CROSS-REFERENCE TO RELATED APPLICATION 
       [0001]    This application is a continuation-in-part application of application Ser. No. 15/062,744 filed on Mar. 7, 2016 which is a continuation of PCT International Application No. PCT/JP2014/074306 filed on Sep. 12, 2014 which claims the benefit of priority from U.S. Provisional Patent Application No. 61/877,069 filed on Sep. 12, 2013 and Japanese Patent Application No. 2014-026241 filed on Feb. 14, 2014, the entire contents of which are incorporated herein by reference. 
     
    
     BACKGROUND OF THE INVENTION 
     1. Field of the Invention 
       [0002]    The present invention relates to a semiconductor laser module. 
       2. Description of the Related Art 
       [0003]    Conventionally, a method has been known, in a case where, in a semiconductor laser module, a laser light is output from an optical fiber, a laser light emitted from a semiconductor laser element fixed at a predetermined position on a package is condensed by a lens or the like to make the condensed laser light coupled to an optical fiber (for example, see Japanese Patent Application Laid-open Publication No. 2004-96088). 
         [0004]    In such a light coupling method, if the semiconductor laser element is high in output, an adhesive fixing the optical fiber and a coated portion of the optical fiber are damaged by heat produced by optical absorption and reliability may decrease sometimes. For that reason, conventionally, a method of inserting an optical fiber through a transparent glass capillary to fix the optical fiber is known (for example, see Japanese Patent Application Laid-open Publication No. 2004-354771). 
       SUMMARY OF THE INVENTION 
       [0005]    It is an object of the present invention to at least partially solve the problems in the conventional technology. 
         [0006]    In accordance with one aspect of the present invention, a semiconductor laser module includes a package; a plurality of semiconductor laser elements provided in the package; a member having a plurality of mounting surfaces on which the semiconductor laser elements are mounted, the mounting surfaces being separated from a bottom surface of the package by respective distances, the distances being gradually different from each other in a manner that the mounting surfaces as a whole form a step-like form; a plurality of lenses collimating respective laser beams emitted from the semiconductor laser elements; a plurality of reflection mirrors reflecting the respective laser beams; a condenser lens unit condensing the laser beams; an optical fiber where the optical beams condensed by the condenser lenses are optically coupled; and an optical filter disposed on optical lines of the respective laser beams reflected by the reflection mirrors and reflecting light having wavelengths different from the wavelengths of the laser beams. 
         [0007]    The above and other objects, features, advantages and technical and industrial significance of this invention will be better understood by reading the following detailed description of presently preferred embodiments of the invention, when considered in connection with the accompanying drawings. 
     
    
     
       BRIEF DESCRIPTION OF THE DRAWINGS 
         [0008]      FIG. 1  is a schematic plan view of a semiconductor laser module according to an embodiment of the present invention; 
           [0009]      FIG. 2  is a schematic partially cutout view showing a side surface of the semiconductor laser module shown in  FIG. 1 ; 
           [0010]      FIG. 3  is an enlarged schematic cross-sectional view of an optical fiber, a glass capillary, and a light-absorbing element of the semiconductor laser module shown in  FIG. 1 ; 
           [0011]      FIG. 4  is an enlarged schematic partially cutout view of a first light-blocking portion of the semiconductor laser module shown in  FIG. 1 ; 
           [0012]      FIG. 5A  is an enlarged view of a part where an optical filer is included of the semiconductor laser module of  FIG. 1 ; 
           [0013]      FIG. 5B  is a view illustrating a part where light reflected by the optical filter irradiates on the first light-blocking portion of  FIG. 4 ; 
           [0014]      FIG. 6  is a schematic view showing a relationship between angle of a light leaking from the optical fiber relative to the center of the optical fiber and an optical power; 
           [0015]      FIG. 7  is an enlarged schematic partially cutout view of a first light-blocking portion of a semiconductor laser module according to a modified example; 
           [0016]      FIG. 8  is a schematic view showing refractive index of a cross section of the glass capillary orthogonal to the longitudinal direction of the optical fiber of the semiconductor laser module according to the modified example; 
           [0017]      FIG. 9  is a schematic cross-sectional view of the cross section of the glass capillary orthogonal to the longitudinal direction of the optical fiber of the semiconductor laser module according to the modified example; 
           [0018]      FIG. 10  is a schematic cross-sectional view of the cross section of the glass capillary orthogonal to the longitudinal direction of the optical fiber of the semiconductor laser module according to the modified example; 
           [0019]      FIG. 11  is a schematic cross-sectional view of the cross section of the glass capillary orthogonal to the longitudinal direction of the optical fiber of the semiconductor laser module according to the modified example; 
           [0020]      FIG. 12  is a schematic cross-sectional view of the cross section of the glass capillary orthogonal to the longitudinal direction of the optical fiber of the semiconductor laser module according to the modified example; 
           [0021]      FIG. 13  is a schematic view showing a relationship between distance from an end surface, at an incident side, of the glass capillary in the longitudinal direction of the optical fiber and optical absorptivity of the light-absorbing element of the semiconductor laser module according to the modified example; and 
           [0022]      FIG. 14  is an enlarged schematic cross-sectional view of an optical fiber, a glass capillary, and a light-absorbing element of the semiconductor laser module according to the modified example. 
       
    
    
     DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS 
       [0023]    Hereafter, embodiments of a semiconductor laser module according to the present invention will be explained in detail with reference to the drawings. The present invention is not limited to these embodiments. In all the drawings, identical or corresponding elements are given same reference numerals appropriately. Moreover, it should be noted that the drawings show schematic examples. Accordingly, a relationship between respective elements may be different from real values. Among the drawings, there may be parts where the relationships and ratios of the shown sizes are different from one another. 
