The high integration and power density of electronic devices can lead to heat accumulation, which can negatively impact their performance and lifespan. Thermal interface materials (TIMs) are used to transfer heat from a heat source to a heat sink. Epoxy resins are commonly used in microelectronics because of their ease of use, excellent chemical stability and low cost, but they often have low thermal conductivity ranging from 0.1 to 0.5 Wm -1 K -1 at room temperature. Despite the widespread use of low-cost ceramic fillers such as alumina (Al2O3) , silicon nitride (Si3N4) , aluminium nitride (AlN) , and silicon carbide (SiC) as thermally conductive fillers, the resulting epoxy composites still demonstrate a low thermal conductivity, which remains below 2.0 W m -1 K -1 .