This application claims benefit under 35 U.S.C. §119(e) to U.S. Provisional Application No. 61/707,757 filed on Sep. 28, 2012, which is incorporated by reference herein for all purposes. 
    
    
     FIELD 
     The present invention relates to lighting. More specifically, embodiments of the present invention relate to a compact optic lens for a high intensity light source having improved output beam characteristics. Some general goals include, increasing light output without increasing device cost or device size to enable coverage of many beam angles. 
     BACKGROUND 
     The present invention relates to lighting. More specifically, the present invention relates to a compact optic lens for a high intensity light source. 
     The era of the Edison vacuum light bulb will be coming to an end soon. In many countries and in many states, common incandescent bulbs are becoming illegal, and more efficient lighting sources are being mandated. Some of the alternative light sources currently include fluorescent tubes, halogen, and light emitting diodes (LEDs). Despite the availability and improved efficiencies of these other options, many people have still been reluctant to switch to these alternative light sources. 
     The inventors of the present believe that there are several key reasons why consumers have been slow to adopt the newer technologies. One such reason is the use of toxic substances in the lighting sources. As an example, fluorescent lighting sources typically rely upon mercury in a vapor form to produce light. Because the mercury vapor is considered a hazardous material, spent lamps cannot simply be disposed of at the curbside but must be transported to designated hazardous waste disposal sites. Additionally, some fluorescent tube manufacturers go so far as to instruct the consumer to avoid using the bulb in more sensitive areas of the house such as bedrooms, kitchens, and the like. 
     The inventors of the present invention also believe that another reason for the slow adoption of alternative lighting sources is the low performance compared to the incandescent light bulb. As an example, fluorescent lighting sources often rely upon a separate starter or ballast mechanism to initiate the illumination. Because of this, fluorescent lights sometimes do not turn on “instantaneously” as consumers expect and demand. Further, fluorescent lights typically do not immediately provide light at full brightness, but typically ramp up to full brightness within an amount of time (e.g., 30 seconds). Further, most fluorescent lights are fragile, are not capable of dimming, have ballast transformers that can emit annoying audible noise, and can fail in a shortened period of time if cycled on and off frequently. Because of this, fluorescent lights do not have the performance consumers require. 
     Another type of alternative lighting source more recently introduced relies on the use of light emitting diodes (LEDs). LEDs have advantages over fluorescent lights including the robustness and reliability inherent in solid state devices, the lack of toxic chemicals that can be released during accidental breakage or disposal, instant-on capabilities, dimmability, and the lack of audible noise. The inventors of the present invention believe, however, that current LED lighting sources themselves have significant drawbacks that cause consumers to be reluctant to using them. 
     A key drawback with current LED lighting sources is that the light output (e.g., lumens) is relatively low. Although current LED lighting sources draw a significantly lower amount of power than their incandescent equivalents (e.g., 5-10 watts v. 50 watts), they are believe to be far too dim to be used as primary lighting sources. As an example, a typical 5 watt LED lamp in the MR16 form factor may provide 200-300 lumens, whereas a typical 50 watt incandescent bulb in the same form factor may provide 700-1000 lumens. As a result, current LEDs are often used only for exterior accent lighting, closets, basements, sheds or other small spaces. 
     Another drawback with current LED lighting sources includes that the upfront cost of the LED is often shockingly high to consumers. For example, for floodlights, a current 30 watt equivalent LED bulb may retail for over $60, whereas a typical incandescent floodlight may retail for $12. Although the consumer may rationally “make up the difference” over the lifetime of the LED by the LED consuming less power, the inventors believe the significantly higher prices greatly suppress consumer demand. Because of this, current LED lighting sources do not have the price or performance that consumers expect and demand. 
     Additional drawbacks with current LED lighting sources includes they have many parts and are labor intensive to produce. As merely an example, one manufacturer of an MR16 LED lighting source utilizes over 14 components (excluding electronic chips), and another manufacturer of an MR 16 LED lighting source utilizes over 60 components. The inventors of the present invention believe that these manufacturing and testing processes are more complicated and more time consuming, compared to manufacturing and testing of a LED device with fewer parts and a more modular manufacturing process. 
