BACKGROUND OF THE INVENTION 
       [0001]    This invention relates to the manufacture of cards with electrostatic protection where the cards include a metal layer. 
         [0002]    The term “card” or “cards” as used herein, and in the appended claims, is intended to include a large variety of documents and instruments such as transactional (financial or credit) cards, identification (including National ID or Driver&#39;s License) cards, electronic passport pages, gift cards, documents for holding permanent and long lasting records such as medical records or security cards, or other cards used for promotion of a product or organization. 
         [0003]    The manufacture of cards formed solely of a metal layer is known. These cards are intended to provide an indication of status and/or bestow a degree of prestige to the user. However, they are generally much more expensive to manufacture than the ubiquitous “plastic” cards. 
         [0004]    Due to the prestige associated with the metal cards, it has become desirable to many users to have a “metal” card. However, the cost of manufacturing metal cards makes it uneconomical and hence undesirable in many applications. As a compromise, Applicant proposed in co-pending application titled Combination Card of Metal and Plastic bearing Ser. No. 13/135,139 the making of cards which include at least one metal layer and at least one plastic layer. Such a card, which may be referred to herein and in the appended claims as a “hybrid-card”, is generally cheaper to make than a pure metal card and would also have some advantages such as the ease with which information may be formed on the plastic layer including the magnetic stripe, hologram and signature panel. 
         [0005]    In co-pending application Ser. No. 13/135,139, Applicant addressed and resolved some of the major problems which exist in the manufacture of a hybrid card (i. e., one having a metal layer and a plastic layer) since the normally different responses of the plastic and metal layers to temperature and stress tend to cause the card to warp and/or delaminate. Consequently, the manufacture of hybrid cards is more attractive. 
         [0006]    In brief, it is desirable to have or to make “metal” or “hybrid” cards; where the “metal” cards are either wholly or mostly comprised of metal and the “hybrid” cards include at least one metal layer and one plastic layer. 
         [0007]    However, there are significant problems with the handling of metal and hybrid cards and their use in point of sale (POS) equipment. The presence of any metal layer may cause an ESD event or a short circuit. It is known that electronic circuitry in point of sale (POS) devices, used to execute financial transactions, are sensitive and susceptible to electro-static discharge (ESD) events caused by the transfer of electrostatic charge from the card-holder and financial transaction card to the POS device itself. In fact the problem of electrostatic discharge is known to plague the Credit/Debit card industry 
         [0008]    The presence of any metal on the financial card increases the likelihood of such an ESD event. The ESD type of event can reset or damage the electronics in the POS device. Due to this phenomenon, a metal card or any card containing a metal layer of virtually any thickness [e.g., greater than 0.001″ thick] can lead to catastrophic failure of the POS device or any like device in certain environments (e.g., cold, low humidity environments). 
         [0009]    Therefore, it is an object of this invention to manufacture metal cards and or hybrid cards (i.e., cards having at least one metal layer and at least one plastic layer) with electrostatic discharge and/or short circuit protection. 
         [0010]    In the discussion to follow, including the appended claims, reference is made to metal layer(s) for ease of reference. It should be understood that the metal layer may be any layer of electrically conductive material, as is normally the case with metals. 
       SUMMARY OF THE INVENTION 
       [0011]    In accordance with the invention, in order to minimize the likelihood of an ESD event (or a potential short circuit), a “metal” card or a “hybrid” having a metal layer with an exposed top surface (also referred to herein as an “inner” surface) or a bottom surface (also referred to herein as an “outer” surface) includes a protective coating overlying the exposed top and/or bottom surface of the metal layer in order to insulate the exposed metal surface and prevent it from directly touching another surface. Insulating the surfaces of the metal layer reduces the possibility of an ESD or causing a short circuit condition when the card is inserted or removed from a POS device or any like device. 
         [0012]    The protective coating includes a layer (coat) of clear resin and/or a layer of a “hard” material which would also provide resistance against wear and tear and scratching. The protective may include either or both types of layers. 
         [0013]    In a particular embodiment of the invention there is included a coat of clear resin overlying the exposed metal surface and a “hard” top-coat layer overlying the clear coat layer. The dual stage protective layers which include a clear-coat layer and a hard top-coat layer ensure that the problem associated with an ESD and/or a short circuit condition is minimized. In addition, the dual stage protection imparted to a card by forming a clear-coat layer and a top-coat layer ensures that any card surface treatment or card decoration is protected over time from excessive wear due to use in conjunction with a POS device and/or during its handling. 
