Chuang, C.-H.; Lin, Y.-C.; Lin, C.-W. Intermetallic Reactions during the Solid-Liquid Interdiffusion Bonding of Bi2Te2.55Se0.45 Thermoelectric Material with Cu Electrodes Using a Sn Interlayer. Metals 2016, 6, 92.
Chuang C-H, Lin Y-C, Lin C-W. Intermetallic Reactions during the Solid-Liquid Interdiffusion Bonding of Bi2Te2.55Se0.45 Thermoelectric Material with Cu Electrodes Using a Sn Interlayer. Metals. 2016; 6(4):92.
Chuang, Chien-Hsun; Lin, Yan-Cheng; Lin, Che-Wei. 2016. "Intermetallic Reactions during the Solid-Liquid Interdiffusion Bonding of Bi2Te2.55Se0.45 Thermoelectric Material with Cu Electrodes Using a Sn Interlayer." Metals 6, no. 4: 92.