SOx_N or SOICx_N, where x is the number of pins), there's also the wide (or sometimes called extended) version. This package is commonly represented as SOx_W or SOICx_W. The difference is mainly related to the parameters WB and WL. As an example, the values WB and WL are given for an 8-pins wide (extended) SOIC package. mini-SOIC Another SOIC variant, available only for 8-pin and 10-pin ICs, is the mini-SOIC, also called micro-SOIC. This case is much smaller, with a pitch of only 0.5 mm. See the table for the 10-pin model. An excellent overview of different semiconductor packages is provided by National Semiconductor. Small-outline J-leaded package (SOJ) Small-outline J-leaded package (SOJ) is a version of SOIC with J-type leads instead of gull-wing leads. Smaller form factors After SOIC came a family of smaller form factors with pin spacings less than 1.27 mm: Thin small outline package (TSOP) Thin-shrink small outline package (TSSOP) Shrink small-outline package (SSOP) Shrink small-outline package (SSOP) chips have "gull wing" leads protruding from the two long sides, and a lead spacing of 0.0256inches (0.65mm) or 0.025inches (0.635mm). 0.5mm lead spacing is less common, but not rare. The body size of a SOP was compressed and the lead pitch tightened to obtain a smaller version SOP. This yields an IC package with a significant reduction in the size compared to standard package. All IC assembly processes remain the same as with standard SOPs. Applications for a SSOP enable end-products (pagers, portable audio/video, disc drives, radio, RF devices/components, telecom) to be reduced in size and mass. Semiconductor families such as operational amplifiers, drivers, optoelectronics, controllers, logic, analog, memory, comparators and more using BiCMOS, CMOS or other silicon / GaAs technologies are well addressed by the SSOP product family. Thin small-outline package (TSOP) A thin small-outline package (TSOP) is a rectangular, thin-bodied component. A Type I TSOP has legs protruding from the width portion of the package. A Type II TSOP has the legs protruding from the length portion of the package. The ICs on DRAM memory modules were usually TSOPs until they were replaced by ball grid array (BGA). Thin-shrink small-outline package (TSSOP) A thin-shrink small-outline package (TSSOP) is a rectangular, thin-body component. A TSSOP's leg count can range from 8 to 64. TSSOPs are particularly suited for gate drivers, controllers, wireless / RF, op-amps, logic, analog, ASICs, memory (EPROM, E2PROM), comparators and optoelectronics. Memory modules, disk