TECHNICAL FIELD 
     The invention pertains to electrical apparatuses, termite sensing apparatuses, methods of forming electrical apparatuses, and methods of sensing termites. 
     BACKGROUND OF THE INVENTION 
     A prior art apparatus and method for detecting termite infestation is described with reference to FIGS. 1 and 2. Specifically, a termite detection device  10  is shown in an assembled configuration and inserted within the ground  12  in FIG. 1, and is shown in a disassembled configuration in FIG.  2 . Device  10  comprises an outer receptacle  14  having a plurality of orifices  16  (only some of which are labeled) extending therethrough. A cap (or a lid)  18  is provided to cover the top of receptacle  14 . Preferably, receptacle  14  is inserted into the ground to a depth at which cap  18  will rest approximately at a surface of the ground. 
     A pair of wooden blocks  20  and  22  are provided within receptacle  14 , and constitute “bait” for termites proximate to device  10 . A holder  24  is provided between blocks of wood  20  and  22  and comprises a shelf  26  upon which blocks  20  and  22  rest. Holder  24  and blocks  20  and  22  together comprise an assembly  27  which can be removably inserted into receptacle  14 . 
     Holder  24  comprises a portion  28  which protrudes upwardly beyond blocks  20  and  22  in the assembled configuration of FIG.  1 . Portion  28  comprises an eye  30  (shown in FIG. 2) which can simplify removal of assembly  27  from receptacle  14  using a tool with a hook. 
     In operation, receptacle  14  is inserted into ground  12 , and blocks  20  and  22  are subsequently left in receptacle  14  for a period of time. Blocks  20  and  22  function as a sensing apparatus to determine if a termite infestation is present in an area proximate device  10 . Specifically, if termites are present, such will penetrate through orifice  16  to reach wooden blocks  20  and  22 . The termites will then burrow into the wooden blocks  20  and  22 . 
     At regular intervals, cap  18  is removed and blocks  20  and  22  withdrawn from device  14 . Blocks  20  and  22  are then surveyed for termite-inflicted damage, and possibly a presence of termites themselves. 
     Generally, a number of apparatuses  10  will be spread around a given location, such as, for example, a house or other wooden structure. Each of the apparatuses will be checked at a regular interval to determine if a termite infestation is occurring proximate the structure. Also, each of the devices will be mapped relative to one another, and relative to the structure. A comparison of the amount of termite-inflicted damage occurring at the respective devices  10  can then enable a person to determine an approximate localized region of any occurring termite infestation. It can be advantageous to pinpoint a localized region of infestation as such can limit an amount of pesticide utilized for destroying the termites. 
     Difficulties can occur in monitoring the amount of termite-inflicted damage occurring at each of the many devices  10  provided around a structure. For instance, it can be difficult to regularly and accurately document the amount of damage at each of the devices. As an example, it can be difficult to remember exactly which of the various devices correlates to a specific location on a map of the devices. As another example, it can be difficult to accurately record a reading of termite-inflicted damage associated with an individual device. As yet another example, it can be tedious and time-consuming to open all of the receptacles  14  proximate the given structure and manually check the blocks  20  and  22  within the receptacles for termite-inflicted damage. 
     One method of reducing the above-discussed difficulties is to provide bar codes on the lids  18  of receptacles  14 . Such bar codes can be scanned to specifically identify a particular device which can simplify correlating the devices to locations on a map of the devices. However, ascertaining an amount of termite-inflicted damage can still be time-consuming in that the receptacles still have to be opened and the blocks of wood manually checked to determine if termite-inflicted damage has occurred to the wood. 
     A recently proposed improvement for monitoring an amount of termite-inflicted damage in a device similar to device  10  is described with reference to FIGS. 3 and 4. Referring to FIG. 3, a device  100  comprises a receptacle  14  of the type described above with reference to FIG. 1, and comprises a cap  18  configured to be received over an open type of receptacle  14 . Device  100  further comprises the pair of wooden blocks  20  and  22 , and a holder  110  similar to the holder  24  described above with reference to FIG.  1 . Holder  110  can comprise, for example, plastic, and differs from holder  24  in that it comprises both a top shelf  112  and a bottom shelf  114 , whereas holder  24  only comprised a bottom shelf. In the shown embodiment, shelf  112  is configured with a slit  116  so that shelf  112  can be slid over a prior holding device (such as the device  24  of FIG. 1) to form the holding device  110 . Slit  116  is optional, and shelf  112  can be molded in one piece with the other components of holder  110 . Holder  110  can be considered as comprising a pillar  111  extending between shelves  112  and  114 , and an extension  113  protruding above shelf  112 . Extension  113  is configured to enable a person to lift holder  110  by the extension, and in the shown embodiment comprises an eye  115  extending therethrough. Shelf  112  can comprise an electrically insulative material, such as, for example, plastic (for instance, polypropylene). 
