times higher thickness at the trench bottom compared to the top was achieved at 950 ℃, Ptotal= 1 kPa with pSiCl4= 20 Pa, padded HCl= 10 Pa. Our findings have shown that the conformal CVD approaches which were initially proposed by Abelson and Girolami for the fabrication of microelectronic devices are transferrable to the CVD processes for hard coatings.