Early in the development of OPV devices, it was discovered that bulk heterojunction (BHJ) device active layers led to higher power conversion efficiencies (PCEs) than the simpler planar heterojunction. Since then, extensive work has been devoted to optimizing the morphology of BHJ active layers with various processing conditions (e.g., thermal annealing, solvent additives, concentration, solvent, etc). Consequently, it is well-understood that the device fabrication procedure (e.g., processing solvent, spin coating speed, annealing temperature) plays an important role in the morphology of the OPV active layer because the process of film formation is kinetically limited. The importance of morphology with respect to OPV device performance has been studied extensively, and plays a role in processes including exciton diffusion, charge separation and transport, and device stability. However, comprehending the intricate correlations between diverse materials and device fabrication parameters, and their collective influence on the final device performance poses an enduring challenge. This intricacy stands as a formidable barrier, impeding the accurate prediction of OPV device performance and contributing to the laborious and costly nature of the production processes.