Overall, bubble printed MXene patterns largely demonstrate advantages in sensitivity and stability for MXene-based strain sensors compared to previously reported sensor technologies, especially when considering the reduced dimensions of the micropatterns herein. This work not only serves as a proof of concept for printed microelectronics using a simple approach that eliminates the need for pre-or postprocessing, but also provides an understanding of how such patterns respond to tensile or compressive strain. The consistent electronic properties under compressive strain with bending angles up to 60° shows promise for applications in wearable and flexible electronics, whereas the high sensitivity to tensile strain in the range of 0 to 20° shows great promise for applications in resistive strain sensing including structural health monitoring and biomechanical sensing. Furthermore, the simplicity and versatility of this technique positions bubble printing of MXenes as a promising solution for advancements in structural health monitoring and wearable electronics.