This application is based on Japanese patent application HEI 10-234363 filed on Aug. 20, 1998, the whole contents of which are incorporated herein by reference. 
    
    
     BACKGROUND OF THE INVENTION 
     a) Field of the Invention 
     The present invention relates to a semiconductor device and its manufacture method, and more particularly to a semiconductor device with a metal silicide film formed on the surface of an active region of a semiconductor substrate and its manufacture method. 
     b) Description of the Related Art 
     In order to achieve high performance of semiconductor devices, it is effective to reduce the resistance and contact resistance of impurity doped regions and gate electrodes. As a method of reducing these resistances, a method (a salicide film forming method) is known which forms a metal silicide film in a self-alignment manner on the upper surface of a gate electrode and the surfaces of source/drain regions on both sides of the gate electrode. The metal silicide films reduce the resistance and contact resistance of the gate electrode and source/drain regions. 
     The salicide film forming method will be described briefly. Side spacer insulating films are formed on the side walls of a gate electrode. The side spacer insulating films electrically separate the surfaces of source/drain regions from the upper and side walls of the gate electrode. A metal film capable of silicification reaction is deposited covering the gate electrode and source/drain regions. The substrate is heated to silicidize the metal film with silicon. A metal silicide film is therefore formed on the upper surface of the gate electrode and the surfaces of the source/drain regions in a self-alignment manner. 
     In order to improve the data storage characteristics of a memory cell of a semiconductor device such as a dynamic random access memory (DRAM), it is desired to reduce junction leak current of an impurity doped region. However, if a metal silicide film is formed on the surface of an impurity doped region, the junction leak current increases (refer to the 178-th Meeting the Electro-chemical Society, pp. 218-220). From this reason, in DRAM manufacture, the salicide film forming method is not used in general. 
     If DRAM cells and logic circuits are formed on the same substrate and the salicide film forming method is not used, the resistances of gate electrodes, source/drain regions and the like of MOSFET&#39;s constituting logic circuits become high. It is therefore difficult to improve the performance of logic circuits. In order to improve the performance of logic circuits without shortening a storage time of DRAM cells, it is desired to apply the salicide film forming method only to MOSFET&#39;s of logic circuits. 
     SUMMARY OF THE INVENTION 
     It is an object of the present invention to provide a semiconductor device in which only desired regions among a plurality of active regions on the surface of a semiconductor substrate is silicidized, and its manufacture method. 
     According to one aspect of the present invention, there is provided a semiconductor device comprising: a semiconductor substrate having a principal surface defined with first and second regions; two projected patterns disposed spaced apart from each other by a certain distance and formed on the principal surface in the first region, the two projected patterns running on a first active and on an element isolation region around the first active region in the first region; a first metal silicide film formed on a surface of an active region in the principal surface in the second region; and a burying member for covering side walls of the two projected patterns and burying a space between the two projected patterns at least in the element isolation region, the burying member being not formed above the two projected patterns, wherein a metal silicide film is not formed on a surface of the first active region. 
     The resistance of a surface layer of the active region with the first metal sulicide film can be lowered. In the active region without the metal silicide film, junction leak current of the impurity dopes regions can be reduced. 
     According to another aspect of the invention, there is provided a semiconductor device comprising: a semiconductor substrate having a principal surface defined with first and second regions; first and second gate electrodes disposed spaced apart from each other by a certain distance and formed on the principal surface in the first region, the first and second gate electrode running on a first active region in the first region; a MOSPET formed in the second region; a first metal silicide film formed on surfaces of source/drain regions of the MOSFET; a second metal silicide film formed on upper surfaces of the first and second gate electrodes; a third metal silicide film formed on an upper surface of a gate electrode of the MOSFET; a first insulating member formed on the second metal silicide; a second insulating member covering side walls of the first and second gate electrodes and side walls of the first insulating member; and a third insulating member covering the source/drain regions of the MOSFET and the third metal silicide film and made of a same material as the first insulating member, an upper surface of the third insulating member being swelled upward in correspondence to the gate electrode of the MOSFET, wherein a metal silicide film is not formed on a surface of the first active region. 
     In the active region with the first metal silicide film, the resistance of the surface layer can be lowered. In the active region without the metal silicide film, junction leak current of the impurity dopes regions can be reduced. The upper surfaces and side walls of the first and second gate electrodes are covered with the first and second insulating members. If a contact hole is formed through an interlayer insulating film formed above the first and second gate electrodes under the conditions that the first and second insulating members are not etched, these first and second insulating members protect the first and second gate electrodes. The contact hole can therefore be formed in a self-alignment manner. 
     According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device comprising the steps of; preparing a semiconductor substrate having a principal surface defined with first and second active regions; forming first and second gate electrodes above the first active region of the semiconductor substrate, the first and second gate electrodes being made of silicon and spaced apart by a certain distance, and forming a third gate electrode made of silicon above the second active region; depositing an insulating film over the principal surface, the insulating film covering the first to third gate electrodes; anisotropically etching the insulating film to leave a portion of the insulating film so as to completely fill a space between the first and second gate electrodes and leave a portion of the insulating film on side walls of the third gate electrode, to thereby expose a surface of the second active region outside of the insulating film covering the side walls of the third gate electrode and expose upper surfaces of the first to third gate electrodes; and forming a metal silicide film on a surface of the exposed second active region and on the upper surfaces of the first to third gate electrodes. 
     A space between the first and second gate electrodes is filled with a portion of the insulating film. Since the silicon substrate surface is not exposed in the space therebetween, the metal silicide film will not be formed in this area. 
