of the premier world-class programs in this subject matter, offers over 12 graduate courses and has over 300 alumni at leading electronics manufacturers all over the world, shaping the future of the industry. For this accomplishment, he shared with Dr. Abhijit Dasgupta of CALCE the US Army Research Laboratories Associated Achievement Award for Technology Transfer. To support hands-on laboratory studies, he also supplied inspection equipment for electronic manufacturing to the U.S. Navy Electronics Manufacturing Productivity Facility at the Naval Weapons Support Center, Crane, Indiana. He noted the cost driver that was nationally pervasive on production lines was the inspection of assemblies after soldering and the subsequent reworking of joints with irregular shapes simply because there were no tools available to assess the risk to reliability after delivery. He decided variations in wetting and spreading were root causes of irregular shapes and invested in radically new research at the Rockwell International Science Center, the Microelectronics Center of North Carolina, and the National Institutes of Science and Technology. The result was an accelerated commercialization of five inventions: Sequential Electrochemical Reduction Analysis (SERA) by Dr. Morgan Tench enabled manufacturers to improve yield by precisely measuring the solderability of parts before beginning assembly. Reduced Oxide Soldering Activation (ROSA) by Dr. Morgan Tench enabled manufacturers to reduce scrap and materials by restoring solderability to the entire lot of components before assembly without using flux; Plasma Assisted Dry Soldering (PADS) by Dr. Stephan Bobbio reduced the cost of materials and handling by enabling components to be soldered without flux. A national Laminography Standard by Dr. Thomas Siewert enabled X-Ray laminography inspection machines to be more accurately calibrated. And, Composite Solders by George Lucey and Dr. Roger Clough offered manufacturers the opportunity to reduce inspection and rework by increasing the strength of the joint. These cooperative efforts of nationally renowned scientists and engineers from government-industry-academia met the Army mission objective of developing new manufacturing technologies capable of reducing the procurement cost of electronic weapons systems currently in production. The program ended, however, when a joint Army – Industry study in 1990 concluded the overall Army ManTech program investments focusing primarily on soldering were too low to incentivize contractors into quick implementation on a large national scale. The study recommendation, instead, was to redirect funding into research for new manufacturing concepts for weapons of the future. The Army Materiel Command presented George Lucey the second highest award offered