         [0024]    Inventors of the subject application found a problem that an adhesive and a coated portion may be damaged by produced heat even if a glass capillary is used in the semiconductor laser module. 
         [0025]    In contrast, according to the embodiment described below, a highly reliable semiconductor laser module is achieved. 
         [0026]    To start with, a configuration of a semiconductor laser module according to an embodiment of the present invention will be explained.  FIG. 1  is a schematic plan view of the semiconductor laser module according to the embodiment of the present invention.  FIG. 2  is a schematic partially cutout view showing a side surface of the semiconductor laser module shown in  FIG. 1 . A semiconductor laser module  100  according to the present embodiment includes a package  101  as a housing, LD-height-adjusting plate  102 , sub-mounts  103 - 1  to  6 , and six semiconductor laser elements  104 - 1  to  6  mounted in order inside the package  101 . Although the package  101  is provided with a lid  101   a  as shown in  FIG. 2 , the lid of the package  101  is omitted to be shown in FIG. The semiconductor laser module  100  includes a lead pin  105  injecting a current to the semiconductor laser elements  104 - 1  to  6 . The semiconductor laser module  100  includes first lenses  106 - 1  to  6 , second lenses  107 - 1  to  6 , mirrors  108 - 1  to  6 , a third lens  109 , an optical filter  110 , and a fourth lens  111 , as optical elements disposed in order on optical paths of laser lights outputted from the semiconductor laser elements  104 - 1  to  6 . The first lenses  106 - 1  to  6 , the second lenses  107 - 1  to  6 , the mirrors  108 - 1  to  6 , the third lens  109 , the optical filter  110 , and the fourth lens  111  are fixed inside the package  101  respectively. The semiconductor laser module  100  further includes an optical fiber  112  disposed to face the fourth lens  111 . An end, at a side into which the laser light is incident, of the optical fiber  112  is enclosed inside the package  101 . 
         [0027]    As shown in  FIG. 2 , the semiconductor laser elements  104 - 1  to  6  are disposed on steps of the LD-height-adjusting plate  102  and inside the package  101 . Each one of the first lenses  106 - 1  to  6 , each one of the second lenses  107 - 1  to  6 , and each one of the mirrors  108 - 1  to  6  are disposed at a corresponding height of each of the semiconductor laser elements. 
         [0028]    A loose tube  115  is provided to an insertion portion, of the optical fiber  112 , to be inserted into the package  101 . A boot  114  is fitted outwardly on a portion of the package  101  to cover a portion of the loose tube  115  and the insertion portion. 
         [0029]    As shown in  FIG. 2 , the optical fiber  112  is inserted into a glass capillary  116  as an optical component. The optical fiber  112  is provided with a coated portion  112   a . However, the coated portion  112   a  is removed at a portion, being inserted into the glass capillary  116 , of the optical fiber  112 . The optical fiber  112  is provided with a protrusion portion  112   b , at a portion at an incident side, projecting from the glass capillary  116 . An outer periphery of the glass capillary  116  is covered with a light-absorbing element  117 . The light-absorbing element  117  is fixed to the package  101 . A second light-blocking portion  118  is disposed at a laser-light-emitting end side of the glass capillary  116 . The second light-blocking portion  118  fits the light-absorbing element  117  at a laser-light-emitting end side of the light-absorbing element  117 . The loose tube  115  is inserted through a portion of the second light-blocking portion  118 . 
         [0030]    Hereafter, a configuration in the vicinity of the optical fiber  112  of the semiconductor laser module  100  will be explained in detail.  FIG. 3  is an enlarged schematic cross-sectional view of the optical fiber, the glass capillary, and the light-absorbing element, of the semiconductor laser module shown in  FIG. 1 . As shown in  FIG. 3 , the optical fiber  112  includes a core portion  112   c  and a cladding portion  112   d.    
         [0031]    The optical fiber  112  is inserted through the glass capillary  116 . The optical fiber  112  and the glass capillary  116  are fastened with a first-fixing agent  119 . The glass capillary  116  is inserted through the light-absorbing element  117 . The glass capillary  116  and the light-absorbing element  117  are fastened with a second-fixing agent  120 . 
         [0032]    A first light-blocking portion  113  is disposed between an end, into which the laser light is incident, of the optical fiber  112  and the glass capillary  116 . 
         [0033]    Hereafter, each of elements constituting the semiconductor laser module  100  shown in  FIGS. 1 to 3  will be explained in further detail. It is preferable that the package  101  as a housing be made of a material of superior thermal conductivity for restraining an increase in temperature thereinside, and the package  101  may be made of a metal component made of various kinds of metal. It is preferable that, as shown in  FIG. 2 , a bottom surface of the package  101  be separated from a plane, on which the semiconductor laser module  100  is disposed, in an area in which the glass capillary  116  is disposed. Hereby, it is possible to decrease an influence of warp of the bottom surface of the package  101  when fixing the package  101  with a screw or the like. 
         [0034]    As described above, the LD-height-adjusting plate  102  fixed in the package  101  is configured to adjust heights of the semiconductor laser elements  104 - 1  to  6  so that optical paths of the laser lights outputted by the semiconductor laser elements  104 - 1  to  6  do not interfere with each other. The LD-height-adjusting plate  102  may be configured to be united with the package  101 . 
         [0035]    The sub-mounts  103 - 1  to  6  are fixed on the LD-height-adjusting plate  102  to assist radiation of the semiconductor laser elements  104 - 1  to  6  mounted thereon. For that purpose, it is preferable that the sub-mounts  103 - 1  to  6  be made of a material of superior thermal conductivity, and the sub-mounts  103 - 1  to  6  may be metal components made of various kinds of metal. 