     Additional drawbacks with current LED lighting sources, are that the output performance is limited by heat sink volume. More specifically, the inventors believe for replacement LED light sources, such as MR16 light sources, current heat sinks are incapable of dissipating very much heat generated by the LEDs under natural convection. In many applications, the LED lamps are placed into an enclosure such as a recessed ceiling that already have an ambient air temperatures to over 50 degrees C. At such temperatures the emissivity of surfaces plays only a small roll of dissipating the heat. Further, because conventional electronic assembly techniques and LED reliability factors limit PCB board temperatures to about 85 degrees C., the power output of the LEDs is also greatly constrained. At higher temperatures, the inventors have discovered that radiation plays much more important role thus high emissivity for a heat sink is desirable. 
     Traditionally, light output from LED lighting sources have been increased by simply increasing the number of LEDs, which has led to increased device costs, and increased device size. Additionally, such lights have had limited beam angles and limited outputs due to limitations on the dimensions of reflectors and other optics. 
     Accordingly, what is desired is a highly efficient lighting source without the drawbacks described above. 
     SUMMARY 
     Embodiments of the present invention utilize a monolithically formed optical lens having multiple regions that modify and direct light from the high intensity light source towards an output. In some embodiments, the ultimate output beam angle, beam shape, beam transitions (e.g., falloff), and the like determined by physical characteristics of the monolithically formed optical lens. 
     According to one aspect of the invention, a compact optic lens for a high intensity light source is described. One device includes a molded transparent body having a light receiving region, a light reflecting region, a light blending region, and a light output region. In various embodiments, the light receiving region comprises a first geometric structure within the transparent body that is configured to receive input light from the high intensity light source within a plurality of first two-dimensional planes, and configured to provide first output light within the first two-dimensional planes within the transparent body to a light reflecting region. In some embodiments, the light reflecting region comprises a surface on the transparent body that is configured to receive the first output light from the light receiving region, and configured to provide second output light within the plurality of first two-dimensional planes within the transparent body to the light blending region. In some embodiments, the light blending region comprises a plurality of prism structures formed on the transparent body that are configured to receive the second output light from the light reflecting region, wherein the plurality of prism structures are configured to optically deflect the second output light to form deflected output light within a plurality of second two-dimensional planes, and wherein the plurality of prism structures are configured to provide the deflected output light as blended light within the transparent body to the light output region. In yet other embodiments, the plurality of first two-dimensional plane and the plurality of second two-dimensional planes intersect, and the light output region comprises the surface on the transparent body that is configured to receive the blended light and output the blended light. 
     According to another aspect of the invention, a method for blending light rays from a light source within a optic lens including a light receiving region, a light reflecting region, a light blending region, and a light output region is described. One technique includes receiving in the light receiving region, a first light ray associated with a first two-dimensional plane from the high intensity light source and providing a first output light ray to the light reflecting region, and a second light ray associated with a second two-dimensional plane from the high intensity light source and providing a second output light ray to the light reflecting region, wherein the first two-dimensional plane and the second two-dimensional plane are not parallel. One process includes receiving in the light reflecting region the first output light ray from the light receiving region and providing a third light ray associated with the first two-dimensional plane to the light blending region, and the second output light ray from the light receiving region and providing a fourth light ray associated with the second two-dimensional plane to the light blending region. A method includes receiving in a plurality of prismatic structures, the third light ray from the light reflecting region and providing a fifth light ray associated with a third two-dimensional plane to the light output region, and the fourth light ray from the light reflecting region and providing a sixth light ray associated with a fourth two-dimensional plane to the light output region, wherein the first two-dimensional plane and the third two-dimensional plane are not parallel, and wherein the second two-dimensional plane and the fourth two-dimensional plane are not parallel. A method includes receiving at a specific location on the light output region, the fifth light ray and the sixth light ray, and outputting blended light in response to the fifth light ray and the sixth light ray. 
     According to yet another aspect of the invention, an illumination source configured to output blended light is described. One source includes an LED light unit configured to provide non-uniform light output in response to an output driving voltage, and a driving module coupled to the LED light unit, wherein the driving module is configured to receive an input driving voltage and configured to provide the output driving voltage. A lamp includes a heat sink coupled to the LED light unit, wherein the heat sink is configured to dissipate heat produced by the LED light unit and the driving module, and a reflector coupled to the heat sink, wherein the reflector is configured to receive the non-uniform light output, and wherein the reflector is configure to output a light beam having reduced non-uniform light output. 
