electronic system resulting minimized logistics needed. needs to miniaturize (area and height) electronics like for medical (hearing aid equipment), wearable (watches, intelligent rings, wearable heart rate monitors) and portable use (mobile phones, tablets etc.). Striplines, baluns etc can be miniaturized with IPDs with smaller tolerances in radio frequency (RF) parts of the system specifically if thin film technology is used. IPD chips can be stacked with active or other integrated passive chips if ultimate miniaturisation is the target. needs to reduce weight of electronic assemblies for example in space, aerospace or in unmanned aerial vehicles (UAVs like drones) applications electronic designs, which require numerous passives with the same value like several one nanofarad (1 nF) capacitors. This may happen in implementations where integrated circuits (ICs) with a high input/output count are needed/used. Many high speed signals or power supply lines may need stabilization by capacitors. Emergence of digital implementations leads to use digital parallel lines (4-, 8-, 16-, 32-, 64-bit etc.) and stabilization of all signal lines resulting capacitor islands in the implementation. Miniaturization of those may result to use integrated capacitor networks or arrays of capacitors. They may also be implemented as part (embedded) of an integrated circuit package like BGA or CSP (chip scale package) substrate or interposer of packages. electronic designs which require numerous electromagnetic interference (EMI) or electrostatic discharge (ESD) suppression functionality like designs with high input/output pin count connectors in interfaces. EMI or ESD suppression typically is realized with RC or R(C)-diode networks. limitations of performance (like Q factors of the coils) and values (like large capacitance values) of passive elements available in integrated circuit technologies like CMOS as monolithically integrated with active elements (transistors etc.). If size (area or thickness) and/or weight of electronics assembly need to be minimized and standard parts are not available, custom IPDs might be the only option towards smallest number of parts, small size or weight of electronics. improved reliability if interfaces between different technologies (monolithic, packaging, electronics and optics/photonics, assemblies like surface mount technology and integrated circuits etc.) needs to be minimised. timing in some applications, if for example there are critical needs for fast and very precise filtering (R(L)C etc.) — and SMD discrete part based solution is not fast enough or not predictable enough. The challenge of custom IPDs compared to standard integrated or discrete passives however is the availability time for the assembly and sometimes