BACKGROUND OF THE INVENTION 
       [0001]    1. Field of the Invention 
         [0002]    The present invention generally relates to a cooling technique, in particular, to a cooling structure, applicable to a machine case requiring cooling in a computer, and especially adaptable to a machine case in an industrial computer. 
         [0003]    2. Description of Prior Art 
         [0004]    At present, cooling problem has become a crucial factor influencing the operation of current computer or relative multimedia computer host. Its importance is without mention, because computer requires an enhancing function day by day. 
         [0005]    Regarding to the cooling requirement for any heating source in a computer, the prior art is not only to provide a most basically needed cooling capability, but also to continuously research and develop toward the improvement of cooling efficiency. However, in terms of desktop computer or laptop computer, since they have an inevitable trend in standardized design, so their corresponding cooling structure or device also has a specifically disposing position and relationship. Therefore, they sometimes resort to redesign, only aiming to improve the cooling efficiency, without considering the match up of different interior structures in various computers at times. However, with respect to industrial computer, because the positions of electronic heating components disposed therein are sometimes changed according to different functions of various models, different cooling structures or devices must be customized according to different models, and thus the correspondingly disposing position and relationship may be then fulfilled. Accordingly, if a cooling structure capable of being adjusted in corresponding to different positions of heating sources is proposed, then it can be applied so comprehensively to any type of industrial computer that a large amount of human labor and material resource regarding to R&amp;D may be saved. 
         [0006]    Accordingly, aiming to solve aforementioned shortcomings, after a substantially devoted study, in cooperation with the application of relatively academic principles, the inventor has finally proposed the present invention that is designed reasonably to possess the capability to improve the prior arts significantly. 
       SUMMARY OF THE INVENTION 
       [0007]    The invention is mainly to provide a mobile cooling structure and a machine case having the same through a special design of rail, by which the cooling structure may be freely adjusted to specific positions in corresponding to the disposing positions of the electronic heating components in various machine cases, and thus a more flexibility may be achieved. 
         [0008]    The invention is to provide a mobile cooling structure particularly arranged in a machine case to facilitate a heating component arranged therein for a heat conduction. The cooling structure includes: two rails, respectively arranged on two inner side faces of the machine case; a heat-conducting plate, arranged between two rails; at least one heat pipe, attached onto the heat-conducting plate; and a heat-conducting block. According to the present invention, the heat-conducting plate is glided, in cooperation with two rails, to a corresponding position, where an electronic heating component is intended to be cooled. Then, the heat-conducting block is engaged between the heat-conducting plate and the electronic heating component to undertake a heat-transferring contact, making the heat generated from the electronic heating component conducted to the heat-conducting plate and then extended toward the positioning direction of two rails in the heat-conducting plate through the heat pipe, thereby, the heat being able to be conducted to the machine case for facilitating a cooling effect. 
         [0009]    The invention is also to provide a machine case having the aforementioned cooling structure. According to the present invention, the machine case is to provide a motherboard disposed therein, on which an electronic heating component is arranged. Meanwhile, the machine case has two cooling lids interspaced in parallel to each other and a cooling structure therein. The cooling structure includes: two rails, respectively arranged on two inner side faces of the machine case; a heat-conducting plate, arranged between two rails; at least one heat pipe, attached onto the heat-conducting plate; and a heat-conducting block. According to the present invention, the heat-conducting plate is glided, in cooperation with two rails, to a corresponding position, where the electronic heating component is intended to be cooled. Then, the heat-conducting block is engaged between the heat-conducting plate and the electronic heating component to undertake a heat-transferring contact, making the heat generated from the electronic heating component conducted to the heat-conducting plate, and then extended toward the positioning direction of two rails in the heat-conducting plate through the heat pipe, thereby, the heat being able to be conducted to the machine case for facilitating a cooling effect. 
     
    
     
       BRIEF DESCRIPTION OF DRAWING 
         [0010]    The features of the invention believed to be novel are set forth with particularity in the appended claims. The invention itself, however, may be best understood by reference to the following detailed description of the invention, which describes a number of exemplary embodiments of the invention, taken in conjunction with the accompanying drawings, in which: 
           [0011]      FIG. 1  is an explosive illustration for showing an interior of a machine case according to the present invention; 
           [0012]      FIG. 2  is an assembled illustration for showing an interior of a machine case according to the present invention; 
           [0013]      FIG. 3  is a cross-sectional illustration for showing an interior of a machine case according to the present invention; 
           [0014]      FIG. 4  is a cross-sectional illustration for showing a heat-conducting block in a machine case according to another embodiment of the present invention; and, 
           [0015]      FIG. 5  is an explosive illustration for showing an interior of a machine case according to a further embodiment of the present invention. 
       
