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U.S. Scar Treatment Market: Overview
Often considered a concept that draws from wound care and first aid, scar treatment has emerged as a niche market promising high growth to medical device manufacturers. However, products used in scar therapy are far more advanced than conventional first-aid adhesives. Driven by innovations, demand in the U.S. scar treatment market is poised to surge exponentially between 2016 and 2024.
Browse through U.S. Scar Treatment Market report to know what factors will shape the market by 2024: http://www.transparencymarketresearch.com/scar-treatment-market.html
A scar is any mark on the skin caused by injury, burns, surgery, acne, or inflammation of tissue. Scars can impact the mental and physical well-being of an individual, resulting in poor self-esteem, depression, embarrassment, and altered social interactions. Scars can be of various types depending on their age, color, shape, and sizes. The incidence of skin problems leading to scar formation is significantly high in the U.S., which is driving the scar treatment market in the country.
Additionally, the U.S. scar treatment market is significantly gaining from the easy availability of technologically advanced products with the capability of fading apparent scars. The growing geriatric population and rising consciousness about appearance among consumers are also aiding the expansion of the scar treatment market in the U.S. Increasing expenditure on personal grooming also has been boosting the U.S. scar treatment market.
A comprehensive overview of the U.S. scar treatment market has been provided in the report. The factors impacting the market's growth are studied in detail. The report also presents insights into the growth drivers and restraints that are expected to influence the market's trajectory during the forecast period. Some of the companies operating in the market are profiled in the report to examine the competition prevailing in the U.S. scar treatment market.
U.S. Scar Treatment Market: Key Opportunities and Threats
The increasing disposable income of consumers and rising economic growth are cited as reasons for the revenue generated from the increasing sale of scar treatment products. It is important to note that while the treatment of keloids and burn scars is considered medically important by regulatory bodies, the treatment of mild to medium acne and spot correction is not considered a medical necessity. However, a rise in the affluence of the population has been fuelling the demand for aesthetic corrective procedures such as dermal filling, wrinkle reduction, volume restoration, and laser treatment.
Botulinum type-A injections and hyaluronic acid based dermal fillers are primarily used for aesthetically improving a person's appearance.
The U.S. scar treatment market is also significantly gaining from the increasing demand for combination therapeutics in scar treatment to enhance the effectiveness of procedures and shorten the time taken for treatment.
The various products available in the U.S. scar treatment market include ointments, creams, gels, oils, and sprays. These products have proven helpful in reducing redness, bumps, pain, and itching caused by scars. Since these products can mostly be applied onto scars without any medical supervision, demand for them is quite high in the U.S. Additionally, the demand for minimally invasive surgical treatments and laser treatments has also significantly increased for the treatment of more severe scars.
On the flip side, some of restraints witnessed by the market include the increasing awareness about the side effects associated with the usage of scar treatment products. The high cost of scar treatment therapies also has an adverse impact on the scar treatment market in the U.S.
Request a sample of this report to know what opportunities will emerge in the rapidly evolving U.S. Scar Treatment Market by 2024: http://www.transparencymarketresearch.com/sample/sample.php?flag=B&rep_id=12509
U.S. Scar Treatment Market: Competitive Insight
To present insights into the prevailing competition in the U.S. scar treatment market, the report also profiles companies such as Valeant Pharmaceuticals International Inc., Johnson & Johnson Services, Oculus Innovative Sciences, Inc., and others.
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Where's all the Recent Content?
5 Comments so far
Leave a comment
August 6, 2011, 8:01 am
Filed under: Uncategorized
Filed under: Uncategorized
Where, indeed?
Life's just gotten busier, and as I've been reducing the number of "extra" things I am willing to add to my to-do list, blogging at NLDM never seems to make it up to the "really important" list.
Want to see new content here?
We welcome your content!! Please contact us about becoming a writer for the NLDM blog!
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Hi Sara,
I would love to participate. I left a more detailed message in your section of "About the Bloggers".

subset: commoncrawl


text:
Current Students
Preparing for a PhD Defense
Below you will find suggestions to help you get ready for the defense and information to give you a sense of what to expect.
Know the Rituals
What happens at a thesis defense? The best way to know what happens and the best way for you to prepare for your defense is to regularly attend the defenses of your colleagues—those internal and external to your field of expertise. You should be doing this throughout your graduate program, not just several weeks prior to your own defense.
Talk to people from your group and in your department who already defended to find out what their defense was like. They know well what occurs in the closed exam and will likely want to share their experiences with you. You should also speak with your advisor to get a sense of his/her specific expectations of a defense. Don't be afraid to ask!
Guidelines for Presentations
Use PowerPoint or Other Software to Create Slides
You should prepare a presentation of the research that comprises the thesis. Your slides should encapsulate the work and focus on its most salient contributions. In preparing, ask yourself these questions: "What do I want people to know about my thesis? What is the most important information that I can present and talk about?" Here are some basic tips:
- Use text large enough to be readable by the audience (especially text from figures)
- Ensure graphics and tables are clear
- Don't clutter your slides – if necessary have things come up on mouse clicks
- Use spell check and proof-read
- Practice your presentation with your peers
- Work on pronunciation, if required
- Time your presentation to ensure it will fit within the allotted time while allowing time for some questions
Public Lecture
If your defense will include a public lecture, it is recommended that you do a trial run of your presentation a day or two before your defense in the room that has been booked for your public lecture. This will allow you to familiarize yourself with the space and the equipment and to address any problems that arise during the trial run.
Plan your public lecture to allow enough time for questions. Present enough information so that the audience understands what you did, why you did it, what the implications are and what your suggestions are for future research.
If there is a public lecture, the date/time/location of your defense and thesis topic are advertised to your program and beyond. Departmental/program announcements are sent by your Graduate Administrator to invite faculty and students. Friends and family are welcome to attend the public lecture. Faculty and students in the audience are given the opportunity to ask questions.
Dress Professionally
Plan to dress professionally for the defense in the same way you would if presenting a paper at a conference or for a job interview. You will be standing for a long time on the day of your defense. You might want to keep this in mind when selecting the shoes you'll wear for your defense.
Items to Bring to the Defense
Your presentation, a laser pointer, a copy of your dissertation, a pen or pencil, a note pad and a bottle of water are essentials that you should bring to the public lecture.
The Closed Examination
You will be asked to leave the room while your Committee reviews your program of study, grades and decides whether the thesis is acceptable/not acceptable. The Committee decides whether members will ask sequential questions or whether each member will be allotted a specific time period for questioning.
The person to start the questioning is designated. You will be called back into the examining room and questioning will begin. After all questions have been addressed, you will be asked to leave the room while your Committee decides the outcome of the exam. You will be asked to return to the room to be informed of the outcome by the Chair of your exam committee.
Address Questions with Confidence
- Listen to the entire question no matter how long it takes the faculty member or student to ask it (take notes if necessary.)
- Pause and think about the question before answering.
- Rephrase the question succinctly.
- Answer the question to the best of your ability. If you do not know the answer, remain calm and say so in a professional way.
- Remember no one will know the ins and outs of the thesis and your research materials as well as you. You are the foremost expert in the thesis topic and YOU really do know the research involved. Be positive!
- Acceptable with minor or no revisions (no further approval required)
- Acceptable with major revisions in content or format (in this case, one or more committee members must be responsible for overseeing and approving the major revisions before the final copies are submitted)
- Not acceptable


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Searches at several Kmart stores turn up empty after bomb threats
Police investigations of bomb threats made to six Kmart stores in the Greater Boston area tonight turned up nothing after state police bomb squad experts, bomb-sniffing dogs and officials from the Fire Marshal's office fanned out across the area to check for explosive devices, a spokeswoman for Fire Marshal Stephen D. Coan said tonight.
"The threats were made early this evening and nothing has been found," said Fire Marshal's Office spokeswoman Jennifer Mieth. "Each store received the threats individually."
|The article you requested has been archived
- More On:
- Bomb threats
- kmart
- Stephen D. Coan


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It's easy to find the Rodeo of the Ozarks!
Parsons Stadium and the Rodeo of the Ozarks are prominently located at the corner of Highway 265 and Emma Avenue just east of downtown Springdale.
For the map enthusiasts- The street address is 1423 E. Emma, Springdale, Arkansas.
From North or South – Take I-540 South to Springdale. Take Exit 73 (Elm Springs Road) and then turn east. Follow Elm Springs Road, which will turn into Huntsville Road all the way across Springdale. Continue east on Huntsville pass through Business 71 to the light at Highway 265 (Old Missouri Road). Turn right and the stadium will be two blocks at the next stoplight.
From the East – Follow US 412 into Springdale to Arkansas 265 (Old Missouri Road). Turn right and go to next stop light and the Rodeo of the Ozarks.
From West – Follow US 412 into Springdale to 71Business (Thompson Street). Turn left (north) on Thompson and then turn right at 2nd stop light (Emma Avenue). Follow Emma Avenue east through downtown Springdale to the Rodeo Grounds.


