We monitored in ipsa hora and in situ the curing of a model two-component polyepoxy, BADGE/JeffAmine, onto model oxide surfaces, alumina, using the SFA's combined force measuring and interface visualization capabilities. We found that (1) low tensile forces promote complete curing across different humidity levels, dominated by molecular interactions; (2) high tensile forces prevent full curing unless compressive forces are applied; (3) high humidity rapidly induces water diffusion, increasing plasticization and preventing cure. Additional micro-tensile tests and failure analysis imaging revealed primarily cohesive (polymer-polymer) rather than adhesive (polymer-substrate) failure modes. This study introduces a novel method for assessing interface quality in polyepoxy-inorganic substrate systems, which has implications for various technological applications requiring durable bonding and adhesion performance.