RELATED APPLICATIONS 
     This application relates to and claims the filing date of Provisional Application Serial No. 60/181,504, filed Feb. 10, 2000 and further relates to and claims the filing date of Provisional Application Serial No. 60/224,062, filed Aug. 9, 2000. 
    
    
     BACKGROUND OF THE INVENTION 
     This invention relates to semiconductor device packages and the method of making such packages and more specifically relates to a chip-scale package and method of its manufacture. 
     Semiconductor device packages are well known for housing and protecting semiconductor die and for providing output connections to the die electrodes. Commonly, the semiconductor die are diced from a large parent wafer in which the die diffusions and metallizing are made in conventional wafer processing equipment. Such die may be diodes, field effect transistors, thyristors and the like. The die are fragile and the die surfaces must be protected from external environment. Further, convenient leads must be connected to the die electrodes for connection of the die in electrical circuits. 
     Commonly, such die are singulated from the wafer, as by sawing, and the bottom of the die is mounted on and connected to a portion of a circuit board which has conforming sections to receive respective die. The top electrodes of the die are then commonly wire bonded to other portions of the circuit board, which are then used for external connections. Such wire connections are delicate and slow the mounting process. They also provide a relatively high resistance and inductance. 
     It is desirable in many applications that the packaged semiconductor devices be mountable from one side of the package, to enable swift and reliable mounting on a circuit board, as well as low resistance connections. 
     SUMMARY OF THE INVENTION 
     This invention provides a novel semiconductor die package comprising a “flip-chip” that is mountable on a circuit board or other electronic interface using one surface of the chip. In particular, the package has contacts, for example, gate, source and drain electrode contacts (for a MOSFET) on the same side of the package, and can be mounted by forming solder ball contacts on the surface of the chip which interface with the external gate, source and drain connections respectively on the circuit board. 
     The source connection to the chip is made with solder balls on the source electrode of the chip, the solder balls being positioned so that they will interface with appropriate source electrical connections on the circuit board. The package is configured so that the drain electrode is on the same surface. 
     In one embodiment, the active junctions reside in a layer of relatively low carrier concentration (for example P − ) below the source electrode and above a substrate of relatively high carrier concentration of the same type (for example, P + ). At least one drain electrode is positioned on the same surface at a region separate from the source electrode. A diffusion region or “sinker” extends from and beneath the top drain electrode, through the layer of relatively low carrier concentration to the substrate. The diffusion region has the same carrier concentration and type as the substrate (for example, P + ). Thus, an electrical path is established from the source electrode, through the active elements, and into the substrate, through the diffusion region and to the top drain electrode. 
     As noted, the drain electrode is on the same surface as the source and gate electrodes and can thus be mounted to the circuit board using solder balls that correspond to locations of appropriate external drain connections. 
     In another embodiment, instead of using diffusion regions beneath the drain contacts, the layer of relatively low carrier concentration may be etched to the substrate and filled with the drain electrode. This may be done concurrently with the step of etching trenches for a vertical conduction trench-type device, for example. 
     In a still further embodiment of the invention, two vertical conduction MOSFET devices are formed in a common chip, with their source regions being laterally interdigitated and with a common drain substrate. This structure forms an inherent bidirectional switch. All contacts are available at the top surface, and the contact balls may be located along straight rows which may be symmetrical around a diagonal to a rectangular chip to simplify connection to a circuit board support. The bottom of the chip may have a thick metal layer to provide a low resistance current path between adjacent devices with common drains. It can also improve thermal conduction when the chip is mounted with its top surface facing a printed circuit board support. 
     Other features and advantages of the present invention will become apparent from the following description of the invention which refers to the accompanying drawings. 
    
    
     BRIEF DESCRIPTION OF THE DRAWINGS 
     FIG. 1 is a perspective view of a first embodiment of the invention. 
     FIG. 2 is a top view of the metallizing pattern of the device of FIG. 1, prior to the formation of the contact bumps. 
     FIG. 3 shows the wafer of FIG. 2 after the formation of solder bumps. 
     FIG. 4 is a cross section of FIG. 2 taken through a small area corresponding to the area at section line  4 — 4  in FIG. 2, and shows the source and drain top metallizations. 
     FIG. 5 is a layout showing the size and spacing of the contact balls of FIGS. 1 and 3. 
     FIG. 6 is a cross-section of FIG. 2 taken across section line  6 — 6  in FIG.  2  and across the gate bus. 
