 PITTSBURGH, April 14, 2021 PRNewswire -- Key Highlights H3C Semiconductor designers used Ansys comprehensive multiphysics platform including Ansys SIwave, Ansys HFSS, and Ansys RedHawk-SC to engineer a state-of-the-art network processor chip featuring 56G Serdes and LPDDR5 interfaces Using Ansys solutions, H3C Semiconductor designers managed multifaceted design issues from chip design to signoff, co-simulating the chip and package to power advanced routing, 5G backhaul, artificial intelligence AI and cybersecurity applications H3C Semiconductor leveraged Ansys NASDAQ: ANSS simulation solutions to launch ENGIANT 660, a highly sophisticated network processor chip that enables routing, AI, 5G backhaul and cybersecurity applications. H3C Semiconductor designers used Ansys cutting-edge multiphysics simulation platform to enhance product signoff efficiency, spur product development and pass stringent testing requirements. 