Herein, we develop degradable polyimide photopolymers compatible with the existing materials, processing, and application requirements of commercial electronics. We propose using thiol-ene click chemistry as an ideal photopolymerization method for the design of ester-containing networks. Despite free-radical polymerization of acrylate or methacrylate free-radical polymerization being a common choice for photopolymerization, it suffers from oxygen inhibition, often resulting in tacky surfaces due to incompletely reacted monomers. On the contrary, thiol-ene polymerizations have the benefit of little oxygen inhibition and are proven capable of forming thin films with non-tacky, smooth surfaces. Further, many commercially available thiol monomers possess the degradable alkyl ester linkages, like trimethylolpropane tris 3-mercaptopropionate (TMPMP). With respect to thermomechanical properties, we envision imide containing alkene monomers boosting backbone rigidity, resulting in high T g and high Young's moduli. In this work, we synthesize a family of ester-containing diallyl imides of varying structure derived from commercially abundant chemical feedstocks. We then demonstrate that the photopolymerized thiol-ene polyimide networks result in quality e-substrates with excellent dielectric properties. Depolymerization of these poly(imide ester) networks via transesterification reactions stimulated at ambient temperatures results in successful recovery and reuse of components.