    
    
     
       BRIEF DESCRIPTION OF THE DRAWINGS 
       In order to more fully understand the present invention, reference is made to the accompanying drawings. Understanding that these drawings are not to be considered limitations in the scope of the invention, the presently described embodiments and the presently understood best mode of the invention are described with additional detail through use of the accompanying drawings in which: 
         FIG. 1  and  FIG. 2  illustrate various embodiments of the present invention. 
         FIG. 3  and  FIG. 4  illustrate modular diagrams according to various embodiments of the present invention. 
         FIG. 5A  and  FIG. 5B  illustrate an embodiment of the present invention. 
         FIG. 6  and  FIG. 7  illustrate various embodiments of the present invention. 
         FIG. 8  and  FIG. 9  illustrate detailed diagrams according to various embodiments of the present invention. 
         FIG. 10  illustrates an example of redirection of light rays according to various embodiments. 
         FIG. 11  illustrates a cross-section of another embodiment of the present invention. 
     
    
    
     DETAILED DESCRIPTION 
     The inventor of the present invention has discovered that with typical single LED lighting assemblies and multiple LED lighting assemblies, the output light beam is typically non-spatially uniform. For instance, the inventor has noted that, the output light beams of many current LED light sources have hot-spots, dark-spots, roll-offs, rings, and the like. The inventor considers such non-uniformities as unattractive and unacceptable for use in many if not most lighting applications. In light of this, the inventor has developed a lighting source that has reduced non-uniform output light beams. Additionally, the inventor has developed a reflective lens capable of receiving non-uniform input light beams, and outputting output light beams with reduced non-uniformity. In some embodiments, the output light beam of the reflective may have increased non-uniformity in output light beams, by specific design, e.g., a light ring pattern. 
       FIG. 1  illustrates an embodiment of the present invention. More specifically,  FIGS. 1 and 2  illustrate embodiments (e.g., in an MR-16 form factor) of an MR-16 light source compatible LED lighting source  100  having GU 5.3 form factor compatible base  120 . MR-16 lighting sources typically operate upon 12 volts, alternating current (e.g., VAC). In the examples illustrated, LED lighting source  100  is configured to provide a spot light having approximately a 10 degree beam size. In other embodiments LED lighting sources may be configured to provide a flood light having a 25 or 40 degree beam size, or any other lighting pattern. 
     In various embodiments, an LED assembly described in the pending patent applications described above, and variations thereof, may be used within LED lighting source  100 . These LED assemblies are currently under development by the assignee of the present patent application. In various embodiments, LED lighting source  100  may provide a peak output brightness of approximately 7600 to 8600 candelas (with approximately 360 to 400 lumens), a peak output brightness of approximately 1050 to 1400 candelas for a 40 degree flood light (with approximately 510 to 650 lumens), and a peak output of approximately 2300 to 2500 candelas for a 25 degree flood light (with approximately 620 to 670 lumens), and the like. Various embodiments of the present invention therefore are believed to have achieved the same brightness as conventional halogen bulb MR-16 lights. 
       FIG. 2  illustrates a modular diagram according to various embodiments of the present invention. As can be seen in  FIG. 2  in various embodiments, light  200  includes a reflecting lens  210 , an integrated LED module/assembly  220 , a heat sink  230 , a base housing  240 , a transmissive optical lens (e.g., transmissive lens  260 , optional), and a retainer  270 . As will be discussed further below, in various embodiments, the modular approach to assembling light  200  are believed to reduce the manufacturing complexity, reduce manufacturing costs, and increase the reliability of such lights. 
     In various embodiments, reflective lens  210  and transmissive lens  260  may be formed from a UV and resistant transparent material, such as glass, polycarbonate material, or the like. In various embodiments, lens  210  or lens  260  may be clear and transmissive or solid or coated and reflective. In the case of lens  210 , the solid material creates a folded light path such that light that is generated by the integrated LED assembly  220  internally reflects within lens  210  more than one time prior to being output. Such a folded optic lens enables light  200  to have a tighter columniation of light than is normally available from a conventional reflector of equivalent depth, as will be discussed further below. In the case of lens  260 , the solid material may be clear or tinted, may be machined or molded, or the like to control the output characteristics of the light from lens  210 . 
     In various embodiments, to increase durability of the lights, the optical materials should be operable at an elevated temperature (e.g., 120 degrees C.) for a prolonged period of time (e.g., hours). One material that may be used for lens  210  is known as Makrolon™ LED 2045 or LED 2245 polycarbonate available from Bayer Material Science AG. In other embodiments, other similar materials may also be used. 
