CROSS REFERENCE TO RELATED APPLICATIONS 
       [0001]    This application is a division of, and claims priority to, U.S. Non-Provisional patent application Ser. No. 11/080,361, filed Mar. 15, 2005, and titled, “LID FOR A SEMICONDUCTOR DEVICE PROCESSING APPARATUS AND METHODS FOR USING THE SAME” (Attorney Docket No. 9109), which claims priority to U.S. Provisional Patent Application Ser. No. 60/553,314, filed Mar. 15, 2004, and titled, “LID FOR A SEMICONDUCTOR DEVICE PROCESSING APPARATUS” (Attorney Docket No. 9109/L). Both of these patent applications are hereby incorporated by reference herein in their entirety for all purposes. 
     
    
     FIELD OF THE INVENTION 
       [0002]    The present invention relates generally to semiconductor device manufacturing, and more particularly to a lid for a semiconductor device processing apparatus and methods for using the same. 
       BACKGROUND OF THE INVENTION 
       [0003]    A semiconductor device processing apparatus, such as a substrate device, may include a lid. The lid may prevent fluids, such as chemistries or water (e.g., deionized (DI) water) employed during semiconductor device processing, from entering or escaping the semiconductor device processing apparatus. A conventional lid may include a cover which defines an opening. Further, the lid may include a sliding door which slides over the opening defined by the cover and prevents fluids from entering or escaping from the semiconductor device processing apparatus. 
         [0004]    During semiconductor device processing chemistries may contact the cover and sliding door and form a residue on the lid of the processing apparatus. Such a residue may cause the lid to malfunction (e.g., stick) during semiconductor device processing. Further, because the cover typically is of a uniform thickness, the cover may be susceptible to sagging. 
       SUMMARY OF THE INVENTION 
       [0005]    In a first aspect, an inventive lid for a semiconductor device processing apparatus comprises a cover having an opening and a wall formed around the opening. The wall is adapted to prevent fluid present on the lid from entering a body of the processing apparatus through the opening. An outer door is adapted to prevent fluid from entering the body of the processing apparatus through the opening of the cover, and an inner door, coupled to the outer door, is adapted to prevent fluid from exiting the body of the processing apparatus through the opening of the cover. 
         [0006]    In a second aspect, the inventive lid comprises a cover having a top surface, an opening formed therein and a wall formed around the opening and extending upwardly from the top surface. The wall is adapted to prevent fluid present on the top surface of the lid from entering a body of the processing apparatus through the opening. The lid further comprises an outer door coupled so as to slide between a closed position wherein the outer door occludes the opening, and an open position wherein the outer door does not occlude the opening. The outer door is positioned above the top surface of the cover a distance at least equal to a height of the wall. 
         [0007]    In a third aspect, the inventive lid comprises a cover having an opening, an outer door adapted to deter fluid from entering a body of the processing apparatus through the opening, and an inner door coupled to the outer door and adapted so as to deter fluid employed within the body of the processing apparatus from contacting the outer door. 
         [0008]    In a fourth aspect, the inventive lid comprises a cover having an opening, an outer door adapted to occlude the opening, and a rinsing mechanism adapted to supply fluid to the lid so as to rinse residue therefrom. 
         [0009]    In a fifth aspect, a method of reducing sticking of a door of a semiconductor device processing apparatus, comprises providing rinsing fluid to a lid of a semiconductor device processing chamber so as to rinse particulates therefrom, and sliding a door that is operatively coupled to the lid so as to move between a closed position wherein the door occludes an opening formed in the lid, and an open position wherein the door does not occlude the opening. 
         [0010]    Other features and aspects of the present invention will become more fully apparent from the following detailed description, the appended claims and the accompanying drawings. 
     
    
     
       BRIEF DESCRIPTION OF THE FIGURES 
         [0011]      FIG. 1  illustrates an exemplary semiconductor device processing apparatus including a lid in accordance with an embodiment of the present invention. 
