what is used for application specific integrated circuits (ASICs) or integrated circuits. Some IPD suppliers offer full design kit support so that System in Package (SiP) module manufacturers or system houses are able to design their own IPDs fulfilling their specific application requirements. History and IPDs role in electronic system assembly In early control system design it was discovered that having same value of components makes design easier and faster. One way to implement passive components with same value or in practice with smallest possible distribution is to place them on the same substrate near to each other. Earliest form of integrated passive devices were resistor networks in the 1960s when four to eight resistors were packaged in form of Single-in-line package (SIP) by Vishay Intertechnology. Many other type of packages like DILs, DIPs etc. used in packaging integrated circuits even customised packages are used for integrated passive devices. Resistor, capacitor, and resistor capacitor networks are still widely used in systems even though monolithic integration has progressed. Today portable electronic systems include roughly 2–40 discrete passive devices/integrated circuit or module. This shows that monolithic or module integration is not capable to include all functionality based on passive components in system realisations, and variety of technologies is needed to minimize logistics and system size. This is the application area for IPDs. Most — by number — of the passives in electronic systems are typically capacitors followed by number of resistors and inductors/coils. Many functional blocks such as impedance matching circuits, harmonic filters, couplers and baluns and power combiner/divider can be realized by IPDs technology. IPDs are generally fabricated using thin, thick film and wafer fabrication technologies such as photolithography processing or typical ceramic technologies (LTCC and HTCC). IPDs can be designed as flip chip mountable or wire bondable components. Trends towards applications with small size, portability and wireless connectivity have stretched various implementation technologies to be able to realize passive components. In 2021, there were 25 - 30 companies delivering integrated passive (including simple passive networks and passives on various substrates like glass, silicon and alumina) devices worldwide. See also Electronic component#Passive components, for discrete devices Surface-mount technology Integrated circuit References External links Integrated Passives in short 2017 Integrated passive technologies Integrated passives in SIPs Database of passive manufacturers world-wide. Search 'network' for passive networks Integration of Passive Components in Thin-Film Multilayer at FhG Integration of Passives with layered ceramics Integrated