different components, such as transistors, capacitors, or resistors, located on the same piece of silicon. The planar process provided a powerful way of implementing an integrated circuit that was superior to earlier conceptions of the integrated circuit. Noyce's invention was the first monolithic IC chip. Early versions of the planar process used a photolithography process using near-ultraviolet light from a mercury vapor lamp. As of 2011, small features are typically made with 193 nm "deep" UV lithography. As of 2022, the ASML NXE platform uses 13.5 nm EUV light, generated by a tin-based plasma source. See also Semiconductor device fabrication References External links A compendium of articles and other information on the development of integrated circuits, including the development of oxide masking, photolithography, the advent of silicon, the integrated circuit and the planar process. The Planar Process An overview of the steps in fabrication of an integrated circuit from the Nobel Prize website. This is a section of the work Techville: The integrated circuit. Semiconductor device fabrication Swiss inventions