To further investigate the emissivity tuning mechanism, scanning electron microscope (SEM) and energy-dispersive X-ray spectroscopy (EDX) were used to characterize the surface morphology and elemental composition of the electrodeposited metal film. (Figure ) It shows that Cu can be deposited uniformly due to the introduction of the Pt-modification and polymer inhibitor. The composition of the deposited metal film was characterized by X-ray photoelectron spectroscopy (XPS) and X-ray diffraction (XRD). In Figure , the peaks at 932.5 and 952.5 eV in the Cu 2p scan confirm the existence of the metallic Cu(0). The shifted Cu 2p 3/2 peak at 934.5 eV and the satellite around 944 eV correspond to the small amount of CuO. The composition analysis of Cu shows that there is 25.11% CuO. After electrodeposition, XRD analyses reveal peaks at 43.4° and 50.5° appearing on the ultra-wideband transparent electrode can be assigned to the Cu (111) and Cu (200), as shown in Figure . There is no signal for the crystallized CuO in the XRD data. Since the XPS analyzes the top surface layer of the sample and XRD delivers the much deeper measurement, we infer that the CuO only exists in the top surface layer, which elucidates that the metallic Cu dominates the electrodeposition process and results in low emissivity.