Despite these advances, a critical need remains for fabrication approaches that combine simplicity, versatility, and scalability while maintaining good electrical and mechanical performance. Micro-and Nanotransfer-based processes have been shown to enable the assembly of complex electronic systems with high fidelity and minimal defects, which is critical for ensuring the performance and reliability of stretchable devices niques is another significant advantage. Traditional methods for fabricating stretchable electronics often involve laborintensive and time-consuming processes that limit their applicability in mass production scenarios. In contrast, transfer printing techniques can be adapted for high-throughput manufacturing, allowing for the rapid production of large-area stretchable electronics. However, most transfer-based approaches focus on single-layer materials, such as patterned organic or inorganic conductors, and thus face similar material-specific limitations. Building upon an established template stripping method , we present a multilayer approach that uses sequential transfers to create engineered wire networks. This process combines the scalability of transfer printing with the mechanical advantages of wire architectures, while avoiding the complex synthesis and assembly challenges of conventional nanowire-based methods. The approach is compatible with various metallic materials, requires minimal specialized equipment, and can be completed rapidly compared to conventional fabrication routes. The resulting conductors demonstrate good mechanical performance, offering a practical balance between fabrication simplicity and device performance.