To assess the degradation mechanisms, we evaluated the oxidation/dissolution potential (Udis) of copper by computing the copper vacancy (VCu) formation energies (E f [VCu]) as a function of applied potential, with the Udis attributed to the potential at which the reaction becomes endergonic for a given surface facet. Within this framework, the dissolution potential is dependent upon two key factors: 1) the orientation of the Cu surface and 2) the nature of the dissolved Cu complex. The latter leads to variations in μCu, which is highly dependent upon both the chemistry and the net charge of the complex. In this work, we have considered a diverse set of possible Cu complex ion chemistries by systematically replacing one or more water ligands in known aqua ion complex geometries with CO2, CO3, HCO3, OH, and OCHO ligands. We refer the reader to the Supplementary Material for details of the structures for the studied Cu complexes.