has 6 or 16 execution units (EUs), compared to Sandy Bridge's 6 or 12. Intel HD Graphics with DirectX 11, OpenGL 4.0, and OpenCL 1.2 support on Windows. On Linux, OpenGL 4.2 is supported since Mesa 17.1. Support for up to three displays (with some limitations: with chipset of 7-series and using two of them with DisplayPort or eDP) Multiple 4K displays video playback Intel Quick Sync Video version 2 IO RAM support up to 2800MT/s in 200 MHz increments DDR3L for mobile CPUs PCI Express 3.0 support (omitted on Core i3, Pentium, and ultra-low-voltage [ULV] processors) Benchmark comparisons Compared to its predecessor, Sandy Bridge: 3% to 6% increase in CPU performance when compared clock for clock 25% to 68% increase in integrated GPU performance Thermal performance issues Ivy Bridge's temperatures are reportedly 10°C higher compared to Sandy Bridge when a CPU is overclocked, even at default voltage setting. Impress PC Watch, a Japanese website, performed experiments that confirmed earlier speculations that this is because Intel used a poor quality (and perhaps lower cost) thermal interface material (thermal paste, or "TIM") between the chip and the heat spreader, instead of the fluxless solder of previous generations. The mobile Ivy Bridge processors are not affected by this issue because they do not use a heat spreader between the chip and cooling system. Socket 2011 Ivy Bridge processors continue to use the solder. Enthusiast reports describe the TIM used by Intel as low-quality, and not up to par for a "premium" CPU, with some speculation that this is by design to encourage sales of prior processors. Further analyses caution that the processor can be damaged or void its warranty if home users attempt to remedy the matter. The TIM has much lower thermal conductivity, causing heat to trap on the die. Experiments with replacing this TIM with a higher-quality one or other heat removal methods showed a substantial temperature drop, and improvements to the increased voltages and overclocking sustainable by Ivy Bridge chips. Intel claims that the smaller die of Ivy Bridge and the related increase in thermal density is expected to result in higher temperatures when the CPU is overclocked; Intel also stated that this is as expected and will likely not improve in future revisions. Models and steppings All Ivy Bridge processors with one, two, or four cores report the same CPUID model 0x000306A9, and are built in four different