           [0012]      FIG. 2  is a front view of the exemplary semiconductor device processing apparatus in accordance with an embodiment of the present invention. 
           [0013]      FIG. 3  is a front view of the exemplary semiconductor device processing apparatus in accordance with an embodiment of the present invention. 
           [0014]      FIG. 4  is a schematic representation of a cover of a lid in accordance with an embodiment of the present invention. 
           [0015]      FIG. 5  is a side isometric view of an outer sliding door and an inner sliding door in accordance with an embodiment of the present invention. 
           [0016]      FIG. 6  is a cross-sectional side view of the outer door and inner door in accordance with an embodiment of the present invention. 
           [0017]      FIG. 7  is a cross-sectional side view of the exemplary semiconductor device processing apparatus including the lid in accordance with an embodiment of the present invention. 
           [0018]      FIG. 8  is a top perspective view of the lid in accordance with an embodiment of the present invention. 
           [0019]      FIG. 9  is a top perspective view of the lid including a spray bar in accordance with an embodiment of the present invention. 
           [0020]      FIG. 10  is a top perspective view of the lid including the spray mechanism in accordance with an embodiment of the present invention with the outer sliding door omitted. 
           [0021]      FIG. 11  is a side perspective view of the exemplary semiconductor device processing apparatus in accordance with an embodiment of the present invention. 
           [0022]      FIG. 12  is a top view of an exemplary semiconductor device processing system in accordance with an embodiment of the present invention. 
           [0023]      FIG. 13  is a side view of an exemplary semiconductor device processing system in accordance with an embodiment of the present invention. 
           [0024]      FIG. 14  is a back view of an exemplary semiconductor device processing system in accordance with an embodiment of the present invention. 
       
    
    
     DETAILED DESCRIPTION 
       [0025]    Embodiments of the present invention relate to reducing errors during semiconductor device processing caused by lid malfunction (e.g., sticking). The present invention also reduces the occurrence of deformities in the lid, such as cover sagging. Further, the lid of the present invention may be mounted so as to be easily removable from the semiconductor device processing apparatus. 
         [0026]    In order to achieve such advantages, an inventive lid comprising a cover having an opening formed therein may comprise (1) a wall surrounding the opening and adapted to prevent fluid present on the lid from entering the opening; (2) an outer door coupled to the lid so as to slide between an open and a closed position, wherein when the door is in the open position a distance at least equal to the height of the wall exists between the top of the cover and the outer door, such that the outer door may not contact residue that may accumulate on the top of the cover, and may thus avoid sticking; (3) a door comprising an outer door and an inner door, wherein the inner door may deter fluids employed within a processing chamber from contacting the outer door, and thereby may deter residue from accumulating thereon and promoting sticking; and/or (4) a rinsing mechanism adapted to rinse residue from a top surface of the cover. Other aspects may include a wall located on the outer door and adapted to deter fluid output from the rinsing mechanism from entering the opening when the outer door is in an open position, additional walls located along one or more of the cover edges and adapted to direct fluid therealong, and/or to provide structural rigidity. Other features may also be included, as described fully below with reference to the figures. 
         [0027]      FIG. 1  illustrates an exemplary semiconductor device processing apparatus  100  including a lid in accordance with an embodiment of the present invention. The semiconductor device processing apparatus  100  may be, for example, a megasonic tank, scrubber chamber, spin-rinse-drier chamber or the like. An exemplary scrubber is described in U.S. Pat. No. 6,299,698, an exemplary megasonic cleaner is described in U.S. Pat. No. 6,119,708, and an exemplary spin-rinse-drier chamber is described in U.S. Pat. No. 6,516,816, each of which is incorporated herein in its entirety. 
