Ni2+ ion reduction [10][11]. The anodic reaction [10] has a reduction potential of 0.50 V. The cathodic reactions [11], [12], and [13] have reduction potentials of -0.25, 0.00 V, and 0.50 V respectively. The potential of the reaction is 1.25 V (spontaneous reaction). The electrochemical mechanism is the only classical mechanism that uses reduction potentials the other 3 classical mechanisms were tested in other ways including calorimetric studies. Metal hydroxide mechanism Proposed in 1968, solvated Ni ions at the catalytic surface ionized water and forms a hydroxide coordinated Ni ion. The hydrolyzed Ni2+ ion catalyzes the production of Ni, P, and H2. Water is ionized at the Ni surface [14], and Ni2+ ions coordinate with hydroxide ions [15]. The coordinated Ni2+ is reduced [16] and NiOH+ab is adsorbed on the substrate surface. At the surface H2PO2- reduces NiOH+ab to elemental Ni0 [17]. The released elemental H recombine to form hydrogen gas and [18] and elemental Ni catalyses the production of the P [19]. The deposited Ni acts as a catatalyst due continued reduction by H2PO2- [17]. Cavallotti and Salvago also proposed that the NiOH+ab [20] and water combination oxidises to Ni2+ and elemental H. The NiOH+ab participates in a competing reaction [21a] (refers to reaction [17] )and [21b] to for elemental Ni and hydrolized Ni respectively. Finally H2PO2- is oxidized [22] and elemental H [21a/21b] recombine to form and H2 evolves for both reactions. The overall reactions is shown in equation [23]. Industrial applications Electroless deposition changes the mechanical, magnetic, internal stress, conductivity, and brightening of the substrate. The first industrial application of electroless deposition by the Leonhardt Plating Company electroless deposition has flourished into metallization of plastics., textiles, prevention of corrosion, and jewelry. The microelectronics industry including the manufacturing of circuit boards, semi-conductive devices, batteries, and sensors. Metallization of plastics by electroless deposition Typical metallization of plastics includes nickel-phosphorus, nickel gold, nickel-boron, palladium, copper, and silver. Metallized plastics are used to reduce the weight of metal product and reduce the cost associated with the use of precious metals. Electroless nickel plating is used in variety of industries including aviation, construction, textiles, and oil and gas industries. Electromagnetic interference shielding Electromagnetic interference shielding (EMI shielding) refers to the process by which devices are protected from interference from the electromagnetic radiation. The interference negatively affects the function of the devices; EMI sources include radiowaves, cell phones, and TV receiver. The Federal