containing gold salts. This process is known in the industry as electroless nickel immersion gold (ENIG). A variant of this process adds a thin layer of electroless palladium over the nickel, a process known by the acronym ENEPIG. Standards AMS-2404 AMS-C-26074 ASTM B-733 ASTM-B-656 (inactive) Mil-C-26074E MIL-DTL-32119 IPC-4552 (for ENIG) IPC-7095 (for ENIG) See also Nickel electroplating Nucleation Organic Solderability Preservative (OSP) Electroless nickel-boron plating Electroless copper plating References Printed circuit board manufacturing Metal plating