         [0028]    The semiconductor device processing apparatus  100  may include a body (or tank, such as a cleaner module tank)  102  for receiving semiconductor wafers during semiconductor device manufacturing or processing. A lid  104  is coupled to the body  102  and may prevent fluids employed during semiconductor device manufacturing or processing, such as Hydrofluoric acid (HF), Ammonium Hydroxide, Acetic acid, Citric acid and/or DI water, from entering into or escaping from the body  102  of the semiconductor device processing apparatus  100 . More specifically, the lid  104  includes a cover  106 , which defines an opening  108  through which a semiconductor wafer may be inserted or removed from the semiconductor device processing apparatus  100 , for example, by a robot. The cover  106  includes a first wall  110  around the opening  108 . The first wall  110  prevents fluid present on the lid  104  from entering the body  102 . The cover  106  may include a wall along one or more portions of one or more cover edges. For example, the cover  106  may include a second wall  112  along a first cover edge  114 , a third wall  116  along a second cover edge  118 , and a fourth wall  120  along a portion of a third cover edge  122 . The walls  110 ,  112 ,  116 ,  120  guide fluids present on the cover  106 . The details of the cover  106  will be described below with reference to  FIG. 4 . 
         [0029]    With reference to  FIG. 1 , the lid  104  includes an outer door  124  coupled to an inner door  126  for preventing fluids from entering and exiting, respectively, the body  102 . The outer door  124  (e.g., outer sliding door) and the inner door  126  (e.g., inner sliding door) are movably coupled to the cover  106 . More specifically, the outer door  124  is coupled, via an outer door mount  130  to a driving mechanism  127 . The driving mechanism  127  may include, for example, a cylinder  128  coupled to the body  102  of the semiconductor device processing apparatus  100  that drives the outer door  124  such that the outer door  124  slides (e.g., in a y-axis direction) along an upper surface of the cover  106 . The inner door  126  may move with the outer door  124 . The inner door  126  slides along a lower surface of the cover  106 . The outer  124  and inner doors  126  are described in detail below with reference to  FIGS. 5-6  and the driving mechanism  127  is described in detail below with reference to  FIG. 11 . 
         [0030]    The lid  104  may include a rinsing mechanism (not shown in  FIG. 1 ; reference numeral  902  in  FIG. 9 ) for supplying fluid such as DI water or the like onto the lid  104 . The rinsing mechanism  902  may spray additional and/or different fluids onto the lid  104 . The fluid may be used to remove any residue formed by chemistries deposited on the lid  104  during semiconductor device processing. 
         [0031]      FIG. 2  is a front view of the exemplary semiconductor device processing apparatus  100  in accordance with an embodiment of the present invention. With reference to  FIG. 2 , the lid  104  is sloped when installed on the body  102  of the semiconductor device processing apparatus  100 . More specifically, the lid  104  is sloped along a longitudinal axis c-c of the lid  104 , such that the longitudinal axis c-c of the lid  104  forms an angle θ with a horizontal axis (e.g., x-axis). In one embodiment, the longitudinal axis c-c of the lid  104  forms a 5 degree angle with the x-axis. The longitudinal axis c-c of the lid  104  may form a larger or smaller angle with the x-axis. The largest tilt angle allowed by a given design configuration may be desired because such an angle may provide the best fluid drainage. For example, the portion of the lid  104  including the first cover edge  114  is lower than the portion of the lid  104  including the second cover edge  118 . Therefore, any fluid present on the lid  104  during semiconductor device processing will travel (e.g., drain) toward the first cover edge  114 . 
         [0032]      FIG. 3  is a front schematic representation of the exemplary semiconductor device processing apparatus  100  in accordance with an embodiment of the present invention. With reference to  FIG. 3 , a robot  302  may insert a semiconductor wafer  304  into and/or remove the semiconductor wafer  304  from the semiconductor device processing apparatus  100 . The exemplary semiconductor device processing apparatus  100  of  FIG. 3  is a brush box, which includes a brush assembly  306 . However, the apparatus  100  may be a different type of semiconductor device processing apparatus. 