     Device  100  further comprises an electronic termite sensing loop  118  of conductive material. Loop  118  is formed on a substantially planar substrate  120 , and is preferably formed of material which can be removed by termites. Exemplary materials are printable materials comprising conductive particles, such as, for example, metal particles or carbon particles. Suitable materials are, for example, silver-filled printed thick film ink and silver-filled epoxy. An exemplary silver-filled ink is Dupont Electronics 5028™ (available from Dupont Electronics of Wilmington, Delaware), which is a silver polymer conductor. Another suitable material for loop  118  is a carbon-particle-containing ink (typically the particles will consist essentially of carbon), such as, for example, a material marked by Dupont Electronics as 7102™ Carbon Polymer Conductor (available from Dupont Electronics of Wilmington, Del.). Carbon-particle-containing inks can be cheaper than other inks, better accepted by pests (i.e., apparently more palatable to the pests), and less subject to environmental damage. Further, the inclusion of carbon inks in a circuit can lower an electrical conductivity (i.e., raise a resistivity) of the circuit. The lowered conductivity can increase the reliability of data obtained from the circuit. More specifically, the inclusion of carbon-particle-containing inks in loop  118  can render the circuit of loop  118  less susceptible to registering false negative readings if mud or water bridges an opening in the circuit. 
     Substrate  120  is preferably formed of material which can be removed by termites. Exemplary materials are polyethylene foam and polyester. The conductive material of loop  118  can be directly applied to substrate  120  using, for example, screen printing methods. Substrate  120  can be pretreated prior to applying the conductive material of loop  118  over substrate  120 . Such pretreatment can comprise, for example, flame pretreatment to promote adhesion of the conductive material to the foam. 
     An electrically insulative protective material  127  (only some of which is shown in FIG. 3) is provided over loop  118  and substrate  120 . Protective material  127  can protect conductive loop  118  from water, abrasion or other environmental damage. The insulative protective material can comprise, for example, a resin which is provided as a liquid and cured by exposure to one or more of heat, ultraviolet light and oxygen. A suitable insulative protective material is a material selected from the general class of epoxy resins (such as, for example, a two-part epoxy resin). Another suitable insulative protective material is a material selected for the general class of thick film inks. Exemplary insulative protective materials are Dupont 5015™ and 5018™ (available from Dupont Electronics of Wilmington, Delaware), with 5018™ being an ultraviolet light curable dielectric material. Another exemplary insulative protective material is a tape adhered over loop  118  with an adhesive. 
     A termite attractant (such as, for example, a suitable pheromone) can be provided in addition to the insulative protective material. Such attractant can, for example, be formed over the insulative protective material or blended within the insulative protective material. 
     In the shown configuration, substrate  120  comprises a pair of opposing sidewall edges  121  and  123 , and a plurality of notches  122  extending into sidewall edges  121  and  123 . Notches  122  are provided to form crevices within which the termites can burrow. 
     Conductive loop  118  comprises a pair of ends ( 130  and  132 ), with end  132  connected to a first prong  134  and end  130  connected to a second prong  136 . Device  100  further comprises a circuit board  150  having circuitry (not shown in FIG. 3) supported thereby and a pair of orifices ( 152  and  154 ) extending therethrough. Board  150  can be considered as a circuit support. Shelf  112  has a pair of orifices  156  and  158  extending therethrough, and configured to be aligned with orifices  152  and  154  of circuit board  150 . In operation, device  100  is assembled by providing substrate  120  within holder  114  such that prongs  134  and  136  extend through orifices  156 ,  158 ,  152  and  154  to retain circuit board  150  atop shelf  112 . Circuit board  150  can then be adhered to shelf  112  and/or prongs  134  and  136 . Blocks  20  and  22  are subsequently provided within holder  110  to form an assembly  160  which can be removably inserted within receptacle  14 . 
