Pragmatically, solving the e-waste problem by rapidly adopting novel e-substrates only occurs if the underlying technology is compatible with the existing production workflow and infrastructure. Our photopolymer resins allow for direct fabrication of e-substrates in solventless, near-ambient conditions, so we sought to implement these desirable attributes in the fabrication of layered devices. To demonstrate such opportunities for direct integration into such operations, we built bench top devices using our PI-ester based resin that highlight such considerations in scalable manufacturing (Figure ).