Recent advances in electronics has led to a widespread global accumulation of electronic waste (e-waste). 2019 alone produced some 54 million tonnes of e-waste, averaging 7.3 kg per person. The continued development of flexible electronics, i.e., thin, flexible devices made on compliant substrates seems inevitable-these devices offer promising opportunities in robotics, wearables, heath monitoring, packaging, and the Internet of Things (IoT). Unfortunately, the continued adoption of flexible electronics and other low-cost single-use electronics only worsens the dire e-waste situation. Awareness of this oncoming catastrophe is evident in the climate initiatives and pledges from some of the largest global hardware manufacturers such as Samsung, Apple, and Google. Beyond sustainability, there are also economic incentives for reprocessing e-waste, since the circuits, including chip and antenna components, contain high-value resources such as precious metals and rare earth elements. For 2019, estimates of the raw material value in e-waste exceeded 57 Billion USD. In many cases, the electronic components would be suitable for a second-life use but recapture remains challenging. Much research approaches the end-of-life issue in electronics by developing new polymeric electronic substrates (e-substrates) with inherent reprocessibility via chemical, thermal, or biological means. In this paradigm, complete degradation or removal of the e-substrate allows for the collection of expensive and reusable electronic components to minimize waste and amortize costs. However, these studies often simplify the circuits design. This simplicity, while understandable, ignores the full spectrum of stringent material requirements for e-substrates in consumer devices (e.g. high dielectric constant and low dissipation factor for dense circuits and data transfer applications), realities of conventional largescale device manufacturing (e.g. Pb-free solder reflow processing at ~250 °C), and the economics of the hardware market (e.g. low raw material and processing costs). For example, several studies report electronic devices built on biodegradable substrates of modified fibrous or synthetic aliphatic polyesters such as polylactic acid and polycaprolactone, The degradability of these substrates typically comes from the ester linkages undergoing hydrolysis under suitable conditions (heat, oxygen exposure, microorganisms). Unfortunately, these polymer systems often possess low heat stability well below conventional processing temperatures , and the conditions for hydrolysis can be so innocuous as to occur in ambient environments leading to premature device failure. Other work utilized liquid metal circuits printed on top of thermoplastic films to separately recapture the e-substrate, conductive traces, and components. Ignoring the inherent concerns with solvent and thermal resistance, thermoplastics are often susceptible to creep and plastic deformation which threaten dimensional stability. Additional shortcomings include that interchain ionic or hydrogen bonds can become active at high frequencies to the detriment of dielectric performance. Recently reported recyclable crosslinked polymers (or "network polymers") may overcome the drawbacks with thermal and ambient stability. However, the fabrication and reprocessing of these novel thermosets is often costly, requiring multi-step processing that involves solvent evaporation to form films. As an alternative, crosslinked polyesters can be formed efficiently at room temperature neat with mild conditions. By comparison, polyimide (PI), particularly aromatic polyimides like Kapton®, is a popular substrate in today's electronic devices due to their unique combination of outstanding mechanical properties including tensile modulus ~ 2 GPa; ultimate tensile strength ~ 230 MPa; ultimate elongation ~ 70%, thermal stability from -250°C < T < 300 °C; relatively high thermal conductivity ~ 0.12 Wm -1 K -1 ; low coefficient of thermal expansion (CTE) ~ 20 ppm °C-1 ; high glass transition temperature, T g > 300 °C, high dielectric constant (DK or ε r ), of 3.5 at 1kHz; and low dielectric loss (DF or tan δ) of 0.002 at 1 kHz. Consequently, PIs are ideal substrates for robust, high density, miniaturized circuits, particularly since the superb electrical barrier performance persists in thin film form factors for flexible electronics. Unfortunately, the exceptionally stable imide bonds that help to impart these properties do not readily cleave under mild conditions to limit reprocessing. Even with the addition of ester linkages, aromatic poly(ester imides) are similarly difficult to degrade. Another challenge with PI substrates is their synthesis. In a typical process, imidization of a polyamic acid solution occurs at exceptionally high temperatures (T~ 250°C) and once the resulting solid film forms, photo-and melt-processing becomes prohibitive. As a result, the conventional PI film processing complicates the build-up of multilayered circuit architectures (e.g. application of interlayer adhesives between PI films, laser ablation of PI to form vias, copper deposition for through-plane electrical conductivity) required for dense electronic devices.