registration and orientation system is available from CyberOptics of Minneapolis, Minn. Machine vision system 402 includes an area array sensor 406, or equivalent sensing system, such as a charge-coupled device ("CCD") imager, or any other equivalent device; and a control system 407 for generating a correction factor and for directing the components of machine vision system 402, as described.
Control system 407 generates the correction factor by using front illumination and imaging to obtain a surface geometry, such as the die pattern of a semiconductor die contact pads, or other interconnect features, of the object being illuminated. Control system 407 also uses back illumination of the die to determine the location and orientation of the edges of die 412 so that a die pattern to edge relationship can be calculated. Control system 407 uses the correction factor to finely adjust the die position that was calculated by in-flight registration and centering system 408 for die 412. This results in the final position of the object to be based on the surface pattern of the object.
A mechanical transport 408 such as a pick and place machine moveable in an X-Y plane 409 and a pick-up head 410 is shown. The pick-up head 410 is used for grasping and moving die 412 from a source location 414, such as from a diced silicon wafer 414 or from a strip of nitto tape having attached die, located at a supply location 416 to a placement location 418. Accurate and precision placement of die 412 at placement location 418 is based on the centroid of die 412 being corrected with the correction factor provided by control system 407 to in-flight registration and orientation system 408. Thus, the correction factor from the machine vision system is used to adjust the position calculated by the conventional perimeter registration system to precisely place the component with respect to features of interest on the component, such as the center of the circuit pattern or center of a group of selected contact pads, rather than the mere outline of the component.
The area array sensor 406 is positioned over a diced silicon wafer 414 and focused so as to have a field of view 422 that includes at least one component having a surface geometry, such as circuit pattern 424 disposed on a top surface 426 of a selected semiconductor die 428. Note that as presently contemplated, the present invention is not intended to be limited in any way for use solely with semiconductor die cut from a wafer but may be used with any component having a surface pattern such as a ball grid array or microprocessor.
A back lighting system 430 integrated with the machine vision system 402 is provided for illuminating the bottom surface 432 of the die 412, producing an image of a perimeter silhouette 434 of the die 412. A front lighting system 436 is provided for illuminating the top surface 426 of the die 428. The appropriate illumination level and configuration for the illumination is determined by the optics assembly 438 and the area array sensor 406 being employed.
As commonly known, a processed uncut wafer 440 typically has lattice-like channels or "streets" 442 that run in rows and columns demarcating the perimeter edge 420 of individual die formed on the uncut wafer 440. The streets 442 are typically "cut-out" or removed during the dicing process, resulting in voids 444 formed between each perimeter edge 420 of the selected die 428. The voids 444 enable the back light system 430 to produce an image of the perimeter silhouette 434 from the selected die 428 as illuminated by the back light system 430. Note that before dicing, each processed uncut wafer 440 has a clear tape backing commonly known as Nitto tape (not shown). The Nitto tape is not cut during the dicing process since the tape stretches away from the cutting blade (not shown). This enables the streets 442 to be removed and the voids 444 formed while the selected die 428 are kept at their respective positions after dicing.
The maximum number of die 428 captured within a chosen field of view 422 is constrained by the placement accuracy required, the maximum resolution of the optics assembly 438 for a given field of view 422, and the number of selected die 428 that can fit within the field of view 422. More particularly, the number of selected die 428 that can be captured at one time by the area array sensor 406 depends on the size of the field of view 422 chosen. The larger the field of view 422, the greater number of selected die 428 that may be imaged. However, the size of the field of view 422 is inversely proportional to the spatial distortion or "pixel resolution" for a given optics assembly, i.e., an increase in the field of view results in a decrease in pixel resolution. In turn, the minimum pixel resolution allowable is limited by the required placement accuracy. Consequently, the placement accuracy required determines the minimum pixel resolution allowable which in turn determines the maximum field of view 422.
For example, it is contemplated that a placement accuracy of 50 microns requires a deviation of no more than 10%, i.e., 5 microns. To accurately measure a deviation of 5 microns requires a minimum pixel resolution of about 1 micron or 20% of the maximum allowable deviation from the required placement accuracy. Obtaining a minimum pixel resolution results in a corresponding field of view which in turn determines the maximum number of die of any given size that may fit within the field of view chosen. For example, a 20 mm�20 mm field of view will be sufficient to cover one 16 mm�16 mm die, four 8 mm�8 mm dice, or sixteen 4 mm�4 mm dice. Thus, the maximum number of die that may fit within the field of view chosen while optimizing accuracy is dependent on choosing a field of view that does not exceed the minimum pixel resolution required for a given placement accuracy requirement.
FIG. 5 shows a flowchart for the preferred method of in-flight centering.
Note that steps 510 through 532 may be performed or directed by control system 407 which may be provided by using an embedded system, or equivalent means, running under program control.
At step 510, under direction of control system 407, the area array sensor 406 is positioned and focused above one or more selected semiconductor die 428.
At step 512, the back lighting system 430 illuminates the bottom surface 432 of a silicon wafer 414, producing an image of the die's perimeter silhouette 434.
At step 514, the front lighting system 436 illuminates the top surface 426 of the wafer 414 so as to illuminate at least one circuit pattern (or surface geometry) 424 disposed on a corresponding selected die 428. The appropriate illumination level and configuration for the illumination is determined by the optics 438 and the area array sensor 406 being employed.
At step 516, an image of at least one selected die 428 is scanned, captured, and stored for digital analysis. The captured image is digitized for intensity graduations, grayscale or any other spectral property related to the pattern or geometric features that were captured. This obtains an image of the surface geometry, such as a die circuit pattern, interconnect features, contact pads, and the like, which is stored as a digital scale.
At step 518, the stored information is analyzed and measured using techniques known in the art such as grayscale edge extraction using gradient or gaussian calculations, or techniques such as normalized correlation.
At step 520, the location of the die's perimeter edges 610 are extracted, as shown in FIG. 6. Each perimeter edge 610 suffers from irregularities that are defined by edge points 612 so that the central value of the edge points is used to determine the location of each edge 610. Specifically, the location of the die's irregular perimeter edge 610 is made visible by the back light 430, scanned, and then extracted by finding the central value 614a of edge points 612 comprising each one of the irregular edges forming the perimeter edges 610 of the die.
At step 522, the central value 614a of the irregular edges 610 forming the die perimeter is then calculated by using the location of the perimeter edges 610 with any appropriate method known in the art, such as a fitting method. In the preferred embodiment of the present invention such a solution includes using a linear least squares fitting technique to obtain the orientation and location of the central value 614a representing each edge. The central value for each edge is expressed in polar coordinates, thereby providing the location and orientation of the die edge. This is the first geometric parameter extracted, and is hereinafter referred to as fit lines.
