SF503A OptiCLEAR™ Liquid Encapsulant Fill | Polysciences, Inc.
Liquid encapsulant fill material specifically designed to offer efficient light transmission & low cure stress. 100% solids, unfilled, liquid encapsulant designed for encapsulation of semiconductor devices requiring high toughness & strong adhesion to various substrates such as metal, ceramic, & organic. UV or thermally curable.