We used nanoindentation with a Berkovich tip to measure the indentation modulus and hardness of the films in the uniform region. To assess the nanomechanical properties of the sample over a wide range of areas, we employed the NanoBlitz3D technique . This high-speed indentation testing technique enables rapid mapping of material properties, unlike traditional indentation methods. NanoBlitz3D applied a specified load to the sample and measured the resulting indentation depth and contact stiffness. These values were then converted into hardness and elastic modulus using the Oliver-Pharr indentation model . To achieve this, we conducted an indentation experiment that covered a substantial portion of the surface area under investigation, performing roughly 10,000 individual indents in total on the specimen with a load of 1.2 mN. To prevent the formation of plastic-affected zones near each indentation, the distance between each indent was set to 10 µm. To compare our results with reference material, the same test was conducted on bulk copper. An array of NanoBlitz3D footprints, each with 400 indents, is shown in Figure . The mean value of the modulus was 133.2 ± 4.24 GPa. When comparing the normal distribution plots in Figures and, it becomes evident that the fabricated metal traces in this work show a broader distribution than the bulk copper; however, statistically, both materials have the same elastic modulus. The large variation in data for the fabricated traces could be attributed to defects generated during manufacturing (Figure ). Additionally, the multi-layer nature of the interconnect may also affect the obtained elastic modulus.