At step 524, the location 616 of the outer boundary of the surface geometry 618 located on the die surface, such as the outer most pathways, contact pads, or the interconnect features of a circuit pattern on a semiconductor die, is calculated using the image information captured in step 516. The centroid location 620 of the surface geometry 618 is then calculated and expressed in polar coordinates. This is the second geometric parameter extracted.
At step 526, an offset coordinate vector is calculated using the geometric parameters extracted in steps 522 and 524 and is expressed in polar coordinates as X, Y, and RZ. In the preferred embodiment of the present invention, this calculation is the vector sum of the X, Y, and RZ components of at least two linear least squares fit lines of the irregular perimeter edge, as extracted in step 522, and the centroid location 620 of the surface geometry 618, as extracted in step 524. The offset coordinate vector specifies the relationship between at least two fitted lines 614a, 614b with the centroid location 620 of the surface geometry 618 as seen from a selected field of view.
At step 528, the die 412 to be assembled is selected and the pick-up head 410 is moved into position to pick-up the die 412 at a somewhat central location of the die 412. The die 412 is then picked up and moved along an X, Y plane toward the placement location 418. During transition from the supply location 416 to the placement location 418, the perimeter centroid location of the die 412 is determined relative to the coordinate system of the pick and place mechanism, as known in the art. As discussed above, the perimeter centroid location of the die is determined using an in-flight registration and centering system that scans the perimeter of the die to obtain the location and orientation of the die's perimeter. It then uses the location and orientation of the die's perimeter to approximate the location of the die's centroid using the scanned perimeter edge.
At step 530, a correction factor is then calculated for the die using the extracted perimeter centroid location obtained in step 528 and the coordinate vector as calculated in step 526.
At step 532, the correction factor is then provided to the in-flight perimeter imaging and registration system 404 to center the die surface geometry 618 at the placement location 418. Adjustment of the placement location 418 is thus accomplished by offsetting the perimeter centroid location of the die found by the in-flight registration and centering system.
The above method enables placement of the die at the placement location 418 such that the circuit pattern, contact pads, interconnect features, or the like, are located and oriented correctly at the placement location 418 regardless of the irregularity of the peripheral sawed edges of the die and the mechanical disturbance introduced by the picking operation. Overall assembly accuracy is enhanced and the production cycle is optimized by having this centering occur during translation from the supply location 416 and to the intended placement location 418. Such an advantage can easily be obtained in areas specific to the assembly of semiconductor dies that use either standard "die-up" or flip-chip methods because such methods require a high degree of precision with respect to the location of contact pads and interconnect features.
While illustrative embodiments and applications of this invention have been shown and described, it would be apparent to those skilled in the art that many more modifications than have been mentioned above are possible without departing from the inventive concepts set forth herein. The invention, therefore, is not to be limited except in the spirit of the appended claims.
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|Gay Fr�res Vente et Exportation S.A.
|Memory device
|Oct 26, 1994
|Apr 26, 1995
|Siemens Aktiengesellschaft
|Method for manufacturing chip cards by injection moulding
|May 10, 1995
|Nov 15, 1995
|Giesecke & Devrient GmbH
|Record carrier with integrated circuit
|Title not available
|Title not available
|Title not available
|Title not available
|Title not available
|Title not available
|Title not available
|Title not available
|Title not available
|Title not available
|Gore, et al., Fluxing Tool Incorporated Into Part Feeder; Specifically for Assembly of C 5 Chip Carriers, Motorola Inc., Technical Developments, vol. 13, Jul. 1991, pp. 36 37.
|Gore, et al., Fluxing Tool Incorporated Into Part Feeder; Specifically for Assembly of C-5 Chip Carriers, Motorola Inc., Technical Developments, vol. 13, Jul. 1991, pp. 36-37.
|Citing Patent
|Filing date
|Publication date
|Jan 14, 1999
|Oct 24, 2000
|Esec Sa
|Ultrasonic transducer with a flange for mounting on an ultrasonic welding device, in particular on a wire bonder
|Jan 29, 2002
|Jan 14, 2003
|Tyco Electronics Corporation
|Method of locating and placing eye point features of a semiconductor die on a substrate
|Sep 30, 1999
|Mar 11, 2003
|Accu-Assembly, Inc.
|Component feeder identification and monitoring and component inventory tracking
|Jun 7, 2000
|Mar 18, 2003
|Cyberoptics Corporation
|Calibration methods for placement machines incorporating on-head linescan sensing
|Mar 13, 2000
|Mar 25, 2003
|Cyberoptics Corporation
|Pick and place machine with improved vision system including a linescan sensor
|Nov 4, 1999
|Aug 19, 2003
|Cyberoptics Corporation
|Electronics assembly apparatus with height sensing sensor
|Nov 4, 1999
|Aug 26, 2003
|Cyberoptics Corporation
|Electronics assembly apparatus with stereo vision linescan sensor
|Jan 7, 2003
|Jun 1, 2004
|Cyberoptics Corporation
|Calibration methods for placement machines incorporating on-head linescan sensing
|Nov 27, 2000
|Aug 17, 2004
|Accu-Assembly Incorporated
|Monitoring electronic component holders
|Mar 28, 2003
|Apr 12, 2005
|Accu-Assembly Incorporated
|Placement of electronic components
|Dec 22, 2006
|Mar 24, 2009
|Pdf Solutions, Inc.
|Adjusting die placement on a semiconductor wafer to increase yield
|Mar 20, 2008
|Jun 29, 2010
|Cyberoptics Corporation
|Method for measuring center of rotation of a nozzle of a pick and place machine using a collimated laser beam
|Jun 5, 2008
|Nov 29, 2011
|Cyberoptics Corporation
|Component sensor for pick and place machine using improved shadow imaging
|Aug 17, 2010
|Dec 11, 2012
|Pepperl + Fuchs Gmbh
|Method for detecting objects
|Jan 7, 2003
|Aug 21, 2003
|Skunes Timothy A.
|Calibration methods for placement machines incorporating on-head linescan sensing
|Mar 28, 2003
|Sep 30, 2004
|Kou Yuen-Foo Michael
|Placement of electronic components
|Oct 26, 2004
|Jun 16, 2005
|Nitto Denko Corporation
|Protective tape joining method and apparatus using the same as well as protective tape separating method and apparatus using the same
|Dec 22, 2006
|May 10, 2007
|Pdf Solutions, Inc.
|Adjusting die placement on a semiconductor wafer to increase yield
|Jan 12, 2006
|May 1, 2008
|Akifumi Wada
|Holder Identifying Apparatus, Component Supplying Method And Mounter
|Jun 5, 2008
|Jan 1, 2009
|Rudd Eric P
|Component sensor for pick and place machine using improved shadow imaging
|Aug 17, 2010
|Mar 31, 2011
|Torsten Olbrecht
|Method for detecting objects
|Nov 13, 1995
|Mar 11, 2003
|Cyberoptics Corporation
|High precision component alignment sensor system
|Jan 29, 2003
|Jul 30, 2003
|Tyco Electronics Corporation
|Method of locating and placing eye point features of a semiconductor die on a substrate
|Jan 29, 2003
|Mar 2, 2005
|Tyco Electronics Corporation
|Method of locating and placing eye point features of a semiconductor die on a substrate
|Nov 20, 2001
|May 30, 2002
|Accu-Assembly Incorporated
|Monitoring electronic component holders
|U.S. Classification
|250/548, 356/400
|International Classification
|Cooperative Classification
|European Classification
|Jun 23, 1998
Owner name: ZEVATECH, INC., NORTH CAROLINA
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HUDSON, EDISON T.;REEL/FRAME:009281/0080
Effective date: 19980319
|Dec 26, 2000
Owner name: ESEC TRADING SA, SWITZERLAND
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:ZEVATECH, INC.;REEL/FRAME:011400/0209
Effective date: 20001201
|Mar 27, 2001
|Certificate of correction
|Jul 31, 2003
|Fee payment
Year of fee payment: 4
|Jul 19, 2007
|Fee payment
Year of fee payment: 8
|Oct 10, 2011
|Maintenance fee reminder mailed
|Feb 29, 2012
|Lapse for failure to pay maintenance fees
|Apr 17, 2012
|Expired due to failure to pay maintenance fee
Effective date: 20120229