         [0036]    The semiconductor laser elements  104 - 1  to  6  are high output semiconductor laser elements, of which optical power of the laser light being outputted is equal to or greater than 1 W, or equal to or greater than 10 W. In the present embodiment, the optical power of the laser light outputted from the semiconductor laser elements  104 - 1  to  6  is, for example, 11 W. The semiconductor laser elements  104 - 1  to  6  output, for example, laser lights at wavelengths of 900 nm to 1000 nm. The number of the semiconductor laser elements  104 - 1  to  6  may be more than one like the semiconductor laser module  100  according to the present embodiment. Alternatively, the number may be one and will not be limited specifically. 
         [0037]    The lead pins  105  supplies electric power to the semiconductor laser elements  104 - 1  to  6  via a bonding wire not shown in the drawings. The electric power being supplied may be at a constant voltage or at a modulated voltage. 
         [0038]    The first lenses  106 - 1  to  6  are cylindrical lenses, of which focal distances are, for example, 0.3 mm. Each one of the first lenses  106 - 1  to  6  is disposed at a position at which a light being outputted from each corresponding one of the semiconductor laser elements becomes an approximate collimated light in the vertical direction. 
         [0039]    The second lenses  107 - 1  to  6  are cylindrical lenses of which focal distances are, for example, 5 mm. Each one of the second lenses  107 - 1  to  6  is disposed at a position at which a light being outputted from each corresponding one of the semiconductor laser elements becomes an approximate collimated light in the horizontal direction. 
         [0040]    The mirrors  108 - 1  to  6  may be mirrors provided with various kinds of metal layers or dielectric layers, and it is preferable that reflectivities thereof be as high as possible at wavelengths of the laser lights being outputted from the semiconductor laser elements  104 - 1  to  6 . The mirrors  108 - 1  to  6  are capable of fine-tuning a direction of the reflected laser light, of a corresponding one of the semiconductor laser elements, to be coupled to the optical fiber  112  desirably. 
         [0041]    The third lens  109  and the fourth lens  111  are cylindrical lenses of which focal distances are, for example, 12 mm and 5 mm respectively and of which curvatures are orthogonal to each other. The third lens  109  and the fourth lens  111  condense the laser lights outputted by the semiconductor laser elements  104 - 1  to  6  to couple the condensed laser lights to the optical fiber  112  desirably. Positions of the third lens  109  and the fourth lens  111  relative to the optical fiber  112  are adjusted so that coupling efficiencies for the laser lights outputted by the semiconductor laser elements  104 - 1  to  6  to the optical fiber  112  are, for example, equal to or greater than 85%. 
         [0042]    The optical filter  110  is a low-pass filter reflecting lights, for example, at wavelengths of 1060 nm to 1080 nm and transmitting lights at wavelengths of 900 nm to 1000 nm therethrough. As a result, the optical filter  110  makes laser lights outputted by the semiconductor laser elements  104 - 1  to  6  be transmitted therethrough and prevents the light at wavelengths of 1060 nm to 1080 nm from being irradiated to the semiconductor laser elements  104 - 1  to  6  from outside. The optical filter  110  is disposed to be angled relative to the optical axis of the laser light so that the laser lights outputted by the semiconductor laser elements  104 - 1  to  6  and slightly reflected by the optical filter  110  do not return to the semiconductor laser elements  104 - 1  to  6 . 
         [0043]    The optical filter  110  is located between two condenser lenses, that it, the third lens  109  and the fourth lens  111 . It is preferable that the optical filter  110  be tilted by, for example, two degrees or more. The optical filter  110  reflects light having a wavelength in a range, for example, of 1060 nm to 1080 nm, the light being propagated through the optical fiber  112  and being irradiated from outside of the optical filter  110 . In this case, due to the tilt of the optical filter  110 , it becomes possible to prevent the light, which is reflected from the optical filter  110 , from being re-coupled in the optical fiber  112  or burning out the adhesive fixing for the optical fiber  112 . Further, due to the location of the optical filter  110  between the two condenser lenses, it becomes possible to prevent the light from being recollected near the optical fiber  112 , the light being propagated through the optical fiber  112  from outside, irradiated to the optical filter  110 , and then reflected by the optical filter  110 . By doing this, it becomes possible to prevent, for example, the portion where the optical fiber  112  is fixed (connected) from being damaged by the light irradiated from outside. In a case where the optical filter  110  is located on the optical fiber  112  side of the two condenser lenses, it is possible to reduce the recollection of the light reflected by the optical filter  110 , but the reflected light may irradiate the portion where the optical fiber  112  is fixed, which is not preferable. Similarly, in a case where the optical filter  110  is located on the opposite side of the optical fiber  112  relative to the two condenser lenses, there is a risk that the reflected light is recollected to a single point, causing burning out of a part such as the portion where the optical fiber  112  is fixed. 
         [0044]    An effect of the optical filter  110  is described with reference to  FIGS. 5A and 5B .  FIG. 5A  is an enlarged drawing of an area of the optical filter  110  of  FIG. 1 . It is assumed that the light, which is propagated through the optical fiber  112  and irradiated from outside, is incident in the direction of the arrow of  FIG. 5A . The reflected light from outside, which is reflected by the optical filter  110 , irradiates a part of the first light-blocking portion  113  as illustrated by the ellipse of  FIG. 5B . That is, the light reflected by the optical filter  110  is not recollected, does not irradiate the portion where the optical fiber  112  is fixed, and the diameter of the reflected light beam becomes greater, so that the light intensity per unit area becomes weaker accordingly, thereby preventing burning out of the irradiated part of the reflected light. Therefore, in a case where the optical filter  110  which is tiled is located between the two condenser lenses, a greater effect can be achieved. 
