It is very much obvious that increasing the temperature from 300K to 900K, there is a decrease in the critical tensile strain values for qHPC 60 , qHPC 58 B 1 N 1 and qHPC 54 B 3 N 3 , respectively. (Figure ). It is to note that at 300K and 600K, the stress-strain curves for qHPC 60 decay faster than the doped counterpart, indicating the lesser stiffness of qHPC 60 at near equal to room temperatures. But, as evident from higher temperature stress-strain curves, qHPC 60 decays at a larger stress value than qHPC 58 B 1 N 1 . This is due to the easy breakage of the more polarized B-N bond at higher temperatures than the C-C bond. These results indicate that the qHPC 60 may bear lesser stress at room temperature but it could tolerate the higher stress than the doped counterpart at the higher temperatures.