         [0033]      FIG. 4  is a top isometric view of the cover  106  of the lid  104  in accordance with an embodiment of the present invention. With reference to  FIG. 4 , a major area  106   a  of the cover  106  is of a first height h 1 . The first height h 1  may be selected based on such factors as strength of the material employed for the cover  106 , dimensions of the body  102 , etc. As stated, the cover  106  may include a first through fourth wall  110 ,  112 ,  116 ,  120 . The walls  110 ,  112 ,  116 ,  120  are preferably as high as a material and/or a space for a design configuration allow. Smaller heights may be used. Further, two or more of the walls  110 ,  112 ,  116 ,  120  may be different heights. The walls  110 ,  112 ,  116 ,  120  increase the material height of the cover  106  thereby increasing the stiffness of the cover  106 , and therefore, the lid  104 . In this manner, lid deformation (e.g., cover sagging) may be reduced and/or prevented. 
         [0034]    As stated above, due to the slope of the lid  104 , fluid provided on the lid  104  will flow (e.g., drain) toward the first cover edge  114 . Therefore, the fluid may contact the second wall  112 . The second wall  112  is shaped such that fluid contacting the second wall  112  will drain from the third cover edge  122  or a fourth cover edge  402 . More specifically, the thickness t 1  of the center of the second wall  112  is greater than the thickness t 2  of the far ends of the second wall  112 . The thicknesses t 1 , t 2  may be selected to provide a sufficient angle to allow for adequate fluid drainage (e.g., about 5 degrees or more relative to the cover edge  114 , although other values may be used). A similar design may be employed to make the thickness of the center of the third wall greater than the thickness of a far end of the third wall (e.g., the end of the third wall  116  nearest the fourth cover edge  402 ). In this manner, fluid provided on the cover flows (e.g., drains) toward the first cover edge  114  and may flow from the lid  104  via areas of the third cover edge which do not include a wall and/or the fourth cover edge  402 . The fourth wall  120  on a portion of the third cover edge  122  prevents fluid from draining from that portion of the third cover edge  122 , and guides the fluid toward the first cover edge  114 . As stated the first cover wall  110  prevents the fluid from flowing into the body  102  of the semiconductor device processing apparatus  100  (assuming the opening  108  is covered by the outer door  124  or the fluid level is not higher than the first wall  110  while the opening  108  is not covered). 
         [0035]    One or more posts  404  may be coupled to the cover  106 . The posts  404  are adapted to receive screws and screw bolts (not shown in  FIG. 4 ;  702  in  FIG. 7-11 ) and secure the lid  104  to the body  102 . The posts  404  may be coupled to the cover  106  by bonding or similar connection means. In this manner, fluid provided onto the cover  106  is prevented from leaking into the body  102  of the semiconductor device processing apparatus  100  via the points at which the lid  104  is secured to the body  102 . In the embodiment shown, the cover  106  includes four posts  404 . The cover  106  may include a larger or smaller number of posts  404 . 
         [0036]    In at least one embodiment, the cover  106  may be formed from chlorinated polyvinyl chloride (CPVC). CPVC is generally compatible (e.g., will not react) with fluids employed during semiconductor device processing. Further, CPVC is compliant with federal semiconductor industry safety standards. The cover  106  may be formed from additional and/or different materials. 
         [0037]      FIG. 5  is a side isometric view of an outer sliding door  124  and an inner sliding door  126  in accordance with an embodiment of the present invention. With reference to  FIG. 5 , the outer door  124  is coupled to (e.g., mounted above) the inner door  126  via one or more bolts  502  or similar connection means. The outer door  124  includes an outer door wall  506  for preventing fluid provided on the lid  104  from entering into the body  102  of the semiconductor device processing apparatus  100 . The outer door wall  506  guides the fluid away from the opening  108 . The outer door wall  506  may be the same height h as one or more of the walls  110 ,  112 ,  116 ,  120  of the cover  106  ( FIG. 1 ). Alternatively, the outer door wall  506  may be a different height. 