text:
Eric Dutram: For investors who focus on emerging market ETFs, political intervention should always be a key worry. While many governments in emerging nations have done a pretty good job of letting companies exist freely outside the state, Argentina has apparently taken a different approach as of late.
Argentina ETF In Focus On Nationalization Proposal (ARGT, YPF, EPU, EWZ, ECH)
Mark Mobius Is Looking At Argentina, But Should You? (ARGT, BMA, YPF, EEM, VWO)
Joseph Hogue: Mark Mobius, executive chairman of the $45 billion Templeton Emerging Markets Group, is buying into Argentine stocks with attractive valuations.
NYSE:ARGT January 5, 2012 2:39pm
Country ETF: Is Argentina Headed For Trouble? (YPF, ARGT, BMA, RBS, EEM, VWO)
Jonathan Yates: A Royal Bank of Scotland (NYSE:RBS) report is warning investors of troubles ahead in Argentina, as the exchanged-traded fund (ETF) for the country (NYSEARCA:ARGT) and major stocks
NYSE:ARGT December 3, 2011 6:32pm

subset: commoncrawl


text:
Claire Mahoney looks at the lesser-known, but no less influential 60s design duo that was: Foale & Tuffin
Designer Zandra Rhodes described them as the 'Queens of Carnaby Street,' others dubbed them the 'Liver Birds' of the London fashion scene – the dynamic duo that they are referring to are designers Foale & Tuffin.
You may not have heard of them. (I hadn't until I started delving deeper into the history of 60s fashion.) But these two East End art school girls has no less an influence on 60s fashion and the mod look than the likes of Mary Quant and to those who were in with the in-crowd, they were the designers that people wanted to wear.
Marion Foale and Sally Tuffin met at Walthamstow Art School. These bright young girls epitomised everything that the 60s was really about. They were determined to do something different and they were going to do it all by themselves and not sell out in the process.
So they stepped straight out of the Royal College of Art and took the bold decision to set up on their own. In 1961 they rented a small workshop and showroom in west London for six guineas a week. Then, with just two old sewing machines bought for them by their parents, they rolled up their sleeves and got to work. Initially they would buy their fabrics from the local department stores. Their workshop was not far from Liberty and the department stores' famous Arts & Crafts influenced prints became a feature of many of their creations. Entire collections were made lovingly by hand to order and when their business started to take off they opened their shop in Ganton Street just off Carnaby Street.
Their little boutique attracted a devoted following – fans included Jean Shrimpton. Julie Christie, Susanna York and Cilla Black and their house model was Pattie Boyd's sister, Jenny.
So what was it about Foale & Tuffin's designs that were so appealing? Well for a start they were rebellious and they understood what young people wanted because they were young themselves.
"We'd had it rammed down our throats – I had to go to Sunday School with white gloves, a hat and a handbag, just like a miniature mum in a dress made by her, exactly the same as hers! I mean who wanted to do that? We just wanted to kick against it all," says Sally Tuffin. And kick they did. People talk about how Yves Saint Laurent introduced the trouser suit for women but actually, it was Foale & Tuffin that did it first. Their design was in brown corduroy and most importantly was created for women by women.
Marion Foale recalls in an interview for the V&A ahead of a retrospective exhibition of their work in 2009. "I remember us putting a corduroy jacket on Jill Kennington and putting the trousers with it and falling about with laughter – it was so funny. We must have been making trousers anyway, but not with jackets. We put it all together and thought it was hilarious!"
It was good timing. By the mid-60s the sharp mod look was starting to get a little more playful with the likes of John Stephen stocking more dandy-ish styles with frills and Victorian style detailing for men. So as the men began to embrace their feminine side the women could explore a more liberated a less sexualised androgyny, that ironically, was no less sexy for it.
Foale & Tuffin designs were also playful. They were one of the first designers of the era to ignore the rule of matching clothes and accessories and wantonly clashed spots, stripes and checks – sometimes all in the same outfit.
They loved plaids and tartans and created skirt and trouser suits in contrasting prints and colours. They matched them with brightly coloured woollen tights. Their designs were so popular that they were eventually picked up by the big stores in the States and licensed to J C Penney and Paraphernalia.
Foale & Tuffin like many of the brands of that era either fizzled out or changed course in the early 70s, in this case, both had settled down to raise their families. Marion Foale, however, later went on to set up a very successful knitwear design business and Sally Tuffin became a successful ceramicist.
The legacy of their brand may not have been discussed as much as the likes of Quant and Biba. But to those in the know, Foale & Tuffin were a brand to be reckoned with.
To read more about them and see some fantastic pictures of their designs – take a look at Foale and Tuffin: The Sixties. A Decade in Fashion by Iain R. Webb, published by ACC Publishing Group.
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text:
Steven Methe
I have a deeper set voice with a vocal range that can go higher. When doing impressions I am also able to matchup the needed voice with accuracy when given enough time.
English (North American), English, Spanish (Iberian)
India (Hindi), Russian, Scottish
Middle Aged, Teen, Young Adult
Special Skills
Audiobooks, Cartoons, Documentaries, Educational, Internet, Movie Trailers, Podcasting, Radio, Television, Videogames
Impressions and announcing in local shows and events.
Computer & Software
Apple Desktop and an HP Laptop with audacity
Turnaround Time
I'm around whenever a job needs to be done
Service Description
I can be around anytime a job is needed to be done for as long as you need me to be around. I also focus on the emotion needed for the character so that a positive atmosphere is built around the voice/character.
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Hire Steven as a voice actor. Payment is made through Voices.com SurePay, an escrow service that guarantees your work is done to your satisfaction. Send payment securely by Visa, Mastercard or PayPal through Voices.com then download your files from the website.
Watch a video to see how to make a payment
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text:
Carlismineforever, I'm so glad you decided to post. Welcome to the forum. I'm very sorry that you, your husband and family are having to deal with his liver disease. I do want to clear up one thing: Your husband would not be denied a transplant due to prior drug use, if it has been that long ago. Undoubtedly, that's how he contracted the hep C. I did, too, in the same manner. What would prevent him from being considered for a transplant is his drinking of 2 beers a day. If that is all he is drinking, it should be easy for him to quit. He may feel that's all he has left, but those 2 beers a day are speeding up the damage to his liver. He already has cirrhosis, so it's like throwing fuel on a fire. He is making it worse. He would need to be alcohol free for 6 mos. and have it documented by participating in alcohol counseling or going to AA meetings, before he would be evaluated for liver transplant. Has he been told that he would not survive a transplant, or is that just what he is telling you? Stage 4 generally means cirrhosis.
First of all, you need to get educated about liver disease. If you'll go to the first topic on the page, Hepatitis Resources, you will find a lot of educational information in there. The addition of Lactulose to your husband's meds is to lower his ammonia level. Damaged livers cannot process certain chemicals and they become toxic. In the case of ammonia, it will build up in his brain, causing personality changes and even coma. You need to make sure that he is taking the Lactulose as prescribed. It will cause him to have several bowel movements a day, which is how the ammonia will be excreted.
Is he being seen by a hepatologist or at a transplant center? It seems he has taken a fatalistic view of his disease and is not willing to do things that will slow down the process. He should refrain from eating beef as the liver finds it very hard to process. He can eat chicken and fish, beans, cheese, etc., for protein. He should eat a lot of fresh fruits and veggies. He CAN help himself feel better, but it will take changing a few things, including giving up alcohol altogether. The main symptom of hep C is fatigue. However, it can lead to cirrhosis and complications of that, as well as liver cancer. Has he ever had hep C treatment?
The esophageal varices and big belly are very common in End Stage Liver Disease.
Read some of the older posts here and you will gain a lot of information. Ask questions about anything you don't understand and some of us will try to answer.
Again, welcome!
Your husband needs to go on the liver transplant list,or doesnt he want to? Do you go with him to his DR. appointments? If you dont or havent in awhile maybe you should,maybe he is confused or just in denial.
Good luck....my thoughts and prayers are with you,
You are right about him having to stop drinking. If its only 2 beers a day ,he can and should stop. Thats why I was wondering if he is confused or just doesnt want to be on the list. Does he have other medical problems that might make him ineligable for transplant? and thats why he continues to drink,even though the 2 beers a day are damaging his liver quicker. The more we know the more we may be able to help her with her questions. I wish her and him the best and they are in my prayers,as you are Connie. How are you feeling?
DeeDee, I am feeling wiped out still from the surgery, but otherwise okay. Hope you are doing well.
Decompensated cirrhosis means that his liver is not functioning correctly. That is also what is causing the ankle swelling. The "water pill" (diuretic, probably Lasix) should eliminate the fluid build-up. He should also curtail his intake of salt. Don't cook with it and don't add it to foods. Get salt substitute instead, or use lemon (which tastes salty) on veggies. Avoid canned foods, which are loaded with salt. He should also elevate his feet. Walking will help, too, as long as he doesn't overdo it.
Please do read the educational posts in Hepatitis Resources. You can get all your questions answered by reading that. Also, with a MELD score of 9, he is not bad enough to place on the transplant list yet. They usually wait until a patient's MELD is in the mid to high 20s or higher.
If he is not willing to stop drinking, there's really nothing you can do. He just needs to be aware that he is speeding up liver failure by drinking. Also, doctors do not look too kindly on a patient with liver disease who continues to drink. They can do their part, but the patient also needs to hold up his end; otherwise, whatever efforts they make mean nothing.
Here's hoping he comes to his senses. Has he applied for SSD?
I think you should talk to the DR. about the meds hes on,the risperdal is given in low doses can be used for sleep problems,as ambien is, neurontin is used for seizures and neuropahty pain,atavan is for anxiety,lithium and risperdol are mood stablizers and for depression, Some of these meds combined can make him more depressed and the beer on top of it will make it worse not to mention intenseify the affects. I'm not sure of the effects it has on the liver but you can ask the pharmacist and they can tell you or ask the Dr. Some times they say the benifits out way the risks,but I'm no doctor.
You said his meld score is 9, mine is 12 and I'm on the transplant list,[low on the list] the higher my score gets the higher I get on the list. The hospital he went to for the transplant evaluation should have given him a diet plan on what to eat and what to stay away from. No red meat ,no salt, how much protien he should have or not ect. You should ask to see a nutitionist .
I hope I helped alittle. Take care and my prayers are with you both,
Thanks to DeeDee and mer for your informative posts. I'm in agreement that Carl may be over-medicated. Since alcohol is a central nervous system depressant, it may keep the antidepressants from doing their job...or can also cause drowsiness. If he drinks with the Ativan, he will have more of a depressed effect. When they are trying to battle both anxiety and depression with meds, it can be quite a balancing act. Does your husband's doctor know that he is still drinking?
Mer, smokers are slower to heal, and of course there are also breathing issues for smokers when they undergo anesthesia...both reasons that doctors encourage patients to stop smoking.
Carlismyforeverlove, when he complains about his ankles swelling, tell him to elevate his legs and cut out salt. If he won't do so, then tell him not to complain about it then. Something tells me he wouldn't be willing to see a counselor to discuss his feelings, but it would be good for him if he would consider it.
A man's ego is so dependent on working and providing for his family, that when he becomes unable to work, it can cause enormous depression. My father actually committed suicide because of it. Counseling regarding his self-worth and the loss he feels by not being able to work would also be invaluable.


