 The data model presented in the OA DB provides a unified model that currently extends from structural RTL through GDSII-level mask data, and now into the reticle and wafer space.It provides a
rich enough capability to support digital, analog, and mixed-signal design data.It provides technology data that can express foundry process design rules through at least 20 nm, contains the definitions of the layers and purposes used in the design, definitions of VIAs and routing rules, definitions of operating points used for analysis, and so on.