To demonstrate electronic component recapture via substrate depolymerization, we made films (100 um thick) from the PI-ester based resin and added a simple routing circuit and basic components. For our conductor, we chose eutectic gallium indium alloys (EGaIn) liquid metal due to its mechanical compliance and more importantly, its recyclability. There is a variety of techniques to pattern liquid metal circuits, but in this study we chose selective wetting where a shadow masking combined with physical vapor deposition produces a 20 nm Chromium and 200 nm copper seed layer onto the film into the desired circuit pattern then the sample is dip coated into an EGaIn bath. EGaIn favorably alloys and wets this seed layer to form conductive traces that are deformable (see Supporting Information for more information). We complete the circuit by attaching electronic components: LED bulb, resistor, R2023 coin cell battery, and battery holder (Figure ). After confirming the circuit is performant, we remove the battery and initiate recapture by immersing the device in the degradation (50% DCM, 50% methanol and 0.07 mol/L (M) K 2 CO 3 ) solution at room temperature. After 2 hours, our PI-ester substrate depolymerized and we observe no visual change of the remaining electronic components. We collect the components, rinse with isopropyl alcohol and dry. We repeat this process for three such circuits and note that the resistors did not exhibit statistically significant changes in resistance: Ω avg, before = 5.17 ± 0.05 Ω; Ω avg,after = 5.23 ± 0.05 Ω (N = 3) (Figure -vii). To further confirm functionality after substrate removal, we place these same components onto a fresh, patterned substrate. This "new" circuit is also performant, as demonstrated by the illuminated LED in Figure . Thus, the poly(imide-ester) substrates allow for the fabrication of functional, flexible circuit and the recovery of the components by depolymerizing the substates.