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Bébé by Minihaha Finn Envelope Neck Tee - River Marle
Dress up your little bundle of joy in cute and adorable clothing by Bébé by Minihaha. Combining current trends with colourful designs and gorgeous prints, this delightful clothing range keeps your little bub comfy and snug, and most importantly, happy all day long.
Available in baby sizing - see size chart for correct fit!
- Bébé by Minihaha
- For babies
- Style: Finn Envelope Neck Tee
- Colour: River Marle
- Envelope neck design
- Contrasting cuffs and neckline
- Ladybug and nature print
- Double-stitched hem - adds warmth
- Materials: 100% cotton
- Machine washable
Bebe by Minihaha believe that baby clothing doesn't have to be boring; it can be bold! This boutique brand combines bright bursts of colour, cute prints and durable designs to ensure that their range remains effortlessly stylish and popular amongst tots and parents alike!


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UK students helping Islamic State jihadis build bombs
BRIT science students are helping Islamic State build radioactive dirty bombs, security experts fear.
Nato is worried about the stockpiling of chemicals and radioactive material seized by IS jihadists .
The warning came from Australia's foreign minister Julie Bishop who said fighters had stolen 40kg of uranium in Mosul, northern Iraq.
Ms Bishop said: "The insurgents did not just clear out the cash from local banks."
She said IS's use of highly trained university graduates, many from the West, revealed its "serious efforts" to develop chemical weapons.
Two months ago we revealed police were probing Twitter boasts by Brit Islamic State scientist Hamayun Tariq that he is making chemical weapons using chlorine gas.
Tariq, 37, who tweets under the name Abu Muslim al-Britani, claimed he gained a BTec in science when he lived in Dudley, West Midlands, before heading to the Middle East.
He appeared to have spent time undergoing bombmaking lessons in Pakistan and was assembling roadside bombs, IEDs, laced with chlorine.


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"No Thanks. Please Close This Box!"
If youre familiar with Taylor Swifts hit song Blank Space then youre probably also familiar with one of the biggest lyrical miscommunications in the history of our species. As much as you enjoy proclaiming it during your impromptu karaoke sessions, Swift is not actually saying Starbucks Lovers. Sorry to burst your bubble.
Shes saying Got a long list of ex-lovers. But that didnt stop these moms from making this Starbucks-loving moms anthem.
Brilliant! Now make sure you share this song with all your Starbucks-loving friends and family!


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Help Me Document The Melvira Method!
Decorating By Melvira Updated 4 Mar 2016 , 4:50am by -K8memphis
I tried this for the first time last night - on a LIGHTLY crusting buttercream that is difficult to smooth. Melvira, you should have kept this to yourself until you could patent and sell special cake smoothers! This is a marvelous technique!
Thank you for sharing it.
Dang... I could've been rich by now!! I guess I'll have to settle for the inner glow that comes from helping people achieve prettier cakes. Hey... you can't spend it, but it sure feels good!
Shucks, this is the last day I am home before I return to work... I am going to the store to purchase one and giving it a whirl ~ my co-workers can eat the product tomorrow.
What a wonderful thing to share Melvira! I would still work on a patent for the "official" Melvira tool. I think there are a lot of people who would still buy it. I would and there isn't a thing in the cake decorating aisles now ~ and as many of us CC'ers there are, there are still some people who are "in the dark" lol, and not here... I say go for it.
Thanks again!
Thanks Valerie!! I have been working on the idea of patenting a few of my ideas and selling them. If you think the roller is the only trick up my sleeve...
Bless you all for your positive reinforcement!
Can this method be used on fondant?
It absolutely can!! You can use it to smooth the icing first so you have a nice smooth surface for the fondant, then after you apply the fondant you can use the roller to smooth it as well! It's very versatile!
Tried this for the first time the other day (my friend's birthday cake). What I think I did wrong was put the cake in the fridge to let the buttercream crust... then let it come to room temperature....caused soft spots that the (barely damp) sponge roller picked up. Is it better just to let the buttercream crust at room temperature? Must say, some spots did come out alot smoother than when I use a spatula. Like any other technique, I need practice!
Yes, you just need to let the icing crust at room temp for 10-15 minutes depending on humidity. Someone else informed me that you can use non-crusting buttercream if you put it in the fridge for a little while, but I have not tried that. (I really am going to!!) I always recommend that for the best results you use crusting BC and let it sit at room temp uncovered to crust before rolling or the tacky icing will stick to the roller. I am sure if you try that you will be much happier with your results. The good part about this method is that there isn't a huge learning curve. Good luck!!
Melvira---You are a genius!!!!!! I finally went out and bought the roller at Home Depot last weekend. My husband and I spent 10 minutes making sure we had the right one.
I used it on my 1st paid cake (for my best friend!) and it was AWSOME!! My husband said, "why did you wait so long to buy that thing, the cake looks perfect!".
I wouldn't go that far, but it took a so-so iced cake and turned it into something I can actually be proud of. I was almost ready to give up on making this a hobby-business while I am a SAHM but now there is hope for my cakes!!!
I will definitely have to go buy a couple and do this technique...thanks Melvira
korensmommy, that is wonderful! I am so happy to hear of your success! Keep up the great (and funny!!) cakes!
I bought my rollers today!! Can't wait to try the Melvira Method!!
The roller works so well! Thanks
Used your method again, this time let the icing crust at room temperature - and I finally got the hang of this - definitely need a light touch doing this, but was so pleased with the results (my christening cake). Thanks again Melvira!
MomLittr... I am SO glad to hear that it worked out for you!! That makes me so happy!! Great job!
This technique sounds amazing!!! So could I seriously say goodbye to the hotwater and spatula method for smoothing cakes? Do you have before and after pictures that you could send me? From your instructions it looks like those images were missing.
Thanks Melvira!
Can't wait to try the Melvira Method!!
DH already got me the roller!
Hey Ang... there is now a link to the method on the CC home page, if you scroll down it's under the new articles list. It is complete with pictures, etc. so you should have all the info you need! Let me know if you need any additional help! And yes, you may be able to say goodbye to all those other methods! I know I have!
Melvira sorry to ask such a .... question , but when you said to better use a Crusting Buttercream, what do you mean?
I just use the Wilton BC recipe. Is there something diferent for a Crusting one?
Biviana, I am happy to answer your question!! The Wilton recipe (if you are using the one with meringue powder) IS a crusting recipe! It just means that if you leave it uncovered for 10 minutes the outside of the icing will become dry to the touch... it forms a slight 'crust'.
I hardly ever use the meringue powder in my buttercream and it does just fine with the roller. I made a three tiered cake today and it was smooth as a baby's behind. I thank you so much Melvira for coming up with this hint. It has helped me with my cakes more than any other hint anyone has given me.
The one I did today was the biggest challenge I have had so far as I don't do much decorating. I used the Wilton 3 tiered stand so I didn't have to stack it but I was still proud of my results. Will try to post a picture when I have time to figure out how.
Had a cyberfriend ask me how I got it so smooth so I emailed her the link to this forum.
Thanks again.
Diane, thanks for that feedback on the non-crusting BC!! I have not done it personally, so I am always nervous to tell people that it works, but if you've had success doing it, that's good enough for me. I did revise my instructions to say that it will work with non-crusting if you put it in the fridge for a bit because a few people have told me that. I know I should test it myself though, just say I can say I have done it! Thanks again!
Hi Melvira!
That tutorial looks great. Wonderful job!
You should be able to use it on different colors as long as it has crusted. I would suggest that you smear a little on some waxed paper and test that theory before you accidentally mess up a cake!! Let me know how it goes, I'd love to be sure about it!
Melvira!!!! Your method rocks!!!! I recommend it 110%!!!!! Thank you!!!!!
Thanks so much for this great method! Can't wait to try it!
Could you please post the recipe for icing you use with this roller method. It would be greatly appreicated & so convenient if it were in this thread with the directions for smoothing the icing. Thank you.
Could you please post the recipe for icing you use with this roller method. It would be greatly appreicated & so convenient if it were in this thread with the directions for smoothing the icing. Thank you.
Any buttercream icing that crusts will work with this method.


