 The company acquired the common shares of ChipMOS Technologies LTD. in 2007, Taiwan Occupational Safety and Health Management in 2008 and merged with Siliconware Investment Company Ltd. in the next year of 2009.In 2013, the company and Siliconware USA, Inc. settled the long patent infringement litigation with Tessera Technologies, Inc.. Siliconware would pay Tessera, Inc. a partial upfront fee and smaller quarterly payments over the next five years, for being released from the litigation.The packaging materials the company processed include substrate (ball grid array) and lead-frame packages, the testing services provided by the company are based on logic, mixed signal, and embedded memory devices to measure the performance and reliability of packaged semiconductor devices.