capturing the front-end/PA sockets on these industry-leading reference designs has been noted. Shift to CMOS-based RFICs As CMOS silicon-based RFICs for wireless applications such as mobile phones have gradually become more competitive (but still inferior) in terms of performance when compared to GaAs (while providing advantages relating to cost and chip integration), they have replaced GaAs products for part of the low-end (2G) power amplifier market as of early 2014. Silicon on insulator technology has already largely replaced GaAs for antenna switch applications, and RFMD has been part of this transition. At various times in the past companies have had strong expectations for CMOS-based RFICs such as power amplifiers which failed to materialize. However, Qualcomm, the dominant provider of the silicon chip content in mobile phones, has made significant investments in this area and reported volume shipments of a 3G/4G front-end solution using CMOS-based power amplifier technology in February 2014. Proliferation of CMOS-based solutions increases competition from CMOS RF companies such as Peregrine Semiconductor as well as mobile phone SoC and chipset providers such as Qualcomm and others, and has the potential to significantly reduce the addressable market for GaAs-based devices. However, companies traditionally focused on GaAs, including RFMD, already use silicon-on-insulator (SOI) technology for switches, and have also invested in CMOS technology for power amplifiers. RFMD announced material volume shipment of CMOS PAs in September 2013. References External link Electronics companies established in 1991 Defunct semiconductor companies of the United States Fabless semiconductor companies Companies based in Greensboro, North Carolina Companies formerly listed on the Nasdaq 1991 establishments in North Carolina 2015 mergers and acquisitions 2014 disestablishments in North Carolina Electronics companies disestablished in 2014