text:
Clinton Calls on African-Americans to Vote Next Week
President Bill Clinton told black religious leaders to urge the members of their communities to participate in the November 7 presidential election by voting for Democrats.
One week from the election, opinion surveys still indicate a race too close to call between Vice President Al Gore and Republican Texas Governor George W. Bush, who nevertheless holds a slight edge over his rival.
Meeting with some 250 African-American religious leaders at the White House, Clinton late Monday spoke of the current US economic prosperity, saying that they would "never have another time like this to build the future of our dreams for our children."
Clinton said that under Gore, the economy would continue to grow, while with the Republicans the country would slip back to budget deficits.
He described Gore as somebody "you know you can count on in case of crisis," directly hinting at Bush's lack of foreign policy experience.
"I can tell you that we've been through some" crises, Clinton said recalling the White House's response to the trouble in Bosnia and Kosovo, the financial woes of Mexico and the peace process in Northern Ireland and the Middle East.
"I can tell you what I have know for eight years," Clinton said of Gore, "he is a good person who will be a great president."
Clinton for several days has been campaigning for the country's African-American vote, representing 12 percent of the US population.
On Sunday, Clinton attended services at two Baptist churches here in Washington and outside the capital in Alexandria, where he urged black Americans to make their votes count on November 7 -- WASHINGTON (AFP)
© 2000 Al Bawaba (www.albawaba.com)
Top Headlines
- Gore Tries to Exchange Jokes at Midnight Comedy Show
- US Elections Too Close to Call as Candidates Scramble to Win Battleground States
- Bush to Nominate Security Advisor, Fly to Washington
- Jewish-Black Tensions over Lieberman May Hurt Gore's Chances for Election
- Jim Zogby: Some Groups Divide the Community on the Basis of Religion


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Set in an almost impregnable position on a steep headland between the river and the North Sea, Tynemouth has always been as much a fortress as a religious site.
Here stood a 7th-century Anglian monastery, burial place of Oswin, sainted king of Northumbria. After its destruction by Danish raiders, the present Benedictine priory was refounded on its site in c. 1090.
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John Drennan: Labour's Macbeth, haunted by past glories and foes
John Drennan on how Eamon Gilmore went from an Aras victory to being less popular than Gerry Adams
One of the more unfortunate features of that unique political creature known as the Irish Labour Party is how its name attracts negative headlines about 'hard Labour' or 'Labour pains' or the 'Laborious party' or even 'Labour's love lost'.
As we enter the run-up to Labour's annual conference next week, all these lines will be disinterred when it comes to the eternal sick man of Irish politics and its struggling leader.
On one level, it might, however, be more accurate to suggest that Mr Gilmore is suffering from a bad case of George Best syndrome.


