To develop geometries suitable for stretchable electronics, we first investigated how different design parameters affect the mechanical resilience of single-layer arrays of microwires transferred onto PDMS. We began by examining the influence of microwire orientation relative to the direction of strain using Finite Element Analysis (FEA). As shown in Fig. , microwires aligned more closely with the direction of strain (smaller angles) experience higher stress compared to those oriented more perpendicularly (larger angles). The von Mises stress was used as an indicator of microwire failure.