The integrated leaching and recovery technology developed above was applied to random access memory (RAM) modules obtained from obsolete computers. These components have gold contacts that are visible to the human eye. This surface can be efficiently leached using the TCCA/NaBr method, but the mixture of metals that result is highly complex, with ratios of leached copper to gold as high as 120:1 (Fig. ). For this reason, milled and concentrated RAM modules were obtained so that the leached mixture would be less complex. In short, this milling process provided particles sizes < 250 µm that could be gravity concentrated with a shaker table. These gold rich fractions of powdered electronic waste were first analyzed by reverse aqua regia digestion and ICP analysis which indicated the most abundant metals in the concentrate were copper (62%), gold (13%), tin (4.6%), nickel (2.4%), iron (1.9%), lead (1.6%), and titanium (1.1%). The concentrate also contained some non-metal substances such as plastic and fiberglass that were not completely separated in the milling and concentration process (Fig. ).