fine details or holes are further away and receive less current resulting in poor plating. Zinc plating Zinc coatings prevent oxidation of the protected metal by forming a barrier and by acting as a sacrificial anode if this barrier is damaged. Zinc oxide is a fine white dust that (in contrast to iron oxide) does not cause a breakdown of the substrate's surface integrity as it is formed. Indeed, the zinc oxide, if undisturbed, can act as a barrier to further oxidation, in a way similar to the protection afforded to aluminum and stainless steels by their oxide layers. The majority of hardware parts are zinc-plated, rather than cadmium-plated. Zinc-nickel plating Zinc-nickel plating is one of the best corrosion resistant finishes available offering over 5 times the protection of conventional zinc plating and up to 1,500 hours of neutral salt spray test performance. This plating is a combination of a high-nickel zinc-nickel alloy (10–15% nickel) and some variation of chromate. The most common mixed chromates include hexavalent iridescent, trivalent or black trivalent chromate. Used to protect steel, cast iron, brass, copper, and other materials, this acidic plating is an environmentally safe option. Hexavalent chromate has been classified as a human carcinogen by the EPA and OSHA. Tin plating The tin-plating process is used extensively to protect both ferrous and nonferrous surfaces. Tin is a useful metal for the food processing industry since it is non-toxic, ductile and corrosion resistant. The excellent ductility of tin allows a tin coated base metal sheet to be formed into a variety of shapes without damage to the surface tin layer. It provides sacrificial protection for copper, nickel and other non-ferrous metals, but not for steel. Tin is also widely used in the electronics industry because of its ability to protect the base metal from oxidation thus preserving its solderability. In electronic applications, 3% to 7% lead may be added to improve solderability and to prevent the growth of metallic "whiskers" in compression stressed deposits, which would otherwise cause electrical shorting. However, RoHS (Restriction of Hazardous Substances) regulations enacted beginning in 2006 require that no lead be added intentionally and that the maximum percentage not exceed 1%. Some exemptions have been issued to RoHS requirements in critical electronics applications due to failures which are known to have occurred as a result of tin whisker formation. Alloy plating In some cases, it is desirable to co-deposit