Optical and WL imaging on the sliding tracks on both FGO-CMMC (0.25CD) and FGO-CMMC (0.5CD) show that wear is limited to the top of the protruding misorientated growths, limiting the contact area on the coating; the high populous for these growths ensure that counterface-sliding does not contact the bulk copper coating (Figure ). Observed wear depths after 10,000 revs sliding are limited to < 5 μm, suggesting that the coatings can achieve a low-friction regime beyond the 10,000 revs endpoint selected. SEM imaging of the wear surface on FGO-CMMC (0.25CD) showed clear evidence of shear-delamination: the contact surfaces are smooth, with the debris primarily consisting of platelet-structured materials. EDX mapping shows that the sliding contact surfaces are rich in carbon but contain no-enriched fluorine content. The debris surrounding the contact areas was also found to contain carbon and oxygen, suggesting that the ejected debris is from the oxidized FGO-Cu tribofilm. In contrast, FGO-CMMC (0.5CD), showed a change in lubrication performance at 4,300 revs; the steady-state friction abruptly increased to CoF ~0. 25 and remained at this level until the end of the sliding test. This was accompanied by the observation of surface fatigue of the coating contact area, as pitting and coating delamination was apparent by the ejection of larger microparticle debris and the increased erosion of the sliding surface. This is commensurate to small increases in interlayer shear energy, leading to increased oxidation at higher levels of friction. The ~9,000 rev high-friction sliding observed during PoD testing of GO-CMMC (0.25CD) and GO-CMMC (0.5CD) is evident in post-test wear scar analysis, as the misaligned growths on these coatings have a significantly higher degree of abrasive wear when compared to FGO-CMMC (Figure ). Moreso, the concentration of misaligned crystal growth on the surface dictates the depth of wear observed. The GO-CMMC (0.5CD) sliding track predominantly shows high wear of the embedded growths, but limited penetration into the Cu-bulk coating.