fixture combined with analysis software allows the production engineer to establish and then control the wave solder process. Solder wave height The height of the solder wave is a key parameter that needs to be evaluated when setting up the wave solder process. The contact time between the solder wave and assembly being soldered is typically set to between 2 and 4 seconds. This contact time is controlled by two parameters on the machine, conveyor speed and wave height, changes to either of these parameters will result in a change in contact time. The wave height is typically controlled by increasing or decreasing the pump speed on the machine. Changes can be evaluated and checked using a tempered glass plate, if more detailed recording are required fixture are available which digitally record the contact times, height and speed. Also, some wave solder machines can give the operator a choice between a smooth laminar wave or a slightly higher-pressure 'dancer' wave. See also Dip soldering Thermal profiling Solder mask References Further reading Seeling, Karl (1995). A study of lead-free alloys. AIM, 1, Retrieved April 18, 2008, from Biocca, Peter (2005, April 5). Lead-free wave soldering. Retrieved April 18, 2008, from EMSnow Web site: Electronic Production Design & Test (2015, February 13) The importance of wave height measurement in wave solder process control Soldering Articles containing video clips Printed circuit board manufacturing