In our previous study of depositing Ru on NHx-terminated metal surfaces , we discussed that the energy cost to break the Ru-C bond is higher due to the stronger Ru-C bond strength. The bond energy between the metal and the Cp rings in RuCp2 and CoCp2 were calculated as 3.05 eV per Ru-C bond and 2.96 eV per Co-C bond. For depositing Ru thin films, Ru compounds with more complex Cp-based ligands are used experimentally, rather than RuCp2; these ligands appear to offer higher reactivity. For Co thin films, CoCp2