The working principle behind ECD is reduction of copper ions on the cathode surface using electrons supplied by a power supply. We have recently presented a vacuum-based chemical vapor deposition (CVD) technique that mimics this process and is referred to as electron CVD (e-CVD). The e-CVD process uses free electrons in a plasma discharge to reduce metal centres in chemisorbed precursor molecules. By applying a positive bias to the substrate surface, it attracts the plasma electrons, enabling them to reduce metal precursors on the substrate surface. The e-CVD process can thus be regarded as a dry form of ECD with the potential to replace the wet-chemical methods, allowing for integration in vacuum cluster tools.