to the receiver on the IC via RF communication. This method has several advantages: no damage is done to circuits, pads, nor probe cards no debris is created probe pads are no longer required, on the periphery of the IC wireless probe points can be placed anywhere on the IC, not just on the periphery repeated probing is possible without damaging the probe points faster data rates are possible than with mechanical probes the wafer prober does not have to exert any force on the probe location (in traditional probing this can be a significant amount of force, when hundreds or thousands of probes are used) References Semiconductor device fabrication Cleanroom technology