     In  FIG. 2 , lens  210  may be secured to heat sink  230  via one or more indentations or heat dissipation fins on heat sink  230 , or the like. In addition, lens  210  may also be secured via an adhesive proximate to where integrated LED assembly  220  is secured to heat sink  230 . In various embodiments, separate clips may be used to restrain lens  210 . These clips may be formed of heat resistant plastic material that is preferably white colored to reflect backward scattered light back through the lens. 
     In other embodiments, transmissive lens  260  may be secured to heat sink  230  via the clips described above. Alternatively, transmissive lens  260  may first be secured to a retaining ring  270 , and retaining ring may be secured to one or more indents of heat sink  230 , as will be illustrated below in greater detail. In some embodiments, once transmissive lens  260  and a retaining mechanism (e.g., retaining ring  270 ) is secured to lens  210  or heat sink  230 , they cannot be removed by hand. In such cases, one or more tools must be used to separate these components. In other embodiments, these components may be removed from lens  210  or heat sink  230  simply by hand. 
     In various embodiments of the present invention, LED assemblies may be binned based upon lumen per watt efficacy. For example, in some examples, an integrated LED module/assembly having a lumen per watt (L/W) efficacy from 53 to 66 L/W may be binned for use for 40 degree flood lights, a LED assembly having an efficacy of approximately 60 L/W may be binned for use for spot lights, a LED assembly having an efficacy of approximately 63 to 67 L/W may be used for 25 degree flood lights, and the like. In other embodiments, other classification or categorization of LED assemblies on the basis of L/W efficacy may be used for other target applications. 
     In some embodiments, as will be illustrated below integrated LED assembly/module  220  includes 36 LEDs arranged in series, in parallel series (e.g., three parallel strings of 12 LEDs in series), or the like. In other embodiments, any number of LEDs may be used, e.g., 1, 10, 16, or the like. In other embodiments, the LEDs may be electrically coupled in other manner, e.g., all series, or the like. Further detail regarding such LED assemblies is provided in the patent applications incorporated by reference above. 
     In various embodiments, the targeted power consumption for LED assemblies is less than 13 watts. This is much less than the typical power consumption of halogen based MR16 lights (50 watts). Accordingly, embodiments of the present invention are able to match the brightness or intensity of halogen based MR16 lights, but using less than 20% of the energy. 
     In various embodiments of the present invention, LED assembly  220  is directly secured to heat sink  230  to dissipate heat from the light output portion and/or the electrical driving circuits. In some embodiments, heat sink  230  may include a protrusion portion  250  to be coupled to electrical driving circuits. As will be discussed below, LED assembly  220  typically includes a flat substrate such as silicon or the like. In various embodiments, it is contemplated that an operating temperature of LED assembly  220  may be on the order of 125 to 140 degrees C. The silicon substrate is then secured to the heat sink using a high thermal conductivity epoxy (e.g., thermal conductivity ˜96 W/m.k.). In some embodiments, a thermoplastic/thermo set epoxy may be used such as TS-369, TS-3332-LD, or the like, available from Tanaka Kikinzoku Kogyo K.K. Other epoxies may also be used. In some embodiments, no screws are otherwise used to secure the LED assembly to the heat sink, however, screws or other fastening means may also be used in other embodiments. 
     In various embodiments, heat sink  230  may be formed from a material having a low thermal resistance/high thermal conductivity. In some embodiments, heat sink  230  may be formed from an anodized 6061-T6 aluminum alloy having a thermal conductivity k=167 W/m.k., and a thermal emissivity e=0.7. In other embodiments, other materials may be used such as 6063-T6 or 1050 aluminum alloy having a thermal conductivity k=225 W/m.k. and a thermal emissivity e=0.9. In other embodiments, still other alloys such AL 1100, or the like may be used. Additional coatings may also be added to increase thermal emissivity, for example, paint provided by ZYP Coatings, Inc. utilizing CR 2 O 3  or CeO 2  may provide a thermal emissivity e=0.9; coatings provided by Materials Technologies Corporation under the brand name Duracon™ may provide a thermal emissivity e&gt;0.98; and the like. In other embodiments, heat sink  230  may include other metals such as copper, or the like. 