     The circuitry supported by circuit board  150  can comprise at least a portion of a transponder unit and is configured to be incorporated into a passive radio frequency identification device (RFID) system. The transponder unit can comprise, for example, a parallel resonant LC circuit, with such circuit being resonant at a carrier frequency of an interrogator. The transponder unit is in electrical connection with an antenna  155  provided externally of the circuitry supported by board  150 . Exemplary circuit board/transponder unit assemblies are described in U.S. patent application Ser. No. 08/705,043, filed Aug. 29, 1996, which is assigned to the assignee of the present invention and hereby incorporated by reference. 
     Referring to FIG. 4, an RFID system  60  comprises the transponder supported by a structure  150  (which can comprise, for example, a circuit board) and an interrogator  45  configured to be passed over such transponder unit. Interrogator  45  comprises a coil antenna configured to stimulate the transponder unit. Such coil antenna consists of one or more coils of conductive material provided within a single plane, and can be in the form of, for example, a loop antenna. 
     In operation, interrogator  45  provides a carrier signal which powers (stimulates) the transponder unit supported by board  150  and causes a signal to be transmitted from the transponder unit. The signal comprises data which identifies the transponder unit. Such signal can also identify if the conductive loop  118  is broken. The signal is received by interrogator  45 , and eventually provided to a processing system configured to decode and interpret the data. Such processing system can be provided in a portable unit with interrogator  45 , or can be provided in a separate unit to which data from interrogator  45  is subsequently downloaded. 
     By having a signal from the transponder unit change with a break in circuit  118 , device  100  can indicate if damage has occurred to loop  118  through a signal sent to an interrogator. Such can enable persons utilizing the device to ascertain if termites are present without having to remove blocks  20  and  22  from receptacle  14 , and even without having to remove the lid  18  from receptacle  14 . Once damage to circuit  118  is detected with an interrogator, persons can remove assembly  160  and quantitate an amount of damage occurring within blocks  20  and  22  to determine an extent of termite infestation. 
     The device  160  is suitable for many applications in which it is desired to detect termite infestation. However, the device can be difficult to assemble and utilize in particular applications. Accordingly, it would be desirable to develop alternative devices for detecting termite infestation. 
     SUMMARY OF THE INVENTION 
     In one aspect, the invention encompasses an electrical apparatus. Such apparatus comprises a first substrate having first circuitry supported thereby. The first circuitry defines at least a portion of a radio frequency identification device. At least one first electrical node is supported by the substrate and in electrical connection with the first circuitry. The apparatus further comprises an input device comprising a second substrate and second circuitry on the second substrate. The second circuitry is in electrical communication with at least one second electrical node. Neither of the first nor second electrical nodes is a lead, and the second electrical node is adhered to the first electrical node to electrically connect the input device with the radio frequency identification device. 
     In another aspect, the invention encompasses a termite-sensing apparatus. Such apparatus comprises a first substrate having first circuitry supported thereon, with the first circuitry defining at least a portion of a radio frequency identification device. At least one first electrically conductive node is supported by the substrate and in electrical connection with the first circuitry. The apparatus further comprises a second substrate having second circuitry supported thereon. At least some of the second circuitry is removable by termites. The second circuitry is in electrical communication with at least one second electrical node. Neither the first or second electrical node is a lead. The second electrical node is adhered to the first electrical node to electrically connect the input device with the radio frequency identification device. The apparatus is configured such that a break in the second circuitry alters a signal transponded by the transponder unit. 
     In other aspects, the invention encompasses methods of forming electrical apparatuses, and methods for sensing termites. 
    
    
     BRIEF DESCRIPTION OF THE DRAWINGS 
     Preferred embodiments of the invention are described below with reference to the following accompanying drawings. 
     FIG. 1 is a diagrammatic, cross-sectional view of an assembled prior art termite sensing device embedded in the ground. 
     FIG. 2 is a perspective view of the prior art termite sensing device of FIG. 1 in a disassembled configuration. 
     FIG. 3 is a disassembled view of a prior art electronic sensor configured to detect termite infestation. 
     FIG. 4 is a diagrammatic view of a person extracting information from the prior art electronic termite sensing device of FIG.  3 . 