text:
Toyota of Puyallup
Review for Toyota of Puyallup
COLLEEN W. on 04/29/2015
"Joe and Mike"
They are the best! they put up with me and my wanting everything for free. They treat me right, give me space and let me be the boss of my purchase. Thank you.
Vehicle: TOYOTA TACOMA
Category: Sales
Sales Date: 04/28/2015
Review Created: 04/29/2015 02:17 PM


text:
We recommend upgrading to the latest Internet Explorer, Google Chrome, or Firefox.
If you are using IE 9 or later, make sure you turn off "Compatibility View".
Handpicked brands for you
Cruising the streets that he grew up on. Worker straight chino Black & Death Valley shirt: DC Defined by @davistorgerson, Fall 2016. Photo: @blabacphoto. Dcshoes.com/dcxdavis #dcshoes #dcdefinedby


text:
MOVIE SYNOPSIS [ General Audiences ] Being a production of USA, this feature film of 2014 has been excellently directed by Jeremy Dylan Lanni. You can watch Conjuring Orson online on TV cable or theaters with original audio in English at different dates. This film premiered in theaters in 2014.
Rating: 5 by 10 users./
Runtime: 9 minutes
Peter Jason, Eileen Barnett, Sarah Glendening, Clifford Morts and Stuart Pankin.
Short film, Comedy.
9-minute film (full movie) directed by Jeremy Dylan Lanni.
The original audio of Conjuring Orson has dialogues in Dolby Digital, it was produced in USA.
It premiered in cinemas or television in 2014.
Screenplay written by Jeremy Dylan Lanni.
Enzo Giobbe.
Jeremy Dylan Lanni.
Composed by Paul Cristo.
Without commercial breaks, the full movie Conjuring Orson has a duration of 9 minutes; the official trailer can be watched in streaming on the Internet. You can watch this full movie free in EnglishDolby Digital in movie TV channels, renting the DVD or with VoD services (Video On Demand player, Hulu) and PPV (Pay Per View, Netflix).
See the page of this full movie, Conjuring Orson in FULLTV Movies.


