Microchips were produced from indium tin oxide (ITO) films using the "ion-beam etching" process. Firstly, the surfaces of ITO coated glass substrates (slides) were cleaned with the help of distilled water and acetone. Next, cleaned ITO-coated glasses were placed in the "Spin-Coater" device and coated with "AZ5214E" (MicroChemicals, Germany) positive/reversal photoresist to cover the entire surface. The coating process was carried out at 2000 rpm for 60 s. Afterwards, the slides covered with photoresist were kept in an oven set at 90 °C for 30 minutes to ensure the polymerization (pre-baking) of the photoresist. A lithography mask with the desired design was used to transfer the patterns to the microchip. Briefly, the patterns on the mask were exposed to UV light via a UV mask aligner and transferred onto photoresist-coated slides . An alkaline developer was used to remove the areas exposed to UV light. Afterward, etching process was carried out with the help of "ion beam etching" device with 30 sccm Argon gas for 1 hour using the parameters 750 V, 49 W, 0.05 A and the sample holder was rotated at an angle of 22.5°.