     FIG. 5 is a diagrammatic view of a first portion of a termite sensing device encompassed by the present invention at an initial step of a method of the present invention. 
     FIG. 6 is a view of the FIG. 5 portion shown at a processing step subsequent to that of FIG.  5 . 
     FIG. 7 is a diagrammatic view of a second portion of a termite sensing device of the present invention, and shown at an initial processing step. 
     FIG. 8 is a view of the FIG. 7 portion shown at a processing step subsequent to that of FIG.  7 . 
     FIG. 9 is a diagrammatic view of an assembly comprising the first portion of FIG. 6, and the second portion of FIG.  8 . 
     FIG. 10 is a top view of a transponder circuit construction being assembled in accordance with a method of the present invention. 
     FIG. 11 is a diagrammatic cross-sectional view of the construction of FIG. 10, shown along the line  11 — 11  of FIG.  10 . 
     FIG. 12 is a view of an construction comprising the transponder circuit construction of FIGS. 10 and 11 joined to a fragment of the FIG. 9 assembly. 
     FIG. 13 is a diagrammatic side view of a termite sensing device encompassed by the present invention. 
    
    
     DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS 
     This disclosure of the invention is submitted in furtherance of the constitutional purposes of the U.S. Patent Laws “to promote the progress of science and useful arts” (Article 1, Section 8). 
     A difficulty which can occur in forming the prior art termite sensing device of FIG. 3 is in connecting circuit support  150  with prongs  134  and  136 . It is desired to have the circuitry associated with support  150  be planar along a surface of the ground so that it can be readily stimulated by an interrogator passed along the ground surface and over such circuitry, and it is further desirable to have the circuitry of loop  118  extending perpendicular with the surface of the ground so that such circuitry is likely to be intercepted by termites passing at various depths beneath a ground surface. An apparent solution for connecting loop  118  to circuitry associated with board  150 , without having to utilize prongs  134  and  136 , is simply to bend support  120  so that part of loop  118  will extend perpendicular to a ground surface, and another part (specifically, the ends of the loop) will extend substantially parallel with the surface of the ground. However, such will require about a 90° bend in foam substrate  120 , which would likely break the substrate and accordingly break the circuit of loop  118 . The present invention provides a mechanism by which circuitry can be bent to enable a connection from the conductive loop extending perpendicular to a ground surface to a transponder circuit extending parallel with the ground surface. 
     An assembly encompassed by the present invention is shown in FIG. 13, and a method of forming such assembly is described with reference to FIGS. 5-13. In referring to FIGS. 5-13, similar numbering will be utilized as was used in describing the prior art, with the suffix “a” used to differentiate structures of FIGS. 5-12 from the corresponding structures of the prior art FIGS. 1-4. 
     Referring to FIG. 5, a first portion  190  of a termite sensing device of the present invention is shown. Portion  190  comprises a first substrate  120   a . Substrate  120   a  is similar to substrate  120  of the prior art (FIG.  3 ), and preferably comprises a material which can be removed by termites, and can comprise, for example, polyethylene foam. Substrate  120   a  comprises notches  122   a  formed therein, and such notches can provide crevices within which termites can burrow. 
     Substrate  120   a  has an upper surface  119   a , and a conductive material loop  118   a  is formed on such surface. Loop  118   a  can be formed utilizing methodology described above for forming loop  118  (FIG.  3 ), such as, for example, by screen printing one or both of a carbon-particle-containing ink and a metal-containing ink onto substrate  120 . Loop  118   a  has a pair of ends (or terminals)  130   a  and  132   a  extending therefrom. Terminals  130   a  and  132   a  define first and second electrical nodes, respectively. Terminals  130   a  and  132   a  comprise a thickened region of the conductive material relative to the rest of loop  118   a . Such thickened region of conductive material can simplify connection of terminals  130   a  and  132   a  to other circuitry (described below). 
     Substrate  120   a  has a pair of opposing ends  141   a  and  143   a . Terminals  130   a  and  132   a  are proximate end  143   a  of substrate  120   a , but are spaced from such end by gaps  200 . Such spacing can enable terminals  130   a  and  132   a  to be completely protected from the environment by simply providing a protective covering over surface  119   a  and loop  118   a . In contrast, if terminals  130   a  and  132   a  extended all the way to end  143   a , the terminals would have a surface exposed over end  143   a , and such surface could be difficult to protect from the environment. It is to be understood, however, that the shown embodiment is an exemplary embodiment, and that the invention encompasses other embodiments (not shown) having other configurations. Such other embodiments include, for example, embodiments in which terminals  130   a  and  132   a  extend to, and even beyond, end  143   a.    
