parallel with the other lead. Extra insulation with heat-shrink tubing may be used to prevent shorting out on nearby components. Conversely, a radial component can be pressed into service as an axial component by separating its leads as far as possible, and extending them into an overall length-spanning shape. These improvisations are often seen in breadboard or prototype construction, but are deprecated for mass production designs. This is because of difficulties in use with automated component placement machinery, and poorer reliability because of reduced vibration and mechanical shock resistance in the completed assembly. Multiple lead devices For electronic components with two or more leads, for example, diodes, transistors, ICs, or resistor packs, a range of standard-sized semiconductor packages are used, either directly onto the PCB or via a socket. Characteristics While through-hole mounting provides strong mechanical bonds when compared to SMT techniques, the additional drilling required makes the boards more expensive to produce. They also limit the available routing area for signal traces on layers immediately below the top layer on multilayer boards since the holes must pass through all layers to the opposite side. To that end, through-hole mounting techniques are now usually reserved for bulkier or heavier components such as electrolytic capacitors or semiconductors in larger packages such as the TO-220 that require the additional mounting strength, or for components such as plug connectors or electromechanical relays that require great strength in support. Design engineers often prefer the larger through-hole rather than surface mount parts when prototyping, because they can be easily used with breadboard sockets. However, high-speed or high-frequency designs may require SMT technology to minimize stray inductance and capacitance in wire leads, which would impair circuit function. Ultra-compact designs may also dictate SMT construction, even in the prototype phase of design. Through-hole components are ideal for prototyping circuits with breadboards using microprocessors such as Arduino or PICAXE. These components are large enough to be easy to use and solder by hand. See also Point-to-point construction Board-to-board connector Surface-mount technology Through hole Via (electronics) References Further reading External links Chip carriers Printed circuit board manufacturing