         [0045]    The optical fiber  112  may be a multi-mode optical fiber of which core diameter is, for example, 105 μm and of which cladding diameter is, for example, 125 μm, or alternatively may be a single-mode optical fiber. For example, NA of the optical fiber  112  may be 0.15 to 0.22. 
         [0046]    The first light-blocking portion  113  is a rectangular plate component provided with a notched portion through which the protrusion portion  112   b  of the optical fiber  112  is inserted. An end of the optical fiber  112  is projecting from the first light-blocking portion  113 .  FIG. 4  is an enlarged schematic partially cutout view of the first light-blocking portion of the semiconductor laser module shown in  FIG. 1 . As shown in  FIG. 4 , the first light-blocking portion  113  is disposed at an outer periphery of the protrusion portion  112   b  of the optical fiber  112  and separated from the optical fiber  112 . 
         [0047]    By separating the first light-blocking portion  113  from the optical fiber  112 , it is possible to restrain heat from being transferred from the first light-blocking portion  113  to the optical fiber  112 , and thus, an increase in temperature of the first-fixing agent  119 , which will be described later, can be restrained. 
         [0048]    By providing the first light-blocking portion  113  so that the end of the optical fiber  112  projects from the first light-blocking portion  113  to an input side of the laser light, it is possible to restrain a non-coupled light from leaking from between the first light-blocking portion  113  and the optical fiber  112 , and thus, it is possible to block the non-coupled light not being coupled to the optical fiber  112  more reliably. 
         [0049]    The optical fiber  112  is inserted through the boot  114  preventing the optical fiber  112  being bent from damage. Although the boot  114  may be a boot made of metal, the material therefor may not be limited specifically, and the boot  114  may be made of rubber, various resin, plastics or the like. 
         [0050]    The optical fiber  112  is inserted through the loose tube  115  preventing the optical fiber  112  being bent from damage. Moreover, the loose tube  115  being fastened to the optical fiber  112  may be configured, as a result, to prevent the optical fiber  112  from being shifted in position when a tensile force is applied to the optical fiber  112  in the longitudinal direction. 
         [0051]    The glass capillary  116  is a round-tube-shaped glass capillary provided with a through hole. The optical fiber  112  is inserted through the through hole of the glass capillary  116 . An inner wall of the through hole of the glass capillary  116  and the cladding portion  112   d  of the optical fiber  112  are fastened with the first-fixing agent  119 . The glass capillary  116  has optical transmittance at wavelengths of laser lights outputted by the semiconductor laser elements  104 - 1  to  6 , and it is preferable that the glass capillary  116  be made of, for example, material of which transmissivity is equal to or greater than 90% at these wavelengths. It is preferable that the refractive index of the glass capillary  116  be equal to or higher than the refractive index of the cladding portion  112   d  of the optical fiber  112 . The relative refractive-index difference of the glass capillary  116  relative to the cladding portion  112   d  of the optical fiber  112  is, for example, equal to or higher than 0.1% and equal to or lower than 10%. The glass capillary  116  may be provided with a tapered portion, at a light-emitting side, for facilitating insertion of the optical fiber  112 . 
         [0052]    The light-absorbing element  117  is disposed at an outer periphery of the glass capillary  116  and is fastened to the glass capillary  116  with the second-fixing agent  120 . The light-absorbing element  117  has optical absorptivity at wavelengths of the laser lights outputted by the semiconductor laser elements  104 - 1  to  6 , and for example, its absorptivity is equal to or higher than 30%, or is more preferable to be equal to or greater than 70% at these wavelengths. As a result, the light-absorbing element  117  absorbs the laser light transmitted through the glass capillary  116 . Since the light-absorbing element  117  radiates heat generated by optical absorption, it is preferable that the light-absorbing element  117  be made of a material, excellent in thermal conductivity, such as a metal component containing Cu, Ni, stainless steel, or Fe, a metal containing Ni, Cr, and Ti, or a member provided with a top-surface-plating layer containing C, ceramics component containing AlN or Al 2 O 3 , or a member provided with a ceramic layer covering a top surface containing AlN or Al 2 O. It is preferable that the light-absorbing element  117  be connected to the package  101  via a good heat conductor, not shown in the drawings, since the light-absorbing element  117  radiates heat generated by optical absorption. It is preferable that the good heat conductor be made of material, for example, solder or thermally-conductive adhesive, of which thermal conductivity is equal to or greater than 0.5 W/mk. 
         [0053]    The second light-blocking portion  118  is connected to the light-absorbing element  117 , and moreover, the optical fiber  112  inserted through the second light-blocking portion  118 . As a result, the second light-blocking portion  118  prevents the light, transmitted through the glass capillary  116  and emitted from an end surface, at an emitting side, of the glass capillary  116 , from being emitted to outside the semiconductor laser module  100 . Therefore, it is preferable that the second light-blocking portion  118  be not damaged by the emitted light and be provided with, for example, such as a metal component containing Cu, Ni, stainless steel, or Fe, a member provided with a top-surface-plating layer containing Ni, Cr, Ti or the like, or a member provided with dielectric multi-layers. Moreover, it is preferable that a surface, at a side of the glass capillary  116 , of the second light-blocking portion  118  be inclined or have a curvature so that a light incident thereto is reflected in a direction leaving away from the optical fiber  112 . 
