The objective of the Engineered Micro Systems & Devices Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of engineered miniaturized systems, including 3-D printing, laser machining, plating, MEMS/NEMS, fractal-enhanced, biomimicry and other miniaturized electro- and/or mechanical systems and devices.
Those wishing to present their work at the Device Packaging Conference must submit a ~500 word abstract electronically no later than December 5, 2014, using the on-line submittal form at: www.imaps.org/abstracts.htm. No formal technical paper is required. A reproduction-ready two- to six-page concise summary ("extended abstract") with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 23, 2015. A post-conference USB containing the full presentation material as supplied by authors will be mailed after the event to all attendees. Please contact Brian Schieman by email at bschieman@imaps.org or by phone at 412-368-1621 if you have questions.
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging. This venue features an ideal atmosphere to showcase your products and services to key decision making professionals in the industry. Full 8' by 10' exhibit spaces will be available. To reserve booth space, please fill out the application form before February 1, 2015 at: www.imaps.org/devicepackaging or contact Brian Schieman by email at bschieman@imaps.org or by phone at 412-368-1621. The exhibits have sold out every year since 2006 and we expect a sell-out again in 2015! We advise you to book early - before January 1 - as we had more than 13 exhibitors on a wait-list in 2014!
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 16th, preceding the technical conference. PDC details and registration on-line soon.
If you would like to participate as an instructor, please submit a description of your short course on-line at www.imaps.org/pdc no later than December 5, 2014.
Please contact Brian Schieman by email at bschieman@imaps.org or by phone at 412-368-1621 if you have questions about the technical program, exhibits, golf or PDCs.
Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, exhibits, meals, refreshment breaks, and one (1) USB of presentations; USB will contain the extended abstract and presentation as submitted by the presenter. USB will be mailed 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.
Each Course Registration is additional to the conference registration. Maximum of 1 morning course and one afternoon course can be selected. Attendees can opt for $0 exhibits only pass if they wish to take a PDC but NOT attend the conference/sessions..
All reservations should be made directly with the hotel and within the IMAPS room block. We are not using a housing company. If any person or firm contacts you and offers to handle your reservations, please beware. They are completely unauthorized and possibly fraudulent. The convention industry is currently plagued by such groups. If you use one of them and experience any problems, including lost deposits and no reservation when you arrive, IMAPS may not be able to assist you. Please be aware in particular of one of these unauthorized firms – Exhibition Housing Services – whose salespeople have falsely claimed to be calling from IMAPS.
The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions.
The Device Packaging student review committee will evaluate all student papers/posters and award at a total of $3,000 in awards checks at/following the Conference: $1500 first prize, $1000 second prize, and $500 third prize. The selected student(s) must attend the event to present his or her work and receive the award.