The mapping of material properties was rapidly conducted using a NanoFlip nanoindenter, which was equipped with a Berkovich tip and utilized the high-speed indentation testing technique known as NanoBlitz3D. The NanoBlitz3D methodology involves applying a specified load to the sample, followed by measuring the resulting indentation depth and contact stiffness. These measured values are then converted into hardness and elastic modulus values through the Oliver-Pharr indentation model. The NanoBlitz nanoindentation technique was applied over a vast area of the Cu pattern, creating approximately 10,000 indents. The indents were arranged in arrays ranging from 20×20 (comprising 400 points within an area of 1600×200 µm²) to 20×160 (comprising 3200 points within an area of 1600×200 µm²), with an applied load of 1.2 mN. To avoid the formation of plastic-affected zones near each indentation, the distance between each indent was set at 10 µm. Additionally, to mitigate errors due to thermal drift during measurement, a thermal drift rate of approximately 0.2 nm/s was established before initiating the tests.