 Sherlock incorporates stresses from a variety of environments into its physics-based prediction algorithms, including elevated temperature, thermal cycling, vibrations (random and harmonic), mechanical shock and electrical stresses (voltage, current, power).Sherlock then performs several different types of reliability analysis and provides the useful (constant failure rate) and wear out (increasing failure rate) portions of the life curve for each mechanism-component combination.The specific mechanisms that are evaluated and predicted include low-cycle solder fatigue due to thermal cycling, high-cycle solder fatigue due to vibration, solder cracking/component cracking/pad cratering due to mechanical shock or excessive flexure, lead fatigue, wire bond fatigue, via fatigue, electromigration, time dependent dielectric breakdown, hot-carrier injection, and negative bias temperature instability.