Figure shows three samples to study the reduction of the CCP power in order to reduce the scallops in a 2-step etch cycle. There is no significant difference in the initial scallops, mask undercut nor depth of the pore when changing the initial CCP power from 80 W (Figure ) down to 60 W (Figure ), indicating that the ion energy is still sufficient at 60 W to fully remove the fluorocarbon at the bottom of the pore. With further reduction to 50 W a splitting of the pores was observed, as shown in Figure . This is caused by an incomplete fluorocarbon removal resulting in an uneven etch, as was previously observed when etch time was reduced too far in Figure . Since varying the CCP power made almost no change in the results of the etch for our system until it was so low that the fluorocarbon was not fully removed, it was concluded that maintaining a relatively high CCP power of 80-90 W and varying other parameters, such as etch time, gave better control over the scallops and mask undercut.