         [0038]    Similar to the cover  106 , the outer door  124  and inner door  126  may be formed from CPVC. Alternatively, the outer door  124  and inner door  126  may be formed from additional and/or different materials. For example, during semiconductor processing, the inner door  126  of the lid  104  may be exposed to a high-temperature environment (e.g., if a megasonic tank is employed). In such circumstances, the inner door  126  of the lid  104  may include Raydel r-ppsu or a similar material, which is stable in a high-temperature environment. 
         [0039]      FIG. 6  is a cross-sectional side view of the outer door  124  and inner door  126  in accordance with an embodiment of the present invention. With reference to  FIG. 6 , the outer door  124  is adapted to cover (e.g., seal) the opening  108  defined by the first cover wall  110 , thereby preventing fluid from entering into the body  102  of the semiconductor device processing apparatus  100 . For example, the outer door  124  prevents chemistries from another processing tank from dripping into the body  102  while a robot is transferring a semiconductor wafer  304  to the semiconductor processing apparatus  100 . More specifically, the outer door  124  has a length l 1  and a width w 1  such that the outer door  124  may cover the opening  108  along a top surface ( 106   a  in  FIG. 7 ) of the cover  106 . 
         [0040]    Similarly, the inner door  126  is adapted to cover the opening  108  defined by the first cover wall  110  along a bottom surface ( 106   b  in  FIG. 7 ) of the cover  106 , thereby preventing fluid from exiting (e.g., spraying out of) the body  102  of the semiconductor device processing apparatus  100 . The inner door  126  has a length l 2  and a width w 2  such that the inner door  126  may cover the opening  108  along the bottom surface ( 106   b  in  FIG. 7 ) of the cover  106 . Further, the inner door  126  may include a coupling portion  602  of height h 2  through which the inner door  126  is coupled to the outer door  124 . Therefore, portions of the inner door  126  are separated from the outer door  124  by the height h 2 . The height h 2  is selected such that the outer door  124  may move (e.g., slide) relative to the top surface  106   a  of the cover  106  and the inner door  126  may move relative to the bottom surface  106   b  of the cover  106 . 
         [0041]      FIG. 7  is a cross-sectional side view of the exemplary semiconductor device processing apparatus  100  including the lid  104  in accordance with an embodiment of the present invention. With reference to  FIG. 7 , when the outer door  124  and inner door  126  are coupled to the cover  106  to form the lid  104 , the outer door  124  is above the first cover wall  110  and the inner door is below the bottom surface  106   b  of the cover  106 . In this manner, the outer door  124  may move relative to the top surface  106   a  of the cover  106  and the inner door  126  may move relative to the bottom surface  106   b  of the cover  106 . 
         [0042]      FIG. 8  is a top perspective view of the lid  104  in accordance with an embodiment of the present invention. With reference to  FIG. 8 , when the outer door  124  is coupled to the cover  106  to form the lid  104 , a bottom surface of the outer door  124  may contact the first  110 , second  112  and third walls  116 . In the embodiment shown, the outer door  124  does not contact other portions of the cover  106 . Therefore, in contrast to conventional doors, when the outer door  124  moves relative to the cover  106 , the bottom surface of the outer door  124  may contact only the top surfaces of the first cover wall  110 , second cover wall  112  and third cover walls  116  and not a larger portion (e.g., all) of the flat surface of the cover  106 . Therefore, the present invention reduces the interface (e.g., potential contact area) between the outer door  124  and the cover  106 . 
         [0043]      FIG. 9  is a top perspective view of the lid  104  including a rinsing mechanism in accordance with an embodiment of the present invention. With reference to  FIG. 9 , the lid  104  includes a rinsing mechanism  902  (e.g., such as a spray nozzle, a fluid outlet for supplying a fluid drip or flow, a spray bar, etc.) for providing fluid for rinsing the lid (e.g., a cleaning solution, DI water, etc.). In the embodiment shown, the rinsing mechanism  902  is coupled to a side of the cover  106 . For example, the rinsing mechanism  902  may be positioned along a side of the cover  106  near the fourth cover edge  402 . The rinsing mechanism  902  may be positioned differently. 
