change of the alloy's melting point and the corresponding change of fluidity. For example, some alloys dissolve both silver and copper; dissolved silver lowers their melting point and increases fluidity, copper has the opposite effect. The melting point change can be exploited. As the remelt temperature can be increased by enriching the alloy with dissolved base metal, step brazing using the same braze can be possible. Alloys that do not significantly attack the base metals are more suitable for brazing thin sections. Nonhomogenous microstructure of the braze may cause non-uniform melting and localized erosions of the base metal. Wetting of base metals can be improved by adding a suitable metal to the alloy. Tin facilitates wetting of iron, nickel, and many other alloys. Copper wets ferrous metals that silver does not attack, copper-silver alloys can therefore braze steels silver alone won't wet. Zinc improves wetting of ferrous metals, indium as well. Aluminium improves wetting of aluminium alloys. For wetting of ceramics, reactive metals capable of forming chemical compounds with the ceramic (e.g. titanium, vanadium, zirconium...) can be added to the braze. Dissolution of base metals can cause detrimental changes in the brazing alloy. For example, aluminium dissolved from aluminium bronzes can embrittle the braze; addition of nickel to the braze can offset this. The effect works both ways; there can be detrimental interactions between the braze alloy and the base metal. Presence of phosphorus in the braze alloy leads to formation of brittle phosphides of iron and nickel, phosphorus-containing alloys are therefore unsuitable for brazing nickel and ferrous alloys. Boron tends to diffuse into the base metals, especially along the grain boundaries, and may form brittle borides. Carbon can negatively influence some steels. Care must be taken to avoid galvanic corrosion between the braze and the base metal, and especially between dissimilar base metals being brazed together. Formation of brittle intermetallic compounds on the alloy interface can cause joint failure. This is discussed more in-depth with solders. The potentially detrimental phases may be distributed evenly through the volume of the alloy, or be concentrated on the braze-base interface. A thick layer of interfacial intermetallics is usually considered detrimental due to its commonly low fracture toughness and other sub-par mechanical properties. In some situations, e.g. die attaching, it however does not matter much as silicon chips are not typically subjected to mechanical abuse. On wetting, brazes may liberate elements from the