     According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device comprising: a deposition step of depositing a silicon film on a surface of a silicon substrate having a principal surface; a patterning step of patterning the silicon film to leave the silicon film in a first region of the principal surface and leave a first gate electrode made of the silicon film in an active region of a second region; a side spacer forming step of forming side spacer insulating members covering side walls of the first gate electrode; a first ion doping step of doping impurity ions into active regions on both side the first gate electrode; a metal silicide forming step of forming a metal silicide film on surfaces of the active regions outside of the side spacer insulating members, on an upper surface of the first gate electrode, and on a surface of the silicon film left in the first region; a second gate electrode forming step of patterning the silicon film and the metal silicide film formed thereon both left in the first region to leave a second gate electrode above the active region in the first region; and a second ion doping step of doping impurity ions into active regions on both sides of the second gate electrode. 
     During the metal silicide forming step, the silicon film is left in the first region. Therefore, the silicon surface in the first region is not subject to a silicification reaction. Only the surface of the active region in the second region can be subject to the silicification reaction. 
     As above, a metal silicide film is formed on the silicon surface in some area of the semiconductor substrate, and it is not formed in the other area. If this structure is applied to DRAM with logic circuits, a metal silicide film is formed on the surfaces of the source/drain regions of MOSFET&#39;s of the logic circuit area, and it is not formed on the surfaces of the source/drain regions in the memory cell array area. In the logic circuit area, the metal silicide film lowers the resistance of the source/drain regions of MOSFET to thereby improve the device performance. In the memory cell array area, the metal silicide film is not formed so that it is possible to prevent the storage time from being shortened. 
    
    
     BRIEF DESCRIPTION OF THE DRAWINGS 
     FIGS. 1A to  1 C,  2 A to  2 C,  3 , and  4  are cross sectional views of a substrate illustrating a method of manufacturing a semiconductor device according to a first embodiment of the invention. 
     FIG. 5A is a plan view of a memory cell array area of a semiconductor device manufactured by the method of the first embodiment, and FIG. 5B is a cross sectional view taken along one-dot chain line B—B of FIG.  5 A. 
     FIGS. 6A to  6 D are cross sectional views of a substrate illustrating a method of manufacturing a semiconductor device according to a second embodiment of the invention. 
     FIGS. 7A to  7 C are cross sectional views of a substrate illustrating a method of manufacturing a semiconductor device according to a third embodiment of the invention. 
     FIGS. 8A to  8 C are cross sectional views of a substrate illustrating a method of manufacturing a semiconductor device according to a fourth embodiment of the invention. 
     FIGS. 9A to  9 D are cross sectional views of a substrate illustrating a method of manufacturing a semiconductor device according to a fifth embodiment of the invention. 
     FIGS. 10A to  10 D are cross sectional views of a substrate illustrating a method of manufacturing a semiconductor device according to a sixth embodiment of the invention. 
     FIGS. 11A to  11 D are cross sectional views of a substrate illustrating a method of manufacturing a semiconductor device according to a seventh embodiment of the invention. 
     FIGS. 12A to  12 D are cross sectional views of a substrate illustrating a method of manufacturing a semiconductor device according to an eighth embodiment of the invention. 
     FIGS. 13A to  13 C are cross sectional views of a substrate illustrating a method of manufacturing a semiconductor device according to a ninth embodiment of the invention. 
     FIGS. 14A to  14 E are cross sectional views of a substrate illustrating a method of manufacturing a semiconductor device according to a tenth embodiment of the invention. 
     FIGS. 15A to  15 C are cross sectional views of a substrate illustrating a method of manufacturing a semiconductor device according to an eleventh embodiment of the invention. 
    
    
     DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS 
     With reference to FIGS. 1A to  5 B, the first embodiment of the invention will be described. FIGS. 1A to  4  are cross sectional views of a substrate illustrating a method of manufacturing a semiconductor device according to the first embodiment of the invention. The left side of waved lines in each Figure shows a memory cell array area, and the right side shows a logic circuit area. 
     The processes up to the processes shown in FIG. 1A will be described first. On the surface of a p-type silicon substrate, shallow trench type element isolation structures  2  are formed by a well known method. The element isolation structures  2  define an a active region  3  in the memory cell array area and an active region  4  in the logic circuit area. On the surfaces of the active regions  3  and  4 , gate oxide films  7  of SiO 2  are formed by thermal oxidation to a thickness of 4 to 10 nm. On the gate oxide film, a first polysilicon film is deposited to a thickness of 100 to 300 nm. For example, the first polysilicon film is deposited by chemical vapor deposition (CVD) using SiH 4 . 
     The first polysilicon film is patterned to leave a plurality of word lines  8   a  in the memory cell array area and a gate electrode  8   b  in the logic circuit area. For example, the first polysilicon film is etched by reactive ion etching (RIE) using a mixture gas of Cl 2  and O 3 . The word line  8   a  extends in a direction vertical to the drawing sheet of FIG.  1 A, and the pitch between adjacent word lines  8   a  is 0.1 to 0.3 μm. Two word lines  8   a  extend over the active region  3 . The word lines  8   a  also extend on the element isolation structures  2  on both sides of the active region  3 . The gate electrode  8   b  in the logic circuit area is spaced by 0.3 μm from unrepresented gate electrodes or wiring patterns on both sides of the gate electrode  8   b.    
     By using the word lines  8   a  and gate electrode  8   b  as a mask, impurity ions are implanted. In the n-channel MOSFET forming regions in the memory cell array area and logic circuit area, phosphorous (P) ions are implanted under the conditions of an acceleration energy of 10 to 30 keV and a dose of 2 to 5×10 13 cm −2 . In the p-channel MOSFET forming regions in the logic circuit area, boron (B) ions are implanted under the conditions of an acceleration energy of 5 to 15 keV and a dose of 1 to 5×10 13 cm −2 . With these ion implantation processes, source/drain regions  9   a  of MOSFET&#39;s are formed in the memory cell array area, and low impurity concentration source/drain regions  9   b  of the lightly doped drain (LDD) structure are formed in the logic circuit area. 
