While the extant literature on MXene-based strain sensors consists of planar films and hydrogels rather than micropatterns, the bubble printed Ti3C2TX MXene patterns reported herein compare mostly favorably in terms of their response to tensile strain. In comparison to a Ti3C2TX MXene and PEDOT:PSS-based (poly(3,4ethylenedioxythiophene)-doped poly(styrene sulfonate)) hydrogel reported by Bi et al., the bubble printed MXene patterns indicate a two times higher sensitivity to tensile strain, with a response of around 10% change in resistance at a bending of 60° compared to 19.6% for the bubble printed MXene lines. Strain sensors based on a composite of Ti3C2TX MXene/ silver nanowires/ TPU (thermoplastic polyurethane) exhibited a change of resistance of 11-14% for 60° bending under tensile strain. When comparing the bubble printed MXene patterns on PET (less than 3%) herein with freestanding three-dimensional graphene composite networks (less than 1%) under compressive strain, the bubble printed MXene patterns showed nearly 3 times higher sensitivity. On the other hand, a mixture of Ti3C2TX MXene and carbon nanotubes on a polydimethylsiloxane sponge showed a drastically enhanced sensitivity to tensile strain, with a change in resistance around 50-70% for 60° bending. In summary, the bubble printing of MXene-based patterns has been successfully demonstrated on a flexible substrate for the first time, allowing direct optical micropatterning of conductive MXene patterns on PET substrates without prior functionalization or post-processing steps. The resulting conductive MXene micropatterns demonstrated distinct electrical responses under compressive and tensile strains, where resistance decreased under compressive strain and increased under tensile strain, which is in agreement with standard responses of conductive films and bulk composites. The resistance change within a single bending cycle is crucial for understanding the future potential of such conductive patterns for applications, as large changes in resistivity are suitable for resistive strain sensing, whereas small changes are beneficial for applications in which electronic properties should be maintained despite bending, such as wearable electronics. Thus, the direction of bending, i.e. whether tensile or compressive strain is applied, has a large impact on the potential applications. The repeated bending of the patterns revealed that cycling stability under compressive strain was higher than under tensile strain, with an average change of 11.3% after 1000 cycles of 60° bending under compressive strain compared to 61.6% under tensile strain. In addition, narrower MXene lines provided greater response to applied strain, while broader lines exhibited improved mechanical robustness as shown by improved cycle stability.