         [0014]    A hybrid card embodying the invention typically includes: (a) a first assembly comprised of multiple plastic layers which have been laminated at a first temperature and pressure; (b) a second assembly comprised of a metal layer which is laminated with the first assembly at a second temperature and pressure; and (c) a protective layer which includes at least one, or both of: (i) a clear coat layer of resin overlying the metal layer; and (ii) a hard top coat layer overlying the metal layer. 
         [0015]    Alternatively, the protective layer may be formed to include a clear coat layer overlying the metal layer and a top coat layer overlying the clear coat layer. 
         [0016]    A hybrid card embodying the invention may also include a top coat layer and/or a clear coat layer overlying the plastic layers. 
         [0017]    A card embodying the invention may include: (a) an electrically conductive (e.g., metal) core layer and (b) a protective coating which may be comprised of: (i) clear coat layers overlying the top and bottom surfaces of the core layer; and/or (ii) hard top coat layers overlying the top and bottom surfaces of the core layer. Alternatively the protective coating includes clear coat layers overlying the top and bottom surfaces of the core layer and hard top coat layers overlying the clear coat layers. 
         [0018]    The clear coat layer may be formed of an acrylic resin (i.e., any of numerous thermoplastic or thermosetting polymers or copolymers of acrylic acid, methacrylic acid, any esters of these acids, or acrylonitrile), ultra violet (UV) curable resin blend including polyester, urethane, diol and carboxyl acrylates with ceramic particles, multifunctional acrylate polymers or any like material. The clear coat resin layer may be applied (or formed) by spraying, screen printing, painting, powder coating or any other like method, and cured (processed) by UV cure, electron beam curing, oven heat, or any radiation curing method or in any other suitable manner. 
         [0019]    The “hard” top coat layer may be formed of electrically non-conductive nano-particles (e.g., silicon or ceramic particles or particles of any hard electrically non-conductive materials, also including polymeric (acrylic) carriers of nano-particles which may, but need not, be in a polymeric radiation cured vehicle. 
         [0020]    The hard top coat nano-particle layer may be applied (or formed) by atomizing, spraying, painting, roll coating, screen printing, thermal transfer or any like suitable method and processed by conventional automotive type spray guns, brushes, screen print equipment, roll lamination and any like suitable method. 
         [0021]    A method for making a hybrid card embodying the invention includes the steps of: (a) laminating multiple plastic layers together under preselected pressure and temperature conditions to reduce subsequent dimensional changes and to form a first “plastic” assembly which is dimensionally stable; (b) forming a second assembly which includes the first “plastic” assembly and a metal layer with an adhesive layer between the plastic assembly and the metal layer; (c) subjecting the second assembly to a lamination process under predetermined temperature and pressure condition; and (d) applying a clear coat resin layer or a hard top coat layer over the metal layer to insulate the metal layer and prevent the metal layer from making direct contact with any other surface to reduce electrostatic discharge (ESD) problems. 
         [0022]    Alternatively, the method includes applying a clear coat resin layer over the metal layer to insulate the metal layer and the additional step of applying a hard coat top layer over the clear coat layer for increasing the level of insulation and improving the hardness and resistance to wear of the surface of the card. 
         [0023]    A method for making a metal card embodying the invention includes the steps of: (a) preparing and treating a metal core layer, including providing appropriate cut-outs, to make the core layer suitable for its intended use; and (b) applying a clear coat resin layer or a hard top coat layer over the metal layer to insulate the metal layer (core) and prevent the metal layer from making direct contact with any other surface to reduce electrostatic discharge (ESD) problems. 
         [0024]    Alternatively, the method includes applying a clear coat resin layer over the metal layer to insulate the metal layer and the additional step of applying a hard coat top layer over the clear coat layer for increasing the level of insulation and improving the hardness and resistance to wear of the surface of the card. 
