Scheme 1: Micropore device fabrication process scheme illustrating (i) initial substrate structure (ii) bottom electrode patterned structure (iii) addition of alumina insulation layer by ALD (iv) patterning and etching alumina layer to uncover the bottom Cr etch stopping layer (v) Cr wet etch to uncover the Au layer, during which a large undercut is created causing the alumina layer to collapse on the Au (see section 3.3 in main text) (vi) activation of the Au surface and binding of the protein (vii) final steps of shadow mask alignment and deposition of the top contact.