Electroless deposition (ED) or electroless plating is defined as the autocatalytic process through which metals and metal alloys are deposited onto nonconductive surfaces. These nonconductive surfaces include plastics, ceramics, and glass etc., which can then become decorative, anti-corrosive, and conductive depending on their final functions. Electroless deposition is a chemical processes that create metal coatings on various materials by autocatalytic chemical reduction of metal cations in a liquid bath. Electroless plating in contrast with electroplating processes, where the reduction is achieved by an externally generated electric current. Electroless deposition deposits metals onto 2D and 3D structures such as screws, nanofibers, and carbon nanotubes ; unlike PVD, CVD, and electroplating which are limited to 2D surfaces. Commonly the surface of the substrate is characterized via pXRD, SEM-EDS, and XPS. Key qualifying parameters of these methods are crucial for a researcher’ or company's purpose for the conductive surfaces. Electroless deposition continues to rise in importance within the microelectronic industry, oil and gas, and aerospace industry. History Electroless deposition was serendipitously discovered by Charles Wurtz in 1846. The nickel-phosphorus bath being used for his experiment spontaneously decomposed and formed nanoparticles. Although Wurtz observed these nanoparticles he did not continue working on this discovery. 70 years François Auguste Roux rediscovered the electroless deposition process and patented it in United States as the ‘Process of producing metallic deposits. Roux deposited nickel on a substrate, but his invention did not seem to receive much commercial use. In 1946 the process was re-discovered by Abner Brenner and Grace E. Riddell while working at the National Bureau of Standards. They presented their discovery at the 1946 Convention of the American Electroplaters' Society (AES); a year later, at the same conference they proposed the term "electroless" for the process and described optimized bath formulations, that resulted in a patent. However, Abner nor Riddell benefited financial from the filed patent. The first commercial deposition was Leonhardt Plating Company in Cincinnati followed by the Kannigen Co. Ltd in Japan which revolutionized the industry. The Leonhardt commercialization of electroless deposition was a catalyst for the design and patenting of several deposition baths including plating of metals such as Pt, Sn, Ag, and their alloys. The first mechanism for electroless deposition, atomic hydrogen mechanism, was proposed until Brenner and Riddell for a nickel deposition bath. This lead the way for other scientist to propose several other mechanisms. The four examples of classical electroless