must take extra care to schedule communication patterns where the EIB is able to function at high concurrency levels. David Krolak explained: Bandwidth assessment At 3.2 GHz, each channel flows at a rate of 25.6 GB/s. Viewing the EIB in isolation from the system elements it connects, achieving twelve concurrent transactions at this flow rate works out to an abstract EIB bandwidth of 307.2 GB/s. Based on this view many IBM publications depict available EIB bandwidth as "greater than 300 GB/s". This number reflects the peak instantaneous EIB bandwidth scaled by processor frequency. However, other technical restrictions are involved in the arbitration mechanism for packets accepted onto the bus. The IBM Systems Performance group explained: This quote apparently represents the full extent of IBM's public disclosure of this mechanism and its impact. The EIB arbitration unit, the snooping mechanism, and interrupt generation on segment or page translation faults are not well described in the documentation set as yet made public by IBM. In practice, effective EIB bandwidth can also be limited by the ring participants involved. While each of the nine processing cores can sustain 25.6 GB/s read and write concurrently, the memory interface controller (MIC) is tied to a pair of XDR memory channels permitting a maximum flow of 25.6 GB/s for reads and writes combined and the two IO controllers are documented as supporting a peak combined input speed of 25.6 GB/s and a peak combined output speed of 35 GB/s. To add further to the confusion, some older publications cite EIB bandwidth assuming a 4 GHz system clock. This reference frame results in an instantaneous EIB bandwidth figure of 384 GB/s and an arbitration-limited bandwidth figure of 256 GB/s. All things considered the theoretic 204.8 GB/s number most often cited is the best one to bear in mind. The IBM Systems Performance group has demonstrated SPU-centric data flows achieving 197 GB/s on a Cell processor running at 3.2 GHz so this number is a fair reflection on practice as well. Memory and I/O controllers Cell contains a dual channel Rambus XIO macro which interfaces to Rambus XDR memory. The memory interface controller (MIC) is separate from the XIO macro and is designed by IBM. The XIO-XDR link runs at 3.2 Gbit/s per pin. Two 32-bit channels can provide a theoretical maximum of 25.6 GB/s. The I/O interface, also a Rambus design, is known as FlexIO. The FlexIO