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htop by Hisham Muhammad <firstname.lastname@example.com> May, 2004 - June, 2009 Introduction ~~~~~~~~~~~~ This is htop, an interactive process viewer. It requires ncurses. It is tested with Linux 2.6, but is also reported to work (and was originally developed) with the 2.4 series. Note that, while, htop is Linux specific -- it is based on the Linux /proc filesystem -- it is also reported to more»
This is a stripped-down version of the PLPA 1.1 package, adapted to be embedded in the htop code base. For the full PLPA package, go to http://www.open-mpi.org/projects/plpa/. Copyright notice for PLPA follows below. -- Hisham Muhammad, htop author. March 2008. =========================================================================== This is the Portable Linux Processor Affinity (PLPA) pack more»
See the ChangeLog for news of the past. See the TODO list for news of the future. Run the program for news of the present.
What's new in version 0.8.3 * BUGFIX: Fix crash on F6 key (thanks to Rainer Suhm) * BUGFIX: Fix more»
BUGS: * tagged files are cleared if 'kill' fails http://bugs.debian.org/cgi-bin/bugreport.cgi? more»
Hisham H. Muhammad
PLPA Authors ============ The IDs in parenthesis are those used in Subversion commit notices. Curr more»
Copyright (c) 2004-2006 The Trustees of Indiana University and Indiana Unive more»


text: I need help finding a nice restaurant not too far from Medford next Friday and Saturday night. Four of us will be going to Long Island for the 1st time and staying at Fairfield Inn in Medford, NY. We will have a car so we can travel. Can be anything from high end to moderately priced but with less than a week reservations might be a challenge?


text:
With First Tutors you can find a local welsh teacher in Uckfield and anywhere in the UK. Local welsh tuition is an excellent way to improve confidence while increasing grades and doesn't have to be dull! Please use our service to find Uckfield welsh tutors and select which best meets your requirements.
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text: Hi everyone I am new the Droid. I have a Moto Droid and so far i am loving it. I know there is so much you can do with a Droid but dont know how, I would love some help. some things I would love to do is get or make a sweet looking home screen also I would like to know how to Root and is good or bad to Root. Thank everyone.


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Fancy Nancy: Every Day Is Earth Day (Hardcover)
Usually Ships in 1-5 Days
Learning to respect the environment is no small task, especially if you want to celebrate Earth Day every day of the week Luckily, Nancy is on hand to make sure Mom, Dad, and her little sister do their part in being green--even if she has to keep reminding them. Nancy knows that she's helping her family do something very important, but will she take her enthusiasm for the environment a step too far?
A sweet story about learning to respect both the Earth and your family, this I Can Read includes a glossary of Fancy Nancy's Fancy Words in the back.


text:
Newsarama Readers' Favorite COVER of 2010: BATWOMAN #0
Click here for Winner: Favorite Writer 2010: Geoff JohnsClick here for Winner: Favorite Artist 2010: J.H. Williams III What more can be said about J. H. Williams III's cover art? Already the winner of our Reader's Favorite Artist competition, his cover to Batwoman #0 simply trounced the competition all the way through the tournament, though Rafael Albuquerque's iconic Superboy #1 cover held its own and did some trouncing throughout the tournament as well.
Before taking down the Boy of Steel, it was the Girl of Steel by Amy Reeder that fell to Williams' pencil. Newsarama Readers just didn't appreciate Pirate Batman from Andy Kubert as much as Newsarama contributors did, and Salvador Larroca's reflection-less vampire variant for Iron Man disappeared easily under Batwoman's might.
When we spoke with Williams about his win yesterday, he had this to say (Statement is repeated from yesterday's victory):
"Thanks so much to the readers, and the Newsarama crew, for all of the good vibes sent my way. I hope you'll find enjoyment from the new material to come in 2011 as well."
The wait for new Williams art isn't long now, with Batwoman #1 (and another amazing cover) due on shelves next month.


text:
EllinikoTheatro is an international performing arts organization based in New York and Athens. Since its inception in 1979, it has sought to serve as an innovative carrier of cultural diplomacy, expanding the temporal, spatial and social boundaries of Hellenic Theatre.
EllinikoTheatro is launching its 2017-18 Capital Campaign to sustain its international projects. Please click on SUPPORT to join our Fundraising Team and to DONATE!
At the Gardens of Athens Concert Hall on the night of September 23rd!Read more »
A huge thank you to Santorini Arts Factory for hosting 'Socrates Now' at their magical venue for the second time and to the audience for the warm and enticing discussion afterwards! Photography: Irigeneia ProudActionsRead more »
Yannis Simonides spoke on national TV live about EllinikoTheatro.Read more »
Socrates Now returns for the 6th summer in Athens to celebrate its new residency at Theatre 104Read more »
"You cannot step into the same text twice: JORGE LUIS BORGES and ANCIENT GREEK PHILOSOPHY"Read more »
Socrates Now is back!Read more »
Marathon Reading of the Odyssey at the summer gardens of Athens Concert Hall (Megaron Mousikis).Read more »


text:
202 South Allen Street
State College, PA 16801
Store Local: 814-237-3655
Store Toll-Free: 800-993-8697
Online Customer Support: 800-372-9982
Mercer Pa
born to be a grandma!
A toy I've looked hard to find
October 25, 2013
Sheryl from Mercer Pa
Purchased for:
My Grandchild
Child's Age:
3 Years Old
Describe Yourself:
born to be a grandma!
Would you recommend?
I was tickled to find the Kettler Cat Digger. I had searched many websites and stores but found it here. This will be a Christmas present for my 3 year old grandson who loves any kind of construction and farm equipment. I just know he's going to love it. Thanks for having the toys that no one else has!
(3 of 3 people found this review helpful.)
Site Map © 2017 GROWING TREE TOYS


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Contest: Win Power Rangers Super MegaForce: The Complete Season on DVD!
With the help of their powerful special Morphers and Legendary Keys, Troy, Noah, Emma, Gia and Jake transform into the Super Megaforce! And there is no time to lose, as they must save the city from Cybax's impending missile launch, battle Skatana's Read More


text:
This page is dedicated to all of our children. Please follow the links below to learn about our terrific kids and learn what help is available.
Special Thanks
We would like to offer a special thanks to all those unmentioned volunteers who have helped the families of these children in many ways.
To all the parents who have shared their stories of their children, thank you very much!
To Chuck and Jenn Cammarata, Greg and Erika Sears, Dianna Greene, and all the parents who have given so much of their time to helping other families share their stories by producing the web pages for these children, thank you very much!
For the families who spend countless hours talking with and sharing with new families who are looking for support and understanding, thank you very much!
|David Aaron
|Breanna Arthurs
|Aaron Bateman
|Emma Lynne Bechtel
|Christopher Benson (Alexander's Disease)
|Elijah Bonney
|Madylen Grace Burk
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|Anthony Caruso
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|Gracie Cooley
|John D'Amico
|Kayla Rose De Visser
|Yannick Dion
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|Saschy Eichhorn
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|Jared Faria
|Chloe Fedorak
|Scarlett Rose Fedorak
|Jason Forslind
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|Erik Haines
|Terry M. Hallock III
|Liam Hammonds
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|Elly Hernandez
|Ida Holmgren
|Brenden Hopkins
|David Hopkins
|Toi Imamure
|Seychelles Marie Ippoliti
|Souta Iwamae
|Taneshia Jackson
|Joseph Jarrell
|Mathew Jarrell
|Rachell Jarrell
|Mikkel Bo Jensen
|Megan Jurek-Plasky
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|Anthony Mattina
|Olivia McCormick
|Mark Elliot McCoy
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|Jack Palamaro (Alexander's Disease)
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|Jamie St. Clair
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|Mika Aaron Summers
|Jayden Anthony Taylor
|Loam Hanna Tesfazion
|Mikey Torres
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|Jackson Kai White
|Timothy Willett
|Michelle Wright
|Katelynn Yerardi


