The ALD process with 4 and water was studied by varying their pulse lengths 290 °C. The resulting saturation curves (Fig. ) show the deposition process is self-limiting for pulse times ≥ 3 s, resulting in film growth of ~1.0 Å/cycle. Varying the deposition temperature whilst using a 4 s pulse of 4 and 3 s pulse of water revealed a temperature interval where the growth per cycle (GPC) is constant with the temperature between 270 and 385 °C (Fig. ). The film thickness for films deposited at 290 °C using 300, 500, 800 and 1100 ALD cycles (Fig. ) follows a linear trend line, however, it shows a significantly slower initial deposition interpreted as a nucleation delay of approximately 49 cycles. This result suggests slow surface kinetics of 4 at low temperatures due to steric crowding of the metal centre. Similar behaviour was also reported for 1, whereby a 'fill-empty' approach was used to circumvent this problem. Attempts to fit a linear trend line results in a line suggesting an average growth per cycle of 0.9 Å.