In recent years, the demand for more compact, efficient, and multifunctional electronic devices has been on the rise . This trend has necessitated advancements in the manufacturing technologies of various components, including circuit traces, which are essential in electronic packaging and circuit boards . Traditionally, circuit traces have been fabricated using subtractive manufacturing methods like photolithography, which can be costly, time-consuming, and less environmentally friendly due to waste generation. Considering these challenges, additive manufacturing technologies, commonly referred to as 3D printing, have emerged as an appealing alternative to produce circuit traces . Processes like direct ink writing (DIW) , electrohydrodynamic printing (EHD) and inkjet printing , liquid metal printing , laserinduced forward transfer (LIFT) and electrochemical printing offer a degree of flexibility and cost-effectiveness that is not readily achievable through conventional means.