     
    
     
       BRIEF DESCRIPTION OF THE DRAWINGS 
         [0025]    In the accompanying drawings, which are not drawn to scale, like reference characters denote like components, and: 
           [0026]      FIG. 1A  is highly simplified cross-sectional diagram of a first “plastic” assembly used to practice the invention; 
           [0027]      FIG. 1B  is a simplified cross-sectional diagram of a first “plastic” assembly used to practice the invention showing the addition of printing matter and a magnetic stripe; 
           [0028]      FIG. 1C  is a simplified cross-sectional diagram of a first “plastic” assembly used to practice the invention showing the addition of RFID chips between the plastic layers prior to lamination of the first assembly; 
           [0029]      FIG. 1D  is a simplified cross-sectional diagram of he plastic assembly of  FIG. 1C  with the addition of a contact chip; 
           [0030]      FIG. 2A  is a highly simplified cross-sectional diagram of a first plastic assembly of the type shown in  FIG. 1A  combined with a second assembly having a metal layer used to practice the invention; 
           [0031]      FIG. 2B  is a simplified cross-sectional diagram of the embodiment shown in  FIG. 2A  with the additional showing of a magnetic stripe and printed information to a plastic layer; 
           [0032]      FIG. 2C  is a simplified cross-sectional diagram of the assembly shown in  FIG. 2B  with the additional showing of RFID and contact chips and the addition of information to the “top” plastic layer and the etching, embossing or engraving of the “bottom” metal layer; 
           [0033]      FIG. 3  is a simplified cross-sectional diagram illustrating the addition of a clear coat layer overlying the external surface of the metal layer in accordance with the invention; 
           [0034]      FIG. 3A  is a simplified cross-sectional diagram illustrating the addition of clear coat layers overlying the external top and bottom surfaces of a card assembly, in accordance with the invention; 
           [0035]      FIG. 3B  is a simplified cross-sectional diagram illustrating the addition of a single hard top coat layer overlying the external surface of the metal layer in accordance with one aspect of the invention; 
           [0036]      FIG. 4  is a simplified cross-sectional diagram illustrating the addition of a clear coat layer overlying the exposed surface of a metal layer and a first hard top coat layer overlying the clear coat layer and a second hard top coat layer overlying the exposed surface of the top plastic layer of the card assembly, in accordance with the invention; 
           [0037]      FIG. 4A  is a simplified cross-sectional diagram illustrating the addition of clear coat layers and hard top coat layers to a card assembly of the type shown in  FIG. 2C ; 
           [0038]      FIGS. 5A to 5G  are simplified cross-sectional diagrams of a metal core card embodying the invention; and 
           [0039]      FIGS. 6 and 6A  are simplified isometric diagrams of cards formed of various layers in accordance with the invention. 
       
    
    
     DETAILED DESCRIPTION OF THE INVENTION 
       [0040]    As already noted electrostatic discharge (ESD) protection is required for any card having a metal layer (i.e., having an electrically conductive layer). Such cards may be of the type defined herein as hybrid cards (i.e. having at least one layer of metal and one layer) or mostly metal (i.e., having a metal core). The cards of interest in practicing the invention may take many forms, as discussed below. 
         [0041]    Referring to (highly simplified)  FIG. 1A  there is shown a core plastic layer PL 1  with a clear overlay plastic layer PL 2   a,  above layer PL 1 , and a clear overlay plastic layer PL 2   b,  below layer PL 1 . This structure accommodates the application of print matter (e.g., information or decoration) on the top surface of the PL 1  core layer (as illustrated by printed offset layer  121   b  shown in  FIG. 1B ) and/or on the bottom surface of the clear overlay PL 2   a  facing the top surface of the PL 1  core layer. This structure enables the printed information to be protected by the clear overlay(s) and to be visible through the clear overlay plastic layers (e.g., PL 2   a ). 
         [0042]    After being collated these three layers (PL 2   a,  PL 1  and PL 2   b ) of plastic material are laminated together to form a first assembly  12  (or  12   a ). The use of three layers is by way of example only. The first assembly  12  (or  12   a ) can be formed of only two plastic layers or of more than three plastic layers. The plastic layers may be of polyvinyl chloride (PVC), Polyethylene terephthalate (PETG), Poly carbonate (PC) or any like plastic material which can be bound together by any appropriate adhesive layer. 
