text: In 2016, a new approach was described for producing hybrid photovoltaic wafers combining the high efficiency of III-V multi-junction solar cells with the economies and wealth of experience associated with silicon. The technical complications involved in growing the III-V material on silicon at the required high temperatures, a subject of study for some 30 years, are avoided by epitaxial growth of silicon on GaAs at low temperature by plasma-enhanced chemical vapor deposition (PECVD).
  Si single-junction solar cells have been widely studied for decades and are reaching their practical efficiency of ~26% under 1-sun conditions. Increasing this efficiency may require adding more cells with bandgap energy larger than 1.1 eV to the Si cell, allowing to convert short-wavelength photons for generation of additional voltage. A dual-junction solar cell with a band gap of 1.6–1.8 eV as a top cell can reduce thermalization loss, produce a high external radiative efficiency and achieve theoretical efficiencies over 45%. A tandem cell can be fabricated by growing the GaInP and Si cells. Growing them separately can overcome the 4% lattice constant mismatch between Si and the most common III–V layers that prevent direct integration into one cell. The two cells therefore are separated by a transparent glass slide so the lattice mismatch does not cause strain to the system. This creates a cell with four electrical contacts and two junctions that demonstrated an efficiency of 18.1%. With a fill factor (FF) of 76.2%, the Si bottom cell reaches an efficiency of 11.7% (± 0.4) in the tandem device, resulting in a cumulative tandem cell efficiency of 29.8%. This efficiency exceeds the theoretical limit of 29.4% and the record experimental efficiency value of a Si 1-sun solar cell, and is also higher than the record-efficiency 1-sun GaAs device. However, using a GaAs substrate is expensive and not practical. Hence researchers try to make a cell with two electrical contact points and one junction, which does not need a GaAs substrate. This means there will be direct integration of GaInP and Si.