Unlike previous work, our work does not concentrate on producing the highest aspect ratio pores possible. The reason is that ultradeep nanopores often entail imperfections in shape such as mask undercut, large scallops and tapering, that notably hamper the interpretation and modelling of observations and applications. These imperfections can become more prominent when starting a process on a different etcher, or in a different lab, requiring the process to be optimized anew. In this work we focus on how the process parameters control the form and shape of the nanopores to create as ideal as possible nanopores for photonic (crystal) applications and create a framework for how to address undesirable feature in an etch process.