         [0044]    The exemplary rinsing mechanism  902  includes a plurality of nozzles  904 - 908  for spraying fluid onto the lid  104 . A first nozzle  904  sprays fluid onto the outer door  124 . A second nozzle  906  sprays fluid onto a first portion of the cover  106  (e.g., a portion near the second cover edge  118 . A third nozzle  908  sprays fluid onto or toward a second portion of the cover  106  (e.g., toward the first cover edge  114 ). Other numbers of spray bars  902  and/or nozzles may be employed. Through use of the rinsing mechanism  902 , residues, which result from the drying of fluid (e.g., chemistries) deposited on the lid  104  during semiconductor device processing, may be removed from the lid  104  before the residues interfere with the movement of the outer door  124  relative to the cover  106 . The fluid provided by the rinsing mechanism  902  onto the lid  402  will flow (e.g., drain) in the direction indicated by the arrows  910 - 918 . As shown in  FIG. 9 , the rinsing mechanism  902  may provide fluid onto the lid  104  (e.g., the outer door  124  and/or the cover  106 ) while the opening  108  is uncovered. The opening  108  is uncovered, for example, while a wafer is being transferred into and/or out of the body  102  of the semiconductor device processing apparatus  100 . The outer door wall  506  and/or the first wall  110  prevents the fluid provided onto the lid  104  by the rinsing mechanism  902  from entering the body  102  of the semiconductor device processing apparatus  100  through the opening  108 . Alternatively, the rinsing mechanism  902  may provide fluid onto the lid  104  (e.g., the outer door  124  and/or the cover  106 ) while the opening  108  is covered. The fluid provided onto the lid  104  by the rinsing mechanism  902  is prevented from entering the body  102  of the semiconductor device processing apparatus  100  in a similar manner. In at least one embodiment, a user may specify when the rinsing mechanism  902  provides fluid onto the lid  104  (e.g., while the opening  108  is covered or uncovered or both). The rinsing mechanism  902  may be hardware or software controlled. 
         [0045]      FIG. 10  is a top view of the lid  104  including the rinsing mechanism  902  in accordance with an embodiment of the present invention with the outer door  124  omitted. With reference to  FIG. 10 , an exemplary range of spray from the second nozzle  906  is clearly illustrated. Further,  FIG. 10  illustrates how the first wall  110  prevents fluid from the nozzles  906 - 908  from entering into the opening  108  by interfering with the spray range of the nozzles  906 - 908 . 
         [0046]      FIG. 11  is a side perspective view of the exemplary semiconductor device processing apparatus  100  in accordance with an embodiment of the present invention. With reference to  FIG. 11 , the driving mechanism  127  is shown coupled to the body  102  (e.g., a side of the body  102 ) of the semiconductor device processing apparatus  100 . The driving mechanism  127  may include a moving bracket  1102  coupled to the cylinder  128 . The cylinder  128  may be, for example, an air (e.g., pneumatically actuated) cylinder, and may be controlled by hardware or software. Other driving mechanisms, such as motors and/or lead screws, also may be used. The moving bracket  1102  may include a driving pin  1104  adapted to couple to an outer door bracket (or mount)  1106 . 
         [0047]    The outer door  124  may be coupled to the outer door bracket (or mount)  1106 . For example, the outer door  124  may be coupled to the outer door bracket  1106  via screws or similar connection means. The outer door bracket  1106  is adapted to couple to the driving pin  1104 . More specifically, the outer door bracket  1106  may include a notch  1108  for receiving the driving pin  1104 . Because the outer door  124  may be coupled to the driving mechanism  127  via the outer door bracket  1106 , the outer door  124  may be easily installed or removed (e.g., for servicing) from the semiconductor device processing apparatus  100 . Because the lid  104  (e.g., cover  106  and outer door  124 ) does not require numerous connections to be disconnected before removing the lid  104  and reconnected after installing the lid  104 , the lid  104  may be easier to remove and/or install than conventional lids. 
