include low-carbon grades (such as 304L and 316L), and grades with additives such as niobium and molybdenum to reduce the formation of chromium carbide (which provides no corrosion resistance). Common designations include 316L (low carbon), and 316LN (low carbon with nitrogen), which can boast a significantly lower magnetic permeability with special welding techniques making them preferable for particle accelerator applications. Chromium carbide precipitation at the grain boundaries can render a stainless steel less resistant to oxidation. Lead: Soldering is performed using lead-free solder. Occasionally pure lead is used as a gasket material between flat surfaces in lieu of a copper/knife edge system. Indium: Indium is sometimes used as a deformable gasket material for vacuum seals, especially in cryogenic apparatus, but its low melting point prevents use in baked systems. In a more esoteric application, the low melting point of Indium is taken advantage of as a renewable seal in high vacuum valves. These valves are used several times, generally with the aid of a torque wrench set to increasing torque with each iteration. When the indium seal is exhausted, it is melted and reforms itself and thus is ready for another round of uses. Zinc, cadmium: High vapor pressures during system bake-out virtually preclude their use. Aluminum: Although aluminum itself has a vapor pressure which makes it unsuitable for use in UHV systems, the same oxides which protect aluminum against corrosion improve its characteristics under UHV. Although initial experiments with aluminum suggested milling under mineral oil to maintain a thin, consistent layer of oxide, it has become increasingly accepted that aluminum is a suitable UHV material without special preparation. Paradoxically, aluminum oxide, especially when embedded as particles in stainless steel as for example from sanding in an attempt to reduce the surface area of the steel, is considered a problematic contaminant. Cleaning is very important for UHV. Common cleaning procedures include degreasing with detergents, organic solvents, or chlorinated hydrocarbons. Electropolishing is often used to reduce the surface area from which adsorbed gases can be emitted. Etching of stainless steel using hydrofluoric and nitric acid forms a chromium rich surface, followed by a nitric acid passivation step, which forms a chromium oxide rich surface. This surface retards the diffusion of hydrogen into the chamber. Technical limitations: Screws: Threads have a high surface area and tend to "trap" gases, and therefore, are avoided. Blind holes are especially avoided, due to the trapped