To incorporate EGaIn into devices, different methods have been developed to spatially manipulate and position EGaIn (e.g., using magnetic fields, microfluidics, and conventional patterning/fabrication techniques ). However, these techniques lack the precise nanometric positioning to control the applied forces and, hence, tune the contact areas on different surfaces (e.g., molecular monolayers, organic thin films, or elastomers) and in different ambient environments (e.g., in air and liquids). There is also little understanding of how the ambient environment affects the surface wetting properties and the contact mechanics of EGaIn. Moreover, the forces typically applied to EGaIn when using conventional fabrication methods are large enough to induce cracks and wrinkles on the oxide surface, possibly reducing surface adhesion and leading to smaller effective contact areas.