     As shown in FIG. 1B, a first SiO 2  film  10  having a thickness of 80 to 200 nm is deposited over the substrate surface. For example, the first SiO 2  film  10  is deposited by CVD using SiH 4  and O 2 . In the memory cell array area, spaces between the word lines  8   a  are buried with the first SiO 2  film  10 . 
     As shown in FIG. 1C, the first SiO 2  film  10  is anisotropically etched to remove the first SiO 2  film on the flat surface. For example, this anisotropic etching is performed by RIE using a mixture gas of CH 4 , CHF 3 , and Ar. 
     In the memory cell array area, burying materials  10   a  of the first SiO 2  film  10  are left between word lines  8   a . The surface of the source/drain regions in the memory cell array area are covered with the burying materials  10   a . In the logic circuit area, side spacer insulating members  10   b  are left on the side walls of the gate electrode  8   b.    
     By using the gate electrodes  8   b  and side spacer insulating members  10   b  as a mask, ions are implanted into the logic circuit area while the memory cell array area is masked with a resist pattern. In the n-channel MOSFET forming region, arsenic (As) ions are implanted under the conditions of an acceleration energy of 30 to 50 keV and a dose of 1 to 4×10 15 cm −2 . In the p-channel MOSFET forming region, B ions are implanted under the conditions of an acceleration energy of 5 to 15 keV and a dose of 1 to 4×10 15 cm −2 . With these ion implantation processes, high impurity concentration source/drain regions  12   b  of the LDD structure are formed. After the ion implantation processes, natural oxide films on the exposed silicon surfaces are removed by hydrofluoric acid. 
     As shown in FIG. 2A, titanium silicide (TiSi) films  15  are formed on the surfaces of the word lines  8   a , gate electrode  8   b , and high impurity concentration regions  12   b . A method of forming the TiSi film  15  will be described hereinunder. First, a Ti filmis deposited covering the whole surface of the substrate. Heat treatment is performed at a substrate temperature of 400 to 900° C. The Ti film is therefore silicidized with the silicon surface to form the TiSi film  15 . Unnecessary Ti films not silicidized are removed by hydrofluoric acid. In the above manner, the TiSi film  15  can be formed in a self-alignment manner only on the exposed Si surfaces. 
     The surfaces of the source/drain regions  9   a  in the memory cell array area are covered with the burying materials  10   a  so that they are not silicidized. The high impurity source/drain regions  12   b  in the logic circuit area are in contact with the Ti film so that the regions  12   b  are silicidized at these contact surfaces. Instead of Ti, other metals capable of being silicidized with Si, such as Co, may be used. 
     As shown in FIG. 2B, a borophosphosilicate glass (BPSG) 18 of 800 to 1200 in thickness is deposited over the whole surface of the substrate. The BPSG film  18  is deposited by CVD using a mixture gas of SiH 4 , B 2 H 6 , O 2 , and PH 3 . After heat treatment at a substrate temperature of 700 to 850° C., the surface of the BPSG film  18  is planarized through chemical mechanical polishing (CMP). 
     A contact hole  19  is formed through the BPSG film  18  to expose the surface of the source/drain region  9   a  in the central area of the active region  3 . Etching the BPSG film  18  is performed by RIE using a mixture gas of CF 4 , CHF 3 , and Ar. A bit line  20  is formed which is connected via the contact hole  19  to the central source/drain region  9   a . The bit line  20  extends along a direction perpendicular to the word line  8   a , in an area other than the cross section shown in FIG.  2 B. 
     A method of forming the bit line  20  will be described hereinunder. A P-doped polysilicon film of 50 nm in thickness and a tungsten silicide (WSi 2 ) film of 100 nm in thickness are deposited over the whole surface of the substrate. The polysilicon film is deposited by CVD using SiH 4  as a source gas, and the WSi 2  film is deposited by CVD using WF 6  and SiH 4  as source gases. Prior to depositing the polysilicon film, a natural oxide film formed on the bottom of the contact hole  19  may be removed by hydrofluoric acid. 
     The polysilicon film and WSi 2  film are patterned to form the bit line  20 . Etching the polysilicon film and WSi 2  film is performed by RIE using Cl 2  and O 2 . 
     As shown in FIG. 2C, a BPSG film  23  is deposited to a thickness of 800 to 1200 nm over the substrate whole surface. After heat treatment at a substrate temperature of 700 to 850° C., the surface of the BPSG film  23  is planarized by CMP. 
     Contact holes  24  are formed through the BPSG film  23  to expose the surfaces of the source/drain regions  9   a  on opposite ends of the active region  3 . A storage electrode  25  is formed which is connected via each contact hole  24  to the corresponding source/drain region  9   a . The storage electrode  25  is formed by depositing a P-doped polysilicon film of 300 to 800 nm in thickness and thereafter patterning this film. 
     As shown in FIG. 3, a silicon nitride (SiN) film of 3 to 5 nm in thickness is deposited over the whole substrate surface. The SiN film is thermally oxidized at a temperature of 700 to 800° C. to form a dielectric film  28  made of SiON. An opposing electrode  29  of P-doped polysilicon is deposited to a thickness of 100 nm, covering the dielectric film  28 . The dielectric film  28  and opposing electrode  29  in the logic circuit area are removed. Etching these two layers is performed by RIE using Cl 2  and O 2b . 
     As shown in FIG. 4, a BPSG film  30  of 1000 to 1500 nm in thickness is deposited over the whole substrate surface. A contact hole  32  exposing a partial surface area of the opposing electrode  29  and a contact hole exposing a partial surface area of the TiSi film in the logic circuit area are formed. Although not shown in FIG. 4, a contact hole exposing a partial surface area of the bit line  20  is also formed at the same time. 
