traces to control crosstalk Controlling the trace width spacing to the reference plane to create consistent trace impedance Using terminations to control ringing Route traces perpendicular on adjacent layers to reduce crosstalk Increasing spacing between traces to reduce crosstalk Providing sufficient ground (and power) connections to limit ground bounce (this sub-discipline of signal integrity is sometimes called out separately as power integrity) Distributing power with solid plane layers to limit power supply noise Adding a pre-emphasis filter to the transmitter driving cell Adding an equalizer to the receiving cell Improved clock and data recovery (CDR) circuitry with low jitter/phase noise Each of these fixes may possibly cause other problems. This type of issue must be addressed as part of design flows and design closure. See also Power integrity Electromagnetic interference Electromagnetic compatibility Notes References Advanced-level reference text for experienced digital designers who want to press their designs to the upper limits of speed and distance. From the backcover: Draws from author's industrial experience and his work teaching more than five thousand engineers. Textbook on the problems of building digital systems, including signal integrity. This book approaches electrical engineering and signal integrity principles from a basic level, assuming little prior understanding. Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise. The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications. Signal Integrity for PCB Designers Altera Signal Integrity Center Basic Principles of Signal Integrity Agilent EEsof EDA - Signal Integrity Analysis Resources "Design tip: Model instruments to improve signal integrity simulation", EETimes, John Olah, 2007-October-25 Topics in signal integrity were discussed at DesignCon 2008 February 4, 2008 to February 7, 2008 "Understanding Signal Integrity - Signal integrity is becoming a more significant problem as clock frequencies increase" by Eric Bogatin, GigaTest Labs, Agilent Application Note 5988-5978EN, April 2002, 8 pages, PDF, 0.9MB "Signal Integrity Analysis Series Part 1: Single-Port TDR, TDR/TDT, and 2-Port TDR" (Agilent Application Note 5989-5763EN, February 2007, 72 pages, PDF, 5.2MB) "Signal Integrity Analysis Series Part 2: 4-Port TDR/VNA/PLTS" (Agilent Application Note 5989-5764EN, February 2007, 56 pages, PDF, 3.6MB) "Signal Integrity Analysis Series Part