text: The thermal bump is compatible with the existing flip-chip manufacturing infrastructure, extending the use of conventional solder bumped interconnects to provide active, integrated cooling of a flip-chipped component using the widely accepted copper pillar bumping process. The result is higher performance and efficiency within the existing semiconductor manufacturing paradigm. The thermal bump also enables power generating capabilities within copper pillar bumps for energy recycling applications.
  Thermal bumps have been shown to achieve a temperature differential of 60 °C between the top and bottom headers; demonstrated power pumping capabilities exceeding 150 W/cm2; and when subjected to heat, have demonstrated the capability to generate up to 10 mW of power per bump.