It is important to note that the melting temperature of qHPC 60 at ∼ 3900 K is comparable to those from , where sublimation was observed using reactive force field ReaxFF, and a bit lower than the monolayer graphene (4095K) . While, the melting process for qHPC 60 at all the stages is similar to qHPC 54 B 3 N 3 and qHPC 58 B 1 N 1 , but the melting temperature of qHPC 60 is negligibly higher than the doped ones as evident from the slow decay of Region II in qHPC 60 . The stress response as a function of the uniaxial applied strain is presented in Figure when subjected to temperature regimes ranging from 300K to 900K, considering a uniaxial strain applied in y-directions here. As can it can be perceived, they were stretched at a constant rate where these materials initially show a well-defined (linear) elastic region until total rupture. Young's modulus is defined as the slope of the linear part of this stress-strain curve, while the fracture stress is the point where the peak stress is reached. as we performed extra simulations to reproduce and to compare our results with the previous literature values . Although these values are much lower than graphene and hBN structures, they are comparable to previous results of qHPC 60 .