While the herringbone design achieves excellent stretchability, its reliance on precise layer-to-layer alignment across large areas poses a significant manufacturing challenge, with misalignment often resulting in non-conductive samples (Fig. ). To address this limitation, we developed a more robust design, presented in Fig. . The layout partially relaxes some stretchability requirements discussed above in favor of a periodic pattern which ensures that misalignment does not result in a complete loss of conductivity (Fig. ). Additionally, the design incorporates redundant layer overlaps, where each microwire connects with multiple microwires in the opposing layer (the intersections are highlighted in red on the schematic), ensuring conductivity preserva-tion even with imperfect transfer processes (Fig. ). Doing so, this design leverages a fundamental property of wire networks, where contact points between conductors are essential for maintaining electrical pathways . Our periodic layout ensures that sufficient contact points between layers are preserved even under non-ideal conditions. Representative examples of misalignment and combined misalignment with imperfect transfer are shown in Fig. and Fig. , respectively. A typical sample used for tensile testing is shown in Fig. . Performance characterization of three samples (600 µm width, 19 mm length, sheet resistance 32.5 ± 1.8 Ω/sq) under uniaxial strain is presented in Fig. . Although the strain-to-failure is lower than with the herringbone design, the relative resistance change remains well below 2 throughout the operating range. With sub-millimeter width and potential for further optimization and miniaturization, this design offers a straightforward path to fabricating stretchable interconnects. Notably, these samples demonstrate excellent durability, maintaining conductivity through over 1000 cycles at 50% strain (Fig. ).