and supplies an output current of up to 150mA.
temperature range and is available in a lead-free, RoHScompliant, ePad SOIC-8 package.
Exposed Pad (ePad) for Thermal Dissipation. Connect to GND.
Bypass Capacitor Connection. Connect 0.1µF capacitor from CPSRR to GND.
VIN = 12V, CIN = 1.0µF, CPSRR = 0.1µF, COUT = 10µF, IOUT = 100µA, TJ = 25°C, bold values indicate –40°C ≤ TJ ≤ +125°C, unless noted.
Exceeding an absolute maximum rating may damage the device.
environments. All options offer 150mA of output current.
remove heat from the die more effectively.
voltage divider from VOUT to ground.
enough headroom to withstand any potential transient.
capacitor must be at least 14V.
designed output voltage of the MAQ5283.
causes artificially low case temperature measurements.
the beam on the IC for long periods of time.