MoS2 flakes, containing regions with varying numbers of layers, were prepared for PEEM measurements using the top-down scotch tape method, starting with bulk MoS2. Exfoliated flakes were transferred onto a polydimethylsiloxane stamp (PF Gel Film®, Teltec GmbH). The stamp is pressed onto substrates, leaving thin-layers of TMDC on them. Mentioned substrates were commercially available silicon wafers, either coated with a 50 nm layer of titanium or used as purchased. To fit the dimensions of the PEEM sample holders, 7.5 x 7.5 mm substrates were cut from these wafers. Native titanium oxide and silicon oxide layers were found on both surfaces as evidenced by photoelectron emission measurements (Figure , Supporting Information). The substrates were ultrasonically cleaned with a solvent cascade, starting with acetone, followed by hexane, ethyl acetate, and isopropanol. As a final cleaning step, the substrates were placed in a UV oven (Photo Surface Processor PL16-110B-1, Sen Lights Corp) for 15 minutes. Successful transfers of the MoS2 flakes were evaluated by optical microscope images. As this preparation method yields a large number of flakes with different thicknesses on the substrates, we selected the most promising ones based on contrast assessments. The in darker areas is low. Below each image the average spectra, integrated over the total detector area is shown.