printed sequentially separated by printed insulating layers. While lower in conductivity and thus limited to certain applications, PTF circuits have found a home in low-power applications at slightly higher voltages. Keyboards are a common application. Flexible circuit materials Each element of the flex circuit construction must be able to consistently meet the demands placed upon it for the life of the product. In addition, the material must work reliably in concert with the other elements of the flexible circuit construction to assure ease of manufacture and reliability. Following are brief descriptions of the basic elements of flex circuit construction and their functions. Base material The base material is the flexible polymer film which provides the foundation for the laminate. Under normal circumstances, the flex circuit base material provides most primary physical and electrical properties of the flexible circuit. In the case of adhesiveless circuit constructions, the base material provides all of the characteristic properties. While a wide range of thickness is possible, most flexible films are provided in a narrow range of relatively thin dimension from 12 µm to 125 µm (1/2 mil to 5 mils) but thinner and thicker material are possible. Thinner materials are of course more flexible and for most material, stiffness increase is proportional to the cube of thickness. Thus for example, means that if the thickness is doubled, the material becomes eight times stiffer and will only deflect 1/8 as much under the same load. There are a number of different materials used as base films including: polyester (PET), polyimide (PI), polyethylene naphthalate (PEN), polyetherimide (PEI), along with various fluropolymers (FEP) and copolymers. Polyimide films are most prevalent owing to their blend of advantageous electrical, mechanical, chemical and thermal properties. Bonding adhesive Adhesives are used as the bonding medium for creating a laminate. When it comes to temperature resistance, the adhesive is typically the performance limiting element of a laminate especially when polyimide is the base material. Because of the earlier difficulties associated with polyimide adhesives, many polyimide flex circuits presently employ adhesive systems of different polymer families. However some newer thermoplastic polyimide adhesives are making important in-roads. As with the base films, adhesives come in different thickness. Thickness selection is typically a function of the application. For example, different adhesive thickness is commonly used in the creation of cover layers in order to meet the fill demands of different copper foil thickness which may