Polyimide film was formed using vapor deposition polymerization of pyromellitic dianhydride (PMDA) and 4,4'-diaminodiphenyl ether (ODA) on the 200 nm Au layer coated Si substrate . Temperature of the source was set to 150 • C (PMDA) and 110 • C (ODA), while the substrate temperature was set to 30 • C. After 30 min of deposition, thermal imidization treatment has been carried out at 150 • C in air for 1 hour. Polyimide layer formation was confirmed using infrared reflection-absorption spectroscopy (IR-RAS). Thickness of polyimide was 60 nm.