         [0043]    In one embodiment, the (two or more) plastic layers, forming the first assembly  12 , are laminated together using known laminating equipment under a platen temperature which is typically in the range of 300 to 350 degrees Fahrenheit at an absolute pressure ranging between 200 to 400 pounds per square inch absolute. The significance of first laminating the plastic layers together is to stress relieve the plastic; rendering it dimensionally stable. The first plastic assembly  12  (or  12   a ), comprised of the various plastic layers, is processed (e.g., pre-shrunk) under selected pressure and temperature conditions to reduce subsequent dimensional changes. Note that the range of temperature and pressure noted above is by way of example only and may be significantly expanded to make the desired product. 
         [0044]    Referring to  FIG. 1B  which is also a simplified cross-sectional diagram of a first “plastic” assembly  12 , there is shown offset print layer  121   b  containing information or decorative matter as discussed above. In addition, there is also shown a magnetic stripe  123  which is attached to the outer surface of layer PL 2   a.  Note that the magnetic stripe  123  may be attached to the outer surface of layer PL 2   a  (in any suitable manner) prior to the lamination step. Thus, the magnetic stripe may be laminated together with the plastic layers (PL 2   a,  PL 1  PL 2   b ) to form the first plastic assembly  12 . 
         [0045]    Referring to  FIGS. 1C and 1D  which are also simplified cross-sectional diagrams of a first “plastic” assembly  12 , there is shown the insertion of an RFID chip  204  between plastic layers PL 2   a  and PL 1  and an RFID chip  206  between plastic; layers PL 1  and PL 2   b.  The RFID chips would typically be inserted between the plastic layers prior to the lamination of the plastic layers forming the first assembly and would thus be under (below) the outer surfaces of the top plastic layer. 
         [0046]      FIG. 1C  is a simplified cross-sectional diagram of a first “plastic” assembly illustrating that a first assembly  12  can include the plastic layers, an offset print layer  121   b,  RFID chips and a magnetic stripe and that this assembly is subjected to a lamination step, as described above. An inductive coupling antenna, as shown on layer  12  in  FIG. 6A , or transponder (RFID chip connected to an antenna structure) can be integrated into the stack up of the card construction. In addition, a ferrite layer may be used to offset the effects of eddy current in the metal layer and such ferrite layer can be used to direct or enhance the electromagnetic field concentration. 
         [0047]      FIG. 1D  is a simplified cross-sectional diagram of a first “plastic” assembly showing the addition of a contact chip  202  to the first assembly  12 , after the first assembly has undergone lamination. 
         [0048]    Referring to  FIGS. 2A ,  2 B, and  2 C, there is shown a second assembly  13  comprised of a first assembly  12  and a second sub-assembly  131 , where subassembly  131  is comprised of an adhesive layer  14 , and a metal layer  16 . The adhesive layer  14  may be, for example, waytech w39, or thermoplastic polyurethane, or any suitable adhesive. The metal layer  16  may be, for example, stainless steel, brass, copper, aluminum, or any suitable material. The metal layer  16  may be a clad metal layer which can constitute more than one metal layer. 
         [0049]      FIG. 2A  is a highly simplified illustration of a previously laminated first “plastic” assembly  12  attached to a metal layer  16  via an adhesive layer and where the combination is subjected to a (second) lamination to form a second assembly  13 . 
         [0050]      FIG. 2B  is similar to  FIG. 2A  but shows the first assembly  12  to include a magnetic stripe  123  and a print layer  121   b  under layer PL 2   a  or above layer PL 1 . 
         [0051]    The second assembly  13  is laminated under a platen temperature which is typically 20-to-30 degrees Fahrenheit below the temperature to which the first assembly was subjected at an absolute pressure ranging between 200 to 400 pounds per square inch absolute. Maintaining the temperature of the laminating step of the second “metal-plastic” assembly  13  below that of the first “plastic” assembly  12  ensures that the plastic assembly does not get delaminated and/or, subjected to dimensional changes. It is a characteristic of plastics that they retain physical memory of the highest temperature at which they have been tempered. Thus, the plastic layers of the first assembly retain their dimensional stability until it is subjected to a temperature which exceeds the prior highest temperature applied to it. By laminating the second assembly  13 , comprised of the first assembly  12  and sub-assembly  131 , at a lower temperature than the laminating temperature of the first assembly, the dimensional stability of the assembly is maintained and there is substantially no warpage of the plastic and metal layers. 
