A microband sensor is presented in Figure . The sensor chips were originally developed for electrochemical based sensing applications. The detailed chip circuit design is presented in SI Figure , the chips had a micro-SD pin-out for easy electrical plug-and-play connectivity to the potentiostat (see SI Figure )). Each chip had six working electrodes that may be individually addressed. In the present work, the electrodes employed were single Au micro bands (1 µm wide, 45 µm long, 50 nm height). These were selected as the high current densities, observed at ultra microelectrodes, enabled the formation of nanoclusters emanating away from the band. A small aliquotfor example, only 2 µL -of the mixed GA/AgNO3 solution was required for one SERS substrate fabrication on the chip. Considering this electrodeposition process took only 10 seconds, the present approach was rapid, low cost, scalable and environmentally friendly. Figure shows a SEM image of a SERS structures electrodeposited on a micro-band electrode. The nanoclusters were strongly attached to the chip surface, were stable and allowed hundreds of Raman measurements to be undertake without any degradation of the substrate being observed.