         [0054]    The first-fixing agent  119 , the second-fixing agent  120 , other ultraviolet curable resin, and silicone or the like may be filled into a space surrounded by the second light-blocking portion  118 , the light-absorbing element  117 , and the glass capillary  116 . 
         [0055]    The first-fixing agent  119  and the second-fixing agent  120  may be made of a same material or may be made of different materials, and are made of, for example, epoxy resin, and ultraviolet curable resin such as urethane-based resin or the like. It is preferable that the refractive index of the first-fixing agent  119  be equal to or higher than the refractive index of the cladding portion  112   d  of the optical fiber  112  at 25° C., and it is more preferable that the refractive index of the first-fixing agent  119  be equal to or higher than the refractive index of the cladding portion  112   d  of the optical fiber  112  at a temperature range at which the semiconductor laser module  100  is being used (for example, 15° C. to 100° C.). It is preferable that the refractive index of the second-fixing agent  120  be equal to or higher than the refractive index of the glass capillary  116  at 25° C., and it is more preferable that the refractive index of the second-fixing agent  120  be equal to or higher than the refractive index of the glass capillary  116  at a temperature range at which the semiconductor laser module  100  is being used (for example, 15° C. to 100° C.). It may be configured that the refractive indices of the first-fixing agent  119  and the second-fixing agent  120  are approximately equal to the refractive index of the glass capillary  116  and higher than the refractive index of the cladding portion  112   d  of the optical fiber  112 . In terms of the refractive indices of the first-fixing agent  119  and the second-fixing agent  120 , relative refractive-index differences thereof relative to, for example, that of the glass capillary  116  are equal to or higher than 0% and equal to or lower than 10%. It is preferable that thicknesses of the first-fixing agent  119  and the second-fixing agent  120  in a plane that is orthogonal to the longitudinal direction of the optical fiber  112  be equal to or greater than 1 μm and equal to or less than 800 μm. It has been known that the refractive index of the ultraviolet curable resin can be lowered by making the ultraviolet curable resin contain fluorine and can be increased by making the ultraviolet curable resin contain sulfur, and thus, the refractive index thereof can be adjusted by adjusting amounts of refractive-index-increasing material and refractive-index-decreasing material. 
         [0056]    Hereafter, an operation of the semiconductor laser module  100  according to the present embodiment will be explained. When electrical power is supplied from the lead pin  105 , each of the semiconductor laser elements  104 - 1  to  6  disposed on the steps outputs a laser light. Each of the outputted laser light is made become an approximate collimated light by each of the first lenses  106 - 1  to  6  and each of the second lenses  107 - 1  to  6  respectively. Then, each of the laser lights are reflected in the direction of the optical fiber  112  by each of the mirrors  108 - 1  to  6  disposed at a corresponding height. Then, each laser light is condensed by the third lens  109  and the fourth lens  111  to be coupled to the optical fiber  112 . The laser light coupled to the optical fiber  112  is guided by the optical fiber  112  to be outputted to outside the semiconductor laser module  100 . The semiconductor laser module  100  prevents unnecessary loss from being produced in the laser light by the steps of the semiconductor laser elements  104 - 1  to  6  and the mirrors  108 - 1  to  6 . In the present embodiment, if optical powers of the lights outputted from the semiconductor laser elements  104 - 1  to  6  are 11 W respectively and coupling efficiencies are 85% respectively, an optical power of the light outputted from the semiconductor laser module  100  is 56 W. 
         [0057]    Herein the way how the laser light condensed by the third lens  109  and the fourth lens  111  propagates will be explained in detail with reference to  FIG. 3 . For the purpose of simple description, in  FIG. 3 , description of refraction of the laser light L 3  which will technically occur at an interface corresponding to a refractive index difference of respective members is omitted. The laser light L condensed by the third lens  109  and the fourth lens  111  becomes a non-coupled light L 1  not being coupled to the optical fiber  112  and a light L 2  being coupled to the optical fiber  112  and propagating in the optical fiber  112 . Although almost of the light L 2  coupled to the optical fiber  112  propagates in the core portion  112   c  of the optical fiber  112 , guided and outputted to outside the semiconductor laser module  100 , a part of the light L 2  is coupled to the cladding portion  112   d  and becomes a light L 3  propagating in the cladding portion  112   d . Sometimes, a part of the light L 2  propagating in the core portion  112   c  leaks from the core portion  112   c  to become a light L 3  propagating in the cladding portion  112   d.    
         [0058]    The first light-blocking portion  113  restrains the non-coupled light L 1  from being incident to the glass capillary  116 , and absorbs a part of the non-coupled light L 1 . The heat produced by this optical absorption is radiated from the first light-blocking portion  113  to the package  101 . For restraining the non-coupled light from being incident to the glass capillary  116  reliably, the first light-blocking portion  113  is disposed at the protrusion portion  112   b  of the optical fiber  112 . For this purpose, it is preferable that the first light-blocking portion  113  be not damaged even if a part of the laser light is irradiated, and be provided with, for example, such as a metal component containing Cu, Ni, stainless steel, or Fe, a member provided with a top-surface-plating layer containing Ni, Cr, Ti or the like, or a member provided with dielectric multi-layers. For being separated from the optical fiber  112  reliably and blocking a light not coupled to the optical fiber  112  sufficiently, it is preferable that the first light-blocking portion  113  be set to have a distance (clearance) from the optical fiber  112  in a plane which is orthogonal to the longitudinal direction of the optical fiber  112 . Since a beam shape of a laser light becomes elliptic usually, it is preferable that the clearance be equal to or greater than 5 μm and equal to or less than 500 μm in the major axis direction of an ellipse. 
