In this work, we analyze the quality of multi-layer metal traces fabricated by combined CED and electroless plating, in which electroless Cu layer was deposited on 3D printed Ni patterns generated by electroplating. Our microscopy results revealed non-uniform regions in the fabricated traces, primarily due to inconsistencies in the electroless plating step. In addition, we characterize the mechanical properties of the fabricated metal traces using a high throughput nanoindentation technique (~10,000 indentations) to create continuous maps. The results of this work will be useful for design and fabrication of circuit traces in printed electronics, circuit boards, and electronic packaging.