and find the value of that parameter for this component Such as pin count for a connector or gate count for a chip From the standard's component model, discover what thermal stress curve applies, and find the value of the temperature in operation for this component The failure rate of connectors may change little with temperature, while that of capacitors may change greatly From the standard's component model, discover what, if any, part stress parameter is needed, what part stress curve applies, and find the value of that part stress parameter for this component in this application A part stress might be the applied power as a fraction of the component's rated power, or the applied voltage as a fraction of the rated voltage From the standard's component model, find the base failure rate for this component, and modify that according to the complexity parameter, the operating temperature and thermal stress curve, the part stress parameter and part stress curve, with arithmetic specified by the standard. This now is the expected failure rate for this component in this application Add up all the results for every component in the system to find the overall failure rate for all components in this system. Other global modification parameters can be employed, which are assumed to have the same effect on every component failure rate. The most usual are the environment, such as ground benign or airborne, commercial, and the purchasing quality assurance process. The standards specify overall multiplier factors for these various choices. References Electrical engineering Engineering concepts