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Walk NYC with us, and take a walking tour through time. We won`t just guide you and tell youâ€â€we`ll show you. Times Square in 1900 ...
Discontinued App
Walk NYC with us, and take a walking tour through time. We won't just guide you and tell youâ€â€we'll show you. Times Square in 1900 - the Brooklyn Bridge under construction - Bob Dylan in Greenwich Village - Concerts in Central Park . . . it's all in there. Imagine the world's greatest guide - the guy who knows where all the bodies are buried and then shows them to you . . . give that guy hundreds of cool images, give him YouTube clips and geo-coded maps, arm him with trivia quizzes and share all the fun on Facebook and Twitter . . . that's the little guy we got working inside your iPhone. So get walkingâ€â€New York City walking tours like never before.
Version: 5.1
Size: 4.62 MB
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Learn how to protect yourself from Internet scams. Read our online fraud prevention tips
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text:
|Publication number
|Publication type
|Application number
|Publication date
|16 Jan 2007
|Filing date
|5 Aug 2005
|Priority date
|12 Apr 2000
|Fee status
|Also published as
|Publication number
|Casey L. Prindiville
|Original Assignee
|Micron Technology, Inc.
|Export Citation
|BiBTeX, EndNote, RefMan
|Patent Citations (28), Referenced by (3), Classifications (21), Legal Events (6)
|External Links: USPTO, USPTO Assignment, Espacenet
This application is a divisional of U.S. application Ser. No. 09/547,640, filed on Apr. 12, 2000, now U.S. Pat. No. 6,949,824.
1. Field of the Invention
The present invention relates to semiconductor packaging. More particularly, the invention relates to an apparatus and method of packaging a semiconductor to dissipate heat generated within the semiconductor package.
2. Description of the Related Art
This section is intended to introduce the reader to various aspects of art which may be related to various aspects of the present invention which are described and/or claimed below. This discussion is believed to be helpful in providing the reader with background information to facilitate a better understanding of the various aspects of the present invention. Accordingly, it should be understood that these statements are to be read in this light, and not as admissions of prior art.
Integrated circuits, such as microprocessors and memory devices, are used in a wide variety of applications. Such applications include personal computers, industrial control systems, telephone networks, and a host of consumer products, just to name a few. As most people are aware, an integrated circuit is a highly miniaturized electronic circuit that has revolutionized the functionality, dependability, and size of these various products.
In the manufacturing of integrated circuits, numerous microelectronic circuits are simultaneously fabricated on a semiconductor substrate. Such substrates are typically referred to as wafers, and a typical wafer includes a number of different regions, known as die regions. When the fabrication of the integrated circuits on the wafer is complete, the wafer is cut along these die regions to form individual die. Each die contains at least one microelectronic circuit, which is usually replicated on each die.
To use such a circuit in an electronic product, the die is typically placed within a sealed package. The sealed package performs several basic functions, such as electrically coupling the die to external electrical circuits, protecting the die from physical or environmental damage, and dissipating the heat generated within the die. One of the main functions of the package is to allow electrical connection of the die within the package to a circuit board or other external electrical components. Typically, these external electrical connections cannot be made directly to the die because of the thin and fragile bond wires used to interconnect the components on the die's surface. The diameters of the thinnest wires available are many times larger than the bond wires used on the surface of the die. Therefore, the die wiring typically terminates in larger bonding pads. The larger bonding pads allow external wires to be electrically connected to the die.
One method of integrated circuit packaging is known as lead-on-chip (LOC) packaging. LOC packages are generally used for very-large-scale integrated (VLSI) circuits or larger. Typically, the initial component in the packaging process is a leadframe. The leadframe provides the leads for the final package. The bonding pads formed on the die are electrically connected to lead fingers on the leadframe using fine bond wires. In an LOC package, the bonding pads are arranged down the center of the die. Typically, a double-sided adhesive tape is used to attach the die to the lead fingers of the leadframe. One side of the tape is applied to the underside of the leadframe. The die is then attached to the adhesive tape using pressure. Additionally, the lead fingers support the die during the encapsulation process.
A typical encapsulation material used in integrated circuit packaging is molded-epoxy. In a typical encapsulation process, a molding machine is charged with warmed pellets of the epoxy material. The molding machine forces a ram into the pellets to produce a liquid state in the epoxy. The liquid epoxy is then forced around the die on the leadframe. After the epoxy sets in the molding machine, the integrated circuits in their molded-epoxy packages are removed and placed in an oven for final curing.
Another function of the sealed package is to protect the die from physical or environmental damage. Physical damage can result in a myriad of ways, including jarring, physical abuse, and/or particle contamination. Environmental damage can result from chemicals, moisture, and even gases. Protection of the die is accomplished by securing the chip to a substrate or die-attachment area, and the die and substrate are then surrounded by an encapsulation material. The encapsulation material seals and protects the die and substrate within a protective cocoon.
Thermal management is another important factor in package design because some die can generate substantial amounts of heat during operation that, if not removed, will damage the die. The prime mechanisms of heat transfer involved with the thermal management of integrated circuit packages are conductive heat transfer and convective heat transfer. Conductive heat transfer, or conduction, is the process by which heat diffuses through a solid or a stationary fluid. In conduction, energy is transported from a region of higher temperature to a region of lower temperature by the drift of electrons. The property used to measure a materials ability to conduct heat is known as "thermal conductivity." A larger value of thermal conductivity indicates that a material is a better conductor of heat. For example, air is not a particularly good conductor of heat and has a corresponding thermal conductivity of 0.024 W/mK. Epoxies are slightly better conductors at 0.23 W/mK. Thermal greases are better conductors at 1.10 W/mK. Metals, however, are very good conductors of heat. Gold, for example, has a thermal conductivity of 298 W/mK. Two other metals have even higher thermal conductivities: copper at 395 W/mK and silver at 419 W/mK.
Convective heat transfer, or convection, is the process by which a moving fluid transfers heat to or from a surface. The motion of the fluid augments of the transfer of heat in convection. If the flow of fluid is not forced by a fan or pump, the mechanism of heat transfer could be either through conduction or natural convection. Natural convection can occur when the fluid near the surface heats up. The warmer fluid will be less dense than the cooler fluid above it and will rise. Thus carrying away heat. The process will continue as warmer fluid is displaced by cooler fluid.
Instead of the thermal conductivity (k) of the material, a term called the heat transfer coefficient (h) is used to simplify convection heat transfer calculations. The determination of the heat transfer coefficient is a very complicated matter because the coefficient can be affected by many factors. One factor is whether the convection is natural convection or forced convection. Forced convection is produced by a fan or pump forcing the flow of fluid. Generally, forced convection is a much better mechanism of heat transfer than natural convection. Another factor is the type of fluid flow, i.e., whether it is smooth laminar flow or whether it is violent turbulent flow. The geometry of the body is also very important, i.e. whether the fluid is flowing over a flat plate, a sphere, or inside a pipe. The fluid involved in convection is a very important factor. All other factors being the same, the heat transfer coefficient will usually be much higher if water, rather than air, is the fluid transferring the heat.
It is possible for an integrated circuit to experience a catastrophic thermal failure. Catastrophic thermal failure is an immediate, thermally induced, total loss of electronic function. In most integrated circuits, heat is transferred from the die through the package by conduction. Heat is then removed from the surface of the package, typically, by convection to a ventilated enclosure. Therefore, the thermal properties of the material forming the package are an important factor in removing heat from the die. In some cases, the integrated circuits generate large quantities of heat that require greater amounts of heat to be transferred than can be achieved by conduction through the package without damaging the die.
Various methods have been used to assist the removal of heat generated within an integrated circuit. These methods may range from the use of a simple heat sink, to the use of fans, to even the use of cyrogenics, such as liquid nitrogen. Substantial differences in the performance and cost of the heat transfer methods, as well as the integrated circuits, guides the selection of a particular approach. However, the use of heat sinks is a commonly used method to remove heat from many integrated circuit packages. Generally, heat sinks are made of metal and shaped to include fins. Metals are used because metals, as described above, are generally good conductors of heat. The fins serve to increase the surface area in contact with the coolant, thereby increasing the heat transfer to the coolant. The heat sink is attached to the outer surface of the package. The heat produced within the die is transferred to the package by conduction. The heat is then transferred by conduction from the package to the heat sink. Finally, the heat is removed from the heat sink by either convection or conduction to the air surrounding the heat sink.
Before a heat sink can transfer heat to a fluid, the heat produced within the die must first be transferred through the package to the heat sink. A temperature gradient will be produced in the package with a higher temperature on the inside of the package near the die and a lower temperature on the outer surface of the package. For the same amount of heat transfer, a lower thermal conductivity (k) will produce a higher temperature gradient and, consequently, a higher die temperature. Unfortunately, integrated circuit package material usually consists of molded-epoxy or ceramic materials that are not good conductors of heat and have low thermal conductivities. Thus, current packaging materials produce a higher die temperature than could be produced if higher thermally conductive material were used.
There is a need, therefore, for an improved technique for removing the heat generated by a semiconductor device. In particular, there is a need for an improved system for removing the heat generated by a semiconductor device within a sealed package.
Certain aspects commensurate in scope with the disclosed embodiments are set forth below. It should be understood that these aspects are presented merely to provide the reader with a brief summary of certain forms the invention might take and that these aspects are not intended to limit the scope of the invention. Indeed, the invention may encompass a variety of aspects that may not be set forth below.
The present invention provides an apparatus and technique for removing the heat generated within a sealed integrated circuit package. Moreover, the technique may also provide a mechanism for securing an integrated circuit die to a substrate.
In one favored approach, a thermally conductive strip, with a thermal conductivity higher than the packaging material, is used to dissipate heat from within an integrated circuit package. The thermally conductive strip can also be used to adhere an integrated circuit die to a substrate. A portion of the thermally conductive strip is within the package and a portion of the thermally conductive strip extends beyond the outer surface of the package into the surrounding environment. The integrated circuit package is disposed on a printed circuit board within an electronic device. During operation, heat is generated within the integrated circuit die and transferred to the thermally conductive strip by conduction. Heat is conducted through the thermally conductive strip from the portion of the thermally conductive strip within the package to the portion of the thermally conductive strip extending into the surrounding environment. Heat is transferred from the portion of the thermally conductive strip extending into the surrounding environment to the surrounding environment by forced convection. However, heat could also be transferred to the surrounding environment by natural convection or conduction or, alternatively, by conduction to a refrigeration system.
Thus, in accordance with a first aspect of the invention, a method is provided for assembling an integrated circuit package. The method includes disposing a thermally conductive strip, with a thermal conductivity higher than the packaging material, adjacent to an integrated circuit die. The method also includes forming a package around the integrated circuit and the thermally conductive strip, so that the thermally conductive strip extends through the package. The thermally conductive strip may be comprised of a metal, and portions of both sides of the metal may be covered with an adhesive to adhere the die to a substrate.
According to another aspect of the invention, an integrated circuit package is provided that includes a thermally conductive strip to dissipate heat generated by the integrated circuit die. The integrated circuit is packaged with the thermally conductive strip disposed adjacent to the integrated circuit die. The integrated circuit die and the thermally conductive strip is packaged within an encapsulation material. A portion of the thermally conductive strip extends through the package into the surrounding environment. The thermally conductive strip may be a double-sided adhesive metal tape. The metal tape may be used to adhere the integrated circuit die to a substrate.
