pulse will remove the methyl radicals from above the surface, which facilitates a more accelerated decrease of the carbon group surface coverage by suppressing the re-adsorption process. With no added pulse of inert gas between TMA and NH3 (Fig. ), the methyl groups previously released from the surface can either become re-adsorbed on the empty sites or converted to C2H6 molecules, which is manifested by the persistence of the dominantly CH3terminated surface in Figure . The C incorporation in the film versus time as estimated from the computed surface coverage is shown in Figure . 5. The re-adsorption process leads to a significant increase in the carbon incorporation in the film (Fig. ). On the other hand, when a pulse is introduced between TMA and NH3, the re-adsorption process is suppressed, and the desorption dominates, resulting in the reduction of the carbon incorporation in the film (Fig. ). This correlates with the experimental results in Figure . We suggest that the extra pulse between TMA and NH3 assists in the diffusion of desorbed methyl groups away from the AlN surface and prevents their re-adsorption. In the kinetic simulations (Fig. ) the methyl groups on the surface desorb quickly and after a short time these methyl groups react and form ethane (C2H6). This would facilitate a faster elimination of the carbon groups by suppressing the re-adsorption pathway according to our kinetic model.