The scheme of fabricating the micropore device is shown in Scheme 1. Wafers of thick silicon oxide (300 nm) on Si (100) (University Wafer) were used as the base substrate for MpD fabrication. The bottom electrode array was patterned by photolithography using a micro-writer (see SI, Sec. 1.1 for details). Electron beam evaporation (see SI, Sec. 1.2) was used to deposit a 5 nm chromium (Cr) adhesive layer, followed by a 45 nm gold (Au) layer onto the developed micro-patterned bottom electrodes. To protect the Au surface from roughening during the subsequent fabrication steps (see section 3.1), an additional 7 nm Cr layer was deposited on the Au. Subsequently, acetone-based liftoff (see SI, Sec. 1.3) was performed, resulting in the final patterned bottom electrode stack: [Si(100)/SiOₓ(300 nm)/Cr(5 nm)/Au(45 nm)/Cr(7 nm)] where the Si(100) wafer is a high resistive one.