According to another aspect of the invention, a thermally conductive strip is provided that is used to dissipate heat from an integrated circuit package. The thermally conductive strip is disposed adjacent to the integrated circuit die and extends outward from the outer surface of the package. The thermally conductive strip may be comprised of a metal foil with adhesive layers covering portions of both sides. The adhesive may be used to adhere the thermally conductive strip to an integrated circuit die and a substrate. One or more thermally conductive strips could be used. A thermally conductive strip with a hole could be used in a device using lead-on-chip packaging. The hole in the thermally conductive strip could be aligned with a hole in the substrate.
According to another aspect of the invention, a method is provided for dissipating heat from an integrated circuit. The method includes the act of disposing a conductive strip adjacent to the integrated circuit die during packaging. The conductive strip has a thermal conductivity that is higher than the thermal conductivity of material used to package the integrated circuit die. Heat is transferred from the integrated circuit die by the conduction through the conductive strip.
According to another aspect of the invention, a system is provided that utilizes an integrated circuit packaged with a thermally conductive strip. The thermally conductive strip is disposed within the integrated circuit package in proximity to the integrated circuit die and extends beyond the outer surface of the integrated circuit package. The integrated circuit is disposed on a printed circuit board within a protective enclosure. Heat generated by the integrated circuit die is transferred to the thermally conductive strip. The heat from the die is transferred through the thermally conductive strip to the surrounding environment. Heat may also be transferred to the surrounding environment by natural convection, conduction to the air, or conduction to a refrigeration system.
The foregoing and other advantages of the invention will become apparent upon reading the following detailed description and upon reference to the drawings in which:
One or more specific embodiments of the present invention will be described below. In an effort to provide a concise description of these embodiments, not all features of an actual implementation are described in the specification. It should be appreciated that in the development of any such actual implementation, as in any engineering or design project, numerous implementation-specific decisions must be made to achieve the developers' specific goals, such as compliance with system-related and business-related constraints, which may vary from one implementation to another. Moreover, it should be appreciated that such a development effort might be complex and time consuming, but would nevertheless be a routine undertaking of design, fabrication, and manufacture for those of ordinary skill having the benefit of this disclosure.
Turning now to the drawings, and referring initially to
Various other devices may be coupled to the processor 22 to enable the device 20 to perform its intended functions. For instance, a user interface 26 may be coupled to the processor 22. Examples of user interfaces 26 include: buttons, switches, a keyboard, a light pin, a mouse, or a voice recognition system. A display 28 may also be coupled to the processor 22. Examples of displays 28 include: an LCD display, a CRT, LEDs, or an audio display. A communications port 30 may also be coupled to the processor 22. The communications port 30 could be adapted to couple the processor 22 to a peripheral device 32, such as a modem, a printer, or a computer, or it may couple the device 20 to a network, such as a local area network or the Internet.
The processor 22 controls the functioning of the device 20 generally under the control of software programming. Electronic memory is coupled to the processor 22 to store and facilitate execution of the program. For instance, the processor 22 may be coupled to volatile memory 34, which may include dynamic random access memory (DRAM) and/or static random access memory (SRAM). The processor 22 may also be coupled to non-volatile memory 36. The non-volatile memory 36 may include a read only memory (ROM), such as an EPROM, to be used in conjunction with the volatile memory. The size of the ROM is typically selected to be just large enough to store the operating system, application programs, and fixed data. The volatile memory, on the other hand, is typically quite large so that it can store dynamically loaded applications. Additionally, the non-volatile memory 36 may include a high capacity memory such as a disk or tape drive memory.
As is clear from the above discussion, a processor-based device 20 may take many forms. The following figures and description illustrate an integrated circuit that could be used in a processor-based device. The integrated circuit could be utilized as a processor, electronic memory, or some other device. As mentioned previously, the integrated circuit operates electrically. The electricity flowing through an integrated circuit produces heat. In certain cases, the heat could eventually damage an integrated circuit if it is not removed. The figures described below illustrate exemplary integrated circuit devices that are constructed to increase the dissipation of heat from within the integrated circuit device, as compared with known integrated circuits.
Referring to
The illustrated embodiment utilizes lead-on-chip (LOC) packaging. In LOC packaging, bonding pads 46 formed on the die 42 are electrically connected to bonding pads 48 formed on the substrate 44 using fine bond wires 50. The substrate 44 is generally rectangular shaped with a rectangular opening 52 near the center. The opening 52 in the substrate is provided to allow the fine bond wires 50 from the die 42 to reach the top side of the substrate 44, opposite the die 42. In this view, the die 42, underlying the substrate 44, is visible through the opening 52 in the substrate 44. However, the present invention is not believed to be limited to use in LOC packaging. The present invention may be utilized in a variety of packaging techniques in addition to LOC packaging, such as board-on-chip (BOC) packaging
The illustrated embodiment is shown utilizing a ball grid array. In a ball grid array, the bonding pads 48 formed on the substrate 44 are electrically coupled to solder balls 54 via conductive traces 56 in the substrate 44. The integrated circuit is mounted and electrically coupled to an external device by briefly heating the solder balls 54 to a molten state and allowing the molten solder to flow between the integrated package and the external device. When the heat is removed, the molten solder will cool and solidify, forming a conductive bond. However, the present invention is not believed to be limited to use in a ball grid array. For example, the electrical connections in the integrated circuit package can be arranged in a pin grid array. Instead of solder balls 54, a pin grid array uses metal leads, or pins, to electrically couple the die 42 to an external circuit.
Typically, in LOC packaging, a double-sided adhesive tape is used to attach the die to the substrate. One side of the tape is applied to the underside of the substrate and the other side of the tape is attached to the die. The die and substrate are then attached to the adhesive tape using pressure and heat. A tape carrier dispenses the tape as part of the production process.
In the illustrated embodiment, the metallic tape 40 is used to connect the die 42 to the substrate 44. The metallic tape 40 is comprised of a thermally conductive adhesive 58 applied to a portion of both sides of a metallic foil 60. The adhesive bonds the die 42 to the foil 60 on one side and the substrate 44 to the foil 60 on the other side. The die 42 and substrate 44 are encapsulated in a molded-epoxy package 62. The metallic tape 40 is configured so that a portion of the metallic foil 60 extends beyond the confines of the molded-epoxy package 62. Heat is conducted from the die 42 to the metallic foil 60 via the thermally conductive adhesive 58. Heat is then conducted through the metallic foil 60 from the portion of the tape 40 inside the package 62 to the portion of the tape outside the package. Heat is then transferred from the tape 40 to the air in the environment 64 outside of the package 62 by convection. Typically, a processor-based device will be contained within a ventilated enclosure with a fan. The increased circulation of air caused by the fan will assist the convective heat transfer from the tape 40 to the environment 64.
Referring generally to
The material comprising the metallic foil 60 is advantageously of a very high thermal conductivity. Copper, gold, and silver are three examples of metals that might be used. However, the metal foil in the metallic tape could be any of a variety of suitable thermally conductive materials, including non-metals. The shape and thickness of the metal foil can be varied as desired. Generally, as the metal foil gets thicker it will become a better conductor of heat.
As illustrated, the metal foil is a flat rectangular strip. However, the tape could be configured in a variety of different shapes to enhance the heat transfer. For example, the sides of the tape that remain outside of the package could be constructed with fins to increase the surface area. Alternatively, the sides may be configured to mate with fins, or some other heat sink (not shown). Thus, for example, a water-cooled heat sink might be used to cool the ends of the metallic tape. This would greatly increase the heat transfer from the die. In fact, the tape need not extend beyond the surface of the package 62 to improve the heat transfer capabilities of the package. The higher thermal conductivity of the tape over that of the molded-epoxy in the package would result in a greater transfer of heat through the tape to the surface, rather than through a comparable thickness of molded-epoxy.
As an alternative, rather than using two pieces of metallic tape to attach the die 42 to the substrate 44, a one-piece tape can be used. Referring generally to
Referring to
Alternatively, a thermally conductive tape can be used purely for heat dissipation, without functioning as the adhesive to adhere a die to a substrate. In
While the invention may be susceptible to various modifications and alternative forms, specific embodiments have been shown by way of example in the drawings and have been described in detail herein. However, it should be understood that the invention is not intended to be limited to the particular forms disclosed. Rather, the invention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the following appended claims.
|Cited Patent
|Filing date
|Publication date
|2 May 1988
|29 Aug 1989
|Bickford Harry R
|Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween
|3 Apr 1989
|2 Oct 1990
|Motorola Inc.
|Electrically isolated heatsink for single-in-line package
|24 May 1990
|25 Feb 1992
|Tomoegawa Paper Co., Ltd.
|Adhesive tapes and semiconductor devices
|27 Nov 1992
|10 May 1994
|Motorola Inc.
|Lead-on-chip semiconductor device and method for making the same
|15 Feb 1996
|17 Dec 1996
|Staktek Corporation
|Integrated circuit package with overlapped die on a common lead frame
|3 Nov 1995
|26 Aug 1997
|Mitsubishi Denki Kabushiki Kaisha
|Semiconductor device with heat sink including positioning pins
|31 May 1996
|25 Nov 1997
|Lsi Logic Corporation
|Wire bondable package design with maxium electrical performance and minimum number of layers
|1 Feb 1996
|2 Jun 1998
|International Business Machines Corporation
|Electronic package with strain relief means
|5 Jun 1996
|14 Jul 1998
|Mitsubishi Denki Kabushiki Kaisha
|Surface mounting semiconductor device and semiconductor mounting component
|6 Jul 1995
|29 Sep 1998
|Nec Corporation
|Seal structure for tape carrier package
|29 Apr 1996
|1 Dec 1998
|Lg Semicon Co., Ltd.
|Semiconductor package, and semiconductor device using the same
|17 Jan 1997
|27 Apr 1999
|Lg Semicon Co., Ltd.
|Lead frame and semiconductor package
|19 Jun 1997
|20 Jul 1999
|Lg Semicon Co., Ltd.
|Printed circuit board card for mounting packages in faces thereof
|17 Sep 1997
|5 Oct 1999
|Lg Semicon Co., Ltd.
|Bottom lead semiconductor package with recessed leads and fabrication method thereof
|1 Oct 1998
|28 Dec 1999
|Micron Technology, Inc.
|Method of forming a synchronous-link dynamic random access memory edge-mounted device
|23 Apr 1997
|2 May 2000
|Lsi Logic Corporation
|High power dissipating tape ball grid array package
|7 Jul 1997
|18 Jul 2000
|Wood; Alan G.
|Discrete die burn-in for nonpackaged die
|17 Mar 1999
|10 Oct 2000
|Chen; Tsung-Chieh
|Thin enhanced TAB BGA package having improved heat dissipation
|16 Jan 1998
|16 Jan 2001
|Seiko Epson Corporation
|Film carrier tape, semiconductor assembly, semiconductor device, and method of manufacturing the same, mounted board, and electronic instrument
|9 Mar 2000
|22 Jan 2002
|Heat Technology, Inc.
|Method for removing heat from an integrated circuit
|10 Dec 1999
|23 Jul 2002
|Amkor Technology, Inc.
|Microelectronic device package having a heat sink structure for increasing the thermal conductivity of the package
|2 Jul 1998
|13 Aug 2002
|Parker-Hannifin Corporation
|Double-side thermally conductive adhesive tape for plastic-packaged electronic components
|25 Apr 2001
|27 Aug 2002
|Micron Technology, Inc.
|Bow resistant plastic semiconductor package and method of fabrication
|10 Sep 2001
|17 Jan 2002
|Distefano Thomas H.
|Compliant semiconductor chip package with fan-out leads and method of making same
|2 Jul 1998
|31 Jan 2002
|Michael H. Bunyan
|Double-side thermally conductive adhesive tape for plastic-packaged electronic components
|21 Jan 1999
|25 Apr 2002
|Chien Ping Huang
|Ball grid array semiconductor package with exposed base layer
|Title not available
|Title not available
|Citing Patent
|Filing date
|Publication date
|3 Jan 2007
|29 Apr 2008
|Siliconware Precision Industries Co., Ltd.
|Method for fabricating semiconductor package
|26 Nov 2014
|17 Nov 2015
|Freescale Semiconductor, Inc.
|Semiconductor device with tube based heat spreader
|3 Jan 2007
|17 May 2007
|Siliconware Precision Industries Co., Ltd.
|Method for fabricating semiconductor package
|U.S. Classification
|International Classification
|Cooperative Classification
|European Classification
|3 Apr 2007
|Certificate of correction
|16 Jun 2010
|Fee payment
Year of fee payment: 4
|2 Jul 2014
|Fee payment
Year of fee payment: 8
|12 May 2016
Owner name: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGEN
Free format text: SECURITY INTEREST;ASSIGNOR:MICRON TECHNOLOGY, INC.;REEL/FRAME:038669/0001
Effective date: 20160426
|2 Jun 2016
Owner name: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL
Free format text: PATENT SECURITY AGREEMENT;ASSIGNOR:MICRON TECHNOLOGY, INC.;REEL/FRAME:038954/0001
Effective date: 20160426
|8 Jun 2017
Owner name: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGEN
Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST;ASSIGNOR:MICRON TECHNOLOGY, INC.;REEL/FRAME:043079/0001
Effective date: 20160426


