base metal. For example, aluminium-silicon braze wets silicon nitride, dissociates the surface so it can react with silicon, and liberates nitrogen, which may create voids along the joint interface and lower its strength. Titanium-containing nickel-gold braze wets silicon nitride and reacts with its surface, forming titanium nitride and liberating silicon; silicon then forms brittle nickel silicides and eutectic gold-silicon phase; the resulting joint is weak and melts at much lower temperature than may be expected. Metals may diffuse from one base alloy to the other one, causing embrittlement or corrosion. An example is diffusion of aluminium from aluminium bronze to a ferrous alloy when joining these. A diffusion barrier, e.g. a copper layer (e.g. in a trimet strip), can be used. A sacrificial layer of a noble metal can be used on the base metal as an oxygen barrier, preventing formation of oxides and facilitating fluxless brazing. During brazing, the noble metal layer dissolves in the filler metal. Copper or nickel plating of stainless steels performs the same function. In brazing copper, a reducing atmosphere (or even a reducing flame) may react with the oxygen residues in the metal, which are present as cuprous oxide inclusions, and cause hydrogen embrittlement. The hydrogen present in the flame or atmosphere at high temperature reacts with the oxide, yielding metallic copper and water vapour, steam. The steam bubbles exert high pressure in the metal structure, leading to cracks and joint porosity. Oxygen-free copper is not sensitive to this effect, however the most readily available grades, e.g. electrolytic copper or high-conductivity copper, are. The embrittled joint may then fail catastrophically without any previous sign of deformation or deterioration. Preform A brazing preform is a high quality, precision metal stamping used for a variety of joining applications in manufacturing electronic devices and systems. Typical brazing preform uses include attaching electronic circuitry, packaging electronic devices, providing good thermal and electrical conductivity, and providing an interface for electronic connections. Square, rectangular and disc shaped brazing preforms are commonly used to attach electronic components containing silicon dies to a substrate such as a printed circuit board. Rectangular frame shaped preforms are often required for the construction of electronic packages while washer shaped brazing preforms are typically utilized to attach lead wires and hermetic feed-throughs to electronic circuits and packages. Some preforms are also used in diodes, rectifiers, optoelectronic devices and components packaging. •Difference between soldering and brazing Soldering