 IP Optimized for High-Speed, Ultra-Low Power Chiplet Interconnects SAINT-SULPICE, Switzerland, Jan. 18, 2023 GLOBE NEWSWIRE Who: Kandou, an innovative leader in high-speed, energy-efficient chip-to-chip link intellectual property IP solutions that improve the way the world connects and communicates What: Will demonstrate GlasswingTM chip-to-chip link intellectual property IP optimized for high-speed, ultra-low power ultra-short USR SerDes ... The post Kandou to Demonstrate Glasswing Ser... 