     The insides of the contact holes  32  are buried with W plugs  35 . A method of forming a W plug  35  will be described hereinunder. First, a barrier metal layer is deposited through sputtering. For example, the barrier metal layer has a two-layer structure of a Ti film and a TiN film. A W film of 300 to 500 nm in thickness is deposited on the barrier metal layer by CVD to fill the insides of the contact holes with the W film. Unnecessary W films and barrier metal layers are removed by CMP to leave the W plugs  35  in the contact holes  32 . 
     A wiring pattern  40  is formed on the BPSG film  30 . The wiring pattern has a lamination structure of a barrier metal layer, an aluminum (Al) layer, and an antireflection film. For example, the antireflection film is made of TiN. 
     A SiO 2  film  41  is deposited on the BPSG film  30 , covering the wiring pattern  40 . For example, the SiO 2  film  41  is deposited by CVD using high density plasma. A contact hole is formed through the SiO 2  film  41  and the inside thereof is buried with a W plug  42 . A wiring pattern  43  is formed on the surface of the SiO 2  film  41 , and an SiO 2  film  44  is deposited covering the wiring pattern  43 . 
     A cover film  45  is deposited covering the SiO 2  film  44 . The cover film  45  has a two-layer structure of an SiO 2  film and an SiN film both formed by plasma CVD. 
     FIG. 5A shows an example of the layout of the memory cell array area of a semiconductor device manufactured by the method of the first embodiment. The cross sectional view of the memory cell array area shown in FIGS. 1A to  4  corresponds to a cross sectional view taken along one-dot chain line A—A in FIG.  5 A. Active regions  3  are regularly disposed along vertical (column) and horizontal (row) directions in FIG.  5 A. The active region  3  is constituted of a first region  3   a  extending in the column direction and a pair of second regions  3   b  extending in opposite directions from both ends of the first region  3   a . The word line  8   a  traverses each second region  3   b  of the active region  3  in the column direction. 
     The contact hole  24  is disposed near the end of the second region  3   b  of the active region, via which contact hole the storage electrode  25  is connected to the source/drain region  9   a . Approximately at the center of the first region  31 , the contact hole  19  is disposed via which the bit line  20  is connected to the source/drain region  9   a.    
     FIG. 5B is a cross sectional view taken along one-dot chain line B—B of FIG.  5 A. The word line  8   a  runs on the element isolation structure  2 . A space between two word lines  8   a  is filled with the burying material  10   a . The burying material  10   a  does not exist on the word line  8   a.    
     In the semiconductor device of the first embodiment, as shown in FIG. 4, a metal silicide film is not formed on the surfaces of the source/drain regions  9   a  in the memory cell array area. It is therefore possible to suppress an increase of junction leak current in the source/drain regions  9   a  and to maintain good storage time characteristics of DRAM. 
     Next, with reference to FIGS. 6A to  6 D, the second embodiment will be described. The processes up to those shown in FIG. 1A are similar to the first embodiment. The methods For ion implantation, thin film formation, etching, and the like used in the processes in the second and following embodiments are similar to the first embodiment, and the detailed description thereof is omitted. 
     As shown in FIG. 6A, a first SiO 2  film  50  of 40 to 200 nm is deposited over the whole substrate surface. In the first embodiment, the first SiO 2  film  10  deposited by the process shown in FIG. 1B has a thickness of 80 to 200 nm. The first SiO 2  film of the second embodiment is thinner than the first SiO 2  film  10 . 
     As shown in FIG. 6B, the first SiO 2  film is anisotropically etched by RIE to leave first side spacer insulating members  50   a  and  50   b  on the side walls of the word lines  8   a  and gate electrode  8   b . Since the first SiO 2  film  50  is thinner than the first embodiment, the source/drain regions  9   a  are exposed between the first side spacer insulating members  50   a  also in the memory cell array area. 
     By using the gate electrode  8   b  and the first side spacer insulating members  50   b  as a mask, impurity ions are implanted into the surface layers of the active region  4  in the logic circuit area, while the memory cell array area is masked with a resist pattern. High impurity concentration source/drain regions  12   b  of the LDD structure are therefore formed. 
     As shown in FIG. 6C, a second SiO 2  film  51  of 40 to 200 nm is deposited over the whole substrate surface. The second SiO 2  film  51  fills the spaces between the word lies  8   a  in the memory cell array area. 
     As shown in FIG. 6D, the second SiO 2  film  51  is anisotropically etched to leave second side spacer insulating members  51   a  and  51   b  on the side walls of the first side spacer insulating members  50   a  and  50   b . Thereafter, similar to the processes of the first embodiment shown in FIG. 2A, a metal silicide film  15  is formed on the silicon surface. 
     In the second embodiment, since the spaces between the word lines  8   a  are filled with the second SiO 2  film  51 , the first SiO 2  film  50  can be made thin. As the first SiO 2  film  50  is made thin, the first side spacer insulating member  50   b  shown in FIG. 6B is made thin so that the low impurity concentration regions  9   b  of the source/drain regions are made shorter. Accordingly, the performance of MOSFET&#39;s in the logic circuit area can be improved. 
     Also in the second embodiment, the end of the metal silicide film formed on the source/drain region of MOSFET in the logic circuit area, the end being on the side of the gate electrode, retracts from the end of the high impurity concentration region  12   b  on the side of the gate electrode. 
     Next, with reference to FIGS. 7A to  7 C, the third embodiment will be described. The second side spacer insulating members  51   b  shown in FIG. 6D are formed by basically using similar processes to the second embodiment. 
     FIG. 7A shows a substrate after the second side spacer insulating members  51   b  are formed. In the second embodiment, both the first and second side spacer insulating members  50   a ,  50   b ,  51   a , and  51   b  are made of SiO 2  films deposited by the same method. 
