It is important to note that the demands of some applications may require further improvements to the material performance and that while comparable, our materials fall short of Kapton along certain metrics. Future investigations could consider adding particulate fillers to further improve the thermal conductivity, thermal expansion coefficient, dielectric constant, etc. Such a straightforward strategy is likely to be successful as commercial polyimide films are often composites. Additionally, our materials are polyimides due to the incorporation of imide groups into our diallyl monomers. We could increase the polyimide character of the backbone by using oligomeric polyimides as precursors, though at the expense of hindered processibility such as increased melting temperature and viscosity. Additionally, we could manipulate the degradation rate by controlling the volumetric density of the ester groups decreases.