    
    
     DETAILED DESCRIPTION OF THE INVENTION 
       [0016]    In cooperation with attached drawings, the technical contents and detailed description of the present invention are described thereinafter according to a number of preferable embodiments, being not used to limit its executing scope. Any equivalent variation and modification made according to appended claims is all covered by the claims claimed by the present invention. 
         [0017]    Please refer to  FIG. 1  and  FIG. 2 , which respectively are an explosive illustration and an assembled illustration for showing an interior of a machine case according to one preferable embodiment of the present invention. The invention is to provide a mobile cooling structure and a machine case having it. The machine case  1  may be a machine case of industrial computer and includes two cooling lids  10  interspaced in parallel to each other, a supporting plate  11  laid between two cooling lids  10 , and an outer shell  12  accommodating the supporting plate  11  therein. 
         [0018]    According to above description, two cooling lids  10  are all constructed by metallic materials with excellent cooling quality and have a plurality of cooling fins  100  arranged on outer side faces thereof. The supporting plate  11  is horizontally connected between two inner side faces of two cooling lids  10  in a lower position of the machine case  1 , such that a motherboard  2  is fixedly disposed on the supporting plate  11 . Furthermore, the outer shell  12  is assembled between two cooling lids, as shown in  FIG. 2 , making the motherboard  2  accommodated in the machine case  1 . 
         [0019]    Please refer to  FIG. 1  and  FIG. 3  together. In this preferable embodiment, the motherboard  2  has at least one electronic heating component  20  arranged thereon, for example, CPU. The cooling structure of the invention is provided for undertaking a cooling process to the electronic heating component  20  on the motherboard  2 . The cooling structure  3  includes: two rails  30 ; a heat-conducting plate  31  capable of gliding on the rails  30 ; at least one heat pipe  32 , attached on the heat-conducting plate  31 ; and a heat-conducting block  33  thermally contacted under the heat-conducting plate  31 . In this case, two rails  30  are respectively arranged on each inner side face of two cooling lids  10  in an upper position of the machine case  1 . Two rails  30  are arranged horizontally, corresponded to each other, and extended along a longitudinal direction of two cooling lids  10 , making the heat-conducting plate  31  capable of being moved between two cooling lids  10  horizontally, by arranging the heat-conducting plate  31  along a longitudinal direction of two rails  30 . Two rails  30  are respectively constructed by two side plates  300 , which are formed as long stripes  300 , interspaced to each other vertically, and arranged on the inner side faces of the cooling lids  10 . 
         [0020]    In this case, the heat-conducting plate  31  includes: a plate body  310 , formed as a flat plate; and two gliding arms  311  extended from the plate body  310 . Two gliding arms  311  can be respectively cooperative with aforementioned two rails  30 , as shown in  FIG. 3 , making the plate body  310  laid between two rails  30 . The heat-conducting plate  31  can be displaced along a longitudinal direction of two rails  30 , by the cooperation between its gliding arms  311  and the rails  30 . In addition, the heat-conducting plate  31  can be further arranged a groove  312 , which is extended from the plate body  310  toward two gliding arms  311 , such that the heat pipe  32  may be embedded in the groove  312  cooperatively. 
         [0021]    Accordingly, as shown in  FIG. 3 , the heat-conducting plate  31  is firstly moved along two rails  30 , making the plate body  310  of the heat-conducting plate  31  moved to a position, which is above an electronic heating component  20  of a motherboard  2 , such that the heat-conducting block  33  is engaged between the heat-conducting plate  31  and the electronic heating component  20 . After the heat-conducting block  33  has contacted with the electronic heating component  20 , the heat generated from the electronic heating component  20  may be transferred to the heat-conducting plate  31  via the heat-conducting block  33 . The heat absorbed by the heat pipe  32  arranged on the heat-conducting plate  31  is further transferred to at least one gliding arm  311 , which contacts with two cooling lids  10 , or the heat can be conducted to the cooling lids  10  through two side plates  300 . In the cooling lids  10 , the conducted heat may be dissipated to the ambience via a plurality of cooling fins  100  arranged thereon. 
         [0022]    Thereby, according to aforementioned structural composition, a mobile cooling structure and a machine case having it of the present invention may be obtained. 
         [0023]    Furthermore, as shown in  FIG. 4 , regarding to the cooling requirement of a plurality of electronic heating components  20 , an extending plate  330  may be extended laterally from the bottom of the heat-conducting block  33  and contacted with other heat sources, such that the all heat generated from each heat sources on the motherboard  2  may be conducted out via the heat-conducting block  33 . 
         [0024]    In addition, as shown in  FIG. 5 , a specific aforementioned groove  312  in the heat-conducting plate  31  may be respectively corresponded to two gliding arms  311 . Since an aforementioned heat pipe  32  is respectively embedded in the groove  312 , two heat pipes  32  may be respectively corresponded to a gliding arm  311  to conduct heat. 
         [0025]    Therefore, a mobile cooling structure and a machine case having the cooling structure according to the present invention may be adjusted, in corresponding to the positions of the electronic heating components  20  in a machine case  1 , and particularly adaptable to an industrial computer. The positions of the electronic heating components  20  in an industrial computer are so frequently changed due to the differences of machine model that the cooling structure  3  of the invention as aforementioned is indeed needed. Especially, the invention applies two rails  30 , which are capable of position adjusting function to fulfill the cooling requirement needed by the heat sources in each kind of industrial computers. 
         [0026]    Summarizing aforementioned description, the invention is an indispensable product of novelty indeed, which may positively reach the expected usage objective for solving the drawbacks of the prior arts, and which extremely possesses the innovation and progressiveness to completely fulfill the applying merits of new type patent, according to which the invention is thereby applied. Please examine the application carefully and grant it as a formal patent for protecting the rights of the inventor. 
         [0027]    However, the aforementioned description is only a preferable embodiment according to the present invention, being not used to limit the patent scope of the invention, so equivalently structural variation made to the contents of the present invention, for example, description and drawings, is all covered by the claims claimed thereinafter.
A cooling structure, through a design of rail installed on an inner wall of a machine case, can be adjusted in corresponding to various electronic heating components disposed in the machine case, and freely moved to a position, where an electronic heating component is needed to conduct heat generated thereof to the machine case.