For the plasma exposure time, 5 s yielded the highest mass evolution, while exposure times longer than 10 s caused a slight decrease in the growth as shown in Fig. . This decline may be attributed to the fluorine content in Cu(hfac)₂, which leads to fluorine contamination in the films, weakening adhesion and causing substrate etching. This effect could also result from increased electron exposure of the surface, potentially facilitating the desorption of certain species from the adsorbed precursor.