For the second layer transfer requiring alignment, a repurposed mask aligner was utilized (Suess MJB3). The PEN/PVA/gold substrate was secured on the vacuum chuck, while the PDMS wafer was mounted upside down on the mask frame, similar to conventional chromium mask positioning. The two substrates were brought into contact slowly, with alignment monitored and adjusted using the instrument's optical microscope and stage micrometer screws. Upon achieving contact, the vacuum was released, and the complete assembly was transferred to a hotplate at 120 °C where manual pressure (enough to ensure a good contact) was applied from above with a soft stamp for 30 s. PVA dissolution was performed following the same procedure as for the first layer.