         [0052]      FIG. 2C , is intended to show that after lamination of the second assembly  13  an outer surface or region  161  of metal layer  16  may be etched, embossed or engraved (coined and debossed) with any personalized information or decorated with any pattern. In addition  FIG. 2C  is intended to show that an offset printed layer  121   a  may be attached or formed on the outer surface of plastic layer PL 2   a.  In  FIG. 2C , a magnetic stripe  123  is shown attached to the outer (external) surface of layer PL 2   a.  Also shown are RFID chips  204  and  206  placed between selected plastic layers. 
         [0053]    Referring to  FIGS. 2C and 1D  there is shown a contact chip  202  placed on the top region of plastic layer PL 2   a  by forming a cavity on, and within, the outer surface of plastic layer PL 2   a  of the card. A cavity may be formed by milling (or any other suitable operation) and inserting a contact chip within the cavity. The contact chip will generally be flush with the plastic surface and can be visible, although it could also be placed along the outer surface of layer PL 2   a.  The contact chip  202  is typically added after the card is finished, but it can be inserted or placed before or after the lamination processes of the first and second assemblies. 
         [0054]    As noted above the metal layer  16  can be the cause of a short circuit or of electostatic discharge (ESD) when a card containing the metal layer is inserted or withdrawn from a POS device and indeed the use of metal cards present a significant problem. This problem is overcome in cards embodying the invention as described below. 
         [0055]    Referring to  FIG. 3 , note that a clear coat resin layer  18   b  is attached or applied to the outer surface of metal layer  16 . The clear coat layer  18   b  insulates the metal layer and prevents it from directly contacting any other surface. Thus, it functions to insulate the surface of the metal layer from making contact with a POS device (when a card containing the metal layer is inserted therein or withdrawn therefrom) thereby preventing ESD and/or short circuit conditions. In  FIG. 3A  a clear coat resin layer  18   b  is shown applied to the surface of the metal layer  16  and a like clear coat layer is shown applied to the top surface of plastic overlay layer PL 2   a  which produces a symmetrical structure. 
         [0056]    As noted above, the clear coat layer ( 18   a,    18   b ) may be formed of an acrylic resin (i.e., any of numerous thermoplastic or thermosetting polymers or copolymers of acrylic acid, methacrylic acid, any esters of these acids, or acrylonitrile), ultra violet (UV) curable resin blend including polyester, urethane, diol and carboxyl acrylates with ceramic particles, multifunctional acrylate polymers or any like material. The clear coat resin layer may be applied (or formed) by spraying, screen printing, painting, powder coating or any other like method, and cured (processed) by UV cure, electron beam curing, oven heat, or any radiation curing method or in any other suitable manner. The thickness of each one of the clear coat resin layers may range from 3 microns to 25 microns, or more. The minimum thickness is to ensure that the metal layer is fully covered. 
         [0057]      FIG. 3B  illustrates that a “hybrid” card embodying the invention can be made with a single hard top coat layer  20  overlying the external, exposed, surface of metal layer  16 . This layer  20  can provide electrical insulation and abrasion protection for the underlying metal layer. Thus, either a single clear coat or a single hard coat layer may be used to insulate the external, exposed, surface of metal layer  16 . 
         [0058]    In  FIGS. 4 and 4A  there is shown a clear coat layer  18   b  overlying the metal layer  16  and a “hard” top coat layer  20   b  which overlies the clear coat layer  18   b . The top coat layer  20   b  functions to add another layer of insulation, in addition to the clear coat, to the metal layer  16 . In  FIG. 4  there is also shown a single hard coat layer  20   a  overlying the outer, external, surface of layer PL 2   a  of the plastic assembly. The hard coat layers  20   a ,  20   b  provide wear and tear protection and reduce the scratching or marring of the underlying surfaces. In  FIG. 4 , a contact chip  202 , a signature panel  401  and a hologram  403  are shown attached and secured to the top of hard coat  20   a.    
         [0059]      FIG. 4A  is similar to  FIG. 4  except that, in this configuration, the clear coat layers and the top coat layers are symmetrically applied to the top and bottom surfaces of the card assembly. Thus, a clear coat layer  18   a  overlies layer PL 2   a  and a clear coat layer  18   b  overlies metal layer  16 . The “hard” top coat layer  20   a  overlies layer  18   a  and the “hard” top coat layer  20   b  overlies layer  18   b.    