     In some example, at an ambient temperature of 50 degrees C., and in free natural convection heat sink  230  has been measured to have a thermal resistance of approximately 8.5 degrees C./Watt, and heat sink  290  has been measured to have a thermal resistance of approximately 7.5 degrees C./Watt. With further development and testing, it is believed that a thermal resistance of as little as 6.6 degrees C./Watt is achievable in other embodiments. In light of the present patent disclosure, it is believed that one of ordinary skill in the art will be able to envision other materials having different properties within embodiments of the present invention. 
     In various embodiments, base assembly/module  240  in  FIG. 2  provides a standard GU 5.3 physical and electronic interface to a light socket. As will be described in greater detail below, a cavity within base module  240  includes high temperature resistant electronic circuitry used to drive LED module  220 . In various embodiments, an input voltage of 12 VAC to the lamps are converted to 120 VAC, 40 VAC, or other voltage by the LED driving circuitry. The driving voltage may be set depending upon specific LED configuration (e.g., series, parallel/series, etc.) desired. In various embodiments, protrusion portion  250  extends within the cavity of base module  240 . 
     The shell of base assembly  240  may be formed from an aluminum alloy, and may formed from an alloy similar to that used for heat sink  230  and/or heat sink  290 . In one example, an alloy such as AL 1100 may be used. In other embodiments, high temperature plastic material may be used. In some embodiments of the present invention, instead of being separate units, base assembly  240  may be monolithically formed with heat sink  230 . 
     As illustrated in  FIG. 2 , a portion of the LED assembly  220  (silicon substrate of the LED device) contacts heat sink  230  in a recess within the heat sink  230 . Additionally, another portion of the LED assembly  220  (containing the LED driving circuitry) is bent downwards and is inserted into an internal cavity of base module  240 . 
     In various embodiments, to facilitate a transfer of heat from the LED driving circuitry to the shell of the base assemblies, and of heat from the silicon substrate of the LED device, a potting compound is provided. The potting compound may be applied in a single step to the internal cavity of base assembly  240  and to the recess within heat sink  230 . In various embodiments, a compliant potting compound such as Omegabond®  200  available from Omega Engineering, Inc. or 50-1225 from Epoxies, Etc. may be used. In other embodiments, other types of heat transfer materials may be used. 
       FIGS. 3 and 4  illustrate an embodiment of the present invention. More specifically,  FIG. 3  illustrates an LED package subassembly (LED module) according to various embodiments. More specifically, a plurality of LEDs  300  is illustrated disposed upon a substrate  310 . In some embodiments, it is contemplated that the plurality of LEDs  300  are connected in series and powered by a voltage source of approximately 120 volts AC (VAC). To enable a sufficient voltage drop (e.g., 3 to 4 volts) across each LED  300 , in various embodiments 30 to 40 LEDs are contemplated to be used. In specific embodiments, 37 to 39 LEDs are coupled in series. In other embodiments, LEDs  300  are connected in parallel series and powered by a voltage source of approximately 40 VAC. For example, the plurality of LEDs  300  include 36 LEDs arranged in three groups each having 12 LEDs  300  coupled in series. Each group is thus coupled in parallel to the voltage source (40 VAC) provided by the LED driver circuitry, such that a sufficient voltage drop (e.g., 3 to 4 volts) is achieved across each LED  300 . In other embodiments, other driving voltages are envisioned, and other arrangements of LEDs  300  are also envisioned. 
     In various embodiments, the LEDs  300  are mounted upon a silicon substrate  310 , or other thermally conductive substrate. In various embodiments, a thin electrically insulating layer and/or a reflective layer may separate LEDs  300  and the silicon substrate  310 . Heat produced from LEDs  300  is typically transferred to silicon substrate  310  and to a heat sink via a thermally conductive epoxy, as discussed above. 
     In various embodiments, silicon substrate is approximately 5.7 mm×5.7 mm in size, and approximately 0.6 microns in depth. The dimensions may vary according to specific lighting requirement. For example, for lower brightness intensity, fewer LEDs may be mounted upon the substrate, accordingly the substrate may decrease in size. In other embodiments, other substrate materials may be used and other shapes and sizes may also be used, such as approximately ovoid or round. 
