System Generator for DSP implements DSP designs on Xilinx FPGAs. A freeware version of its EDA software called ISE WebPACK is used with some of its non-high-performance chips. Xilinx is the only (as of 2007) FPGA vendor to distribute a native Linux freeware synthesis toolchain. Xilinx announced the architecture for a new ARM Cortex-A9-based platform for embedded systems designers, that combines the software programmability of an embedded processor with the hardware flexibility of an FPGA. The new architecture abstracts much of the hardware burden away from the embedded software developers' point of view, giving them an unprecedented level of control in the development process. With this platform, software developers can leverage their existing system code based on ARM technology and utilize vast off-the-shelf open-source and commercially available software component libraries. Because the system boots an OS at reset, software development can get under way quickly within familiar development and debug environments using tools such as ARM's RealView development suite and related third-party tools, Eclipse-based IDEs, GNU, the Xilinx Software Development Kit and others. In early 2011, Xilinx began shipping the Zynq-7000 SoC platform immerses ARM multi-cores, programmable logic fabric, DSP data paths, memories and I/O functions in a dense and configurable mesh of interconnect. The platform targets embedded designers working on market applications that require multi-functionality and real-time responsiveness, such as automotive driver assistance, intelligent video surveillance, industrial automation, aerospace and defense, and next-generation wireless. Following the introduction of its 28 nm 7-series FPGAs, Xilinx revealed that several of the highest-density parts in those FPGA product lines will be constructed using multiple dies in one package, employing technology developed for 3D construction and stacked-die assemblies. The company's stacked silicon interconnect (SSI) technology stacks several (three or four) active FPGA dies side by side on a silicon interposer – a single piece of silicon that carries passive interconnect. The individual FPGA dies are conventional, and are flip-chip mounted by microbumps on to the interposer. The interposer provides direct interconnect between the FPGA dies, with no need for transceiver technologies such as high-speed SerDes. In October 2011, Xilinx shipped the first FPGA to use the new technology, the Virtex-7 2000T FPGA, which includes 6.8 billion transistors and 20 million ASIC gates. The following spring, Xilinx used 3D technology to ship the Virtex-7 HT, the industry's first heterogeneous FPGAs, which combine high bandwidth FPGAs with a maximum of sixteen 28 Gbit/s and seventy-two