     In the third embodiment, the first side spacer insulating members  50   a  and  50   b  are made of an SiO 2  film deposited by CVD using SiH 4  and O 2  at a substrate temperature of 750 to 800° C. The second side spacer insulating members  51   a  and  51   b  are made of a borosilicate glass (BSG) film or a phosphosilicate glass (PSG) film. These films are formed by CVD at a substrate temperature of 300 to 500 ° C. An etching rate of the BSG and PSG films relative to hydrofluoric acid is faster than an etching rate of an SiO 2  film deposited by high temperature CVD. 
     As shown in FIG. 7B, after the memory cell array area is covered with a resist pattern  55 , the second side spacer insulating members  51   b  in the logic circuit area are removed by hydrofluoric acid. Since the etching rate of the first side spacer insulating members  50   b  is relatively slow, the first side spacer insulating members  50   b  can be left with high reproductivity. After the second side spacer insulating members  51   b  are removed, the resist pattern  55  is removed. 
     As shown in FIG. 7C, a metal silicide film  15  is formed on the silicon surface by processes similar to the first embodiment shown in FIG.  2 A. 
     In the third embodiment, the end of the metal silicide film  15  formed on the source/drain region in the logic circuit area is in contact with the first side spacer insulating member  50   b . Namely, as compared to the second embodiment, the end of the metal silicide film  15  on the source/drain region comes near the gate electrode  8   b . Therefore, the resistance of the source/drain region can be lowered. 
     Next, with reference to FIGS. 8A to  8 C, the fourth embodiment will be described. A substrate shown in FIG. 6B is formed by processes similar to the second embodiment. 
     As shown in FIG. 8A, an SiN film  60  of 10 to 30 nm in thickness is deposited over the whole substrate surface. 
     An SiO 2  film is deposited on the SiN film  60  to a thickness of 40 to 200 nm and anisotropically etched to leave second side spacer insulating members  51   a  and  51   b  on the sloped surface of the SiN film. This anisotropic etching is performed by RIE using a mixture gas of C 4 F 8  and Ar under the conditions of a larger etching selection ratio relative to the SiN film. Spaces between word lines  8   a  in the memory cell array area are buried with the first side spacer insulating member  50   a , SiN film  60 , and second side spacer insulating member  51   a.    
     As shown in FIG. 8B, the memory cell array area is covered with a resist pattern  61 , and the second side spacer insulating members  51   b  in the logic circuit area are removed. Etching the second side spacer insulating members  51   b  is performed by using hydrofluoric acid or hydrofluoric acid vapor. The second side spacer insulating members  51   b  can be selectively removed by leaving the SiN film  60  unetched. 
     After the second side spacer insulating materials  51   b  are removed, the resist pattern  61  is removed. 
     As shown in FIG. 8C, the SiN film  60  is anisotropically etched to remove the SiN film  60  in the flat surface. This etching is performed by RIE using a mixture gas of CF 4 , CHF 3 , and Ar. This etching gas provides a small etching selection ratio of the SiN film to the SiO 2  film. Therefore, the surface layer of the second side spacer insulating member  51   a  is slightly etched so that the boundary of the second side spacer insulating film  51   a  smoothly couples on the upper surface of the SiN film  60 . 
     Spaces between the word lines  8   a  are buried with the first side spacer insulating members  50   a , SiN film  60 , and second side spacer insulating members  51   a . The SiN film  60  covers partial areas of the side walls of the first side spacer insulating members  50   a  and the surface of the source/drain regions  9   a . The second side spacer insulating member  51   a  covers the surface of the SiN film  60 . The SiN film  60  is also left on the side walls of the first side spacer insulating members  50   b  in the logic circuit area. 
     A metal silicide film  15  is formed on the silicon surface by processes similar to the first embodiment shown in FIG.  2 A. 
     In the fourth embodiment, the end of the metal silicide film  15  formed on the source/drain region in the logic circuit area contacts the SiN film  60 . The resistance of the source/drain region can therefore be lowered similar to the third embodiment. 
     Next, with reference to FIGS. 9A to  9 D, the fifth embodiment will be described. A substrate shown in FIG.  6 A. is formed by processes similar to the second embodiment. 
     As shown in FIG. 9A, on the slanted surfaces and side walls of the first SiO 2  film  50 , side spacer insulating members  65  of BSG, PSG, or BPSG are formed. The side spacer insulating member  65  has an etching rate sufficiently faster than that of the first SiO 2  film relative to hydrofluoric acid. Spaces between the word lines  8   a  are buried with the first SiO 2  film  50  and side spacer insulating members  65   f.    
     As shown in FIG. 9B, the memory cell array area is covered with a resist pattern  66 . The side spacer insulating members  65  in the logic circuit area are removed by using hydrofluoric acid. Since the first SiO 2  film  50  has a higher resistance to etching than the side spacer insulating members  65  relative to hydrofluoric acid, the first SiO 2  film  50  can be left unetched with high reproductivity. After the side spacer insulating members  65  are removed, the resist pattern  66  is removed. 
     As shown in FIG. 9C, the first SiO 2  film  50  and side spacer insulating members  65  are anisotropically etched. This anisotropic etching is performed by RIE using a mixture gas of CF 4 , CHF 3 , and Ar. In spaces between the word lines  8   a , insulating members  50   a  of the first SiO 2  film  50  are left. The upper surface of the insulating member  50   a  has a dent. In this dent, an insulating member  65   a  of a portion of the side spacer insulating member  65  is left. 
     Side spacer insulating members  50   b  of the first SiO 2  film  50  are left on the side walls of the gate electrode  8   b  in the logic circuit area. By using the gate electrode  8   b  and side spacer insulating members  50   b  as a mask, impurity ions are implanted to form high impurity concentration source/drain regions  12   b.    
     As shown in FIG. 9D, a metal silicide film  15  is formed on the silicon surface by processes similar to the first embodiment shown in FIG.  2 A. The end of the metal silicide film  15  formed on the surface of the source/drain region in the logic circuit area contacts the side spacer insulating member  50   b.    