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Mamata Banerjee welcomed the move initiated by Mahato who was injured during the encounter in which Kishenji was killed. Mahato's husband - Sasadhar Mahato was also killed.
Mahato reportedly had played a key role during Silda massacre. According to sources, Mahato communicated through some mediators and tried to confirm about rehabilitation after surrender.
Mamata Banerjee might be very happy as she has been requesting the Maoists to leave the path of violence and to adopt the path of peace. It seems that the Trinamool Congress chief and West Bengal Chief Minister finally stepped up in her struggle to bring the Maoists on the "right path."
OneIndia News


text:
Scandal (Shubun) Reviews
December 3, 2016
Odd film about gossip sheets has many interesting touches and rich photography.
March 4, 2013
Done with Kurosawa's subtle touch of irony.
Full Review | Original Score: 3/4
February 11, 2008
a mustard seed for later masterworks
Full Review | Original Score: B
Top Critic
December 6, 2004
Scandal is not a great film, but it is much more than a curiosity, and much funnier than any plot synopsis might suggest.
Full Review | Original Score: 3.5/5
May 24, 2003
Anybody contemplating a tabloid career should watch this movie.
January 1, 2000
This is an awkward comedy made just before Kurosawa's breakthrough film, Rashomon.
Full Review | Original Score: C
July 18, 2005
Read More | Original Score: 3/5


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Bored work-experience girl set fire to hardware store causing £1m worth of damage
A PUBLIC schoolgirl set fire to a hardware store - causing £1million worth of damage - because she was BORED of her work experience placement at the shop, a court has heard.
The teenager, who was on a placement at the Wilkinson's store from a fee-paying private school, started the blaze with a cigarette lighter in July this year.
Warwick Crown Court heard that the "intelligent student" set fire to waste cardboard in a cage in the goods inward bay because she was fed up of stacking shelves and wanted to go home for the day.
Fire crews were called after the blaze got out of control and swept through the premises in Nuneaton, Warwickshire at lunchtime.
Staff and customers were forced to evacuate as thick black smoke billowed from the store - causing a staggering £1 million worth of damage.
Firefighters battled for half an hour to bring it under control.
To a degree she got a bit bored, and she would have liked to have done something more exciting than stocking shelves
The schoolgirl, who cannot be named for legal reasons, was arrested by police shortly afterwards where she admitted to officers it was a "stupid thing to do."
Ninda Gill, prosecuting, said the incident occurred at lunchtime when the store was "busy" and elderly customers were left "distressed."
She said: "The potential for injury to staff and customers was great as the store was consumed by smoke."
As a result of the inferno, the hardware chain is now reviewing its national policy in relation to taking on any more work experience youngsters.
She said: "It has caused a national employer not to engage in work experience schemes."
The teenager was captured by CCTV cameras showing her leaning into a cage of waste cardboard in the goods inbound bay.
Smoke began to rise one minute later and, as she left the bay, flames began to appear, which quickly turned into an inferno.
Fire investigators rated the danger to life at eight on a scale of one to ten, although the building was evacuated without anyone being injured.
A "conservative estimate" has been put on the damage caused at between £600,000 and £1 million.
However, John Mohammed, defending, insisted she had not "intended to harm anyone" but "got a bit bored."
"To a degree she got a bit bored, and she would have liked to have done something more exciting than stocking shelves.
"When she went to the goods inward area she intended to start what she thought would be a small fire in a crate, as she described it, which contained cardboard boxes."
He continued: "She lit the corner of a box, and did not expect it to spread any further than the cage it was in.
"She thought it would cause some disruption, sufficient for her to be able to go home.
"She acknowledged it was a stupid thing to do. She didn't realise how quickly the fire would spread to other boxes.
He added: "She didn't think it would lead to the sort of damage it did cause, principally as a result of smoke, as the fire itself was mainly contained within the goods inward area.
"She certainly did not intend to harm anyone."
Mr Mohammed said that the girl came from a good family and her parents were "aghast" at her actions.
He added that she bitterly regrets what she did and had written a letter of apology to Wilkinson.
The teenager told the court she hadn't thought of the consequences.
She said: "It was a stupid act. If I could turn the clock back, I would."
On Wednesday the teenager was due to be sentenced after earlier pleading guilty to arson with intent to cause damage and being reckless whether lives were endangered.
But a judge ordered for her to be examined by a psychiatrist before her fate is decided at a later date.
Judge Alan Parker said he was "very concerned" about the girl because the report suggested she may suffer from "dissociation."
This is a physchological disorder whereby a person feels detached from reality.
He said: "The fact that she is an intelligent girl makes it more disturbing.
"I think there has to be a psychiatric report to allay any anxieties a sentencing judge might otherwise have.
"I regard the preparation of such a report as essential."
The judge adjourned the case for the report to be prepared.


