 When a high-density plasma is used, the ion density can be high enough that significant sputtering of the deposited film occurs; this sputtering can be employed to help planarize the film and fill trenches or holes.A simple DC discharge can be readily created at a few torr between two conductive electrodes, and may be suitable for deposition of conductive materials.However, insulating films will quickly extinguish this discharge as they are deposited.