     FIG. 7 shows the use of a P +  sinker diffusion to enable the connection of a top contact of drain metal to the P +  substrate. 
     FIG. 8 shows a modified contact structure for making contact from the top surface drain of FIG. 4 to the P +  substrate. 
     FIG. 9 is a top view of the metallized top surface of another embodiment of the invention. 
     FIG. 10 shows FIG. 9 with rows of contact balls in place. 
     FIG. 11 is a cross-section of FIG. 9 for a planar junction pattern instead of the trench structure of FIG.  4 . 
     FIG. 12 is a cross-section of a further embodiment of the invention which is similar to that of FIG. 4 but uses two MOSFETs in a common chip, producing a bidirectional conduction device and is a cross-section of FIG. 14 taken across section line  12 — 12  in FIG.  14 . 
     FIG. 13 is a circuit diagram of the device of FIG.  12 . 
     FIG. 14 is a top view of a device such as that of FIGS. 12 and 13. 
     FIG. 15 is a front view of the device of FIG.  14 . 
     FIGS. 16 to  19  show further varients of the device of FIG.  14 . 
     FIG. 20 shows a cross-sectional view of a lower surface of a die according to the present invention. 
    
    
     DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS 
     FIGS. 1 to  6  show a first embodiment of the invention which is in the form of a flip-chip power MOSFET having all electrodes in one planar surface and having contact bumps to enable contact to traces or other electrical conductors of a support structure such as a printed circuit board. The device to be described could be any other type device such as a P/N or Schottky diode, an IGBT, a thyristor, an integrated circuit die having plural components and the like. Further, the device of FIGS. 1 to  6  is shown as a P channel device. The conductivity types can be reversed to make an N channel device. Further, the device of FIGS. 1 to  6  is shown as a trench type device, but it could be a planar cellular or stripe structure as well as will be later described. 
     The completed device, ready for mounting, is shown in FIG.  1  and consists of a silicon die  30  having upper source electrode metallizing  31  (usually aluminum which may be from 2 microns to 8 microns thick), drain electrode metallizing  32  and gate electrode metal pad  33  (FIG. 2) and gate bus  34 . 
     The die is processed in wafer form, as partly shown in FIGS. 2 and 3. Contact balls are formed on the wafer, shown in FIGS. 1,  3  and  4  as source contact ball  40  on source metal  31 , drain contact balls  41  and  42  on drain contact metallizing  32  and gate contact ball  43  on gate pad metallizing  33 . The die within the wafer are then singulated and are ready for assembly on a circuit board or the like. 
     FIGS. 4 and 6 show a trench-type power MOSFET geometry for the device of FIGS. 1 and 3. Thus, for a P channel device, a P +  silicon substrate  50  is used and a lower concentration P type, junction receiving layer  51  is epitaxially grown atop P +  substrate  50 . An N type base or channel diffusion  52  (FIGS. 4 and 5) is then formed. 
     Thereafter, and using conventional techniques, a plurality of parallel trenches  60 ,  61 , (FIG. 4) or an array of intersecting trenches forming isolated mesa regions. A thin insulation layer, such as silicon dioxide is then grown on the walls of each of trenches  60  to  64 , shown as gate insulation layers  70  to  74  respectively. A conductive polysilicon gate  75  is then deposited into each of the trenches and over the gate oxide layers and is then etched away to leave polysilicon only in the trenches and gate bus and pad regions. After that, a TEOS layer  80  is deposited and patterned, leaving insulation caps  76  and  77  (which may be TEOS) over the top of the polysilicon  75  in trenches  60  and  61  (FIG.  4 ). 
     A P +  source diffusion  53  is formed in the top of N diffusion  52  are etched through layers  52  and  53 . Contact openings  81  and  82  (FIG. 4) are next etched through the P +  source layer  53  and into channel layer  52 , and N +  contact diffusions are formed in the bottoms of openings  81  and  82 . The dielectric material is then etched laterally to expose a portion at the source regions on the die surface for contact. A continuous aluminum layer is then deposited atop the surface of the device, with the aluminum contacting the P +  source regions  53  and N type channel regions  52 . This aluminum layer is separated, by etching, into source contact  31 , drain contact  32  and gate pad  33 . 
