A typical printed MXene line with a width of 21 µm was fabricated by printing two lines by moving the stage in a linear path in opposite directions with a slight overlap between the two (Figure ). Scanning electron microscopy (SEM) revealed a largely smooth surface with many random holes with sizes ranging from hundreds to tens of nanometers. Such holes are likely formed by vapor escaping from the inside of the patterns during printing. While such holes have been previously observed, the increased resolution of these images compared to previous findings reveal "wall" and "bridge" type structures that have been previously observed in freeze-dried MXenes (Figure , bottom panel). These observations suggest both densely packed stacked assemblies and porous structures due to the percolation of vapor from the assembly during printing, which can lead to alignment of the resulting porous channels along the curvature of the pattern. Moreover, SEM revealed that after 1000 cycles of bending to 60.3° under tensile strain the printed patterns showed visible signs of damage (Figure ). Certain regions of the printed lines showed visible cracks (Figure , middle panel), and some segments appeared to have flaked off (Figure , bottom panel), however, no complete breakage was observed. Lines of ~7 mm (the diameter of the imaging spacer used) were printed, and then contacted by applying silver paste to the ends of the lines (Figure ). A custom-built bending setup was used to control the bending direction and angle of the MXene lines printed on PET (Figure ). Bending was applied in two different directions: towards the surface that the line was printed on (compression) and in the direction away from the printed side (decompression). This differentiates between the type of strain that is applied to the sample. Under compression the sample undergoes compressive strain, which is defined by the measure of how much a material shortens or deforms when subjected to compressive forces. Under decompression, the sample undergoes tensile strain, which is how much a material elongates or deforms when subjected to tensile forces. The current-voltage (IV) curves of the bubble printed MXene patterns were measured at different bending angles in both directions in order to compare how compressive and tensile strain influence the electronic properties. The IVcharacteristics demonstrated linear behavior in the range of -5 to 5 V, showing ohmic conductivity, with a resistance of ~6.9 kΩ for unbent samples. There were marked differences in the current-voltage curves under compressive and tensile strain. Under compressive strain there is almost no change in resistance up to a bending angle of 60.3°, with a mean resistance of 17.6 kΩ, where increasing bending to 90° increases the resistance to 19.8 kΩ (Figure ). In contrast, when tensile strain is applied (Figure ), there is an increase in resistance for bending from 0°, with 16.2 kΩ, to 90°, with 32.4 kΩ. This marked difference between the current-voltage characteristics indicates that the bubble printed MXene patterns are much more sensitive to tensile than to compressive strain, where the observed change in resistance is attributed to physical deformation or microstructural changes (i.e. micro-crack formation) resulting in decreased effective contact between the MXene particles that limits the electron flow (Figure ). These results are in line with typical responses from strain sensors, where under compressive strain the resistance decreases and under tensile strain the resistance increases. The stability of the conductive MXene micropatterns during repeated bending was tested by measuring the change in resistance of the printed line over 1000 cycles of repeated bending in both directions (Figure ). Under bending to 60.3° in the compressive direction, there was an average increase in resistance of 11.3% across all samples, where the maximum increase in resistance for a single sample was 25.3% (Figure ). However, the average increase in resistance over 1000 cycles of tensile bending was 61.6%, which shows that the samples subjected to compressive strain have a higher overall stability, with a 5.5 times lower change in resistance (11.3%).