The fabrication process comprises several key steps, as illustrated in Fig. (detailed procedures are provided in the Experimental section). The process begins with the creation of a template through patterning and dry etching of a silicon wafer, followed by metal (typically Au) evaporation. A flexible adhesive-supported polyvinyl alcohol (PVA) layer is used to strip the top metal layer from the template through soft lamination. The pressure-less nature of this lamination ensures selective stripping of metal only from the template's top surface, despite the adhesive sheet's flexibility. By performing this process at 120°C, above PVA's glass transition temperature, the adhesion strength to Au is enhanced. Upon cooling to room temperature, the sheets are separated, enabling reliable pattern transfer at both nano-and microscales . The metal pattern is subsequently transferred onto a stretchable polydimethylsiloxane (PDMS) substrate through pressure lamination at 120°C, followed by pressure using a soft stamp for at least 30 seconds. After separating the supporting layer, the PVA is dissolved in water. While this dissolution can occur at room temperature, using boiling water accelerates the process to approximately 10 minutes due to PVA's enhanced dissolution rate above 80°C. This entire process can be repeated to stack multiple layers of patterned metal on the receiving substrate, with an additional PDMS layer spin-coated onto the transferred metal layers for encapsulation. This methodology enables the creation of stretchable interconnects, as demonstrated in Fig. . Fig. reveals the hierarchical structure, where two arrays of microwires are pictured -one array with microwires extending from bottom left to top right (first layer), and another from bottom right to top left (second layer). The process offers several distinct advantages. First, pattern geometry is defined by the metal-coated template, which can be fabricated from various materials (e.g., silicon or SU-8) using any established lithographic method. Second, successful transfer relies on the differential adhesion between the metaltemplate and metal-PVA interfaces. When necessary, an optional perfluoro-silane treatment can be introduced between template fabrication and metal evaporation to reduce template adhesion, enabling transfer of materials that typically exhibit strong template adhesion. This versatility has been demonstrated in the successful transfer and plasma bonding of SiO 2 /Ti/Pt stacks for soft multi-electrode arrays . Finally, as shown in Fig. , the template can be reused following wet etching of residual metal, enabling a highly efficient and straightforward fabrication process.