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Letter(s) from Olga Sutyagina to S. H. (USA)
Letter 1
How are you? Thanks for the letter. You would know how many pleasures to me have brought that you have answered me! Now I understand, that people in your country really responsible ! I directly would like to learn more about you to learn your interests as you live as you work. I am very glad to have such friend, as you. I'd like to introduce my self. My name is Olga. I'm 27. I was born 25 November in 1978 in Ivanovo , it's 900 km from Moscow. My height is 168cm and me weight is 54kg. My black are black. I don't have
children. I am feminine and tender inside of my heart.
I live with the mum. The father has left from us when to me there were 10 years. With us my grandmother lives. I very love the relatives. Our flat isn't large but cosy. I like to create warmth at home. Unfortunatelly, I don't have a phone yet, but we can communicate
through correspondence. I write from internet cafe. I have higher education. I have graduated from the University. I'm an accountant,
but work as a hairdresser, as it's difficult to find a job here.
Write me more about you. What do you like? Have you got a family?
Children? What is your job? Do you like nature? Have you got pets?
Without fall send me your photo!!!
I will wait your letter
Letter 2
Hi my love.
I am very glad that you have written to me. I just have come from job. Excuse me if I shall write to you a little.
Simply I am very tired today. Today day at us was not quiet.
I absolutely agree with your rules. You would like if I came to you? I how much not confused that with you with growth less. For me it does not matter. I have learned you as kind and liking father of children. I very much would want that we met you. You would like if I came to you for new year? I have foreign passport, I will need only to pay for the visa and ticket. What you to look at it?
As the girlfriend works for me in travel agency and she has said will help me with registration of the document. I finish to write excuse that I have not answered all your questions. I wish to you successful day and good mood. I shall wait very much your letter your love Olga!!!
Letter 3
Hi my love!!!
Excuse that I long did not write to you. At us was jobs much.
What at you weather? At us the present winter began. Temperature Air -17. I would learn all for this purpose what to arrive to you. I shall be
To reserve to itself the tourist visa, I have learned that she is given iao?e
Month. And I can quietly I shall then to you come, from you not
The invitation is necessary what, I shall be as the tourist to visit your country.
But the truth such visa will cost for me 430 $. To me her can make
For three weeks, as I already spoke to you that my girlfriend will do her.
And on this it so quickly to turn out. Can I count your help in
Money if I can not find such money? If there will be very well that I
I can come to you for new year. You would like it? My love I
I send you the intimate photo. I did not want her to send but I
I think that you the present man, and I believe that we with you will have all
Well. And I hope that you can to me help me to you with arrival.
I hope that my photo will not upset you. I finish to write I
I shall wait very much your letter your love Olga!!!
Letter 4
Hi my love.
Excuse that I to you so was has written. I was not right.
I always read your letters very closely(very attentively) and not one time.
I simply can sometimes I mix up words in translation. I think that I bett I shall
To understand you when we shall live together. I have learned(found out) all from my girlfriend
That the ticket will cost for me 756 $ and plus the visa 430 $. Excuse me still
Time that I so to you was has written. I want tomorrow to leave from job
That I could completely engage in my moving to you. As
I still should then go in Moscow in embassy. They me shall be
To ask questions different and to check my English language. I about it
Wanted to talk to you on the phone. My love I answered yours
Question concerning photos. I spoke you what is it my girlfriend me
Photographed. And that what is it was only is made specially for you.
My love I did not overlook what is your name and where you live. Simply to me
It was necessary to know your exact home address. I your all data already
Has said in travel agency it it is necessary that they
Knew to whom I meal. My agent asks on what number to me
To reserve the ticket. As my visa will be ready till December 25. At you
What day will be free what me to meet? I finish to write.
If you have to me questions that I shall set to me them to answer. I
Very much I wait your answer your love Olga!!!


