Print-and-plate electrode fabrication. Direct ink writing, an extrusion-based 3D printing method, was used to pattern a graphene nanocomposite (GNC) ink, which is readily extruded through a 30 µm nozzle. The ink is composed of a commercially available thermoplastic polyurethane (TPU), graphene nanoplatelets (GNP), and dimethylformamide (DMF), which inhibits physical crosslinking of the TPU prior to printing (Fig. ). While this ink exhibits shear thinning behavior (Fig ), its storage (G') and loss (G") moduil are nearly identical at low shear stresses (Fig. ). . However once the ink exits the nozzle, the solvent (DMF) evaporates, leading to a pronounced solidification that allows the printed filaments to span gaps as large as 700 µm (> 20x larger that then the filament diameter), with negligible sagging (Supplementary Movie 1). Solvent-driven changes in ink elasticity are particularly well suited to printed lattices composed of microscale filaments with a high surface-to-volume ratio. The printed lattices are composed of a rectangular region with overall dimensions 6 mm x 3 mm and two long tails that facilitate handling during subsequent processing steps. These architected electrodes are composed of printed filaments with a diameter ~ 20 µm arranged in 7-layer woodpile structure with a total thickness of ~140 µm (Fig. process and directly imaged them in the Y-Z plane. We find that the filament cross-section of the as-printed lattices deviates slightly from the desired circular shape with mean diameter of ~19 µm along the z-axis and ~21 µm along the y-axis. We note that the effective filament diameter is considerably smaller than that of the printing nozzle (inner diameter of 30 µm), which arises due to slight under-extrusion of the GNC ink during printing followed by solvent evaporation. As expected, the filament diameter increased to values of ~ 23 µm and 26 µm after nickel plating and to final values of ~ 24 µm and 29 µm after gold plating, along the z-and y-axes, respectively. Concomitantly, the vertical gap between alternating layers decreased from Ni plating for 10 min, then 40 mΩ sq -1 after 20 minutes of Ni plating, followed by 20 minutes of gold electroplating.