Measurements for the thickness of the CrN layer performed by SEM are presented below for the case of DC power supply (Figure ). Similarly, the corresponding images for thickness measurements of the deposited film for the case of HiPIMS power supply are represented in Figure . The same magnification factor was used in all displayed SEM investigations to aid the visual perception. and one can notice that the main difference in the films deposited by DC sputtering and HiPIMS sputtering consists greatly in the structure of the morphology. In Figure , the deposited layer when using the DC power supply seems fine and has a columnar structure, while in Figure , the deposited layer in the case of HiPIMS power supply seems dense and uniform. Moreover, the film thickness can be extracted from the figures mentioned before. When using the DC power supply, the film thickness increases at approximately a constant rate but when using the HiPIMS power supply the film thickness for the deposition times of 5 and 10 minutes are approximately the same while for the deposition time of 15 minutes it sees a sudden jump of 200%.