the need to remove and replace the component. This may or not resolve the problem; and there is a chance that the reflowed board will fail again after some time. For typical devices (PlayStation 3 and Xbox 360) one repair company estimates that the process, if there are no unexpected problems, takes about 80 minutes. On a forum where professional repair people discuss reflowing of laptop computer graphics chips, different contributors cite success rates (no failure within 6 months) of between 60 and 90% for reflowing with professional equipment and techniques, in equipment whose value does not justify complete reballing. Reflowing can be done non-professionally in a domestic oven or with a heat gun. While such methods can cure some problems, the outcome is likely to be less successful than is possible with accurate thermal profiling achieved by an experienced technician using professional equipment. Reballing involves dismantling, heating the chip until it can be removed from the board, typically with a hot-air gun and vacuum pickup tool, removing the device, removing solder remaining on the device and board, putting new solder balls in place, replacing the original device if there was a poor connection, or using a new one, and heating the device or board to solder it in place. The new balls can be placed via several methods, including: Using a stencil for both the balls and the solder paste or flux, Using a BGA "preform" with embedded balls corresponding to the device pattern, or Using semiautomated or fully automated machinery. For the PS3 and Xbox mentioned above, the time is about 120 minutes if all goes well. Chips are at risk of being damaged by the repeated heating and cooling of reballing, and manufacturers' warranties sometimes do not cover this case. Removing solder with solder wick subjects devices to thermal stress fewer times than using a flowing solder bath. In a test twenty devices were reballed, some several times. Two failed to function, but were restored to full functionality after reballing again. One was subjected to 17 thermal cycles without failing. Results Properly carried out rework restores the functionality of the reworked assembly, and its subsequent lifetime should not significantly be affected. Consequently, where the cost of reworking is less than the value of the assembly, it is widely used in all sectors of the electronic industry. Manufacturer and service providers of communications-technologies, entertainment- and consumer-devices, industrial commodities,