     FIG. 5 shows the novel configuration of contact balls  40  and  41 . These solder balls are formed by a well known process employing a nickel-gold plating, followed by the stencil printing of solder, and flowing the solder to form balls. Thus, the solder balls or bumps are on 0.8 mm centers which is a wider pitch than is conventionally used. By using a pitch of 0.8 mm or larger, the flip chip structure of the invention can mimic the application and attachment of conventional chip scale packages to a circuit board with conventional traces, using conventional surface mount techniques. The solder balls  40  and  41  are conventionally thermosonically welded onto a surface, but have a larger diameter than those previously used, for example, 200μ or greater, compared to the standard 150μ. By using a larger diameter, thermal conduction is enhanced and resistance to thermal fatigue is improved. 
     In FIG. 4, the drain metal  32  is shown as contacting an upwardly extending portion of P +  substrate  50 . This is a schematic representation, and in practice, the contact from surface drain  32  to P +  substrate  50  is made as shown in FIG. 7 or  8 . Thus, in FIG. 7, a P +  “sinker” diffusion  90  is employed to make the contact. In FIG. 8, a trench  91  is formed, as during the trench etching process for making the active area, and is filled with metal or conductive polysilicon  92 . 
     The operation of the device of FIGS. 1 to  8  will be apparent to those of ordinary skill. Thus, to turn the device on, and with suitable potentials applied to the source and drain electrodes  31  and  32 , the application of a gate potential to gate  75  will cause the N type silicon adjacent the gate oxide layers  70  to  74  to invert to the P type, thus completing a circuit from source electrode  31 , through source regions  53 , through the inversion regions to P region  51 , P +  substrate  50  and then laterally through P +  substrate  50  and upwardly (through regions  90  or  92 ) to drain electrode  31 . 
     The novel device of FIGS. 1 to  8  brings the size of the device ready for mounting to a minimum; that is, to the size of the die. The die itself has an extremely low RDSON, using a vertical construction, cellular trench technology. For example, the design can employ over 110×10 6  cells per in 2 . However, unlike the standard trench FET design, the drain connection is brought to the front or top of the die. There is no need for back-grinding the bottom die surface or for metal deposition on the bottom surface of the die. By not back grinding, the thicker P +  substrate allows for lower lateral resistance to flow of drain current. Preferably, the bottom of die  30  surface may be rough and unpolished to increase its surface area to assist in heat removal from the chip, as illustrated in FIG.  20 . 
     After metal, a silicon nitride (or other dielectric) passivation layer is deposited. The silicon nitride passivation is patterned to leave 4 openings per die with a pitch, for example, of 0.8 mm. The die size may typically be about 0.060″×0.060″. Larger devices of 0.123″×0.023″ are also typical. The silicon is so designed as to provide a 20 volt P-channel device with an R*A of 46.8 ohm-mm 2  at Vgs of 4.5 volt. 
     While a metal layer is not required on the bottom surface of substrate  50 , it can be useful to use such a metal layer as a current conductor or to make thermal contact to a heat sink. 
     Other surface geometries, with a larger number of solder balls for higher current capacity can also be used. Thus, as shown in FIGS. 9 and 10, a larger die  100  can be laid out so that its top surface provides a source electrode  101 , two drain electrodes  102  and  103  bordering the opposite edges of the die  100  and a gate pad  104  with runners or bus  105 ,  106 . As shown in FIG. 10, each of drain electrodes  102  and  103  receive 5 solder balls, aligned in respective rows, and source  101  receives 8 solder balls also aligned in parallel rows. A single solder ball is connected to gate pad  104 . By aligning the solder balls in respective parallel rows, the respective conductive traces on the printed circuit board receiving the device can be laid out in simple straight lines. 
     FIG. 11 shows how the device of FIG. 9 can be carried out with planar technology, and as an N channel device. Thus, in FIG. 11, die  100  is formed with an N +  substrate  110 , an N type epitaxial (epi) layer  111  and with spaced polygonal P channel diffusions  112 ,  113 ,  114 . Each of diffusions  112 ,  113  and  114  receives an N +  source diffusion  115 ,  116  and  117  respectively and a P +  contact diffusion  118 ,  119  and  120  respectively. A suitable gate structure, including a polysilicon gate latice  121  overlies a conventional gate oxide and is covered by an insulation layer  122  to insulate the gate latice from overlying source electrode  101  which contacts the source regions and channel regions in the usual manner. An N +  sinker provides a conductive path from the N +  substrate to drain electrode  103 . 
