 PITTSBURGH, Pa., March 25, 2021 PRNewswire -- Key Highlights GUC engineers are using Ansys HFSS 3D Layouts advanced simulation workflow to speed advanced integrated circuit Advanced-IC design The workflow helps GUC rapidly incorporate its die-to-die solution across CoWoS Chip-on-Wafer-on-Substrate, InFO Integrated Fan-Out and interposer designs to create leading-edge artificial intelligence AI, high-performance computing HPC and data center networking customer ASICs Global Unichip Corporation GUC is adopting a groundbreaking simulation workflow developed by Ansys NASDAQ: ANSS to accelerate Advanced-IC design. 