Researchers have fabricated transistors of phosphorene to examine its performance in actual devices. Phosphorene-based transistor consists of a channel of 1.0 μm and uses few layered phosphorene with a thickness varying from 2.1 to over 20 nm. Reduction of the total resistance with decreasing gate voltage is observed, indicating the p-type characteristic of phosphorene. Linear I-V relationship of transistor at low drain bias suggests good contact properties at the phosphorene/metal interface. Good current saturation at high drain bias values was observed. However, it was seen that the mobility is reduced in few-layer phosphorene when compared to bulk black phosphorus. Field-effect mobility of phosphorene-based transistor shows a strong thickness dependence, peaking at around 5 nm and decrease steadily with further increase of crystal thickness.
Atomic layer deposition (ALD) dielectric layer and/or hydrophobic polymer is used as encapsulation layers in order to prevent device degradation and failure. Phosphorene devices are reported to maintain their function for weeks with encapsulation layer, whereas experience device failure within a week when exposed to ambient condition.