the previous generation of Xilinx FPGAs. In June 2010, Xilinx introduced the Xilinx 7 series: the Virtex-7, Kintex-7, and Artix-7 families, promising improvements in system power, performance, capacity, and price. These new FPGA families are manufactured using TSMC's 28 nm HKMG process. The 28 nm series 7 devices feature a 50 percent power reduction compared to the company's 40 nm devices and offer capacity of up to 2 million logic cells. Less than one year after announcing the 7 series 28 nm FPGAs, Xilinx shipped the world's first 28 nm FPGA device, the Kintex-7. In March 2011, Xilinx introduced the Zynq-7000 family, which integrates a complete ARM Cortex-A9 MPCore processor-based system on a 28 nm FPGA for system architects and embedded software developers. In May 2017, Xilinx expanded the 7 Series with the production of the Spartan-7 family. In Dec, 2013, Xilinx introduced the UltraScale series: Virtex UltraScale and Kintex UltraScale families. These new FPGA families are manufactured by TSMC in its 20 nm planar process. At the same time it announced an UltraScale SoC architecture, called Zynq UltraScale+ MPSoC, in TSMC 16 nm FinFET process. In March 2021, Xilinx announced a new cost-optimized portfolio with Artix and Zynq UltraScale+ devices, fabricated on TSMC's 16 nm process. Virtex family The Virtex series of FPGAs have integrated features that include FIFO and ECC logic, DSP blocks, PCI-Express controllers, Ethernet MAC blocks, and high-speed transceivers. In addition to FPGA logic, the Virtex series includes embedded fixed function hardware for commonly used functions such as multipliers, memories, serial transceivers and microprocessor cores. These capabilities are used in applications such as wired and wireless infrastructure equipment, advanced medical equipment, test and measurement, and defense systems. The Virtex 7 family, is based on a 28 nm design and is reported to deliver a two-fold system performance improvement at 50 percent lower power compared to previous generation Virtex-6 devices. In addition, Virtex-7 doubles the memory bandwidth compared to previous generation Virtex FPGAs with 1866 Mbit/s memory interfacing performance and over two million logic cells. In 2011, Xilinx began shipping sample quantities of the Virtex-7 2000T "3D FPGA", which combines four smaller FPGAs into a single package by placing them on a special silicon interconnection pad (called an interposer) to deliver 6.8 billion transistors in a single large chip. The interposer provides 10,000 data pathways between the individual FPGAs – roughly 10 to 100 times more than