     In the fifth embodiment, after the first SiO 2  film  50  shown in FIG. 9A is formed, the surfaces of the source/drain regions  9   a  in the memory cell array area are not exposed. The source/drain regions  9   a  in the memory cell array area are therefore not damaged. 
     Next, with reference to FIGS. 10A to  10 D, the sixth embodiment will be described. A substrate shown in FIG. 6A is formed by processes similar to the second embodiment. 
     As shown in FIG. 10A, on the surface of the first SiO 2  film  50 , an SiN film  70  is deposited to a thickness of 10 to 30 nm. Side spacer insulating members  71  are formed on the slanted surfaces and side walls of the SiN film  70 . The side spacer insulating members  71  are formed by the method similar to that of forming the side spacer insulating members  65  of the fifth embodiment shown in FIG.  9 A. As the side spacer insulating member  71 , a tetraethylorthosilicate (TEOS) film formed by CVD using O 3  and TEOS may be used. The TEOS film is excellent in burying a dent. Spaces between the word lines  8   a  are buried with the first SiO 2  film  50 , SiN film  70 , and side spacer insulating member  71 . 
     As shown in FIG. 10B, the memory cell array area is covered with a resist pattern  72 . The side spacer insulating members  71  in the logic circuit area are removed by RIE using C 4 F 8  and Ar. The SiN film  70  functions as an etching stopper layer. Therefore, the side spacer insulating members  71  can be removed to leave the first SiO 2  film  50  with high reproductivity. After the side spacer insulating members  71  are removed, the resist pattern  72  is removed. 
     As shown in FIG. 10C, the first SiO 2  film  50 , SiN film  70 , and side spacer insulating member  71  are anisotropically etching. This anisotropic etching is performed by RIE using a mixture gas of CF 4 , CHF 3 , and Ar. Insulating members  50   a  of the first SiO 2  film  50  are left in spaces between the word lines  8   a . The surface of the insulating member  50   a  has a dent. An insulating member  70   a  of the SiN film  70  is left in the dent. An insulating member  71   a  of the side spacer insulating member  71  is left on the upper surface of the insulating member  70   a.    
     Side spacer insulating members  50   b  of the first SiO 2  are left on the side walls of the gate electrode  8   b  in the logic circuit area. On the side walls of the side spacer insulating members, insulating members  70   b  of the SiN film  70  are left. The insulating member  70   b  buries a groove parallel to the substrate plane formed on the side wall of the side spacer insulating member  50   b.    
     By using the gate electrode  8   b  and side spacer insulating members  50   b  as a mask, impurity ions are implanted to form high impurity concentration source/drain regions  12   b.    
     As shown in FIG. 10D, a metal silicide film  15  is formed on the silicon surface by processes similar to the first embodiment shown in FIG.  2 A. The end of the metal silicide film  15  on the side of the gate electrode  8   b  formed on the surface of the source/drain region in the logic circuit area contacts the side spacer insulating member  50   b.    
     Similar to the fifth embodiment, in the sixth embodiment, after the first SiO 2  film  50  shown in FIG. 10A is deposited, the surfaces of the source/drain regions  9   a  in the memory cell array area are not exposed. The surface of the source/drain region  9   a  can therefore be maintained clean. While the side spacer insulating members  71  are removed in the process shown in FIG. 10B, the SiN layer  70  is used as the etching stopper layer so that the side spacer insulating member  50   b  can be left with high reproductivity. 
     After the side spacer insulating members  71  are removed in the process shown in FIG. 10B, the SiN film  70  in the logic circuit area may be etched by using the resist pattern  72  as a mask. For example, the SiN film  70  is etched by RIE using a mixture gas of CHF 3  and O 2 . If the SiN film  70  in the logic circuit area is removed, the insulating members  70   b  are not left on the side walls of the gate electrode  8   b  in the logic circuit area shown in FIG.  10 D. 
     Fine insulating members  70   b  are likely to be removed at a later process. If the insulating member  70   b  is not left, dusts to be caused by removal of the insulating member  70   b  can be prevented. 
     Next, with reference to FIGS. 11A to  11 D, the seventh embodiment will be described. In the seventh embodiment, as shown in FIG. 11D, the upper surface of the metal silicide film  15  of the second embodiment shown in FIG. 6D is covered with insulating members  77   a  and  77   b  of SiN. Further, in the sixth embodiment, the side spacer insulating members  50   a  and  50   b  of SiO 2  are formed on the side walls of the word lines  8   a  and gate electrode  8   b , whereas in the seventh embodiment, these side spacer insulating members are made of SiN. Namely, the upper surfaces and side walls of the word lines  8   a  and gate electrode  8   b  are covered with the SiN film. 
     The processes up to those processes of FIG. 11A will be described first. In place of the word lines  8   a  shown in FIG. 6A, a two-layer structure is used having a word line  8   a  made of polysilicon and an insulating member  75   a  made of BSG or PSG. Similarly, in place of the gate electrode  8   b  shown in FIG. 6A, a two-layer structure is used having a gate electrode  8   b  made of polysilicon and an insulating member  75   b  made of BSG or PSG. By using these two-layer structures as a mask, impurity ions are implanted to form source/drain regions  9   a  of MOSFET&#39;s in the memory cell array area and low impurity concentration source/drain regions  9   b  of MOSFET&#39;s in the logic circuit area. 
     Side spacer insulating members  50   a  and  50   b  of SiN are formed on the side walls of the two-layer structures. The side spacer insulating members  50   a  and  50   b  are formed by depositing an SiN film by CVD to a thickness of 0.03 to 0.1 μm and thereafter by performing RIE using a mixture gas of CF 4 , CHF 3 , and Ar. Ion implantation is again performed to form high impurity concentration source/drain regions  12   b  of MOSFET&#39;s in the logic circuit area. 