     In various embodiments, the silicon substrate  310  and/or flexible printed circuit (FPC)  340  may have a specified (e.g., controlled) color, or these surfaces may be painted or coated with a material of a specified (e.g., controlled) color. In some embodiments, it has been recognized that some light from LEDs  300  that enters lens  210  may escape from the back side of lens  210 . This escaped light may reflect from silicon substrate  310  and/or flexible printed circuit (FPC)  340 , enter lens  210  and be output from the front of lens  210 . A result is that light output from lens  210  may be tinted, colored, or affected by the color of silicon substrate  310  and/or FPC  340 . Accordingly, in some embodiments, the surface coloring of these surfaces is controlled. In some instances, the color may be whitish, bluish, reddish, or any other color that is desired. In various embodiments, portions of heat sink  230  may also have a controlled color for similar reasons. For example, the surface of heat sink  230  facing lens  210  may be painted or anodized in a specific color such as white, silver, yellow, or the like. This surface may have a different color compared to other surfaces of heat sink  230 . For example, heat sink  230  may be bronze in color, and the inner surface of heat sink  230  facing lens  210  may be silver in color, or the like. 
     As shown in  FIG. 3 , a ring of silicone  315  is disposed around LEDs  300  to define a well-type structure. In various embodiments, a phosphorus bearing material is disposed within the well structure. In operation, LEDs  300  provide a blue-ish light output, a violet, or a UV light output. In turn, the phosphorous bearing material is excited by the blue/UV output light, and emits white light output. Further details of embodiments of plurality of LEDs  300  and substrate  310  are described in the co-pending application incorporated by reference and referred to above. 
     As illustrated in  FIG. 3 , a number of bond pads  320  may be provided upon substrate  310  (e.g., 2 to 4). Then, a conventional solder layer (e.g., 96.5% tin and 5.5% gold) may be disposed upon silicon substrate  310 , such that one or more solder balls  330  are formed thereon. In the embodiments illustrated in  FIG. 3 , four bond pads  320  are provided, one at each corner, two for each power supply connection. In other embodiments, only two bond pads may be used, one for each AC power supply connection. 
     Illustrated in  FIG. 3  is a flexible printed circuit (FPC)  340 . In various embodiments, FPC  340  may include a flexible substrate material such as a polyimide, such as Kapton™ from DuPont, or the like. As illustrated, FPC  340  may have a series of bonding pads  350 , for bonding to silicon substrate  310 , and bonding pads  360 , for coupling to the high supply voltage (e.g., 120 VAC, 40 VAC, etc). Additionally, in some embodiments, an opening  370  is provided, through which LEDs  300  will shine through. 
     Various shapes and sizes for FPC  340  are contemplated in various embodiments of the present invention. For example, as illustrated in  FIG. 3 , a series of cuts  380  may be made upon FPC  340  to reduce the effects of expansion and contraction of FPC  340  versus substrate  310 . As another example, a different number of bonding pads  350  may be provided, such as two bonding pads. As merely another example, FPC  340  may be crescent shaped, and opening  370  may not be a through hole. In other embodiments, other shapes and sizes for FPC  340  are contemplated in light of the present patent disclosure. 
     In  FIG. 4 , substrate  310  is bonded to FPC  340  via solder balls  330 , in a conventional flip-chip type arrangement to the top surface of the silicon. By making the electrical connection at the top surface of the silicon, it is electrically isolated from the heat transfer surface of the silicon. This allows the entire bottom surface of the silicon substrate  310  to transfer heat to the heat sink. Additionally, this allows the LED to bonded directly to the heat sink to maximize heat transfer instead of a PCB material that typically inhibits heat transfer. As can be seen in this configuration, LEDs  300  are thus positioned to emit light through opening  370 . In various embodiments, the potting compound discussed above is also used to serve as an under fill operation, or the like to seal the space  380  between substrate  310  and FPC  340 . 
     After the electronic driving devices and the silicon substrate  310  are bonded to FPC  340 , the LED package sub assembly or module  220  is thus assembled. In various embodiments, these LED modules may then be individually tested for proper operation. 
       FIGS. 5A and 5B  illustrate a block diagram of a manufacturing process according to embodiments of the present invention. In various embodiments, some of the manufacturing separate processes may occur in parallel or in series. For sake of understanding, reference may be given to features in prior figures. 
