 The semiconductor module is in compliance with SAE ARP 6338 and is being considered as a replacement to traditional empirical reliability prediction methods (MIL-HDBK-217, Telcordia SR-332, FIDES, and Siemens SN29500) in predicting the reliability of semiconductor devices.A graphical interface allows users to examine results, make iterations, and pre-perform analyses as necessary.The software does not allow the user to make permanent changes to the electronic design.