     Side spacer insulating members  76   a  and  76   b  of Sio 2  are formed on the side walls of the side spacer insulating members  50   a  and  50   b . The side spacer insulating members  76   a  and  76   b  are formed by depositing an SiO 2  film by CVD to a thickness of 0.05 to 0.2 μm and thereafter by performing RIE using a mixture gas of CF 4 , CHF 3 , and Ar. Spaces between the word lines  8   a  are buried with the insulating members  50   a  and  76   a.    
     As shown in FIG. 11B, the insulating members  75   a  and  75   b  are removed by using hydrofluoric acid or hydrofluoric acid vapor to expose the upper surfaces of the word lines  8   a  and gate electrode  8   b . Since BSG or PSG has a lower etching resistance relative to hydrofluoric acid than the side spacer insulating members  50   a ,  50   b ,  76   a , and  76   b , the latter can be left unetched with high reproductivity. 
     As shown in FIG. 11C, a metal silicide film  15  is formed on the upper surfaces of the exposed word lines  8   a  and gate electrode  8   b  and on the surfaces of the exposed high impurity concentration source/drain regions  12   b . Since the surfaces of the source/drain regions  9   a  in the memory cell array area are covered with the buried insulating members  50   a  and  76   a , the metal silicide film is not formed on these surfaces of the source/drain regions  9   a.    
     As shown in FIG. 11D, insulating members  77   a  and  77   b  of SiN are formed on the metal silicide films  15  formed on the word lines  8   a  and gate electrode  8   b  and on the side walls of the side spacer insulating members  76   b . The insulating members  77   a  and  77   b  are formed by depositing an SiN film by CVD to a thickness of 100 to 200 nm and thereafter by performing RIE using a mixture gas of CF 4 , CHF 3 , and Ar. 
     In the seventh embodiment, the upper surfaces and side walls of the word lines  8   a  are covered respectively with the insulating members  77   a  and  50   a  of SiN. While the contact hole  24  shown in FIG. 2C is formed, the insulating members  77   a  and  50   a  of SiN protect the word lines  8   a . Therefore, even if an exposure mask is misaligned, the word line  8   a  will not be exposed in the contact hole  24  so that a contact between the word line  8   a  and storage capacitor  25  can be avoided. Even if the contact hole  24  is formed by using an etching mask having an opening larger than the space between the word lines  8   a , the contact hole  24  can be formed in a self-alignment manner. 
     Next, with reference to FIGS. 12A to  12 D, the eighth embodiment will be described. In the seventh embodiment, the insulating members covering the upper surfaces and side walls of the word lines  8   a  and gate electrode  8   b  are made of SiN, whereas in the eighth embodiment, these insulating members are made of siO 2 . 
     The processes up to those shown in FIG. 12A will be described first. Similar to the seventh embodiment shown in FIG. 11A, the word lines  8   a , gate electrode  8   b , and insulating members  75   a  and  75   n  on the word lines and gate electrode are formed. By using these two-layer structures as a mask, impurity ions are implanted to form source/drain regions  9   a  of MOSFET&#39;s in the memory cell array area and low impurity concentration source/drain regions  9   b  of MOSFET&#39;s in the logic circuit area. 
     Side spacer insulating members  50   a  and  50   b  of SiO 2  are formed on the side walls of the two-layer structures. The side spacer insulating members  50   a  and  50   b  are formed by depositing an SiO 2  film by CVD to a thickness of 0.03 to 0.1 μm and thereafter by performing RIE using a mixture gas of CF 4 , CHF 3 , and Ar. Ion implantation is again performed to form high impurity concentration source/drain regions  12   b  of MOSFET&#39;s in the logic circuit area. 
     An SiO 2  film  80  of 10 to 30 nm in thickness and an SiN film  76  of 50 to 200 nm in thickness are deposited by CVD over the whole substrate surface. The SiO 2  film  80  provides a function of improving tight adhesion between the silicon substrate  1  and SiN film  76 . The SiN film  76  and SiO 2  film  80  are anisotropically etched by RIE using a mixture gas of CF 4 , CHF 3 , and Ar to expose the upper surfaces of the insulating members  75   a  and  75   b  on the word lines  8   a  and gate electrode  8   b . Spaces between the word lines  8   a  in the memory cell array area are buried with the insulating members  50   a  and  80   a  of SiO 2  and the insulating member  76   a  of SiN. 
     In the logic circuit area, the insulating member  80   b  of SiO 2  covers the side spacer insulating members  50   b  and a partial surface area of the high impurity concentration source/drain regions  12   b  continuous with the side spacer insulating member  50   b , in conformity with the topology of the underlying layer. The insulating member  76   b  of SiO 2  covers the surface of the insulating member  80   b.    
     As shown in FIG. 12B, the insulating members  75   a  and  75   b  are removed by using hydrofluoric acid or hydrofluoric acid vapor to expose the upper surfaces of the word lines  8   a  and gate electrode  8   b . As shown in FIG. 12C, a metal silicide film  15  is formed on the upper surfaces of the exposed word lines  8   a  and gate electrode  8   b  and on the surfaces of the exposed high impurity concentration source/drain regions  12   b.    
     Similar to FIG. 11D, as shown in FIG. 12D, insulating members  77   a  and  77   b  of SiO 2  instead of SiN are formed on the metal silicide films  15  formed on the word lines  8   a  and gate electrode  8   b  and on the side walls of the side spacer insulating members  76   b.    
     In the eighth embodiment, the upper surfaces and side walls of the word lines  8   a  are covered respectively with the insulating members  77   a  and  50   a  of SiO 2 . If the BPSG films  23  and  18  shown in FIG. 2C are made of SiN instead of BPSG, the contact hole  24  shown in FIG. 2C can be formed in a self-alignment manner. 
