Moreover, the change in electrical resistance of the bubble printed MXene patterns under compressive and tensile strain after 999 cycles revealed distinct responses. As shown in Figure , the sensor exhibited an average decrease in resistance of -4.0% with 60.3º of bending under compressive strain. This observation is typical of conductive films, and generally indicates that the distance between conductive particles decreases during compression, leading to an increase in electrical conductivity. In contrast, when subjected to tensile strain, the printed MXene lines demonstrated an averaged increase in resistance of 25.7%. This increase in resistance can be explained by a larger distance between MXene particles as tension is applied, and is a typical response profile for resistive strain sensors. In addition to the different overall change in resistance upon compressive and tensile strain, the change of resistance with increasing bending angle is also different depending on whether compressive or tensile strain is applied (Figure ). Under compressive strain, the resistance decreases in a mostly linear fashion from 0 to 60.3°. However, in the case of tensile strain, the resistance increases linearly by ~17.1% from a bending angle of 0° to ~16°, where the resistance increases only an additional 8.4% between ~16° and 60.3°. This suggests that strain sensors fabricated by this approach would be most sensitive in the range between 0° and ~16° bending, where the responsivity at bending angles between 16° and 60° is 5.5 times lower. The strong difference in the resistive behavior between compressive and tensile strain highlights the inherent anisotropic electronic behavior of the bubble printed MXene lines, since they are only deposited on one side of the PET film, and supports their potential for applications in both flexible electronics and strain sensors.