are shown in Table 1., in which Zn with a lower standard potential (-0.7618 V) act as a reducing agent to copper (0.3419 V). The calculated potentials for the reaction of the copper salt and zinc metal is ~0.4169 V meaning the reaction is spontaneous. Since electroless deposition also uses the principles of standard electrode potentials we are also able to calculate potential, E, of metal ions in a solution governed by the Nernst equation (3). E is the potential of the reaction, E0 is the standard reduction potential of the redox reactio, and Q is the concentration of the poducts divided by the concentration of the reactants .Metallizing Standard potentials governs the ability for elemental metal deposition on a substrate, however ED is a not as simplistic as described in a metal exchange process. Electrons for ED are produced by powerful reducing agents in the deposition bath for example formaldehyde, sodium borohydride, glucose, sodium hypophosphite, hydrogen peroxide, and ascorbic acid. These reducing agents have negative standard potentials that drive the deposition process The standard potential of the reducing agent and metal salt is not the only determinant of the redox reaction for electroless deposition. Conventional deposition of the copper nanoparticles uses formaldehyde as a reducing agent. But the E0 of formaldehyde is pH dependent. At pH 0 of the deposition bath is E0 of formaldehyde is 0.056 V, but at pH=14 the E0=-1.070. The formaldehyde (pH 14) is a more suitable reducing agent than at pH=0 because of the lower negative standard potential which makes it a powerful reducing agent. Formaldehyde (pH 14) allows the solution to be buffered without rapid degradation of the bath. Four classic deposition mechanisms Although industrial companies patented and commercialized ED baths the mechanism remained elusive. The electroless plating bath are influenced by several factors including pH, binding ligand, and the potential etc. of the solution. The deposition is buffered to ensure there isn't a rapid drop or increase in the pH during the deposition process. Binding ligands/complexing agents are used to increase the solubility of the metal salts while maintaining bath stability for slower release of the metal cations. The potential of the bath is determined by the standard potentials of a powerful reducing agent and the metal cations. All these factors along with others determine the overall deposition kinetics. Mechanisms for Ni-P, Cu, Pt, and Pd etc. have been proposed for decades