     In various embodiments, the following process may be performed to form an LED assembly/module. Initially, a plurality of LEDs  300  are provided upon an electrically insulated silicon substrate  310  and wired, step  400 . As illustrated in  FIG. 3 , a silicone dam  315  is placed upon the silicon substrate  310  to define a well, which is then filled with a phosphor-bearing material, step  410 . Next, the silicon substrate  310  is bonded to a flexible printed circuit  340 , step  420 . As disclosed above, a solder ball and flip-chip soldering (e.g.,  330 ) may be used for the soldering process in various embodiments. 
     Next, a plurality of electronic driving circuit devices and contacts may be soldered to the flexible printed circuit  340 , step  430 . The contacts are for receiving a driving voltage of approximately 12 VAC. As discussed above, unlike present state of the art MR-16 light bulbs, the electronic circuit devices, in various embodiments, are capable of sustained high-temperature operation, e.g., 120 degrees C. 
     In various embodiments, the second portion of the flexible printed circuit including the electronic driving circuit is inserted into the heat sink and into the inner cavity of the base module, step  440 . As illustrated, the first portion of the flexible printed circuit is then bent approximately 90 degrees such that the silicon substrate is adjacent to the recess of the heat sink. The back side of the silicon substrate is then bonded to the heat sink within the recess of the heat sink using an epoxy, or the like, step  450 . 
     In various embodiments, one or more of the heat producing the electronic driving components/circuits may be bonded to the protrusion portion of the heat sink, step  460 . In some embodiments, electronic driving components/circuits may have heat dissipating contacts (e.g., metal contacts) These metal contacts may be attached to the protrusion portion of the heat sink via screws (e.g., metal, nylon, or the like). In some embodiments, a thermal epoxy may be used to secure one or more electronic driving components to the heat sink. Subsequently a potting material is used to fill the air space within the base module and to serve as an under fill compound for the silicon substrate, step  470 . 
     Subsequently, a reflective lens may be secured to the heat sink, step  480 , and the LED light source may then be tested for proper operation, step  490 . 
       FIGS. 6 and 7  illustrate various views of one embodiment of a reflective lens  600 , as mentioned above. More specifically,  FIG. 6  includes perspective view  210 , a top view  610  and a side view  620  of a reflective lens  600 , and  FIG. 7  illustrates a close-up view of a cross-section  630  according to various embodiments. 
     In various embodiments, reflective lens  600  is monolithic and fabricated via a molding process. In other embodiments, reflective lens  600  may be fabricated via a molding and etching process. As discussed above, reflective lens  600  may be formed from a transparent material such as Makrolon™ LED 2045 or LED 2245 polycarbonate available from Bayer Material Science AG. In the various embodiments, a forward-facing side  635  and a rearward-facing side  645  define bounds of the transparent material forming reflective lens  600 . 
     As can be seen in cross-section  630  in  FIG. 7 , reflective lens  600  includes a body  680  with number of physical regions including a light receiving region  640 , a combined light reflecting region and a light output region  650 , and a light blending region  660 . 
       FIGS. 8 and 9  illustrate detailed diagrams according to various embodiments of the present invention. As seen in  FIG. 8 , in various embodiments, light blending region  660  comprises a plurality of prism structures (e.g., triangular prismatic structures  690 ). As can be seen, in some embodiments, the prismatic structures  690  begin in an inner region  700  and extend towards an outer perimeter  710  following along the contour of rearward-facing side  645 . In other embodiments, prismatic structures  690  may follow other paths along the contour of rearward-facing side  645 , such as a spiral pattern, concentric pattern, or the like. 
     In some embodiments of the present invention, for an MR-16 light source, there are approximately 180 (within a range of 150 to 200) prismatic structures (e.g. each prismatic structure is approximately 2 degrees). Accordingly, at outer perimeter, the pitch between prisms is approximately 0.8 mm (within a range of 0.75 mm to 1 mm) Additionally, the peak to trough depth is approximately 0.4 mm (within a range of 0.3 mm to 0.5 mm). In other embodiments, the number of prismatic structures, the pitches, the depths, or the like may change depending upon specific design. 
     In some embodiments, an internal angle of the prismatic structures are constant as measured by a tangent line along rearward-facing side  645 . In some embodiments, the angles may be slightly less than 90 degrees (e.g., 85, 89, 89.5 degrees, or the like); the angles may be slightly more than 90 degrees (e.g., 90.5, 91, 95 degrees, or the like); or the angles may be approximately 90 degrees. 
