fabricated in a single step by combining CMOS image sensors, chip scale packaging processes, (CSP) and wafer-level optics (WLO). These fully integrated chip products have camera functionality and are intended to produce thin, compact devices. RGB-Ir technology RGB-iR technology uses a color filter process to improve color fidelity. By committing 25% of its pixel array pattern to infrared (IR) and 75% to RGB, it can simultaneously capture both RGB and IR images. This makes it possible to capture both day and night images with the same sensor. It is used for battery powered home security cameras as well as biometric authentication, such as gesture and facial recognition. PureCel technologies OmniVision developed its PureCel and PureCel Plus image sensor technology to provide added camera functionality to smartphones and action cameras. The technical goal was to provide smaller camera modules that enable larger optical formats and offer improved image quality, especially in low-light conditions. Both of these technologies are offered in a stacked die format (PureCel-S and PureCelPlus-S). This stacked die methodology separates the imaging array from the image sensor processing pipeline into a stacked die structure, allowing for additional functionality to be implemented on the sensor while providing for much smaller die sizes compared to non-stacked sensors. PureCelPlus-S uses partial deep trench isolation (B-DTI) structures comprising an interfacial oxide, first deposited HfO, TaO, oxide, Ti-based liner, and a tungsten core. This is OmniVision's first DTI structure, and the first metal filled B-DTI trench since 2013. PureCel Plus uses buried color filter array (BCFA) to collect light with various incident light angles for tolerance improvements. Deep trench isolation reduces crosstalk by creating isolation walls between pixels inside silicon. In PureCel Plus Gen 2, OmniVision set out to improve deep trench isolation for better pixel isolation and low-light performance. Its target application is smartphone video cameras. Nyxel Developed to address the low-light and night-vision performance requirements of advanced machine vision, surveillance, and automotive camera applications, OmniVision's Nyxel NIR imaging technology combines thick-silicon pixel architectures and careful management of the wafer surface texture to improve quantum efficiency (QE). In addition, extended deep trench isolation helps retain modulation transfer function without affecting the sensor's dark current, further improving night vision capabilities. Performance improvements include image quality, extended image-detection range and a reduced light-source requirement, leading to overall lower system power consumption. Nyxel 2 This second generation near-infrared technology improves upon the first generation by increasing