The modification and manipulation of polymers using lasers has spurred critical advances in electronics, biotechnology, and nanotechnology. In particular, direct laser lithography and laser ablation benefit from the rapid manipulation of polymer architectures with exquisite spatial control on the micro-and nanometer scale. Furthermore, these direct modifications to polymers do not typically require masks or complex chemical etching procedures necessary in other lithographic techniques. The lasers used for direct lithography and ablation of polymers, however, are typically expensive and high-power pulsed UV lasers (>100 W). These UV lasers require strict safety controls to prevent harmful exposure to the laser light. In the case of laser ablation, high energy UV light is required for efficient absorption and bond-breaking events for most commercially available polymers. The direct ablation and manipulation of polymers using lasers or other light sources operating in the visible spectrum are less common and typically require tailored chemical structures, additives for absorption at these wavelengths, or long irradiation times (minutes to hours). The benefit of modifying polymers with low-powered continuous wave lasers operating at only a few mW in the visible spectrum is that the laser systems would be simpler, safer, and more economical. The potential for controlled polymer modifications at short exposure times (<< 1 second) when using a focused beam would also be a useful capability. To realize these benefits, readily accessible polymers that respond to such low-power irradiation are required.