Jobs would later push this same ideology onto almost all Apple models he had control of, from the Apple Lisa and Macintosh 128K to the iMac. To allow the computer to dissipate heat, the base of the Apple III was made of heavy cast aluminum, which supposedly acts as a heat sink. One advantage to the aluminum case was a reduction in RFI (Radio Frequency Interference), a problem which had plagued the Apple II series throughout its history. Unlike the Apple II series, the power supply was mounted – without its own shell – in a compartment separate from the logic board. The decision to use an aluminum shell ultimately led to engineering issues which resulted in the Apple III's reliability problems. The lead time for manufacturing the shells was high, and this had to be done before the motherboard was finalized. Later, it was realized that there was not enough room on the motherboard for all of the components unless narrow traces were used. Many Apple IIIs were thought to have failed due to their inability to properly dissipate heat. inCider stated in 1986 that "Heat has always been a formidable enemy of the Apple ///", and some users reported that their Apple IIIs became so hot that the chips started dislodging from the board, causing the screen to display garbled data or their disk to come out of the slot "melted". BYTE wrote, "the integrated circuits tended to wander out of their sockets". It has been rumored Apple advised customers to tilt the front of the Apple III six inches above the desk and then drop it to reseat the chips as a temporary solution. Other analyses blame a faulty automatic chip insertion process, not heat. Case designer Jerry Manock denied the design flaw charges, insisting that tests proved that the unit adequately dissipated the internal heat. The primary cause, he claimed, was a major logic board design problem. The logic board used "fineline" technology that was not fully mature at the time, with narrow, closely spaced traces. When chips were "stuffed" into the board and wave-soldered, solder bridges would form between traces that were not supposed to be connected. This caused numerous short circuits, which required hours of costly diagnosis and hand rework to fix. Apple designed a new circuit board with more layers and normal-width traces. The new logic board was laid out by one designer