drives, recordable optical disks, telephone handsets, speed dialers, video / audio and consumer electronics / appliances are suggested uses for TSSOP packaging. Exposed pad The exposed pad (EP) variant of small outline packages can increase heat dissipation by as much as over a standard TSSOP, thereby expanding the margin of operating parameters. Additionally, the exposed pad can be connected to ground, thereby reducing loop inductance for high-frequency applications. The exposed pad should be soldered directly to the PCB to realize the thermal and electrical benefits. References External links Amkor Technology SOIC Package Amkor Technology ExposedPad SOIC/SSOP Package Amkor Technology SSOP package. Image of a 74HC4067 multiplexer chip in a SSOP package. A US quarter is shown for a size reference. Chip carriers