         [0059]    As described above, herein the light L 3  propagating in the cladding portion  112   d  is produced in the cladding portion  112   d.    
         [0060]    In the protrusion portion  112   b , the light L 3  is confined in the cladding portion  112   d  of the optical fiber  112  by the refractive index difference of the cladding portion  112   d  relative to air thereoutside and propagates in the cladding portion  112   d  of the optical fiber  112 . 
         [0061]    Then, the light L 3  reaches an interface between the cladding portion  112   d  and the first-fixing agent  119 . Herein if the refractive index of the first-fixing agent  119  is higher than the refractive index of the cladding portion  112   d , the light L 3  is likely to be transmitted through this interface. Moreover, the light L 3  is the most likely to be transmitted through this interface when the refractive indices of the cladding portion  112   d  and the first-fixing agent  119  are identical. Although the light L 3  transmitted through this interface (that is, leaking from the optical fiber  112 ) propagates in the first-fixing agent  119 , the first-fixing agent  119  is restrained from being damaged since its thickness of equal to or less than 800 μm is sufficiently thin and its optical absorption is sufficiently low. It is more preferably that the thickness of the first-fixing agent  119  be equal to or less than 5 μm. 
         [0062]    Subsequently, the light L 3  reaches an interface between the first-fixing agent  119  and the glass capillary  116 . The light L 3  is likely to be transmitted through this interface similarly if the refractive index of the glass capillary  116  is higher than the refractive index of the first-fixing agent  119 . Moreover, the light L 3  is the most likely to be transmitted through this interface when the refractive indices of the first-fixing agent  119  and the glass capillary  116  are identical. Although the light L 3  transmitted through this interface propagates in the glass capillary  116 , the light L 3  is transmitted through the glass capillary  116  since the transmissivity, for example, equal to or greater than 90%, of the light L 3  at the glass capillary  116  is sufficiently high. 
         [0063]    Subsequently, the light L 3  reaches an interface between the glass capillary  116  and the second-fixing agent  120 . The light L 3  is likely to be transmitted through this interface similarly if the refractive index of the second-fixing agent  120  is higher than the refractive index of the glass capillary  116 . Moreover, the light L 3  is the most likely to be transmitted through this interface when the refractive indices of the glass capillary  116  and the second-fixing agent  120  are identical. Although the light L 3  transmitted through this interface propagates in the second-fixing agent  120 , the second-fixing agent  120  is restrained from being damaged since its thickness of equal to or less than 800 μm is sufficiently thin and its optical absorption is sufficiently low. It is more preferable that the thickness of the second-fixing agent  120  be equal to or less than 5 μm. 
         [0064]    Subsequently, the light L 3  reaches the light-absorbing element  117 . Then, the light L 3  is absorbed by the light-absorbing element  117  having optical absorptivity, for example, equal to higher than 30%, or more preferably equal to or greater than 70% of absorptivity. Heat generated by this optical absorption is radiated from the light-absorbing element  117  to the package  101 . 
         [0065]    Herein  FIG. 6  is a schematic view showing a relationship between an angle of a light leaking from an optical fiber relative to the center of the optical fiber and an optical power thereof. The horizontal axis of  FIG. 6  indicates an angle of a light, propagating in the cladding portion  112   d  and then leaking from the optical fiber, relative to the center of the optical fiber and is an angle θ in  FIG. 3 . As shown in  FIG. 6 , the light leaking from the cladding portion  112   d  of the optical fiber  112  is emitted from the center of the optical fiber  112  to outside the angle θa. In this state, it is preferable that the glass capillary  116  be of a sufficient length so that a light outputted from the optical fiber  112  at an angle θa reaches the light-absorbing element  117 . Moreover, it is more preferable that the glass capillary  116  be of a sufficient length so that a light reflected at, but not absorbed by, the light-absorbing element  117  reaches the light-absorbing element  117  again. For length as such, the glass capillary  116  is of a length of equal to or greater than 3 mm in the longitudinal direction of the round tube. 
         [0066]    It is preferable that an inner diameter of the round tube of the glass capillary  116  be equal to or smaller than 0.13 mm for decreasing the amount of the first-fixing agent  119  sufficiently. It is preferable that the glass capillary  116  be of, or greater than, a certain thickness so that heat caused by optical absorption by the light-absorbing element  117  does not damage the first-fixing agent  119  and the coated portion  112   a  of the optical fiber  112 , and it is preferable that an outer diameter of the round tube be, for example, equal to or greater than 1.8 mm. 
         [0067]    As described above, the semiconductor laser module  100  according to the present embodiment obtains an effect below. That is, a non-coupled light is restrained from being incident to the glass capillary  116  by the first light-blocking portion  113 . As a result, the first-fixing agent  119 , the second-fixing agent  120 , and the coated portion  112   a  or the like of the semiconductor laser module  100  are restrained from being damaged by the non-coupled light. 
         [0068]    A refractive index of each member of the semiconductor laser module  100  is selected appropriately so that a light propagating in the cladding portion  112   d  is likely to leak from the optical fiber at each of interfaces of the cladding portion  112   d  to second-fixing agent  120 . Therefore, since the light leaking as such is restrained from being reflected at each interface, the light leaking as such is absorbed by the light-absorbing element  117  effectively. 
         [0069]    Moreover, since the semiconductor laser module  100  has the glass capillary  116  between the optical fiber  112  and the light-absorbing element  117 , the density of the leakage light can be reduced before the leakage light from the optical fiber  112  reaches the light-absorbing element  117 . Hereby an increase in temperature of the light-absorbing element  117  can be restrained. 