text:
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Hi everyone out there (:
I have been playing the violin for about two years now. I'm going to be moving to college soon, and since my roommates most likely wont appreciate being disturbed by me practicing and i've always wanted an electric violin, i decided to go for it. Problem is that im completely lost on this subject and i really dont know what to go for? I can only afford to spend about a 1000 dollars give or take and it needs to be one i can buy in the EU as the customs almost doubles the expenses if i buy from places like the US. What would you guys recommend? Thanks in advance for any tips and suggestions (:
Thanks a lot for the fast answer! I had been looking into the yamaha SV-130 too, so i guess i wasn't completely off (: Would you (or anyone else for that matter) recommend any bows in particular for electric violins? I have no idea whatsoever as to what i should look for in a good, reasonabled priced bow :/ I have been looking around myself too, but i feel lost in it pretty fast.
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An excerpt from www.HouseOfNames.com archives copyright © 2000 - 2017
Eeloffe Early Origins
Northumberland where they held a family seat as Lords of the Manor. After the Battle of Hastings in 1066, William, Duke of Normandy, having prevailed over King Harold, granted most of Britain to his many victorious Barons. It was not uncommon to find a Baron, or a Bishop, with 60 or more Lordships scattered throughout the country. These he gave to his sons, nephews and other junior lines of his family and they became known as under-tenants. They adopted the Norman system of surnames which identified the under-tenant with his holdings so as to distinguish him from the senior stem of the family. After many rebellious wars between his Barons, Duke William, commissioned a census of all England to determine in 1086, settling once and for all, who held which land. He called the census the Domesday Book, [1]CITATION[CLOSE]
Williams, Dr Ann. And G.H. Martin, Eds., Domesday Book A Complete Translation. London: Penguin, 1992. Print. (ISBN 0-141-00523-8) indicating that those holders registered would hold the land until the end of time. Hence, conjecturally, the surname is descended from the tenant of the lands. The first record is of a Ailef of Palestine who was preumably a returning Norman knight from the Holy Land about 1200. He, or his successors, held estates in that shire in 1175.
Eeloffe Spelling Variations
Eeloffe Spelling Variations
The English language only became standardized in the last few centuries. For that reason, spelling variations are common among many Anglo-Norman names. The shape of the English language was frequently changed with the introduction of elements of Norman French, Latin, and other European languages; even the spelling of literate people's names were subsequently modified. Eeloffe has been recorded under many different variations, including Ayloffe, Ayloff, Ayliffe, Ayliff and others.
Eeloffe Early History
Eeloffe Early History
This web page shows only a small excerpt of our Eeloffe research. Another 251 words (18 lines of text) covering the years 1510, 1600, 1534, 1585, 1563, 1627, 1621, 1622, 1592, 1662, 1661, 1662, 1618, 1675, 1685, 1631 and 1722 are included under the topic Early Eeloffe History in all our PDF Extended History products and printed products wherever possible.
Eeloffe Early Notables (pre 1700)
Eeloffe Early Notables (pre 1700)
Outstanding amongst the family at this time was William Ayloffe (died 1585), an English judge of the Queen's Bench; Sir William Ayloffe, 1st Baronet (1563-1627), English Member of Parliament (M.P.) for Stockbridge from 1621 to 1622, from Braxtead Magna, Essex; Sir Benjamin Ayloffe, 2nd Baronet (1592-1662), an English landowner and politician...
Another 70 words (5 lines of text) are included under the topic Early Eeloffe Notables in all our PDF Extended History products and printed products wherever possible.
The Great Migration
The Great Migration
To escape the uncertainty of the political and religious uncertainty found in England, many English families boarded ships at great expense to sail for the colonies held by Britain. The passages were expensive, though, and the boats were unsafe, overcrowded, and ridden with disease. Those who were hardy and lucky enough to make the passage intact were rewarded with land, opportunity, and social environment less prone to religious and political persecution. Many of these families went on to be important contributors to the young nations of Canada and the United States where they settled. Eeloffes were some of the first of the immigrants to arrive in North America: Edward Ayliffe, aged 38, who arrived at Ellis Island, in 1922; Frank Ayliffe, aged 37, who arrived at Ellis Island from London, England, in 1909; Harry Ayliffe, aged 28, who arrived at Ellis Island from London, in 1907.
Eeloffe Family Crest Products
Eeloffe Family Crest Products
See Also
See Also
Other References
The Eeloffe Family Crest was acquired from the Houseofnames.com archives. The Eeloffe Family Crest was drawn according to heraldic standards based on published blazons. We generally include the oldest published family crest once associated with each surname.
This page was last modified on 19 November 2013 at 15:44.
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Make 2018 Your Year of Adventure. Save $150 when you Book Now - Learn More >
Unique wildlife, facinating culture and spectacular Moghul architecture
Northern India conjures up memorable and colourful images of turbans, saris, flavoursome curries and rickshaws. We visit the 'Pink City' of Jaipur, home to the wonderful former Maharaja's Palace and the splendid hilltop Amber Fort. Agra and the serene Taj Mahal are not to be missed and fully live up to expectations. An early morning boat ride through the mist along the ghats of Varanasi is probably the most sensory intoxicating excursion in India with the sight of so much Hindu culture both fascinating and deeply moving, an experience only equalled by spotting a tiger in Ranthambore National Park.
Click on the button below for detailed Trip Notes containing all the particulars about this trip, including kit lists and practical information.
Note: these can vary by departure; you can check out the specific Trip Notes for your chosen adventure on the dates & prices page.
Just returned from an amazing trip - Highlights of Northern India. As I expected in was very fast...
A very fast paced tour combining the highlights of this region of India with Indian culture and...
A fast paced journey through Northern India. Your feet barely touch the ground and you are...
A great way to see all the must see highlights Northern India with like-minded people. Quite a...
This is an amazing introduction to India. A fairly short trip which packs everything in. Krishna...
This was a jammed packed introduction to the highlights of Northern India, it was exactly as...
For me it was trip of a lifetime. As a single traveller I enjoyed fabulous company and...
Amazing tour, fully loaded with all aspect of a great insight into India and the Northern city...
This was my second trip with Exodus and again, the trip was very well organized and our tour...
We had a wonderful tour of some of the sights of northern India and were left feeling that a...
At Exodus we believe in the power of Responsible Travel.
Every time we travel, w/trip/AICe are part of a global movement that creates jobs, builds more sustainable societies, encourages cultural understanding and safeguards common natural and cultural heritage. To learn more about what Responsible Travel means to Exodus click here…
Those who are on the group flights will land in Delhi in the morning. Those not on the group flights will need to be at the start hotel by 9am (or at the airport when the group land). A local representative will meet Land Only clients at the start hotel and provide a transfer to the airport where we meet clients arriving on the group flight. Once everyone has arrived we will then depart on the drive to Jaipur, which may take between 5-7 hours depending upon traffic conditions.
Standard Hotel
Built in the late 18th century, Jaipur is a planned city of broad avenues built of sandstone and painted pink at a later stage. We visit the City Palace in the centre of Jaipur, formerly the residence of the Maharaja, now a fine museum containing rare manuscripts, paintings, royal garments and weapons. Close to the palace is one of the most intriguing sights of India, the observatory of Jai Singh. This is an assembly of immense astronomical instruments made of marble and brass set in a pleasant garden. We will also see Jaipur's impressive landmark, the Hawa Mahal, or Palace of the Winds. We then see the impressive and splendid Amber Fort, a few miles from the main city, rising above a lake. Jaipur is a centre of many handicrafts, such as durries (woven rugs), carpets, printed cloth, semi-precious stones, leatherwear etc. It will be difficult to leave a workshop without buying anything!Standard Hotel
We wind our way through the villages of rural India to Ranthambore Tiger Reserve (approx. 5 hr drive); we stay in a hotel not far from the park entrance and make 2 game drives into the park, one in the late afternoon and one the following morning. Ranthambore is one of India's tiger reserves under Project Tiger. After initial success, poaching has drastically reduced the tiger population and the chance of spotting a tiger is small, but many Exodus groups have seen tigers over the last few years. There is other wildlife such as several species of deer, crocodiles and bird life including purple heron, kingfishers, cormorants, parakeets, jacanda, waders and partridges.Standard Hotel
In the morning we take our second game drive, trying to find that elusive tiger, before we start our journey to Agra via Fatehpur Sikri. Fatehpur Sikri is the Emperor Akbar's deserted royal city. This impressive and well-preserved citadel became his capital in 1571, after the blessing of a local Moslem holy man correctly predicted the birth of a longed-for son, his successor the Emperor Jehangir. The mosque, designed to hold ten thousand worshippers, the palaces, residences and halls of audience are all made of decorative red sandstone. But this magnificence only lasted 14 years, as in 1584 Akbar left Fatehpur Sikri to secure his outlying territories, leaving this city much as we see it today - in perfect condition. This is another very full but rewarding day. Total driving time approx. 7 hrs.Comfortable Hotel
Today we will rise early to visit the beautiful white marble Taj Mahal at sunrise; built by the Moghul Emperor Shah Jahan in memory of his beloved wife, Mumtaz Mahal, who died in 1631. The Taj is serenely beautiful and never fails to amaze a first time visitor; the white marble exterior changes colour according to the position of the sun during the day and is matched by the rich interior detail. Within striking distance is the imposing Red Fort of Akbar, third of the Moghul Emperors, whose mighty sandstone walls enclose the beautiful white marble Pearl Mosque and the palaces, halls, courtyards and fountains of his sons and successors, Jehangir and Shah Jahan. It is here that the latter spent his last years, imprisoned by his own son Aurangzeb. Later in the day we will transfer to Agra train station and join the overnight sleeper train to Varanasi.
Sleeper Train
We arrive in Varanasi during the morning and transfer to our hotel. Varanasi, located on the river Ganges, is one of the most holy cities in India and stands at the centre of the Hindu Universe. As such, the city lives and breathes Hinduism: there are thousands of pilgrims, wandering holy men (Sadhus), religious elders and casual visitors. It is a city to get immersed in by exploring its maze of narrow lanes and the many temples, and watching the Hindu ceremonies that take place around the clock. There is time to explore the emporiums specialising in silks and brocades or maybe take a massage by the banks of the Ganges. Your leader can organise various optional sightseeing trips during your 2 days here.Comfortable Hotel
Just before dawn, we take a boat out on the Ganges to witness the extraordinary spectacle on the ghats, the steps leading down to the river. Every day thousands of Hindu pilgrims come to these three miles of riverbank to soak in the holy waters. The rest of the day is free to continue exploring the city, relax at the hotel or go on optional sightseeing excursions. In the late afternoon we board the overnight train back to Delhi. Sleeper Train
We arrive in Delhi during the morning where we will transfer to our hotel. Today you are free to relax or explore the sites of New and Old Delhi (an optional sightseeing trip will be organised if you wish). Recommended sites are the Red Fort, Humayun's Tomb, India Gate, Jama Masjid (India's largest mosque), Sheeshganj Gurudwara (Sikh Temple) and Raj Ghat. For last minute shopping, we recommend the market area of Chandni Chowk or Karol Bagh. Standard Hotel
Those on the flight inclusive package will depart for the airport this morning for the daytime flight back to London; Land Only arrangements will finish after check-out from the hotel.
Visas are required if you are British and for most other nationalities. For UK residents full details of the visa process can be found here http://www.exodus.co.uk/assets/travelink/India-visa-information.pdf. Other nationalities should check with their travel agent or the relevant embassies.
There are no mandatory vaccination requirements. Recommended vaccinations are: Polio, Tetanus, Diphtheria, Typhoid, Hepatitis A. The risk of malaria is slight but you may wish to consult your GP or travel health clinic for further advice. Dengue fever is a known risk in places visited. It is a tropical viral disease spread by daytime biting mosquitoes. There is currently no vaccine or prophylaxis available for Dengue, and therefore the best form of prevention is to avoid being bitten. We recommend you take the usual precautions to avoid mosquito bites.
Some of our India trips spend time at altitude. In regions over approx. 2000m, there is low to no risk of mosquito-borne diseases. For trips going to altitudes of over 3000m there is a risk of being affected by Acute Mountain Sickness. Our itineraries are designed to enable everyone to acclimatise to these altitudes, but you should be aware that it is still possible for you to be affected. Please see the TRIP NOTES for further information.
All breakfasts and 1 lunch are included in this trip.
India is famous for its food and there is ample chance to try various curries such as the familiar tandoori, biriyani and rogan josh. If you are a vegetarian, India is a great destination. There are wonderful desserts and excellent beers, soft drinks and Indian specialities such as lassi, a refreshing yoghurt drink.
You should allow at least £13 - £15 (approx. US$18 - US$20) per day for lunch and dinner. You can eat out very cheaply in India, but if you go to the more expensive restaurants most of the time, you will spend more than the suggested amount. In most of the towns there is a good choice of restaurants and a choice between Indian and Western food. Please note that service in restaurants can be quite slow. Tea and soft drinks are very cheap. A (large!) bottle of beer is approximately £3 (approx. US$4). Mineral water is widely available, but drinking water is provided in a large container in the bus in order to reduce our use of plastic, so please bring your own water bottle with you to refill.
Activity Level: 1 (Leisurely)
This holiday is designed so that you can see the best parts of Northern India in a short period of time. Therefore this is generally a fast-paced itinerary and please bear in mind that once everyone has arrived in Delhi we will then depart on the drive to Jairpur, which may take between 5-7 hours depending upon traffic conditions. We recommend an extra night in Delhi at the start of the trip if you'd prefer to not do this journey after your flight.
You should be prepared for some long days and some early starts. The times stated in the trip notes are actual driving times and do not include photo, tea, comfort or lunch breaks. Journeys can sometimes take longer due to local traffic or road damage after the monsoon. On December and January departures, fog is common and this can sometimes slow us down. These departures may also experience severe train delays or cancellations. If a severe delay occurs, the group will travel overnight on a private comfortable bus instead. In the rare event of not being able to travel by bus at night because of severe fog, and flying is also not an option, we have an alternative itinerary in place where we visit Bharatpur, Deeg Palace and Mathura instead of Varanasi. However, this scenario is rare.
There is a lot to see in the time you are in India, but everything is scheduled so that it doesn't feel too rushed. You should come armed for an experience: India can be hard work and the heat and the bustle of some of the cities can be a little overwhelming. That said, there are places where you can find peace and this is one of the few places in the world from where you will return armed with great stories and memories to last a lifetime.
Please note that the Archaeological Survey of India (ASI) are responsible for the conservation of many monuments in India, including the Taj Mahal, and very occasionally this may mean that work is taking place at sites visited on this trip. The ASI's schedule is never published so it is not possible to forewarn our clients of when work will be taking place.
Holi and Diwali Festivals
Some departures will be in India during the festivals of Holi and Diwali. They are great festivals to witness and some very minor itinerary alterations may be made locally in order to make the most of these occasions. Holi celebrations typically involve people throwing coloured water at each other and smearing powder on each other's faces. This is accompanied by dancing, music and traditional Holi sweets such as Ghujiya and Bhanng. It's a riot of colours as the powder bursts into the sky. During Diwali, the festival of lights, people typically light up their houses, shops and streets, and celebrate on the streets with fireworks.
6 nights hotels, 2 nights air-conditioned sleeper trains.
The hotels used are standard city tourist hotels (2 or 3-star, local rating). All rooms have en suite facilities. Service and amenities are generally adequate.
Single accommodation (from GBP125) excludes sleeper trains.
Overnight trains
These are booked in 2-tier (or 3-tier if 2-tier is not available) sleeper A/C. There are many excellent trains in India but the standard of seating and sleeping is not in line with European standards. All seats are pre-allocated at the time the tickets are issued, meaning that we cannot guarantee the whole group are together on the train; your leader will manage this as best as possible and will always check on you during the journey. Indian trains are safe to travel on but we recommend that you keep valuables with you at all times. Snacks are often offered on board (at an additional cost). Whilst some trains have western-style facilities, the majority of services are equipped with squat toilets. Please note trains are sometimes delayed for reasons beyond our control, particularly in December and January when fog is common, but we endeavour to minimise the impact of these delays on the overall journey.
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Colum McCann and musician Joe Hurley cowrote a song-cycle—"The House That Horse Built (Let the Great World Spin)"—based on McCann's novel. The album is narrated from the perspective of the character Tillie. It was recorded with Hurley's band The Gents—James Mastro (Ian Hunter), Tony Shanahan (Patti Smith), and Ken Margolis (Cracker)—and features The Chieftains' Paddy Moloney, Matt Sweeney, soul singer Tami Lynn, film actress Antonique Smith, Denis Diken and Joe McGinty. It was produced by Don Fleming and Hurley.[10]
This content is from Wikipedia. GradeSaver is providing this content as a courtesy until we can offer a professionally written study guide by one of our staff editors. We do not consider this content professional or citable. Please use your discretion when relying on it.