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BEC Study Group January/February 2013
CPA Exam Forum › BEC › BEC Review › BEC Study Group January/February 2013
This topic contains 403 replies, has 112 voices, and was last updated by k917 4 years, 8 months ago.
January 6, 2013 at 3:22 pm #401477
Goodluck to all you who just took it.
Everybody in exam experience is saying there are so few calculations. Im mostly worried/studying B2-B3 with all the different formulas and such. I'll be pretty bummed if I spent so much review time and none show up, hah.January 6, 2013 at 4:32 pm #401478
Well I did all of the Becker MCQ (including the optional ones) two times, and I try to concentrate on the fundamental material right now. If you understand the general calculations, it's enough for the exam. I'm sure the MCQ on the exam will look quit different than the ones on Becker (like most of the BEC-takers already told), so it's more important to focus on the basics and have a general understanding of business than tackle every calculation as often as you can.
Just my thought 😉January 7, 2013 at 3:18 am #401479
I noticed you have all 4 sections of the exam scheduled within 3 weeks. If you dont mind me asking how are you doing that? lol How do you study given the short amount of time. (I could use any tips you have)
I am also taking BEC on 1/8. It will be my second attempt. I have been studying intensly for about 2 weeks now. I took BEC on 10/31 and failed with a 70. I studied for about 5 weeks then and thought I did really well but much to my surprise I failed.
I am begining to panic because I am still doing chapter 6 and then will have to do a final review in a day. I am scoring better this time around on all the mcq (Becker). What or how do u suggest on focusing. Do you believe in "overstudying" or burning yourself out it? A lot people have said to me not to study the day before because u will burn yourself out however, I am not sure I really believe in that (I have always been a crammer for studying).January 7, 2013 at 2:20 pm #401480
Well I have no experience how effective my learning approach is, because I don't know the results yet 😉
I'm using Becker self-study, listen to every lecture, doing every MCQ two or three times, doing all of the simulations, making notes and doing the final exams. I also think full time study is more effective than studying after work or only on weekends (if you can choose to do so), because if you going through all of the material of BEC in 60 hours within a week it probably stays longer in your mind than studying piecemeal.
BEC is a strange section of the CPA exam, I hope I will nail it tomorrow.
Now back to the material 😉January 7, 2013 at 2:52 pm #401481
I agree with you- I feel like the material sticks with you more if you study say 60 hrs a week instead of 60 hrs over a month.
When I took the BEC exam first time, the last 3 ch (ch4-6) I uderstood & retained more because I did it in 3 days.
However, ch 1-3 took me about 3-4 weeks to get thru and I had such a hard time with it. Granted the first 3 chapters are much harder.
This time around, for my second attempt at BEC, I have been studying full time for about 2 weeks. Granted I have already studied the info 2 months ago, but it is so much easier to understand itJanuary 7, 2013 at 3:22 pm #401482
Just finished a progress test with 72 MCQ with a 94%, I think I will now leave the Becker software and review the text book for the rest of the day.
Wish you all the luck you need for tomorrowJanuary 7, 2013 at 4:15 pm #401483
Thank you!
Still amazed at how well u do given the short amount of time!:)January 7, 2013 at 4:37 pm #401484
Ugh…wanted to move my exam up to Wed/Thur and I go onto prometric and theres no seats left. Figures, really dont have the motivation to study for another week, ready to get this done with.January 7, 2013 at 5:54 pm #401485
Ended up rescheduling at a different place, taking it Thursday now.
Going to do Final Exams/Progress Tests and read notes until then.January 7, 2013 at 8:05 pm #401486
@vt7, I feel the same. My first BEC try was spanned over 2.5-3 months, but I wasn't studying 3+ hours EVERY day. It also took me a loooong time to get through the hard chapters and not so much time to get through the easier ones/ But I guess come test time, that hard material never really stuck. This time around, I've been studying multiple hours a day (taking one day off completely) each week, and now EVERYTHING seems fresh in my mind, not just the easy stuff. We'll see if it pays off! I have 12 days and I almost wish I had LESS days now. I'm not sure how to make the best of my week and a half left!January 7, 2013 at 8:32 pm #401487
57/72 on Final Exam 1 + hopefully 100% on the WC = 83.
Kind of nervous though because you really need to be close to perfect on the McQ in order to pass this exam. I don't like the weighing of this exam score…January 8, 2013 at 1:25 am #401488
BEC questions are so tricky.
The process of capturing data and ultimately producing information output is referred to as:
Data processing
Transaction processing
Transaction controls
Information and communication
You read it and youre like oh its definitely a….wrong B.January 8, 2013 at 4:13 am #401489
^ I concur! This section is brutal. Not sure if I'm just eager to be done or what. Concepts come off straight forward and very quickly become convoluted ;(January 8, 2013 at 4:12 pm #401490
Wow…just took the second final exam in Becker.
If thats anything like what the real test is like I might as well stay homeJanuary 8, 2013 at 5:57 pm #401491
Wow… I'm pretty sure that if we ask that question to any IT guy out there he would have picked letter A too.
What's Becker's excuse, I mean "explanation" for A beign wrong?
This is one of the things that bothers me about Becker, they come up with these unnecessary hard and complicated questions that are time consuming and the only thing they accomplish is to chatter the student's confidence.
Studying for this section has been a total pain in the ***. It took me 3 days to get through all of chapter 2's homework.
Makes me wish I was studying for REG again.January 8, 2013 at 9:54 pm #401492
^^ I dont really remember I think it said something like Data processing occurs after transaction processing.
Been taking 50 McQ Progress tests and re-reading/writing notes. I think I am ready to go and give it my best shot and get it over with… T – 48 hours.January 9, 2013 at 6:34 am #401493
I'm hardly learning from B2's MCQs (Budget & Analysis) except for the variance part. The answers are so vague, they haven't presented "why" the answer is such. They just throw you the computations. Should I just switch to Wiley? I've hardly been productive the past 2 days with this section.
Becker is just throwing tables & "squeezes" on the answers. At least I know this is the worst chapter, just a struggle to get through this part. Thanks.January 9, 2013 at 8:06 am #401494January 9, 2013 at 2:03 pm #401495
^^ Becker has been reported by many who took BEC to have prepared them well. Just a heads up with Becker, the McQ are very difficult for a reason — so you learn.
Don't expect to be a master after trying them once. I did every chapter 2x over now (reading and questions) and saw a huge improvement. Keep practicing it will become easier.
Although, if you think another study material would help you better than Becker go for it.January 9, 2013 at 2:23 pm #401496
I used Becker fresh out of school (now I'm almost 5 years removed), before the grind of public accounting really starting to suck all my free time out of me…………. and didn't pass one part in 4 attempts.January 9, 2013 at 2:44 pm #401497
I just finished B3 and am starting to watch the lectures for B4.
I'm hoping the experience that others had will be the same in that the calculations for B1-B3 are overkill. I have that issue with Becker too in that they seem to make these questions overly complicated. I guess there's a method to their madness and I have to step back and realize the material is going to stick if I do the work.
I like adding facts I find as I do the Becker MCQs to the NINJA notes and I then read the final notes daily as I work progress tests. Hopefully it will work well for BEC too as B1-B3 are harshing my mellow.
Becker Self Study and NINJA NotesJanuary 9, 2013 at 3:01 pm #401498
Another cumulative PT – 94% Wish my exam was today and not tomorrow, feeling ready to go. Thank god I pushed my exam up from next monday.January 9, 2013 at 3:31 pm #401499
Does anyone have a better solution for a Wiley BEC test bank problem in Cost Measurement COST-0040? The CM for the second calculation doesn't make sense as to how $7.5M was derived. Any help is much appreciated.January 9, 2013 at 3:36 pm #401500
Post the question and full solutionJanuary 9, 2013 at 5:23 pm #401501
Becker does overcomplicate the formula- especially the budget variances. I would just stick with knowing the basics and you will do fine. Both times I took BEC, I have never had an exam question that was complicated like Beckers. The
exam questions are much simpler and basic than Becker. I just took Becker yesterday and there was very few calculations involved. It was more theory and conceptual stuff. But they were extremely tricky. My friend also took BEC a few days before me and her exam was all calculations.
My suggestion is to just make a "cheat sheet" of all formulas and know how to apply the formula to a basic problem.
Becker's approach is too make the study material harder than the exam so that u will be well prepared for the exam.
Becker is like an "over achiever" lol. You never know what actually questions will show up on the exam, it's like a hit or miss. I took BEC in Oct- mostly computational & extremely hard (failed with 70) and retook yesterday – had few computational questions (theres goes my days of studying formuals/problems) mostly theory but very tricky.
I have also noticed that BEC sample written communications in the begining of book are very similar to exam. I actually had exact question on exam (both times).January 9, 2013 at 5:57 pm #401502
Unfortunately I can't copy and paste the question and solution to the forum due to Wiley CPA not allowing the copy paste function in there software.January 9, 2013 at 8:13 pm #401503
I just moved my exam up a week to this Friday. I'm so burn out on this material. I added Ninja notes plus CPAexcel this time + Becker flashcards.
I never want to study this again!!January 10, 2013 at 3:39 pm #401504
Feeling extremely confident right now, not sure if thats good or bad. Just went through the entire Becker book page 1-end and could almost recite each page from memory. Didnt have to stop and review any topics heavily, just hoping the MC questions aren't brutal today.
5 Hours till exam getting pumped to be done.January 10, 2013 at 4:24 pm #401505
Good luck! I hope you get to share your approach after taking BEC, just not the biggest fan of this section. You got this.January 10, 2013 at 5:38 pm #401506
simple question: Wren sells 4 units of product A for every unit of product B. Becker says it means product A = 4 * product B. I don't understand why it is not the other way (4A = 1B). can someone explain it to me? it seems really easy but I can't understand it for some reason.
The topic 'BEC Study Group January/February 2013' is closed to new replies.