         [0070]    Moreover, since the semiconductor laser module  100  includes the light-absorbing element  117  having a optical absorptivity, the reflected light at the light-absorbing element  117  is restrained from damaging the first-fixing agent  119 , the second-fixing agent  120 , and the coated portion  112   a.    
         [0071]    Since the first-fixing agent  119  and the second-fixing agent  120  are sufficiently thin, the semiconductor laser module  100  is restrained from being damaged by optical absorption of the first-fixing agent  119  and the second-fixing agent  120 . The semiconductor laser module  100  according to the present embodiment obtains the effects described above and is a highly reliable semiconductor laser module. 
         [0072]    Moreover, since the second light-blocking portion  118  has inclination or curvature so that a light being incident thereto is reflected in a direction leaving away from the optical fiber  112 , and since the light being incident to the second light-blocking portion  118  is reflected and prevented from damaging the first-fixing agent  119  of a tapered portion of the glass capillary  116 , the semiconductor laser module  100  is a highly reliable semiconductor laser module. Since it is not preferable from a safety point of view if a light being transmitted through the glass capillary  116  leaks outside the semiconductor laser module  100 , the second light-blocking portion  118  prevents the light being transmitted through the glass capillary  116  from being emitted to outside the semiconductor laser module  100 . For this reason, the semiconductor laser module  100  is a highly safe semiconductor laser module. 
         [0073]    As described above, the semiconductor laser module  100  according to the present embodiment is a highly reliable and safe semiconductor laser module. 
       Modified Example 
       [0074]    Hereafter, a modified example of the semiconductor laser module in the above-described embodiment will be explained. The semiconductor laser module according to the modified example can be configured by replacing each of the elements of the semiconductor laser module of the above-described embodiment with elements of a modified example below. 
         [0075]    The first light-blocking portion is not limited to a shape shown in  FIG. 4 .  FIG. 7  is an enlarged schematic partially cutout view of a first light-blocking portion of a semiconductor laser module according to a modified example. As shown in  FIG. 7 , a first light-blocking portion  213  may be a first light-blocking portion  213  which is a round disk provided with a hole through which, for example, an optical fiber  212  is inserted. The first light-blocking portion  213  is mounted on a pedestal  213   a  fixed on a package  201 . As described above, the first light-blocking portion  213  is not limited to a specific shape as long as the first light-blocking portion  213  is capable of restraining a non-coupled light from being incident to a glass capillary. 
         [0076]    The glass capillary as an optical component may have a refractive index profile in a cross section which orthogonal to the longitudinal direction of the optical fiber.  FIG. 8  is a schematic view showing refractive index of a cross section orthogonal to the longitudinal direction of the optical fiber of the glass capillary of the semiconductor laser module according to the modified example. As shown in  FIG. 8 , the glass capillary of the modified example is made higher in its refractive index, if being more distant from its center, in the cross section orthogonal to the longitudinal direction of the optical fiber. As a result, this glass capillary is capable of causing the incident light to escape thereoutside effectively. Therefore, the glass capillary of the modified example is capable of further increasing reliability of the semiconductor laser module. 
         [0077]    Moreover, it is preferable that the glass capillary as an optical component restrain a light emitted from the optical fiber to the glass capillary from returning to the optical fiber.  FIGS. 8 to 11  are schematic cross-sectional views of the cross section orthogonal to the longitudinal direction of the optical fiber of the glass capillary of the semiconductor laser module according to the modified example. 
         [0078]    As shown in  FIG. 9 , although a glass capillary  316  of the modified example is round-shaped in the cross section orthogonal to the longitudinal direction of the optical fiber, the center of a through hole  316   a  is eccentric from the center C of the glass capillary  316 . That is, an optical fiber is inserted through the glass capillary  316  at a position that is eccentric from the center C. As a result, the glass capillary  316  restrains a light emitted from the optical fiber to the glass capillary  316  from being reflected by the light-absorbing element and returning to the optical fiber. 
         [0079]    As shown in  FIG. 10 , a glass capillary  416  of a next modified example may be rectangular in the cross section orthogonal to the longitudinal direction of the optical fiber. As a result, the glass capillary  416  restrains a light emitted from the optical fiber to the glass capillary  416  from being reflected by the light-absorbing element and returning to the optical fiber. Similarly, the glass capillary may be of a polygonal shape, a flower shape, or a star shape or the like in the cross section orthogonal to the longitudinal direction of the optical fiber. 
         [0080]    As shown in  FIG. 11 , a glass capillary  516  may be a two-core capillary provided with two through holes as a through hole  516   a  and a through hole  516   b  extending in the longitudinal direction of the optical fiber. An optical fiber is inserted through one of the through hole  516   a  and the through hole  516   b  of the glass capillary  516 . Both the through hole  516   a  and the through hole  516   b  are disposed to be eccentric from the center of the glass capillary  516 . As a result, in the glass capillary  516 , a light emitted from the optical fiber to the glass capillary  516  is restrained from being reflected by the light-absorbing element and returning to the optical fiber. 
         [0081]    In the glass capillaries of the modified examples described above, since the light emitted from the optical fiber to the glass capillary is restrained from returning to the optical fiber, the first-fixing agent, the second-fixing agent, and the coated portion of the optical fiber are restrained from being damaged by the light reflected by the light-absorbing element. Therefore, the glass capillaries of the modified examples are capable of increasing reliability of the semiconductor laser module. 