     Referring to FIG. 6, a dielectric material  202  is provided over a predominate portion of conductive loop  118   a  (shown in phantom view in FIG.  6 ). Specifically, dielectric material  202  covers an entirety of loop  118   a  except for the ends of terminals  130   a  and  132   a . The uncovered ends  130   a  and  132   a  define first and second electrical nodes, respectively. Dielectric material  202  can comprise, for example, materials described above for prior art layer  127  (FIG.  3 ), and can form a fluid-tight protective layer over conductive loop  118   a . Dielectric material  202  can have a termite attractant (such as, for example, a termite-attracting pheromone) mixed therein. 
     Referring to FIG. 7, a second portion  210  of a termite sensing device of the present invention is shown. Portion  210  comprises a second substrate  212  having an upper surface  215 , and pair of conductive lines  214  and  216  formed on surface  215 . Substrate  212  preferably comprises a flexible material, such as, for example, polyester or other plastics. Conductive lines  214  and  216  can comprise the same material utilized for conductive loop  118   a , and can be printed onto substrate  212  by, for example, screen printing. In embodiments in which substrate  212  comprises an insulative material, conductive lines  214  and  216  can be printed directly onto the material. In other embodiments (not shown) substrate  212  can comprise a conductive material, and a dielectric material can be provided over such conductive material prior to the forming of conductive lines  214  and  216  over the substrate. Conductive lines  214  and  216  together comprise a circuit pattern formed over substrate  212 . Conductive line  214  can be referred to as a first conductive line, and conductive line  216  can be referred to as a second conductive line. 
     First conductive line  214  comprises a pair of ends ( 218  and  220 ), and second conductive line  216  comprises another pair of ends ( 222  and  224 ). End  222  of second conductive line  216  is proximate end  218  of first conductive line  214 , and end  224  of second conductive line  216  is proximate end  220  of first conductive line  214 . Ends  218 ,  220 ,  222  and  224  define electrical nodes. Electrical nodes  222  and  224  are referred to herein as a third electrical node and fourth electrical node, respectively, and electrical nodes  218  and  220  are referred to herein as a fifth and sixth electrical node, respectively. 
     Substrate  212  comprises a pair of opposing ends  230  and  232 . Conductive lines  214  and  216  are spaced from end  230  by gaps  234  and  236 , respectively, and are spaced from end  232  by gaps  238  and  240 , respectively. 
     A dielectric material  242  is formed over a predominate portion of lines  214  and  216 . Dielectric material  242  can comprise the same materials described above with reference to dielectric material  127  of the prior art (FIG.  3 ). Dielectric material  242  does not cover the ends of conductive lines  214  and  216 , and accordingly leaves the third, fourth, fifth and sixth electrical nodes exposed. Dielectric material  242  can form a fluid-tight protective coating over the predominate portion of lines  214  and  216  covered by such dielectric material. 
     Referring to FIG. 8, a conductive material  250  is provided over ends  218 ,  220 ,  222  and  224 . Conductive material  250  can comprise, for example, an adhesive having conductive particles dispersed therein. A suitable adhesive is 3M #9703™ electrically conductive adhesive transfer tape (Z-axis tape), available from 3M Corporation of St. Paul, Minn. The material is referred to as a Z-axis adhesive because such material conducts electricity only in a Z-axis direction. Accordingly, the material will not form a short between conductive lines  214  and  216 , but can form electrical connections from conductive lines  214  and  216  to other circuitry formed thereover. In the preferred embodiment, the conductive adhesive overlaps the edges of dielectric material  242 , and extends from the edges to ends  230  and  232  of substrate  212 . The Z-axis adhesive  250  and dielectric material  242  thus can together comprise a fluid-tight seal which extends entirely over conductive lines  214  and  216 , as well as entirely over the surface  215  of substrate  212  (FIG.  7 ). 
     In embodiments in which the conductive adhesive  250  comprises a Z-axis tape, the adhesive will be provided with a release liner adhered thereto. Such release liner can be left in place in forming the construction shown in FIG.  8 . 
