Current micro and nanoscale electronics are dominantly manufactured using complex layering processes or 3D printing techniques: primarily extrusion printing or direct ink writing. Whilst these processes can now provide flexible electronics to be wrapped onto biological material, through the pre-assembling of the electronic component before their incorporation with biology, the interface between both systems is poor, and only provides a 2D structure across a surface. Having the capability to selfassemble 3D electronics in situ would not only increase the information processing density of the electronics, but may also greatly improve the integration with biological tissue, and the efficacy of treatment.