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Entry #90
Years ago when I heard Nickelodeon was making an anime inspired Nicktoon, I wasn't that interested at the time. On first impressions alone I originally had low expectations about it since it was a Nicktoon and it wasn't going to be taken that seriously. I was sorely mistaken and, looking back, I admit that I missed out on it back then. Osuka, who is one of my closest friends, has been recommending the animation ever since I met him years ago. Then When Doug Walker started his Avatar Vlogs, I was curious to see what all the fuss was about.
I was not disappointed, it's a great series. Fun likeable characters, interesting plot, occasionally legit funny moments and beautiful artwork. From the very beginning the show took itself very seriously but at the same time not losing that optimistic sense of adventure. it even has an accurate explanation of the concept of Chakra (In comparison to Naruto where Chakra is compared to Magic in RPGs or "the force" in Star wars). Watching the entire Last Airbender series during the summer I can assure you it is a highly recommended show for all ages. The first season was a little rocky at times, but the show improves in the 2nd and 3rd seasons.
Originally I chose to watch the first three seasons in order to get an Idea as to why Shyamalan's "The Last Airbender" was so bad. And it is! The story is too rushed (season 1 squished into a 90 minute film), the actors are awful, extremely odd casting, way too many plot holes and the visual effects, though OK at times, just comes off as poor. in short, M Night Shyamalan should stay away from Avatar. There are rumors of a sequel, but it shouldn't be made at all.
Now when it comes to the spin off series The Legend of Korra, it was a bit hard to get used to considering the drastic changes that were made in comparison to the original(TLoK taking place about 70 years after the original series), but overall the new series grows on you over time. The best way to describe both shows would be to compare the first Avatar series to The Never Ending Story in terms of fantasy adventure and the Korra spinoff to 90s Batman cartoon being dark, serious and somewhat adult with the political turmoil and terrorism.
Now the first season of Korra was a bit rushed considering that it was originally given a 12 episode run, but none the less it was an enjoyable run. Thanks to this, there will be 3 more seasons out and I'm looking forward to them. I'm currently watching season 2 right now and, just like the first series, it has started to gain momentum halfway through.
In closing, if you're new to the Avatar universe, I say check it out. You have to let it grow on you before you start to appreciate it. You will not be disappointed.
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2013-11-14 10:10:20
I love the Avatar series!
I gate how almost every episode ends on a cliff hanger. D:
2013-11-15 20:47:25
Watched it since the very beginning...will always be an amazing show. Korra isn't as good as the original but it's still awesome.
2013-11-16 04:06:56
I loved the series... and I loved the movie! What more could you expect from an LA version? I find it pretty amazing how much the real characters resemble the ones from the animation, they really managed to find real-life counterparts on everyone. The special effects are great, the plot is the same... it seems people always expect too much from LA, either it must be exactly like the anime or it has to be re-done entirely, if the movie weren't based on anything, it'd probably get a much more positive response for what it is: great entertainment!
Didn't know Avatar was a Nickelodeon series btw, good knowing.
2013-12-08 08:18:01
Will be out Episode 9 in this year or 2014?
I'm doing what I can. You want me to release an unfinished episode?
2013-12-09 07:03:35
No hadoukendude.
I wait.


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Author Lisa Appignanesi in conversation with Margot Waddell
Venue: The Institute of Psychoanalysis
Date: Thursday 6 March 2008
Author and cultural commentator Lisa Appignanesi talked to Margot Waddell about her new book Mad, Bad and Sad: A History of Women and the Mind Doctors from 1800 to the Present. They explored the changing attitudes towards women's mental health over the last 200 years and the way women have contributed to the development of the professions that treat them – as patients, as objects of experiments and eventually as mind doctors themselves.
Lisa Appignanesi was born in Poland, grew up in Paris and Canada now lives in London. She is the author of many novels as well as several non-fiction works including Freud's Women, co-authored with John Forrester. Her memoir Losing the Dead was short-listed for the Charles Taylor Prize for Literary Non-Fiction and the Wingate Literary Prize 2000. She also writes for The Guardian, The Independent and has made several series for BBC Radio 4.
Margot Waddell is a psychoanalyst in private practice and a consultant child and adolescent psychotherapist at the Tavistock Clinic. She has a doctorate in English Literature from Cambridge and has published many articles. Her most recent book, Inside Lives: psychoanalysis and the growth of the personality was published in 2002 by Karnac.
What's on your mind?
Thursday 13th March, 2008 | Posted by Caroline Graty
'When I was growing up people were unhappy, not depressed.' Lisa Appignanesi was talking to psychoanalyst Margot Waddell at Connecting Conversations. She feels that the definition of 'ordinary\\' has become increasingly restricted. Emotions have become symptoms rather than an inevitable part of life's journey. People find a diagnosis and a pill reassuring, and are complicit in the medicalisation of the human condition.
This is explored in her impressive new book Mad, Bad and Sad: A History of Women and the Mind Doctors from 1800 to the Present. The book investigates the interplay between an era's anxieties and concerns and the mental health conditions that arise within it. It also charts the development of 'mind doctoring' and the ways in which the boundaries between madness, badness and sadness have shifted through time.
The conversation between Appignanesi and Waddell ranged as widely as the book. Did the feminist movement reveal cases of anorexia, or cause them by drawing attention to women's bodies? Was the rise in multiple personality disorder a by-product of a crisis in female identity? Is self-harm, a rapidly growing phenomenon in teenage girls, a copycat act, or does the virtual, Facebook world young people inhabit change their relationship with their physical body?
Although Appignanesi's book focuses on women, Waddell noted that men's minds are not immune to the culture they live in, stating the huge rise in referrals of young men with body dysmorphic disorder as an example. 'We've never had quite so much emphasis on the male body image,' says Appignanesi. 'Images play on the mind in more direct and immediate ways than words. You end up comparing your body with what you see.'
Male or female, there\\'s probably a lot more on your mind than you realise...