     In some embodiments, the internal angles of the prismatic structures need not be constant, and may be dependent upon a radial distance away from light receiving region. For example, near inner region  700 , the angle may be slightly more than 90 degrees (e.g., 91, 95 degrees, or the like), and outer region  710 , the angle may be much larger than 90 degrees (e.g., 110, 120 degrees, or the like). In some embodiments, modification of the angle may help reduce or increase hotspots, reduce undesired voids, or modify the beam shape, as desired. 
     As illustrated in the example in  FIG. 9 , at outer perimeter  710 , prismatic structures  690  may be flattened  705 . In various embodiments, this may reduce breakage and facilitate mounting within a heat-sink, as discussed above. 
     In operation, in various embodiments as illustrated in  FIG. 7 , an LED source, as described above, provides high intensity light  670  (e.g., light ray  720 ) to light receiving region  640 . In various embodiments, because of an index of refraction mismatch, high intensity light bends within body  680  to form light ray  730 . Next, in various embodiments, based upon the index of refraction mismatch, the light ray  730  from the light output region  640  internally reflects (light ray  740 ) at region  650  within body  680  towards light blending region  660 . 
     In various embodiments, light blending region  660  changes the direction of light ray  740  received from region  650 , to generally be directed towards region  650 , e.g., light ray  750 . Subsequently, at region  650 , because of index of refraction mismatch, light ray  750  becomes light ray  760 . In the example in  FIG. 7 , light rays  750  and  760  are dotted, as these light rays are typically not within the same two-dimensional plane as light rays  720 ,  730 , and  740 . For example, as illustrated in a top view in  FIG. 10 , light rays  730  and  740  are shown traversing body  680  within first plane  770 . However, when light ray  740  strikes a left leaning prism face  790 , it becomes light ray  745  that in turn strikes a right leading prism face  800  and become light ray  750 . As can be seen, light ray  745  and  750  shown traversing body  680  within a second plane  780 . 
       FIG. 10  also illustrates an example of out-of plane redirection of light rays at light blending region  660 . In various embodiments of the present invention, as approximately parallel light rays strike the prismatic structures, the light rays are redirected in different directions, depending upon which part of the structures they strike. For example, a first light ray  740  strikes a first portion  790  of a first prismatic structure, bends to the left as light ray  745 , strikes a first portion  800  of a second prismatic structure and is directed upwards and to the left as light ray  750  towards region  650 . In contrast, a second light ray  810  strikes a second portion  820  of a first prismatic structure, bends to the right as light ray  820 , strikes a first portion  830  of a second prismatic structure and directed upwards and to the right as light ray  840  towards region  650 . Because the same effect occurs to other light rays that strike the prismatic structures, light that reaches a particular portion of region  650  may be light from different light rays from the high intensity light source. Accordingly, the light rays are blended and output from the reflective lens. 
       FIG. 11  illustrates a cross-section of another embodiment of the present invention. More specifically, a reflective lens  900 , including a light receiving region  910 , a light reflection region  920 , a light blending region  930 , and a light output region  940 . As discussed above, in various embodiments, light reflection region  920  and light output region  940  may be the same physical surface. As can be seen, light receiving region  910  may be flat, compared to the embodiments illustrated above. Further, it should be understood that the outer perimeter may be flattened similar to flattened  705  region in prismatic structures  690 , as desired. 
     In this example, high intensity light  940  is provided to light receiving region  910 . The light enters reflective lens  900  and internally reflects within light reflection region  920 . The reflected light strikes the light blending region  930 , and as described above, bends the light into a different two-dimensional plane (dotted lines). The blended light is output from light output region  940 , as was discussed. 
     Further embodiments can be envisioned to one of ordinary skill in the art after reading this disclosure. In other embodiments, combinations or sub-combinations of the above disclosed invention can be advantageously made. The block diagrams of the architecture and flow charts are grouped for ease of understanding. However it should be understood that combinations of blocks, additions of new blocks, re-arrangement of blocks, and the like are contemplated in alternative embodiments of the present invention. 
     The specification and drawings are, accordingly, to be regarded in an illustrative rather than a restrictive sense. It will, however, be evident that various modifications and changes may be made thereunto without departing from the broader spirit and scope.
The present invention relates to a compact optic lens for a high intensity light source having improved output beam characteristics. The compact optic lens provides increased light output without increasing device cost or device size to enable coverage of many beam angles.