Metasurfaces were fabricated using conventional electron beam lithography (EBL), electron beam evaporation of metals and a lift-off process. First, a 200 nm thickness Au layer was thermally evaporated on the Si substrate with a 5 nm Cr adhesion layer, followed by 60 nm of vacuum polymerization of polyimide, carried out onto the Au film without any adhesion layer. Then, spin coating of positive tone EB resist, ZEP 520A 1:2 diluted by anisole, was spin coated at 1000 rpm for 10 seconds and 3000 rpm for 40 sec. Then it was prebaked at 130 • C on a hotplate for 10 min and used for EBL writing at 100 kV acceleration voltage, 5 nA of irradiation current with 350 µC/cm 2 area dose. After E-beam drawing the pattern was developed in ZED-N50 for 1 min, followed by thermal evaporation and subsequent lift-off for creation of 50 nm thickness Au disk MIM pattern. The same EBL pattern definition and lift-off process was used for creating metasurfaces with polyimide deposited by spin coating.