     Referring to FIG. 9, the assembly  210  of FIG. 8 is adhered to the assembly  190  of FIG. 6 utilizing the adhesive  250  proximate end  230 . (In embodiments in which conductive adhesive  250  comprises a Z-axis tape, the release liner over Z-axis tape  250  proximate end  230  will be removed prior to forming the construction of FIG. 9.) The assembly  210  is inverted relative to assembly  190  in the FIG. 9 construction such that so-called upper surface  215  (FIG. 7) of substrate  212  faces downwardly toward upper surface  119   a  of substrate  120   a . Such enables electrical connection of nodes  218  and  222  with nodes  132   a  and  130   a , respectively. 
     Substrate  212  overlaps with substrate  120   a  in an overlap region  260 . Also, third electrical node  222  overlaps with first electrical node  130   a  in overlap region  260 , and fifth electrical node  218  overlaps with second electrical node  132   a  in such overlap region. Conductive material  250  bonds third electrical node  222  to first electrical node  130   a , and fifth electrical node  218  to second electrical node  132   a . In embodiments in which material  250  comprises a Z-axis adhesive, such material can form a conductive bond between the first and third nodes, as well as between the second and fifth nodes, without causing a short between conductive lines  214  and  216 . 
     In the shown embodiment, dielectric material  202  and dielectric material  242  both extend into the overlap region  260 . Such can assist in forming a water-tight seal within overlap region  260 . A water-tight seal is desired to prevent water from leaking between lines  214  and  216 , and causing an electrical short between such lines. 
     Referring to FIGS. 10 and 11, a transponder assembly  300  is shown in a top view (FIG.  10 ), and in a cross-sectional side view (FIG.  11 ). Transponder assembly  300  comprises a circuit supporting substrate  302 , which can comprise, for example, a circuit board. Circuitry  304  is provided over circuit-supporting substrate  302 , and a coil  306  is provided beneath circuit-supporting substrate  302 . Circuitry  304  preferably comprises at least a portion of a transponder unit, and in preferred embodiments, comprises at least a portion of a radio frequency identification device (RFID). Coil  306  is preferably configured as an antenna for the RFID device of circuitry  304 . Substrate  302 , and coil  306  can be similar to, for example, substrate  150  and antenna  155 , respectively, that were discussed above in the “Background” section of this disclosure. 
     Conductive circuit pads  310  and  312  are provided on circuitry  304 , and define electrical nodes for connection of external circuitry (not shown in FIGS. 10 and 11) to circuitry  304 . Pads  310  and  312  can comprise, for example, a conductive ink, and can be formed by, for example, screen printing. It is noted that pads  310  and  312  are not conductive leads. For purposes of interpreting this disclosure and the claims that follow, the term “electrical lead” refers to an electrical connection which is longer than it is wide, with the length being defined as a dimension of the conductive material extending away from the circuitry connected to the conductive material. Accordingly, pads  310  and  312  have lengths “X” (shown in FIG.  11 ), and have widths “Z” and “Y” (FIG. 10) which are wider than the length “X”. Note that either of “Y” or “Z” can be considered a width of pads  310  and  312  depending on the side from which the pads are viewed. For instance, in the view of FIG. 11, pads  310  and  312  have a length “X” and a width “Y”. It is noted that “Y” corresponds to a minimum width of pad  310 , and that such minimum width is longer than any maximum length to which pad  310  extends outwardly (shown as upwardly) from circuitry  304 . 
     The circuit support  302 , and associated coil  306 , circuitry  304 , and pads  310  and  312 , are shown placed within a potting cup  314 . Also shown is an encapsulant  316  which has been poured within cup  314  and over circuitry  304 , and coil  306 , while leaving pads  310  and  312  exposed. Encapsulant  316  can comprise, for example, an epoxy resin. The encapsulant  316  is provided as a liquid, and subsequently cured to harden the encapsulant into a solid which protects circuitry  304  and coil  306  from moisture. In particular embodiments, the potting cup can be utilized as a mold. Specifically, a release material can be provided within potting cup  314  prior to forming encapsulant  316  within the cup, and after the encapsulant is hardened it can be removed from cup  314  together with the board  302 , coil  306 , circuitry  304 , and pads  310  and  312 . Alternatively, potting cup  314  can be adhered to encapsulant  316  as the encapsulant cures, such that potting cup  314  becomes part of a transponder device formed within potting cup  314 . In any event, after encapsulant  316  cures, surfaces of pads  310  and  312  remain exposed through the encapsulant for subsequent electrical connection to an electrical device. 
