Results support the following: 1) low imposed tensile forces favor complete cure of the polyepoxy at various relative humidity environments, and molecular forces dominate the system during curing; 2) at high imposed tensile forces, regardless of relative humidity, no complete cure was ever observed unless the load (force) experience by the polyepoxy consisted of a compressive load; 3) upon exposure of the polyepoxy to high relative humidity, water diffusion takes place within seconds, increasing the degree of plasticization, preventing cure. Finally, to provide a complete and detailed quantitative picture of the adhesion and failure mechanisms of the polyepoxy-inorganic substrate system studied, we complemented with destructive micro-tensile tests and failure analysis imaging, revealing mainly cohesive (polymer-polymer) rather than adhesive (polymer-substrate) failure modes. Overall, we present a new interface quality measurement method to investigate polyepoxy-inorganic substrate systems expected to be of interest to various technological applications.