     Next, with reference to FIGS. 13A to  13 C, the ninth embodiment sill be described. In the eighth embodiment, in the process shown in FIG. 12A, the surfaces of insulating members  75   a  and  75   b  made of BSG or PSG are exposed by etching the SiN film  76  and Sio 2  film  80  by using a mixture gas of CF 4 , CHF 3 , and Ar. In the ninth embodiment, only the SiN film  76  is etched by RIE using a mixture gas of CHF 3  and O 2 . This etching stops at the SiO 2  film  80  under the SiN film  76  so that the SiO 2  film  80  is left on the insulating members  75   a  and  75   b.    
     FIG. 13A shows the SiO 2  film  80  left unetched. The memory cell array area is covered with a resist pattern  90 . The side spacer insulating member  76   b  is removed by using mixture gas of CHF 3  and O 2  under the conditions that the etching progresses isotropically. Thereafter, the resist pattern  90  is removed. 
     As shown in FIG. 13B, the SiO 2  film  80  left on the insulating members  76   a  and  76   b  is removed by RIE using a mixture gas of CF 4 , CHF 3 , and Ar. The structure shown in FIG. 13C is obtained by performing the processes of FIGS. 12B to  12 D. 
     As shown in FIG. 13C, in the ninth embodiment, a partial surface area of the high impurity source/drain region  12   b  continuous with the side wall of the side spacer insulating member  50   b  is not covered with the insulating member  80   b . Therefore, the end of the metal silicide film on the surface of the source/drain region on the side of the gate electrode  8   b  becomes nearer to the gate electrode  8   b  than the eighth embodiment shown in FIG.  12 D. The resistance of the source/drain region can therefore be lowered. 
     Next, with reference to FIGS. 14A to  14 E, the tenth embodiment will be described. 
     As shown in FIG. 14A, a silicon substrate  1  has element isolation structures  2  formed on its surface, similar to those of the first embodiment shown in FIG. 1A. A gate oxide film  93  is formed through thermal oxidation on the surface of the substrate  1 . A polysilicon film  8  is deposited on the gate oxide film  93 . The polysilicon film  8  in the logic circuit area is patterned to form a gate electrode  8   b . In the memory cell array area, the polysilicon film  8  is not patterned. Impurity ions are implanted to form low impurity concentration source/drain regions in the logic circuit area. 
     As shown in FIG. 14B, side spacer insulating members  10   b  of SiO 2  are formed on the side walls of the gate electrode  8   b . The side spacer insulating members  10   b  are formed by depositing an SiO 2  film by CVD to a thickness of 0.03 to 0.2 μm and thereafter by performing anisotropic RIE. Impurity ions are again implanted to form high impurity concentration source/drain regions in the logic circuit area. 
     As shown in FIG. 14C, a metal silicide film  15  is formed on the upper surfaces of the polysilicon film  8  in the memory cell array area, and on the upper surface of the gate electrode  8   b  and surfaces of the high impurity concentration source/drain regions  12   b  in the logic circuit area. 
     As shown in FIG. 14D, the polysilicon film  8  and metal silicide film  15  are patterned in the memory cell array area to leave word lines  8   a  and metal silicide films formed on the upper surfaces of the wordlines, while the logic circuit area is covered with a resist pattern. 
     As shown in FIG. 14E, impurity ions are implanted into the memory cell array area to form source/drain regions  9   a.    
     Similar to the first to ninth embodiments, also in the tenth embodiment, the metal silicide film can be formed only on the surfaces of the source/drain regions of the logic circuit area without forming it on the surfaces of the source/drain regions  9   a  in the memory cell array area. The side spacer insulating film  10   b  formed in the process shown in FIG. 14B is not required to bury the spaces between the word lines. It is therefore possible to optimize the size of the low impurity concentration region  9   b  in the logic circuit area. 
     Next, with reference to FIGS. 15A to  15 C, the eleventh embodiment will be described. The processes from FIG. 14A to FIG. 14C are used in common with the tenth embodiment. 
     As shown in FIG. 15A, an SiN film  95  of 50 to 200 nm in thickness is deposited over the whole substrate surface. 
     As shown in FIG. 15B, in the memory cell array area, an SiN film  95 , a metal silicide film  15 , and a polysilicon film  8  are patterned to leave word lines  8   a , metal silicide films  15  formed thereon, and insulating members  95   a  of SiN. In the logic circuit area, the SiN film  95  is left over the whole area. Impurity ions are implanted into the memory cell array area to form source/drain regions  9   a.    
     As shown in FIG. 15C, side spacer insulating members  96   a  are formed on the side walls of each lamination structure made of the word line  8   a , metal silicide film  15 , and insulating member  95   a . In the logic circuit area, side spacer insulating members  96   b  are formed on the convex skirt surface of the SiN film  95  in an area corresponding to the gate electrode  8   b.    
     Similar to the seventh embodiment, in the eleventh embodiment, the insulating members  95   a  and  96   b  of SiN cover the upper surfaces and side walls of the word lines  8   a . Therefore, the contact hole  24  shown in FIG. 2C can be formed in a self-alignment manner. 
     In the eleventh embodiment, the insulating members of SiN cover the upper surface and side walls of the word line  8   a . The insulating members of SiO 2  may be used similar to the eighth embodiment. 
     The present invention has been described in connection with the preferred embodiments. The invention is not limited only to the above embodiments. It is apparent that various modifications, improvements, combinations, and the like can be made by those skilled in the art.
First and second regions are defined in a principal surface of a semiconductor substrate. Two projected structures are disposed on the principal surface of the first region and spaced apart by a certain distance. The two projected structures run on a first active region in the first region and on an element isolation region around the first active region. A first silicide film is formed on the surface of a partial active region in the principal surface in the second region. A burying member covers the side walls of the two projected structures and buries a space between the two projected structures at least in the element isolation region. The burying member is not formed above the two projected structures. A metal silicide film is not formed on the surface of the first active region.