     It is also possible to make the die with bidirectional conduction characteristics in which two series connected MOSFETs are integrated into a single chip. Thus, as shown in FIG. 12 the die can be formed in the manner of FIGS. 1 through 8 for a P channel trench implementation. Thus, using the numerals used in FIGS. 1 to  8 , the bidirectional die  130  of FIG. 12 integrates two such devices in a single die. The two devices are identified with the numerals of FIG. 4, followed by an “A” and a “B” respectively, but with a common substrate  50 . Two respective gate structures will also be provided, each having the structure of FIGS. 5 and 6. A substrate metallization  131  is also shown. 
     The circuit diagram of the bidirectional device is shown in FIG.  13  and consists of two MOSFETs  140  and  141  having respective source terminals S 1  and S 2 , respective gate terminals G 1  and G 2  and a common drain  50 ,  131 , thereby to form the bidirectional conduction circuit. MOSFETs  140  and  141  are vertical conduction devices with respective body diodes (not shown in FIG. 13) which conduct when the other MOSFET is turned on. 
     FIGS. 14 and 15 show a top view of the chip or die  130  of FIG.  12 . The chip  130  may have the bottom conductive drain electrode  131  (FIG. 15) and will have respective gate ball electrodes G 1  and G 2  which may have respective gate runners or bus  142  and  143  respectively. Drain  131  electrode may be a thick low resistance metal layer (as compared to the conventional source electrode thickness). The bottom conductor  131  may be eliminated if P +  substrate  50  has a high enough conductivity, but it can be useful as a heat sink. 
     The source electrodes of each of FETs  140  and  141  have two or more electrode bumps S 1  and S 2  as shown in FIG.  14 . The distance between the S 1  bumps and G 1  bump is equal; as is the distance between the S 2  bumps and the G 2  bump. 
     In accordance with a further aspect of the invention, the height of chip or die  130  is greater than its width. Thus, it is a non-square, elongated rectangle. Further, the die bumps S 1 , S 2 , G 1  and G 2  are symmetric around a diagonal of the die  130 , shown as dotted line diagonal line  150  in FIG.  14 . Thus, the source and gate electrodes will be in the same location regardless of the up/down orientation of the chip. Since the die has rotational symmetry, no pin marking is necessary and simple pattern recognition apparatus can determine die orientation or placement during attachment to a surface. 
     As pointed out previously, and in accordance with the invention, the source balls S 1  are in a line or row which is spaced from and parallel to the line of source balls S 2 . 
     FIGS. 16,  17 ,  18  and  19  show alternate arrangements for FET 1  (FET  140 ) and FET 2  (FET  141 ) of FIGS. 13,  14  and  15  where similar numerals identify similar parts. The silicon die of FIGS. 16 to  19  may have an area of about 0.120″×0.120″. Note that in each case, source balls S 1  and S 2  lie in respective vertical and parallel rows, making it easy to use straight conductors for their parallel connection by either straight metal strips or straight metalizing lines on a printed circuit board. Further note that the sources of FETs  140  and  141  are interdigitated in FIGS. 17,  18  and  19  increasing the area of their connection. The arrangement of FIG. 19 is particularly advantageous, because it minimizes the distance current has to travel in the substrate, while keeping the two source metal bump sets together. In this way, both substrate and metal resistance are very low, while board level connection is very easy. 
     Although the present invention has been described in relation to particular embodiments thereof, many other variations and modifications and other uses will become apparent to those skilled in the art. It is preferred, therefore, that the present invention be limited not by the specific disclosure herein, but only by the appended claims.
A flip-chip MOSFET structure has a vertical conduction semiconductor die in which the lower layer of the die is connected to a drain electrode on the top of the die by a diffusion sinker or conductive electrode. The source and gate electrodes are also formed on the upper surface of the die and have coplanar solder balls for connection to a circuit board. The structure has a chip scale package size. The back surface of the die, which is inverted when the die is mounted may be roughened or may be metallized to improve removal of heat from the die. Several separate MOSFETs can be integrated side-by-side into the die to form a series connection of MOSFETs with respective source and gate electrodes at the top surface having solder ball connectors. Plural solder ball connectors may be provided for the top electrodes and are laid out in respective parallel rows. The die may have the shape of an elongated rectangle with the solder balls laid out symmetrically to a diagonal to the rectangle.