         [0048]    In operation, the cylinder  128  causes the moving bracket  1102  to move along the y-axis. The moving bracket  1102  causes the outer door bracket  1106  to move along the y-axis, and consequently, the outer door  124  moves along the y-axis. In this manner, the outer door  124 , and therefore, the inner door  126 , may move together (e.g., along the y-axis) relative to the cover  106 , and cover and/or uncover the opening  108 . The outer door  124  may prevent fluid from entering into the body  102  of the semiconductor device processing apparatus  100  through the opening  108  and the inner door  126  may prevent fluid from exiting the body  102  of the semiconductor device processing apparatus  100  through the opening  108 . As described above, the interface (e.g., potential contact area) between the outer door  124  and the cover  106  of the lid  104  is reduced compared to conventional lids thereby reducing chances of and/or preventing the outer door  124  from sticking to the cover  106 . Further, fluid may be sprayed on and drained from the lid  104  (while the opening  108  is covered or uncovered), thereby cleaning chemistries and/or chemistry residues from the lid  104 . Such cleaning does not require removal of the lid  104 . Further, the cleaning may be performed before, during and/or after semiconductor device processing. 
         [0049]      FIGS. 12-14  are a top, side and back view, respectively, of an exemplary semiconductor device processing system  1200  in accordance with an embodiment of the present invention. With reference to  FIGS. 12-14 , the exemplary semiconductor device processing system  1200  includes an input station  1202  for receiving semiconductor wafers coupled to a plurality of semiconductor device processing apparatus  100   a - c  (each of which includes a lid  104  in accordance with an embodiment of the present invention). However, a smaller number of semiconductor device processing apparatus may be employed. In one embodiment, the exemplary semiconductor device processing system  1200  may include three semiconductor device processing apparatuses  100 . For example, the exemplary semiconductor device processing system  1200  may include a first brush box  100   a  which includes a first lid  104   a  in accordance with an embodiment of the present invention and a second brush box  100   b  which includes a second lid  104   b  in accordance with an embodiment of the present invention. Further, the exemplary semiconductor device processing system  1200  includes a megasonic cleaner  100   c  which includes a megasonic tank  102   c  and a lid  104   c  similar to the lid  104  described above. The exemplary semiconductor device processing system  1200  includes a drip pan  1204  coupled to the semiconductor device processing apparatus  100   a - c . The drip pan  1204  may receive fluids drained from the semiconductor device processing apparatus  100  during semiconductor device processing. The exemplary semiconductor device processing system  1200  includes one or more spray mechanism  1206  for providing fluid, such as cleaning fluid, to the drip pan  1204 . In this manner, the drip pan  1204  of the exemplary semiconductor device processing system  1200  is cleaned. 
         [0050]    The lids  104   a - c  of the exemplary semiconductor device processing system  1200  provide the advantages described above, and therefore, increase operating efficiency and manufacturing yield of the system. 
         [0051]    The foregoing description discloses only exemplary embodiments of the invention. Modifications of the above disclosed apparatus and methods which fall within the scope of the invention will be readily apparent to those of ordinary skill in the art. For instance, although in some embodiments, the outer door  124  interfaces with the wall  110  formed around the opening  108  and respective walls  112 ,  116 ,  120  along portions of one or more cover edges as the outer door  124  slides along the cover  106 , thereby reducing a contact area between the outer door and the cover, in other embodiments, the outer door  124  may interface with a larger or smaller area of remaining portions of the lid  104 . 
         [0052]    Accordingly, while the present invention has been disclosed in connection with exemplary embodiments thereof, it should be understood that other embodiments may fall within the spirit and scope of the invention, as defined by the following claims.
A method of reducing sticking of a door of a semiconductor device processing apparatus is provided. The method comprises providing rinsing fluid to a lid of a semiconductor devise processing chamber so as to rinse particulates therefrom; and sliding a door that is operatively coupled to the lid so as to move between a closed position wherein the door occludes an opening formed in the lid, and an open position wherein the door does not occlude the opening. Numerous other aspects are provided.