         [0060]    As noted above, the “hard” top coat layer ( 20   a    20   b ) may be formed of electrically non-conductive nano-particles (e.g. silicon or ceramic particles or particles of any hard electrically non-conductive materials, also including polymeric (acrylic) carriers of nano-particles which may, but need not, be in a polymeric radiation cured vehicle. The hard top coat nano-particle layer may be applied (or formed) by atomizing, spraying, painting, roll coating, screen printing, thermal transfer or any like suitable method and processed by conventional automotive type spray guns, brushes, screen print equipment, roll lamination and any like suitable method. 
         [0061]    By way of example, the thickness of each one of said top coat layers ( 20   a,    20   b ) is typically in the range of 1.5 to 15 microns. 
         [0062]    Note that a signature panel  401 , a hologram  403  and a contact chip  202  can be attached&#39; to the card assembly as shown in  FIGS. 4 and 4A . 
         [0063]    It has thus been shown that cards embodying the invention may be formed with just a clear coat (e.g.,  18   b ) overlying the exposed surface of a metal layer or with just one “hard” top coat layer (e.g.,  20   b ) overlying the exposed metal layer. Alternatively, a hard coat layer may be applied so as to overlie a clear coat. In addition, it has been shown that a clear coat and/or a hard top coat may be applied to the exposed surface of the plastic assembly. Protecting the major card surfaces of a card from wear and tear and abrasion is highly advantageous. 
         [0064]    Hybrid cards bearing ESD protection, as described above, have a stable structure and the various layers do not delaminate. Cards embodying the invention may be manufactured by combining various subassemblies. The subassemblies can be formed so as to optimize their properties and characteristics as further discussed below. 
         [0065]    Hybrid cards embodying the invention include a first plastic subassembly  12  attached to a metal layer subassembly  131  to which is then attached a clear coat to which is then attached a hard top coat layer. Although this is advantageous, for purpose of economy hybrid cards can also be formed with only a clear coat or a top coat attached to exposed surface of the metal layer. 
         [0066]    Hybrid cards embodying the invention may be formed in a series of steps. The first step includes the lamination of two or more plastic layers and pre shrinking these layers to form a first assembly  12 . Typically, the magnetic stripe  123  is attached to the outer PVC layer, PL 2   a,  prior to the first lamination. The second step includes: (a) the formation of a sub assembly  131  comprised of an adhesive layer  14  attached to a metal layer  16 ; and (b) the lamination of the first assembly  12  with subassembly  131  to form assembly  13 . The third step includes the application of a clear coat layer  18  to the metal layer  16  or the application of a top coat layer. If a clear coat is applied in the 3 rd  step, then a fourth step may include the application of a hard top coat layer  20   b  to the clear coat layer. A clear coat layer may be applied to a card assembly and cured as discussed above. Likewise, a hard top coat layer may be applied to a card assembly and cured as discussed above. 
         [0067]    In practicing the invention, a clear coat layer or a top coat layer may be applied to an exposed metal surface. If a clear coat is applied first, a top coat layer can then be applied to the clear coat layer. In a hybrid card, it is not necessary to have an ESD protective coating over the plastic assembly. However, if it is decided to do so, then a clear coat layer or a top coat layer may be applied over the plastic assembly. As in the case of metal card, if a clear coat is applied first, a top coat layer can then be applied to the clear coat layer. 
         [0068]    Typically, a fifth step includes affixing a signature panel  401  above and on the outside of any protective coating because the signature panel needs to be on the outside. Generally a hologram  403  may be affixed to the card at the same time as the signature panel. However, note that the hologram can be affixed before or after the application of a clear coat and/or a hard coat. Also, a contact chip  202  may need to be attached after the application of a top coat to enable the chip to make physical contact with a POS device. 
         [0069]    Cards embodying the invention may be formed with a metal core as shown in  FIGS. 5A to 5G .
