For nanocalorimetry and thermoelectric/Hall effect characterization, CuP 2+x films were deposited on previously described microfabricated chips designed for calorimetry 3 and in-plane thermoelectric characterization 4 of thin-film samples. In both types of chips, CuP 2+x was deposited on a free-standing Si 3 N 4 membrane. Due to the fragility of the membrane, thinner CuP 2+x films (90 nm-120 nm) were employed for these studies. Since these samples had to be shipped for measurements, they were packed in vacuum after their last processing step and unpacked just before the measurement. Both calorimetry and thermoelectric measurements took place about a month after the samples had been packed.