The GnP powders used in the deposition process (G7Nan -Nanesa S.r.l.) have an average lateral dimension and thickness of 7 μm and 20 nm respectively. The dispersions for GnP-Cu, Ni and Cu coatings were produced by Nanesa S.r.l. through proprietary processes. The Cu-GnP deposition solution was formulated with the help of a dispersing agent to ensure disaggregation and stabilization of the GnP component. The electrodeposition procedure needed to produce the multilayer structures object of this work was a multi-step procedure.