   A. Cards embodying the invention may have a metal core  161  as shown in  FIG. 5A .   B. During a first step the metal core  161  may be machined to form pockets (cut outs). By way of example, three cut-outs ( 301   a,    303   a,    305   a ) are shown in  FIG. 5A .   C. During, and as part of, a second step, as shown in  FIG. 5B , clear coat layers  18   a,    18   b  are formed above and below the metal core. The clear coat layers  18   a,    18   b,  as described above, may be an acrylic resin, or any like material, which functions to insulate the metal layer from making contact with a POS device thereby preventing ESD or the possibility of a short circuit. As above, the clear coat resin layer may be applied (or formed) by spraying, screen printing, painting, powder coating or any other like method, and cured (processed) by UV cure, electron beam cure, oven heat, or any radiation curing method or in any other suitable manner. The clear coat layer is intended to prevent ESD, short circuits and to also prevent the metal from tarnishing.   D. During and as part of a third step, as shown in  FIG. 5C , appropriate adhesive (such as acrylic, solid urethane, EEA/EVA, acrylic acid modified polyolefins) and insert materials  311  (e.g., such as PVC, PET ABS, Styrenics) are added to the cut outs  301   a,    303   a ,  305   a  to enable the subsequent insertion and adhesion of selected inserts such as a magnetic stripe, a signature panel and a hologram.   E. During and as part of a fourth step, as shown in  FIG. 5D , a magnetic stripe  123  is attached within cut out  305 . The insertion/attachment of the magnetic stripe may be done by stamping. A hologram  403  may also be attached within cut out  303 . However, it may also be done at a later step.   F. During and as part of a fifth step, “hard” top coat layers  20   a,    20   b  are applied to both top and bottom surfaces of the card assembly. As discussed above, the top coat layer ( 20   a,    20   b ) may be formed of silicon nano-particles or any like materials. The top coat layer  20   b  functions to add another layer of insulation to the metal layer, in addition to the clear coat layer. Most importantly, the top coat layers  20   a,    20   b  function to provide a protective coat which reduces wear and abrasion of the underlying clear coat. The top coat nano-particle layer  20   a,    20   b  may be applied (or formed) and processed as discussed above.   G. During and as part of a sixth step, as shown in  FIG. 5F  a signature panel  401  and a hologram  403  are attached to the card over layer  20   a.  As discussed above, the signature panel  401  usually has to be above the top coat layer to enable access to the panel. The hologram may be applied at several different stages. For purpose of economy it will often be applied at the same time as the signature panel.   
 
         [0077]    A metal card formed as discussed above includes a clear coat layer and a hard coat layer to provide two levels of electrical insulation as well as wear and tear and abrasion resistance of the underlying metal surfaces. 
         [0078]      FIG. 5G  is provided to illustrate that a full metal card can be made with only top coat layers  20   a  and  20   b  to provide ESD protection and abrasion resistance. 
         [0079]      FIGS. 6 and 6A  are provided to illustrate that various layers can be stacked to form metal core card ( FIG. 6 ) or a hybrid card ( FIG. 6A ). Protection against ESD discharged is provided for the planar surfaces (i.e., the top and bottom surfaces). In  FIG. 6 , metal core  16  is shown with a top surface  16   a  and a bottom surface  16   b . Protective layers  18   a ,  20   a  are mounted above surface  16   a  and protective layers  18   b ,  20   b  are mounted below surface  16   b . In  FIG. 6A  metal layer  16  is laminated with assembly  12 , as discussed above, and an antenna is shown winding around the periphery of a layer of assembly  12 . So that above surface  16   a  there is an assembly  12  with layers  18   a  and/or  20   a . Protective layers  18   b ,  20   b  are mounted below surface  16   b .surface. Note that the edge outer peripheral side of layer  16  can be cut back so that the outer edge of metal layer  16  would also not come into contact with any other surface.
A metal card or a hybrid metal-plastic includes an acrylic resin protective clear coat layer and/or a "hard" nano-particle top-coat layer overlying any exposed metal surface in order to insulate the metal and reduce the likelihood of an electrostatic discharge (ESD) or a short circuit condition. In a particular embodiment the "hard" nano-particle top-coat layer overlies the clear coat layer. The dual stage protective layers which include a clear-coat layer and a top-coat ensure that the problem associated with an ESD and/or a short circuit condition is minimized. In addition, the dual stage protection imparted to a card by forming a clear-coat layer and a top-coat layer ensures that any card surface treatment or card decoration is protected over time from excessive wear or scratching due to use in conjunction with a POS device and/or handling.