The all-solution-processable fabrication methodology can be applied to a wide variety of 3D curved objects, transforming them into electrochromic, variable-emittance devices. To demonstrate this versatility, we used a copper cup due to its high thermal conductivity and complex topography. The fabrication process is largely similar to the methods described above, with minor modifications to accommodate the curved surface. Specifically, Kapton tape was applied as an insulation layer on the surface of the copper cup to leverage its thermal conductivity while preventing direct electrical contact. In addition, a layer of filter paper was employed to provide capillary support for the PAM/LiCl aqueous precursor solution, ensuring the precursor solution remained on the curved copper cup surface during the UV crosslinking process (See Methods for details). In the following, we present experimental setups and IR images highlighting the functionality of the curved copper cup ASPIRE device. Fig. and show photographs of the experimental setups and IR thermal images of the copper cup ASPIRE device. During testing, the cupper cup was maintained at a constant 38 ± 0.2 ℃. A constant potential of -2 V and 2 V was alternatively applied to the device for eight minutes each. The apparent surface temperature of the ASPIRE region changed by 1.8 ℃ due to emissivity modulation. Furthermore, Fig. showcases the adaptability of this all-solution-processed fabrication approach, showing its application to various objects, including planar films, cylinders, semi-spheres, curved 3D-printed masks, and water kettles. Most importantly, this methodology is substrate-independent, enabling any insulating substrate to transform into an electrically tunable, variable-emissivity device for thermal regulation and electrochromic applications in numerous fields.