Today, electronic devices using PI rely predominantly on pre-fabricated PI films due to the inability to liquid-process PI while staying within an acceptable thermal window of many electronic subcomponents. Linear, aromatic PI has prohibitively high T m (>300°C) that prevents melt processing, and alternatives based on liquid poly(amic acids) precursors still require imidization steps at > 250 °C to initiate ring-closing reactions. In order to obtain dense electronic circuits with conventional, (i.e., prefabricated PI films) approaches, one would need to build each electronic layer onto a film separately and then align and stack films. Particularly challenging is obtaining the necessary through-layer electronic connections; this requirement usually entails additional subtractive steps to "drill" through the substrate to create a "via" and then applying suitable solder to achieve conduction. Electronic components placed on top of the films break 2D planarity and different components are often different heights. Applied liquid "build-up layers" can accommodate this height differential, but adhesion is not trivial. Adhesives also add to thickness and create discrete transitions in stiffness, which consumes valuable real estate while also threatening overall flexibility and mechanical reliability. By contrast, our resins are viscous liquids at modest temperatures, which permits straightforward deposition, casting, and leveling of thin layers iteratively. As shown in Scheme 1B, we can readily doctor blade and cure films down to 100 microns. Starting with a preformed PI film, we can place conductive traces and components conventionally. The thermal resistance of our PI films permits solder reflow of Pbfree solder at temperatures of 265C for 10 min (see Figure ). For packaging, we can then cast more resin to planarize and insulate this electronic layer. In Figure , an ohmmeter probe on the bare conductive trace of the layer measures R = 0.8 Ω but after recoating and curing of our PI-ester the probe measures an open circuit (R > 10 8 Ω). Rather than insulating the entire circuit, we can also easily achieve "redistribution layers" (RDLs) for multilayered circuits. By employing photomasks, we can selectively photopolymerize our PI-ester in desired regions and leave unexposed regions uncured. This additive approach yields the necessary vias directly; we can simply remove the uncured resin (University of Utah logo, Figure ) and backfill the via with a conductor. The next layer's traces and components can then be built conventionally while simultaneously achieving the desired insulation and conductivity with the previous layer. This workflow is repeatable and infinite for an arbitrary number of layers of flexible circuitry. This proposed manufacturing approach significantly reduces the complexity of building multilayered PI based circuits. Furthermore, we evaluated the dimensional stability of our network polymers. We expected the networks to resist creep deformation given their covalent crosslinking. Creep tests conducted on PI ester showed very little strain using film samples in tension, performed at 25 °C, 100 °C, and 200 °C with 0.1 MPa of constant stress. It is worth noting that the dimensional stability at high temperatures is particularly of interest for solder reflow as mentioned above (Figure ). At ambient, 25 °C, a low creep strain of 0.2% after 50 minutes was observed while at 200 °C a creep strain of 5% was found showing high temperature creep resistance. Much of this "creep" however was due to thermal expansion (3.1% from 25 °C to 200 °C) based on calculations using PI ester CTE.