         [0082]    As shown in  FIG. 12 , a glass capillary  616  of another modified example may be provided with a light-scattering means as, for example, a bubble  616   b . As a result, the glass capillary  616  is capable of making the light being incident from the cladding portion be scattered by the bubble  616   b  to be absorbed by the light-absorbing element effectively. This glass capillary restrains the first-fixing agent, the second-fixing agent, and the coated portion or the like of the optical fiber from being damaged by making the light-absorbing element absorb the light emitted from the optical fiber to the glass capillary effectively. Therefore, the glass capillaries of the modified examples are capable of increasing the reliability of the semiconductor laser module. 
         [0083]    The light-absorbing element may have a profile for an optical absorptivity at a wavelength of the laser light along the longitudinal direction of the optical fiber.  FIG. 13  is a schematic view showing a relationship between distance from an end surface, at an incident side, of the glass capillary in the longitudinal direction of the optical fiber and optical absorptivity of the light-absorbing element of the semiconductor laser module according to the modified example. As shown in  FIG. 13 , optical absorptivity of a light-absorbing element  717  according to the modified example is made higher at a side emitting a laser light than at a side into which the laser light is incident. In this state, as shown in  FIG. 13 , optical absorptivity of the light-absorbing element  717  is higher at a position where a laser light L, as a light leaking from, for example, the cladding, is reflected once by the light-absorbing element  717  and is irradiated to the light-absorbing element  717  for the second time than at a position where the laser light L is irradiated to the light-absorbing element at first. This results in restraining the second-fixing agent from being damaged by heat produced by optical absorption concentrated at a side into which the laser light L is incident. Therefore, the light-absorbing element  717  of the modified example is capable of increasing the reliability of the semiconductor laser module. 
         [0084]    As a specific example of the light-absorbing element having a profile of optical absorptivity, average surface roughness of a plane, of the light-absorbing element of the modified example, fastened to the glass capillary is made smaller at a side of the fourth lens (light-incident-side) along the longitudinal direction of the optical fiber. Herein the absorptivity of metal becomes higher if the surface roughness of the plane into which a light is incident is greater. Therefore, the optical absorptivity of this light-absorbing element is smaller at the side of the fourth lens. That is, in this light-absorbing element, the second-fixing agent is restrained from being damaged by heat produced by optical absorption concentrated at a side into which the laser light L is incident. Therefore, the light-absorbing element of the modified example is capable of increasing the reliability of the semiconductor laser module. 
         [0085]      FIG. 14  is an enlarged schematic cross-sectional view of an optical fiber, a glass capillary, and a light-absorbing element of the semiconductor laser module according to the modified example. As the first light-blocking portion and the second light-blocking portion, a first light-blocking portion  113 A and a second light-blocking portion  118 A shown in  FIG. 14  may be provided instead of the first light-blocking portion  113  and the second light-blocking portion  118  shown in  FIGS. 2 and 3 . These first light-blocking portion  113 A and the second light-blocking portion  118 A are dielectric multi-layers formed at an end surface of the glass capillary  116 . It is preferable that reflectivity of this dielectric multi-layer be equal to or greater than 90% at wavelengths of laser lights outputted by the semiconductor laser elements  104 - 1  to  6 . It is preferable that a distance (clearance) between the first light-blocking portion  113 A and the optical fiber  112  be equal to or greater than 5 μm and equal to or less than 500 μm in a major axis direction of a beam, shaped in ellipse, of the laser light. Although the second light-blocking portion  118 A shown in  FIG. 14  is formed from an end surface of the glass capillary  116  to a tapered portion of the through hole, the second light-blocking portion  118 A may not be formed at the tapered portion alternatively. 
         [0086]    By providing the second light-blocking portion  118 A, it is possible to restrain the light, transmitted through the glass capillary  116  and emitted from the end surface, at an emitting side, of the glass capillary  116  from being emitted to outside the semiconductor laser module  100  and make the light-absorbing element  117  absorb the light. 
         [0087]    The semiconductor laser module may be provided with various kinds of radiation structure. As a result, semiconductor laser module is capable of restraining the second-fixing agent from being damaged by temperature increased by optical absorption of the light-absorbing element. For such radiation structures, a radiation structure being provided with a fin air-cooling an light-absorbing element or a package and a radiation structure or the like being provided with a circulation pump and cooling a light-absorbing element or a package with water or various kinds of refrigerant can be chosen. 
         [0088]    As described above, the semiconductor laser module of the present embodiments or the modified examples is a highly reliable semiconductor laser module. 
         [0089]    The present invention is not limited to the above-described embodiments. The present invention includes a configuration appropriately combining the above-described elements. Further effects or modification examples can be derived by an ordinary skilled person in the art easily. Therefore, further wide aspects of the present invention are not the above-described embodiments, and various modifications may be made. 
         [0090]    As described above, the semiconductor laser module according to the present invention is suitable mainly for use in high-output semiconductor laser module. 
         [0091]    Although the invention has been described with respect to specific embodiments for a complete and clear disclosure, the appended claims are not to be thus limited but are to be construed as embodying all modifications and alternative constructions that may occur to one skilled in the art that fairly fall within the basic teaching herein set forth.
A semiconductor laser module includes a package; a plurality of semiconductor laser elements provided in the package; a member having a plurality of mounting surfaces on which the semiconductor laser elements are mounted, the mounting surfaces being separated from a bottom surface of the package by respective distances, the distances being gradually different from each other in a manner that the mounting surfaces as a whole form a step-like form; a plurality of lenses collimating respective laser beams emitted from the semiconductor laser elements; a plurality of reflection mirrors reflecting the respective laser beams; a condenser lens unit condensing the laser beams; an optical fiber where the optical beams condensed by the condenser lenses are optically coupled; and an optical filter disposed on optical lines of the respective laser beams reflected by the reflection mirrors and reflecting light having wavelengths different from the wavelengths of the laser beams.