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- Please select a date to see the proper prices!
Description of the accommodation:
Rooms, services 24 comfortably furnished rooms are offered by Rodeway Inn Akron to guests looking for accommodation in Akron. In case you ever feel like eating in, you may taste delicious local dishes in the restaurant of the hotel. The exact scope of services offered by Rodeway Inn Akron (including those for an extra fee) is available on the information sheet below.
Payment Advance payment by credit card or providing credit card guarantee may be necessary for finalizing the reservation, depending on the chosen date, room and price.
Arrival, opening hours The earliest time to arrive is 15:30, the latest time to leave the rooms is 10:00. You will be able to speak with the personnel in English.
Rodeway Inn Akron rooms Rooms
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Affinity Kitchen and Bath
Foundation Masters, LLC hired Affinity Kitchen and Bath to install Kitchen counter tops BIG MISTAKE! They were honorable from day one, it reminded me of , when you go into a restaurant and you wait forever to get drinks, that is when you can tell how the rest of the dinner service will probably go, I wish I would have left. They told me so many different stories they couldn't even keep up with them.
Well, when they finally showed up to install the counter tops, they only sent two guys and the soap stone counter tops are very heavy. Their guys would speak their foreign language and very little English which is very rude, along with their very bad personal hygiene. It was very clear that they were arguing with each other by the tone of there voice. They brought the first counter top in and set it up right on its side on the bar island and broke the counter top. Then the second piece for the center island they set on one side of the island breaking the island. Then they set the counter top on the island and the counter top cracked down the middle.
The bar top island was also damaged. I have 2×4's supporting my kitchen counter tops and they never secured them. This happened back around Christmas time 2016. Today is 2-16-2017. I built this house and we can't use our kitchen because they will not replace our counter tops. This company has been the worst company I have ever dealt with in my life.
These soap stone counter tops cost $6000.00 Thanks Tiffany. Affinity Kitchen and Bath caused over $12,000.00 damage to my kitchen and we have been with our kitchen for two months.
Affinity Kitchen and Bath Sarasota
Tiffany if you think that your going to bully me out of this you couldn't be more wrong. I also have the domain of http://affinitykitchenabath.com/ I will have your new (review) website up by the end of the week.
This lady to the left is Tiffany Farrell she is one of the owners of Affinity Kitchen and Bath (at least i think they never were very honest about anything).
I met with her about the damage to my counter tops. She only was concerned about how much money was on the deposit in other words they didn't care about my loss. Tiffany did recommend that I try to make a claim on their insurance and include the counter tops, so they did not come out of pocket for anything. We did make a claim for the damage to the island cabinets. They do not carry the proper insurance as they denied my claim. This company damaged my kitchen and the insurance company said they do not carry the proper insurance.
If you had any trouble with Affinity Kitchen & Bath please feel free to contact us for a FREE Inspection and a engineered stamped report.
Affinity Kitchen & Bath
These links below (in Green) are all review links for Affinity Kitchen & Bath Sarasota.
Affinity Kitchen & Bath sucks Affinity Kitchen & Bath sucks
Affinity Kitchen & Bath sucks Affinity Kitchen & Bath sucks
Affinity Kitchen & Bath sucks Affinity Kitchen & Bath sucks
Affinity Kitchen & Bath sucks Affinity Kitchen & Bath sucks
Affinity Kitchen & Bath sucks Affinity Kitchen & Bath sucks
This page will be updated regularly as new info becomes available.
Tiffany just because you have money doesn't give you a right to treat people this way.


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Release Date: 1940
Not Yet Rated|1 hr 2 min
Plot Summary
Trying to get information on airline mogul and accused spy Archer Coe (Richard Kipling), sleuth Philo Vance (James Stephenson) soon finds himself investigating a murder when Coe turns up dead. Because Coe was such a widely disliked and unethical character, everyone in his orbit becomes a suspect -- even his niece, the strong-willed Hilda Lake (Margot Stevenson). Hopping from one continent to another, Vance must piece together a complicated set of clues in order to close the case.
Cast: James Stephenson, Margot Stevenson, Henry O'Neill, Edward Brophy, Ralph Forbes, Martin Kosleck, Richard Kipling
Director: William Clemens
Genres: Mystery
Production Co: Warner Brothers/Seven Arts
Keywords: Pursuit, Engaging, 1940s, Murder, Mystery, Investigation