     Referring to FIG. 12, the device  300  of FIGS. 10 and 11 is shown attached to flexible portion  210  of FIG.  9 . Specifically, pads  320  and  322  have been formed on exposed ends  220  and  224  (FIG. 9) of conductive lines  214  and  216 , respectively. Pads  320  and  322  can be formed of screen-printed conductive ink, as described above for pads  310  and  312 . Pads  320  and  322  constitute electrical nodes, and, like pads  310  and  312 , are not leads. Pads  320  and  322  can be adhered to pads  310  and  312  utilizing a Z-axis adhesive tape, such as, for example, the 3M™ Z-axis tape described above. It is noted that although pads are shown associated with both transponder circuitry (specifically pads  310  and  312 ) and the circuitry on flexible portion  210  (specifically pads  320  and  322 ), the invention encompasses embodiments wherein the pads on one or both of the transponder circuitry and the circuitry on the flexible portion are eliminated. In such embodiments, the electrical connection between the transponder circuitry and the circuitry on the flexible portion can remain leadless so long as any nodes associated with such connection are wider than they are long. 
     FIG. 13 illustrates the construction of FIG. 12 incorporated into a termite-sensing device  400 . The relative scales of portions  300  and  210  are changed in the view of FIG. 13 relative to FIGS. 5-12, with the relative scales of FIG. 13 being a more preferred application of the invention, and the relative scales of FIGS. 5-12 being utilized for illustration purposes. 
     FIG. 13 shows foam substrate  190  provided between a pair of wooden blocks  20   a  and  22   a . Flexible portion  210  extends from between blocks  20   a  and  22   a  to over block  20   a , and is bent around a corner of block  20   a . Flexible portion  210  electrically connects circuitry associated with the non-flexible portion  190  to the circuitry of transponder device  300 . In operation, if termites remove enough of the circuitry from portion  190  to break loop  118   a  (FIG.  5 ), such will change a signal generated by the transponder device  300 . Accordingly, the circuitry associated with portion  190  functions as an input device to the transponder circuitry of assembly  300 . It is noted that although in the shown embodiment non-flexible portion  190  is connected to assembly  300  through an intervening flexible portion  210 , the invention encompasses other embodiments (not shown) wherein the circuitry of non-flexible portion  190  is directly coupled to circuitry of transponder assembly  300 , rather than being coupled through an intervening flexible substrate. 
     The device  400  of FIG. 13 can be monitored for termite-inflicted damage by monitoring a signal transponded by transponder unit  300  to determine if a conductive loop associated with substrate  190  is broken. 
     Although the invention is described above with application to a termite sensing device, it is to be understood that the invention can be utilized in other applications wherein an input device is to be coupled to a transponder assembly. The leadless interconnection of the present invention can offer advantages relative to traditional mechanical lead connections. Specifically, the leadless interconnection can offer mechanical strength. For instance, it is not uncommon for leads to bend or break in operation. The leadless connection of the present invention can avoid such bending and breaking of leads by eliminating the leads from the circuit construction. 
     In compliance with the statute, the invention has been described in language more or less specific as to structural and methodical features. It is to be understood, however, that the invention is not limited to the specific features shown and described, since the means herein disclosed comprise preferred forms of putting the invention into effect. The invention is, therefore, claimed in any of its forms or modifications within the proper scope of the appended claims appropriately interpreted in accordance with the doctrine of equivalents.
The invention encompasses an electrical apparatus. Such apparatus comprises a first substrate having first circuitry supported thereby. The first circuitry defines at least a portion of a radio frequency identification device. At least one first electrical node is supported by the substrate and in electrical connection with the first circuitry. The apparatus further comprises an input device comprising a second substrate and second circuitry on the second substrate. The second circuitry is in electrical communication with at least one second electrical node. Neither of the first nor second electrical nodes is a lead, and the second electrical node is adhered to the first electrical node to electrically connect the input device with the radio frequency identification device. The invention also encompasses a termite-sensing apparatus. Additionally, the invention encompasses methods of forming electrical apparatuses, and methods for sensing termites.