that the importance of the Soviet designation has spread across the globe. When foundries are not able to label the circuit in the Cyrillic alphabet then the Latin alphabet is used (e.g. KF1174PP1). In general, devices already in production when a new standard came out kept their old designation. However, in some case devices were renamed: When the 1980 standard was published, devices named after the 1968 standard and still in production were renamed, e.g. К1ЛБ553 to К155ЛА3. As in this example, the renaming was often fairly straightforward: The two parts of the serial number were combined (1 and 55 to 155), the functional group remained unchanged or was converted as in the table below (ЛБ to ЛА), and the variant number remained unchanged (3). In some series the renaming was more complicated. This change affected many series (e.g. 101, 116, 118, 122, 133, 140, 153, 155, 174, 237, 501). Before the introduction of a package designation in 1980 the suffix П (P) was used in some series to indicate a plastic package (as opposed to the then more-common ceramic package). In 1983 the package designation was changed for the 531 series (e.g. К531ЛА19П to КР531ЛА19). Other series were similarly renamed at some point (e.g. К501ХЛ1П to КР501ХЛ1). Before the definition of group В (V) in 1980 computing devices were all assigned subgroup ИК (IK), e.g. microprocessors (КР580ИК80А), peripheral devices (КР580ИК51А). With the introduction of group В the devices in the 580 series were renamed (to КР580ВМ80А and КР580ВВ51А, respectively) in 1986. Since the publication of the 2000 standard, some devices have been labeled with the package designation according to the new standard, e.g. КР1407УД2 to К1407УД2Р and КФ1407УД2 to К1407УД2Т. Starting in 2016, certain newer devices were renamed according to the 2010 standard, e.g. 1967ВЦ2Ф to 1967ВН028 and 1586ПВ1АУ to 1583НВ025 (note the change of the series). Structure of the designation Structure (1968) Structure (1973 / 1980) Structure (2000) Structure (2010) Elements: – Prefix (zero to three letters) – Export designation: The letter Э (E) here indicates an integrated circuit intended for export with a pin spacing of 2.54mm (1/10") or 1.27mm (1/20"). If this element is empty then the device has the Soviet (metric) spacing of 2.5mm or 1.25mm between pins. – Application area: The letter К (K) here indicates an integrated circuit for commercial and consumer applications (with requirements according to GOST 18725—83). If this element is