SPS prepared pellets were cut into semicircles with 1.13 mm thickness and 4.9 mm radius using a low-speed, diamond-blade saw for Seebeck coefficient, electronic resistivity, and thermal conductivity measurements. Copper electrodes were attached to the pellet using Ag epoxy and left to dry overnight. The offcuts from the pellets were used for powder diffraction and compositional analysis. The thermal conductivity, electronic conductivity and Seebeck coefficient were measured simultaneously between 2 and 300 K using two probe geometry on a dense pellet of CuBiSeCl2 using the Thermal Transport Option (TTO) on a Quantum Design Physical Properties