Among these methods, confined electrodeposition (CED) has demonstrated exceptional control over the microstructure of printed metal , facilitating the direct printing of highconductivity (< 2-times of the bulk conductivity) metals such as copper (Cu) and nickel (Ni) onto various substrates . It is also possible to print alloys using this technique by coelectrodeposition from a single electrolyte . Electroless plating can be combined with electroplating or direct ink writing for development of hybrid printing technologies . Both electroplating and electroless plating are low-cost and scalable techniques for such applications and hence are appealing from engineering point of view .