transport is a particularly important factor in their heat dissipation, with G ≲ G c under both wetting conditions. For the simulated poor wetting case, the G values of the 3 and 5 nm AuNPs even approach the boundary for interface limited heat dissipation. Considering the experimental estimates of G for AuNPs in water, it appears that G only approaches the boundary for thermal diffusion limited heat dissipation around d ∼ 100 nm, suggesting that the interface slows AuNP heat dissipation for diameters d < 100 nm. However, coating AuNPs with a sufficiently hydrophilic ligand such as PEG may lead to much higher G, which may make heat dissipation out of particles with d < 100 nm thermal diffusion limited. Conversely, G for CTAB stabilized gold nanorods in water may be as low as ∼ 50 MW m -2 K -1 in some cases, so more hydrophobic ligands will promote interface limited heat dissipation out of AuNPs with d ≤ 5 nm.