Metasurfaces were fabricated with the standard electron beam lithography (EBL). Both Au thin film and ITO substrates were prepared via following route. Au thin film has vacuum evaporated on a sapphire (Al 2 O 3 ) substrate with 2 nm of Cr as an adhesion layer. Then, a 100 nm of SiO 2 film has deposited using electron beam (EB)-evaporation without any adhesion layer. ITO substrates were commercially acquired with 180 m thickness. They had ∼ 6 Ω/ sheet resistance, which showed 10 5 to 10 6 (Ω.cm) -1 conductivity on the soda-lime glass substrate. A film of 100 nm of SiO 2 has deposited using EB-evaporation without any adhesion layer.