Plating. Printed lattices included an initial meander to equilibrate ink flow and several lattices were typically printed in a single batch without stopping. Before release from the substrate, a razor blade was used to sever the printed lattice from the initial meander and subsequent lattice in each print so that each lattice was an independent monolith on the substrate surface. Then, the substrate with adhered lattices was placed in a large weigh boat and reverse osmosis water was added to the surface to dissolve the underlying PSS layer, releasing the printed latices from the substrate. After release, lattices were transferred to a 20 mL vial filled with milli-Q water, shaken to fully submerge, then subjected to brief (~ 2 second) pulses in a sonication bath to release trapped air bubbles. The water was twice decanted and replaced, for a total of 3x20 mL washes. The lattices were placed on a dry Kimwipe and left in a vacuum chamber for 30 minutes to evaporate the remaining water. Then, 5 mL of Loctite 5 Minute Quick Set Epoxy was manually mixed and spread on a new glass slide, and the lattices adhered by the tip of 1 tail each. The glue was given 2 hours to cure, then the glass slide with adhered lattices was moved to an oven for 72 h at 80 °C. Then, the slide with adhered lattices was subjected to oxygen plasma (0.35 mbar, 100% O2 gas flow, 20 minutes) using a Zepto plasma cleaner equipped with a W6 vacuum chamber (Diener Electronic), then submerged in a 1 wt% solution of PEI in milli-Q water for 5 minutes and rinsed in 2x100 mL milli-Q water. A sensitizing Sn 2+ solution was prepared by combining 1 g SnCl2, 36 mL milli-Q water, and 4 mL of HCl (36.5-38%) and vortexing until the solution cleared. The glass slide with adhered lattices was fully submerged in the sensitizing solution, agitated to remove trapped bubbles, allowed to sit for 10 minutes, then removed and rinsed in 2x100 mL milli-Q water. The Pd 2+ activating solution was prepared by combining 20 mg PdCl2, 150 mL milli-Q water, and 3 mL of 37 wt% HCl, then sonicating and agitating for ~ 1 hour to fully solvate the solids. 40 mL of this solution was set aside and the substrate with adhered lattices submerged, 10 µL of the Sn 2+ sensitizing solution was added, and the mixture homogenized by gently swirling. Lattices were allowed to sit in the activating solution for 10 minutes before rinsing in 2x100 mL milli-Q water. The electroless Nickel plating solution (Caswell, Inc.) was prepared by combining 2 mL of part A, 6 mL of part B, and 32 mL of milli-Q water in a speed mix container and manually agitating to homogenize. The solution was capped and placed in a 75 °C oven for 30 minutes, then the activated lattices were quickly transferred into the preheated solution, loosely re-capped to avoid pressurization due to gas evolution, and returned to the 75 °C oven for the target duration (typically 10 or 20 minutes). The plating bath was then removed from the oven and the Ni-plated lattices were removed from the bath and rinsed in 2x100 mL milli-Q water. A gold plating bath (24K Bright Gold, Gold Plating Services) was heated in a Jewel Master Pro HD (Gold Plating Services)